NVIDIA's GeForce MX-series mobile GPU line exists so notebook manufacturers can put the NVIDIA logo on their products and boast of gaming capabilities. The company is giving finishing touches to its new GeForce MX330 and MX350 chips, based on the "Pascal" architecture. The MX330 is the company's second rebrand of the MX150 that's based on the 14 nm "GP108" silicon. It's equipped with 384 CUDA cores, and up to 2 GB of GDDR5 memory across a 64-bit wide memory interface. NVIDIA increased the clock speeds to 1531 MHz base, and 1594 MHz GPU Boost (compared to 1227/1468 MHz of the MX150), while remaining in the 25 W TDP envelope.

The MX350, on the other hand, is based on the 14 nm "GP107" silicon, is equipped with 640 CUDA cores, and 2 GB of GDDR5 memory across the same 64-bit bus width as the MX330; but has aggressive power-management that lends it a TDP of just 20 W, despite 66% more CUDA cores than the MX330. Both chips are easily capable of handling non-gaming tasks on typical 1080p / 1440p notebooks; but can game only at 720p thru 1080p, with low-to-mid settings.

With its own silicon fabrication facilities pushed to their capacity limits, Intel is looking for third-party semiconductor foundries to share some of its supply load, and according to a WCCFTech report, its latest partner could be GlobalFoundries, which has a 14 nm-class fab in Upstate New York. If it goes through, the possible Intel-GloFo deal could see contract manufacturing commence within 2020.

GloFo's fab offers 14 nm FinFET and 12LPP, a refinement that's marketed as 12 nm. According to the report, Intel could use GloFo for manufacturing CPU dies, specifically its entry-level chips such as Core i3, Pentium, and Celeron. Intel is also known to shed its own manufacturing workload by contracting foundries for 14 nm core-logic (chipsets). In a bid to maximize 14 nm fab allocation for its CPUs, Intel also started making some of its 300-series chipsets on the older 22 nm process, which goes to show the company's appetite for 14 nm.

Intel's upcoming 400-series desktop chipset will lack support for PCI-Express gen 4.0. The motherboards will stick to gen 3.0 for both the main x16 PEG slots wired to the LGA1200 socket, and general purpose PCIe lanes from the PCH, according to a Tom's Hardware report. It was earlier expected that 400-series chipset motherboards will come with preparation for PCIe gen 4.0, so even if the upcoming 10th gen "Comet Lake" desktop processors lacked gen 4.0 root-complexes, the boards would be fully ready for the new bus standard in 11th gen "Rocket Lake" desktop processors.

10th gen "Comet Lake" desktop processors are built on 14 nm process, and implement Intel's current-gen CPU core design Intel has been implementing since 6th gen "Skylake." It's only with 11th gen "Rocket Lake" that the mainstream desktop platform could see a new CPU core design, with the company reportedly back-porting "Willow Cove" CPU cores to the 14 nm process. "Rocket Lake" is also expected to feature a small Gen12 iGPU with 32 execution units, and a new-gen uncore component that implements PCIe gen 4.0. PCIe gen 4.0 doubles bandwidth over gen 3.0, and while only a handful GPUs support it, the standard is made popular by a new generation of M.2 NVMe SSDs that are able to utilize the added bandwidth to push sequential transfer rates beyond M.2 PCIe 3.0 x4 limitations.

NVIDIA will apparently still be using Pascal when they launch their next generation of low-power discrete graphics solutions for mobile systems. The MX300 series will replace the current crop of MX200 series (segregated in three products in the form of the MX230, MX250 10 W and MX250 25 W). The new MX300 keeps the dual-tiered system, but ups the ante on the top of the line MX350. Even though it's still Pascal, on a 14 nm process, the MX350 should see an increase in CUDA cores to 640 (by using NVIDIA's Pascal GP107 chip) from the MX250's 384. Performance, then, should be comparable to the NVIDIA GTX 1050.

The MX330, on the other hand, will keep specifications of the MX250, which signals a tier increase from the 256 execution units in the MX230 to 384. This should translate to appreciable performance increases for the new MX300 series, despite staying on NVIDIA's Pascal architecture. The new lineup is expected to be announced on February.

The "Zen 2" based Ryzen 4000-series mobile processors and Threadripper 3990X HEDT chip dominated headlines throughout AMD's CES 2020 event, but an important product announcement slipped past us: the mobile Athlon 3000 Gold and 3000 Silver families of entry-level mobile SoCs. These are 15-Watt SoCs targeting low-cost ultraportables, convertibles, and straight up Windows x64 tablets, competing against Intel's Pentium Gold 5000U "Whiskey Lake" and Pentium Silver "Gemini Lake Refresh" series. The family currently only consists of two SKUs, the Athlon Gold 3150U and Athlon Silver 3050U.

The two chips are based on the "Dali" silicon, and feature "Zen" CPU cores. The Athlon Gold 3150U features a 2-core/4-thread "Zen" CPU clocked at 2.40 GHz with 3.30 GHz boost. The Athlon Silver 3050U, on the other hand, is configured with a 2-core/2-thread CPU clocked at 2.30 GHz with 3.20 GHz boost. The CPUs on both models is configured with 4 MB of L3 cache, which takes their "total cache" (L2 + L3) figure up to 5 MB. The iGPU on the 3150U is a Radeon Vega 3 with 192 stream processors, clocked at 1.00 GHz. The one on the 3050U, is AMD's smallest, with just 2 compute units, working up to 128 stream processors, but the engine clock is set at 1.10 GHz.

Reports are flooding the web regarding Intel's total lack of reference to their upcoming Comet Lake family of CPUs, which will be branded under the Intel Core 10000 series. As reports would have it, motherboard makers had stock of LGA 1200 motherboards ready to showcase at CES, but were told to pull them in what is equivalent to a logistical "last minute". It seems that both Intel's lack of commitment to Comet Lake on its CES presentation and absence of ecosystem showcase at this year's CES might have something to do with, well, close to shame on Intel's parts.

Comet Lake will increase the maximum core count for their desktop CPUs up to 10 cores and 20 logical threads. But being built on the same 14 nm process as previous Intel generations since Skylake, there isn't much that can be done to offset increased power consumption. This is why industry sources are claiming Intel decided to skip Comet Lake at this CES - a difficulty to rein in the processors' power consumption in time for the event, with power consumption hitting 300 W. And with Intel's Core i9 10900K being configured with a PL2 (Power Level 2) of 250 W, a maximum 300 W under full load seems more than plausible.

Intel's upcoming Core i9-10900K desktop processor is up to 30 percent faster than the Core i9-9900K according to the company, which put out a performance guidance slide that got leaked to the web. Based on the 14 nm "Comet Lake-S" silicon and built for the new LGA1200 platform (Intel 400-series chipset motherboards); the i9-10900K is a 10-core/20-thread processor that leverages increased TDP headroom of 125 W to sustain higher clock-speeds than 9th generation "Coffee Lake Refresh," while also offering a 25% increase in processing muscle over the i9-9900K, thanks to the two additional CPU cores.

In its performance guidance slide, Intel shows the i9-10900K scoring 30% more than the i9-9900K in SPECint_rate_base2006_IC16.0. There's also a 25% boost in floating-point performance, in SPECfp_rate_base2006_IC16.0, which roughly aligns with the additional core count, as both these tests are multi-threaded. Other noteworthy results include a 26% gain in Cinebench R15, and 10% in SYSMark 2014 SE. In tests that don't scale with cores, Intel appears to rely entirely on the increased clock-speeds and improved boosting algorithm to eke out performance gains in the low-to-mid single-digit percentages. Intel is introducing a new clock-speed boosting technology called Thermal Velocity Boost, which can dial up clock-speeds of the i9-10900K up to 5.30 GHz.

Ahead of a possible reveal in the sidelines of CES, followed by an early-Q2 2020 product-launch, company slides detailing Intel's 10th generation Core desktop processors in the LGA1200 package, codenamed "Comet Lake-S," leaked to the web courtesy Informatica Cero. They confirm that HyperThreading will play a key role, with Intel enabling it across the lineup. The range-topping Core i9 series will be 10-core/20-thread along with 20 MB of L3 cache. The Core i7 series will be 8-core/16-thread, along with 16 MB L3 cache. The all-important Core i5 series will be 6-core/12-thread, equipped with 12 MB of L3 cache. The Core i3 series will have two sub-tiers: i3-103xx series with 4-core/8-thread and 8 MB L3 cache; and i3-101xx series 4-core/8-thread with 6 MB L3 cache.

The Core i7 and Core i9 "Comet Lake" chips will feature native support for dual-channel DDR4-2933, while the Core i5 and Core i3 will make do with native DDR4-2667 support (memory overclocking possible). Besides core/thread counts, and cache size increases, Intel will dial up clock speeds across the board by as much as 300 MHz per SKU (vs. their 9th gen predecessor), and introduce Turbo Boost Max 3.0, which has been exclusive to its HEDT processors. The introduction of Turbo Boost Max 3.0 could also bring about modern favored-core capability (benefiting Windows 10 1909 and later). The classic Turbo Boost is also available. There's also a mysterious new feature called "Thermal Velocity Boost," with its own set of clock-speeds depending on core/thread load. The chips could also feature Modern Standby C10 power-state support (first to the desktop platform). Intel is said to have also added several new core and memory overclocking features on the K-SKUs.

This piece of news shouldn't surprise anyone, except for the fact that Intel is apparently signing on a TDP of 125 W for even its K-series unlocked processors for their next-generation Comet Lake-S family. Intel's current Comet Lake 9900K CPU features a TDP of "only" 95 W - when compared to the rumored 125 W of the 10900K), whilst their current top offering, the i9-9900KS, features a 127 W TDP. Remember that Intel's 10900K should feature 10 cores and 20 threads, two extra cores than their current 9900K - this should explain the increased TDP, a mathematical necessity given that Intel can only count on marginal improvements to its 14 nm fabrication process to frequencies and power consumption of its CPUs.

A leaked slide from momomo on Twitter shows, if real, that Intel's future enthusiast-grade CPUs (likely i5-10600K, i7-10700K and i9-10900K) will feature this 125 W TDP, while other launches in that family will make do with the more traditional 65 W TDP (interesting to see that Intel has some 10-core CPUs with 65 W TDP, the same as their current 9900, despite two more cores). A footnote on the leaked slide shows that these K processors can be configured for a 95 W TDP, but this would likely come at a significant cost to operating frequency. Intel seems to be bringing a knife to a gunfight (in terms of core counts and TDP) with AMD's Ryzen 3000 and perhaps Ryzen 4000 CPUs, should those and Intel's future offerings actually coexist in the market.

Baidu, a leading Chinese-language Internet search provider, and Samsung Electronics, a world leader in advanced semiconductor technology, today announced that Baidu's first cloud-to-edge AI accelerator, Baidu KUNLUN, has completed its development and will be mass-produced early next year. Baidu KUNLUN chip is built on the company's advanced XPU, a home-grown neural processor architecture for cloud, edge, and AI, as well as Samsung's 14-nanometer (nm) process technology with its I-Cube (Interposer-Cube) package solution.

The chip offers 512 gigabytes per second (GBps) memory bandwidth and supplies up to 260 Tera operations per second (TOPS) at 150 watts. In addition, the new chip allows Ernie, a pre-training model for natural language processing, to infer three times faster than the conventional GPU/FPGA-accelerating model. Leveraging the chip's limit-pushing computing power and power efficiency, Baidu can effectively support a wide variety of functions including large-scale AI workloads, such as search ranking, speech recognition, image processing, natural language processing, autonomous driving, and deep learning platforms like PaddlePaddle.

Today Intel's CPU based on yet unannounced architecture got revealed in the SiSoft benchmark database. Featuring six cores and twelve threads running at 3 GHz, it appears like a regular 14 nm CPU that's already available, however, when digging through the details, many things are revealed. The newly submitted CPU has a different L2 cache configuration from previous CPU offerings, with this chip featuring 1.25 MB of L2 cache per core, it is unlike anything else Intel currently offers. Ice Lake mobile chips feature 512 KB, while the highest amount of L2 cache is currently present on i9-10980XE, which features 1 MB of L2.

It is unknown where this CPU fits in the whole 14/10 nm lineup, as we don't know if this is an iteration of 10 nm Tiger Lake or the rumored 14 nm Rocket Lake CPU. All we know is that this CPU features new architecture compared to Skylake iterations that are currently being used, judging by L2 cache bump, which usually happens on new architectures. The platform used for benchmarking this CPU was SuperMicro X12DAi-N SMC X12 dual-socket motherboard, which featured two of these new CPUs for a total of 12 cores and 24 threads.

A 3DMark results database entry confirmed that the 10th generation Core i5 desktop processor will indeed feature HyperThreading (HTT). Based on the 14 nm "Comet Lake" silicon, the next-gen Core i5 processor will be 6-core/12-thread. Besides HTT, the processors will feature higher clock-speeds than their 9th generation counterparts. In the 3DMark validation, a Core i5-10600 processor is referenced, featuring 6 cores and 12 logical processors. The chip has a nominal clock-speed of 3.30 GHz in its name string (a 200 MHz increment over the i5-9600), although its Turbo Boost frequency hasn't been detected properly by SystemInfo.

It's possible that the maximum Turbo Boost will be a similar 100-200 MHz gain over the 4.60 GHz of the i5-9600. It remains to be seen what L3 cache amount Intel gives these chips. The 6-core/12-thread Core i7-8700 has 12 MB, or an additional 512 KB L3 slice per core, to cope with the HTT overhead, although there have been exceptions to this rule in the company's mobile processor lineup. Intel is expected to debut its 10th generation Core "Comet Lake" processor series alongside the Z490 Express chipset in April 2020.

Intel is expected to finally refresh its mainstream desktop platform with the introduction of the 14 nm "Comet Lake-S" processors, in Q2-2020. This sees the introduction of the new LGA1200 socket and Intel 400-series chipsets, led by the Z490 Express at the top. Platform maps of these PCI-Express gen 3.0 based chipsets make them look largely similar to current 300-series platform, with a few changes. For starters, Intel introducing its biggest ACPI change since C6/C7 power states that debuted with "Haswell;" with the introduction of C10 and S0ix Modern Standby power-states, which give your PC an iPad-like availability while sipping minimal power. This idea is slightly different from Smart Connect, in that your web-connected apps and processor work at an extremely low-power (fanless) state, rather than waking your machine up from time to time for the apps to refresh. 400-series chipset motherboards will also feature updated networking interfaces, such as support for 2.5 GbE wired LAN with an Intel i225-series PHY, 802.11ax WiFi 6 WLAN, etc.

HyperThreading will play a big role in making Intel's processor lineup competitive with AMD's given that the underlying microarchitecture offers an identical core design to "Skylake" circa 2015. The entry-level Core i3 chips will be 4-core/8-thread, Core i5 6-core/12-thread, Core i7 8-core/16-thread; and leading the pack will be the Core i9-10900K, a 10-core/20-thread processor. According to a WCCFTech report, this processor will debut in April 2020, which means at CES 2020 in January, we'll get to see some of the first socket LGA1200 motherboards, some even based on the Z490. The platform also mentions an interesting specification: "enhanced core and memory overclocking." This could be the secret ingredient that makes the i9-10900K competitive with the likes of the Ryzen 9 3900X. The LGA1200 platform could be forwards-compatible with "Rocket Lake," which could herald IPC increases on the platform by implementing "Willow Cove" CPU cores.

The "Willow Cove" CPU core design succeeds "Sunny Cove," Intel's first truly new CPU core design in close to 5 years. "Sunny Cove" is implemented in the 10 nm "Ice Lake" microarchitecture, and "Willow Cove" cores are expected to debut with the 10 nm+ "Tiger Lake." It turns out that Intel is working to adapt "Willow Cove" CPU cores onto a 14 nm microarchitecture, and "Rocket Lake" could be it.

Twitter user @chiakokhua, a retired VLSI engineer with high hit-rate on CPU microarchitecture news, made sense of technical documents to point out that "Rocket Lake" is essentially a 14 nm adaptation of "Tiger Lake," but with the iGPU shrunk significantly, to make room for the larger CPU cores. The Gen12 iGPU on "Rocket Lake-S" will feature just 32 execution units (EUs), whilst on "Tiger Lake," it has three times the muscle, with 96 EUs. "Rocket Lake" also replaces "Tiger Lake's" FIVR (fully-integrated voltage regulation) with a conventional SVID VRM architecture.

Samsung has reportedly secured a "PC CPU" manufacturing order from Intel. This would entail Intel using Samsung's fabs to manufacture its processors. "PC CPU" is a broad term, interchangeable with "client CPU," and could include both notebook and desktop processors, spanning the "S," "H," "U," and "Y" silicon variants (mainstream desktop, mainstream notebook, ultrabook, and ultra low-power, respectively). Samsung's bouquet of contract-manufacturing covers not just silicon fabrication across 14 nm, but also sub 10 nm nodes, but also provides other key stages of processor manufacturing, including bumping and packaging. Intel would want minimal expenditure in adapting its chip designs to Samsung's nodes

In her November 20 letter addressed to Intel's customers, executive V-P and GM for sales, marketing, and communications, Michelle Johnston Holthaus, mentioned that in addition to Intel's own manufacturing facilities, the company is roping in "foundries" (third-party silicon fabrication companies) to meet demand. Samsung and TSMC lead the foundry business, followed by the likes of GlobalFoundries, UMC, etc.Many Thanks to biffzinker for the tip.

Intel's 11th generation Core "Rocket Lake-S" desktop processor will come in core-counts only up to 8, even as its predecessor, "Comet Lake-S," goes up to 10. Platform descriptors for Intel's next four microarchitectures surfaced on the web, detailing maximum values of their "S" (mainsteam desktop), "H" (mainstream notebook), "U" (ultrabook), and "Y" (low power portable) flavors. Both "Comet Lake-S" and "Rocket Lake-S" are 14 nm chips. "Comet Lake-S" comes with core counts of up to 10, a TDP of up to 125 Watts, Gen 9LP iGPU with 48 execution units, and native support for up to 128 GB of DDR4-2667.

The "Rocket Lake-S" silicon is interesting. Rumored to be yet another derivative of "Skylake," it features up to 8 CPU cores, the same 125 W maximum TDP, but swanky Gen12 iGPU with 32 execution units. The memory controller is also upgraded, which supports DDR4-2933 natively. There is no "Ice Lake-H" or "Ice Lake-S" in sight (no mainstream notebook or mainstream desktop implementations), ditto "Tiger Lake." For the foreseeable future, Intel will only make quad-core designs of the two 10 nm microarchitectures. "Rocket Lake-S" is slated for 2021 when, hopefully, we'll see Intel escape the 14 nm black hole.

PC major Dell in its quarterly results call blamed Intel for cuts in its revenue forecast for 2019 (full year) sales. "Intel CPU shortages have worsened qtr-over-qtr, impacting our commercial PC and premium consumer PC Q4 forecasted shipments," said Dell COO Jeffrey Clarke. Intel's CPU shortages are caused due to demand in the PC and server markets significantly outpacing supply, and not because Intel is supplying below its capacity. The company increased its capex toward manufacturer by $1 billion YoY, retrofitting its manufacturing facilities to make 14 nm processors, all while juggling resources to execute its 10 nm rollout for high-volume mobile and high-margin server processors.

The company hasn't launched 10 nm desktop or HEDT processors, yet, and is reportedly preparing yet another 14 nm line of processors for these platforms, codenamed "Comet Lake." This microarchitecture has also seen a mobile rollout for mainstream mobile form-factors, while Intel focused 10 nm "Ice Lake" for ultraportables and ultra low-power form-factors. Intel executive VP for sales Michelle Johnston Holthaus recently wrote a letter to its customers (primarily companies like Dell,) informing them that despite their best efforts, demand continues to beat supply, and that they hadn't managed to solve their supply issues.

Intel executive vice-president and general manager for sales, marketing, and communications, Michelle Johnston Holthaus, in a letter addressing the company's customers and partners, expressed regret that the company hasn't been able to resolve the challenge of PC CPU supply falling behind market growth (demand) despite its "best efforts." She elaborated on these efforts by summarizing additional billions of dollars in capital-expenditure the company spent in retrofitting its facilities to 14 nm fabs. The added capacity increased Intel's output in 2H 2019 by a "double digit" percentage compared to 1H, however, even that proved insufficient to cope with market demand. "Sustained market growth in 2019 has outpaced [Intel's] efforts and exceeded third-party forecasts," she said.

"Supply remains extremely tight in our PC business where we are operating with limited inventory buffers. This makes us less able to absorb the impact of any production variability, which we have experienced in the quarter. This has resulted in the shipment delays you are experiencing, which we appreciate is creating significant challenges for your business," she added, probably referring to the vast portfolio of dozens of SKUs of products that aren't yet EOL, but share the same 14 nm node. Intel deployed its product representatives to proactively reach out to all their customers to "answer their questions." This is probably another way of saying "retaining your businesses." Intel is embattled on two fronts: to make its 14 nm supply keep pace with demand; and to quantitatively transition to the newer 10 nm process.

AMD today released its Athlon 3000G low-cost desktop processor to cap off its entry-level. Based on the 14 nm "Raven Ridge" silicon, the chip combines a 2-core/4-thread CPU based on the original "Zen" microarchitecture, with Radeon Vega 3 integrated graphics based on the "Vega" architecture, and featuring 3 NGCUs (192 stream processors). AMD dialed up the CPU clock speeds to 3.50 GHz, a 300 MHz increase over that of the "previous gen" 200GE, and iGPU engine clock speed by 100 MHz to 1.10 GHz. A unique feature this time around is unlocked base-clock multiplier, enabling CPU overclocking. AMD is pricing the Athlon 3000GE at just $49 (MSRP), it competes with Intel's Pentium Gold G5000 series processors.

Read the TechPowerUp review of the AMD Athlon 3000G here.

Intel issued a product change notification (PCN) dated November 13, calling for a recall of boxed Xeon E-2274G processors from customers and distributors. The boxed SKU of the E-2274G, which includes a stock cooling solution, has been marked as "discontinued" and "end of life." Intel is offering an E-2274G tray processor (chip-only) as replacement for the returned inventory. The cause for the recall is the cooling solution included in the boxed SKU, which has been found to be insufficient to cool the E-2274G, a 4-core/8-thread processor based on the 14 nm++ "Coffee Lake" microarchitecture, with a rated TDP of 88 W.

The E973708-003 fan-heatsink included with boxed Xeon E-2274G processors is supplied by Foxconn, and has been known to be bundled with Intel's entry-level client-segment processors, such as the Pentium Gold series and Core i3 series (chips with TDP typically rated 65 W or less). It features a thin, circular, all-aluminium heatsink, which lacks a copper core that certain other LGA115x-compatible stock coolers by Intel have. The heatsink makes contact with the CPU over pre-applied TIM on an aluminium surface, with spirally-projecting fins dissipating heat under the fan's airflow. It could be been an oversight bundling such an underpowered cooler with an 88 W TDP processor that's designed for the rigors of mission-critical use-cases such as workstations and small-business servers.Heatsink images courtesy: AndyKingParts (Amazon seller)

AMD today announced four new desktop processors across three very diverse markets. To begin with, the company crowned its socket AM4 mainstream desktop platform with the mighty new Ryzen 9 3950X processor. Next up, it released its new baseline entry-level APU, the Athlon 3000G. Lastly, it detailed the 3rd generation Ryzen Threadripper HEDT processor family with two initial models, the Ryzen Threadripper 3960X and the flagship Ryzen Threadripper 3970X. The company also formally released its AGESA Combo PI 1.0.0.4B microcode, and with it, introduced a killer new feature for all "Zen 2" based Ryzen processors, called ECO Mode.

The Ryzen 9 3950X is a 16-core/32-thread processor in the AM4 package, compatible with all socket AM4 motherboards, provided they have the latest BIOS update with AGESA Combo PI 1.0.0.4B microcode. The processor comes with clock-speeds of 3.50 GHz base, with 4.70 GHz maximum boost frequency, and the same 105 W TDP as the 12-core Ryzen 9 3900X. With 512 KB of dedicated L2 cache per core, and 64 MB of shared L3 cache, the chip has a mammoth 72 MB of "total cache."

Intel has today announced the Stratix 10 GX 10M - a Field Programmable Gate Array (FPGA) built on 14 nm technology that has an astonishing 43.3 Billion transistors, making it the largest FPGA in the world, dethroning the Xilinx with their previously largest Virtex VU19P FPGA which had a "mere" 35 Billion transistors. The Stratix 10 GX 10M is a home to over 10.2 million logic cells housed inside two large dies, connected by Intel's own Embedded Multi-die Interconnect Bridge (EMIB).

The 10M model is packing four additional dies besides the two for logic, also connected by EMIB, that feature 48 transceivers in total which have a combined bandwidth of up to 4.5Tb/s. If you are wondering about the bandwidth between all dies, then judging by EMIB's 25,920 connections, there is 6.5 Tb/s of inner-die bandwidth, meaning that components will not be starving for additional speeds to transfer the data. Additionally there are 2,304 user I/O pins, allowing for some creative integration solutions that involve plenty of ports for development purposes.

Intel CFO George Davis in an interview with Barron's commented on the company's financial health, and some of the reasons behind its rather conservative gross margin guidance looking forward to at least 2023. Intel's current product stack is moving on to the company's 10 nm silicon fabrication process in a phased manner. The company is allocating 10 nm to mobile processors and enterprise processors, while brazening it out with 14 nm on the client-desktop and HEDT platforms until they can build 10 nm desktop parts. AMD has deployed its high-IPC "Zen 2" microarchitecture on TSMC's 7 nm DUV process, with plans to go EUV in the coming months.

"We're still keenly focused on gross margin. Everything from capital efficiency to the way we're designing our products. What we've said though, the delay in 10 nanometer means that we're going to be a little bit disadvantaged on unit cost for a period of time. We actually gave guidance for gross margin out in 2021 to help people understand. 2023 is the period that we were ultimately guiding [when] we're going to see very strong revenue growth and margin expansion. We've got to get through this period where we have the 10 nanometer being a little bit late [as] we're not optimized on a node that we're on. But [by] then we're moving to a two to two and a half year cadence on the next nodes. So we're pulling in the spending on 7 nanometer, which will start up in the second half of 2021 because we think it's the right thing to do competitively," he said.

Intel is preparing to debut its next generation Pentium Silver and Celeron "Gemini Lake Refresh" low-power processors in November 2019. The latest company roadmap slide detailing low-power SoC rollout, sourced by FanlessTech, pinned their launch sometime between week 45-47 (November). These are two key variants of this silicon, J and N. The J variant targets low-power desktops and AIOs, while the N variant targets notebooks, tablets, and other portables.

"Gemini Lake Refresh" SoCs are built on Intel's latest 14 nm node, and pack up to four "Goldmont Plus" CPU cores, and the same Intel UHD graphics, but offer significantly higher clock-speeds on both the CPU cores and the iGPU. Leading the pack is the Pentium Silver J5040, clocked at 2.00 GHz with up to 3.20 GHz boost. This chip succeeds the J5005, which ticks at 1.50 GHz with 2.80 GHz boost. The table below details the other J and N series models with the clock-speeds and core-counts.

Intel in a quick rebuttal to the earlier reports from Monday, clarified that desktop processors based on the 10 nm silicon fabrication node are still on the company's roadmap. "We continue to make great progress on 10 nm, and our current roadmap of 10 nm products includes desktop," the company said in its one-liner. Monday's reports predicted a horror story where Intel would drag its 14 nm "Skylake" derived microarchitecture through to 2022, at which point it would be 7 years old.

The Tom's Hardware report that posts the statement, however, pins 14 nm to still last till 2021, if not the 2022 date predicted in the HardwareLuxx report. Intel will sell "Comet Lake" through 2020, succeeded by "Rocket Lake," which takes up much of 2021. Towards the end of 2021, Intel will release a desktop processor based on its matured 10 nm++ silicon fabrication node, which will lead the company into 2022, when it finally launches 7 nm EUV-based desktop chips.