GIGABYTE, the world's leading premium gaming hardware manufacturer, today announced the launch of the Radeon RX 5600 XT GAMING OC 6G and Radeon RX 5600 XT WINDFORCE OC 6G. The latest Radeon RX 5600 XT series graphics processing built with 7 nm processor technology with RDNA architecture is designed for the best 1080 pixel gaming experience, and supports the PCI Express 4.0 interface. It delivers extreme 1080 pixel performance so users can enjoy higher game fidelity, better gaming performance with higher frame rates, and ultra-fast response times, for a better gaming experience than ever before.

GIGABYTE Radeon RX 5600 XT GAMING OC 6G is cooled by the WINDFORCE 3X cooling system that comes with triple 90 mm unique blade fans and alternate spinning fans. The thermal cooling solution includes 5 copper heat-pipes that directly touch the GPU so the heat from the GPU will be dissipated rapidly via conductivity effect. With these thermal dissipation methods, GIGABYTE tends to each component's temperatures for VRAM and MOSFETs at the same time, keeping components at low temperatures during the stable working state and extends the lifespan. The black metal back plate not only strengthens the overall structure but also prevents the PCB from bending or losing parts and gives the external design a more textured look. Moreover, GAMING OC has LOGO lighting on the card side so gamers can synchronize 16.7 million customizable color options and numerous lighting effects with other AORUS devices by clicking on RGB Fusion 2.0. It also allows users to adjust the diversified gaming atmosphere to what they have in mind.

As the world's most popular GAMING graphics card brand, MSI is proud to introduce its full line up of graphics cards based on new AMD Radeon RX 5600 XT graphics card with considerable performance. Furnished with the new AMD RDNA gaming architecture - Efficiently energetic, RDNA architecture was designed to deliver incredible performance, scalability and power efficiency. Built on the 7 nm FinFET process and delivering higher performance-per-watt compared to the previous architecture. The Radeon RX 5600 XT Series will be available as GAMING and MECH.

These AMD RDNA architecture-powered GAMING cards feature the new MSI exclusive Innovative Power Allocation Technology. This technology ensures that the card will draw its power from the power supply rather than the PCIe slot on the motherboard, resulting in a cleaner power signal and preventing any issues with the motherboard.

SAPPHIRE Technology launches PULSE version of the AMD Radeon RX 5600 XT graphics card with powerful TriXX boost Software tool that delivers up to a 15% performance improvement in popular games when the resolution is adjusted from 1920 x 1080 to 1728 x 972. Built on the groundbreaking AMD RDNA gaming architecture and 7 nm process technology, the PULSE Radeon RX 5600 XT graphics card comes with 2304 stream processors, a Boost Clock of up to 1620 MHz and a Game Clock of 1560 MHz delivering ultra- responsive high fidelity AAA gaming @ up to 60 FPS in select titles. The SAPPHIRE Radeon RX 5600 XT Series are equipped with 6 GB GDDR6 of high speed memory and PCI Express 4.0 support for maximum game performance, exceptional power efficiency and outstanding value.

Focusing on what gamers' need, the PULSE Radeon RX 5600 XT graphics card comes with a pivotal set of exciting features that deliver a superlative gaming experience powered by the new AMD RDNA gaming architecture. Impressive clock speeds, near silent cooling and a durable design are the trademark of the PULSE series of graphics cards.

The leading global motherboard, graphics card and mini PC manufacturer, ASRock, announces the brand-new Radeon RX 5600 XT Phantom Gaming and Challenger series graphics cards, including the triple-fan Radeon RX 5600 XT Phantom Gaming D3 6G OC, the dual-fan Radeon RX 5600 XT Phantom Gaming D2 6G OC, and the dual-fan Radeon RX 5600 XT Challenger D 6G OC graphics cards.

They use AMD 7 nm Radeon RX 5600 XT GPUs, with 6 GB 192-bit GDDR6 video memory, plus support for the PCI Express 4.0 bus standard, as well as the latest thermal design and excellent default GPU/VRAM clock settings, making ASRock's Phantom Gaming & Challenger series product lines more complete, and providing gamers an excellent 1080p gaming experience.

At a Q&A session with the tech press in Las Vegas, AMD CEO Dr Lisa Su raised hopes of a high-end graphics card based on its "Navi" family of GPUs. Responding to a specific question by Gordon Ung from PC World on whether there will be a high-end competitor in the discrete graphics space, Dr Su stated that one should expect a "high-end Navi." Dr Su states: "I know those on Reddit want a high end Navi! You should expect that we will have a high-end Navi, and that it is important to have it. The discrete graphics market, especially at the high end, is very important to us. So you should expect that we will have a high-end Navi, although I don't usually comment on unannounced products."

For months now, it's been speculated that AMD has been working on a larger GPU die than "Navi 10." In 2020, AMD is expected to release the "Navi 20" familly of GPUs built on 7 nm+ (EUV) node, based on the RDNA2 graphics architecture. The key design goals of RDNA2 are expected to be support for at least tier-1 variable-rate shading (VRS), and possibly hardware-accelerated ray-tracing. It's possible that "high-end Navi" belongs to this family of GPUs.

AMD today announced its Ryzen 4000-series mobile processors designed to compete with Intel's fastest, across both its 10th gen "Ice Lake" and "Comet Lake" mobile processors lines. At the heart of these processors is the 7 nm "Renoir" silicon, which doubles the CPU core count over the previous generation "Picasso," and improves IPC (single-thread performance) by a double-digit percentage. "Renoir" combines a CPU with 8 cores based on the "Zen 2" microarchitecture, with an iGPU that has the number-crunching machinery of "Vega," but with display- and multimedia-engines of "Navi." It is a monolithic piece of silicon with a dual-channel IMC that supports not just conventional DDR4 memory, but also fast LPDDR4X.

There are two distinct classes of Ryzen 4000 Mobile: U and H. The Ryzen 7 4800U, with its 15 W TDP, targets ultra-portable notebooks, and goes head-on against Intel's Core i7 "Ice Lake-U" processors, winning on the CPU front with its high core-count and IPC. The Ryzen 7 4800H, on the other hand, taps into the 45 W TDP headroom to dial up CPU and iGPU clock-speeds significantly, offering CPU performance that beats the desktop Core i7-9700K. It also introduces SmartShift, an iGPU + dGPU virtualization technology that lets your notebook dynamically switch between the two based on graphics load.

AMD CEO Dr Lisa Su at the company's 2020 International CES address announced the company's e-sports flagship graphics card, the Radeon RX 5600 XT. This card is designed to dominate the sub-$300 market-segment that's been led by NVIDIA's GeForce GTX 1660-series. Based on 7 nm "Navi" silicon, the RX 5600 XT has surprisingly powerful specs: 2,304 stream processors across 36 RDNA compute units, which is the same as the RX 5700, but with some cost-cutting in the way of memory: 6 GB of GDDR6 across a 192-bit wide memory interface, and 12 Gbps memory speed. The GPU has a gaming engine clock of roughly 1500 MHz. Other key specs include 144 TMUs and 48 ROPs.

Designed with a 150 W typical board power target, the card draws power from a single 8-pin PCIe power connector. The RX 5600 XT is designed to provide 1080p e-sports gaming at high refresh-rates, or 1440p gaming at reasonable graphics settings. In its presentation, AMD showed the RX 5600 XT beating the GTX 1660 Ti that leads NVIDIA's GTX 16-series. With a price of USD $279 SEP, which is on-par with that of the GTX 1660 Ti, AMD looks to bring some serious competition to the $200-300 market-segment. Available January 21, 2020.

Phil Spencer, head of the Xbox division at Microsoft, posted a picture of the semi-custom SoC at the heart of the company's upcoming "Project Scarlett" Xbox Series X game console as his Twitter avatar. The picture reveals a chip that looks visibly similar to that of "Project Scorpio" (Xbox One X). The picture was also taken from an angle that reveals the pinkish/auburn tinge of 7 nm AMD chips made at TSMC. You'll find the same tinge on chips such as "Navi 10" when viewed from an angle. The die unabashedly bears the "Project Scarlett" and "8K" markings.

Next-generation game consoles are marketing 4K 60 Hz and 8K gaming capability. They likely use a combination of dynamic resolution-scale and variable rate shading to achieve this. The "Project Scarlett" SoC is a semi-custom chip co-designed by Microsoft and AMD, and uses CPU cores based on the company's "Zen 2" microarchitecture, combined with a powerful GPU based on RDNA2, which features hardware-accelerated ray-tracing and variable-rate shading. Hardware enthusiasts on Twitter are abuzz with estimating the die-size of the SoC, with calculations pinning it around the 350 mm² mark ±10 mm², or roughly similar to that of "Project Scorpio," but one must factor in the switch to 7 nm from 16 nm significantly increasing transistor-density.

Here's the first press-shot of an upcoming Radeon RX 5600 XT custom-design graphics card, this one from ASRock. The RX 5600 XT Phantom Gaming OC appears to combine a compact PCB with a long triple-fan cooling solution that's 29 cm in length. The cooling solution features an aluminium fin-stack heatsink that's ventilated by a trio of 80 mm spinners. The card draws power from a single 8-pin PCIe power connector, indicating a significantly lower power draw target than the RX 5700-series. The card's box confirms 6 GB of GDDR6 memory, and factory-overclocked speeds, which according to VideoCardz are 1560 MHz gaming.

From an older report, we know that the RX 5600 XT is designed to compete with NVIDIA's GeForce GTX 1660 Ti. It's armed with 2,304 stream processors, 144 TMUs, possibly 48 ROPs, and a 192-bit wide GDDR6 memory interface holding 6 GB of memory, which ticks at 12 Gbps. The RX 5600 XT appears to be carved from the 7 nm "Navi 10" silicon, with a quarter of its memory interface disabled. AMD is expected to debut the card at its International CES 2020 presser, later this month.

As we approach the release of NVIDIA's Ampere GPUs, which are rumored to launch in the second half of this year, more rumors and information about the upcoming graphics cards are appearing. Today, according to the latest report made by Taipei Times, NVIDIA's next-generation of graphics cards based on "Ampere" architecture is rumored to have as much as 50% performance uplift compared to the previous generations of Turing GPUs, while using having half the power consumption.

Built using Samsung's 7 nm manufacturing node, Ampere is poised to be the new king among all future GPUs. The rumored 50% performance increase is not impossible, due to features and improvements that the new 7 nm manufacturing node brings. If utilizing the density alone, NVIDIA can extract at least 50% extra performance that is due to the use of a smaller node. However, performance should increase even further because Ampere will bring new architecture as well. Combining a new manufacturing node and new microarchitecture, Ampere will reduce power consumption in half, making for a very efficient GPU solution. We still don't know if the performance will increase mostly for ray tracing applications, or will NVIDIA put the focus on general graphics performance.

AMD in the second half of 2020 could outpace Apple as the biggest foundry customer of TSMC for its 7 nm silicon fabrication nodes (DUV and EUV combined). There are two key factors contributing to this: AMD significantly increasing its orders for the year; and Apple transitioning to TSMC's 5 nm node for its A14 SoC, freeing up some 7 nm allocation, which AMD grabbed. AMD is currently tapping into 7 nm DUV for its "Zen 2" chiplet, "Navi 10," and "Navi 14" GPU dies. The company could continue to order 7 nm DUV until these products reach EOL; while also introducing the new "Renoir" APU die on the process. The foundry's new 7 nm+ (EUV) node will be utilized for "Zen 3" chiplets and "Navi 2#" GPU dies in 2020.

Currently, the top-5 customers for TSMC 7 nm are Apple, HiSilicon, Qualcomm, AMD, and MediaTek. Barring AMD, the others in the top-5 build mobile SoCs or 4G/5G modem chips on the node. AMD is expected to top the list as it scales up orders with TSMC. In the first half of 2020, TSMC's monthly output for 7 nm is expected to grow to 110,000 wafers per month (wpm). Apple's migration to 5 nm in 2H-2020, coupled with capacity-addition could take TSMC's 7 nm output to 140,000 wpm. AMD has reportedly booked the entire capacity-addition for 30,000 wpm, taking its allocation up to 21% in 2H-2020. Qualcomm is switching to Samsung for its next-generation SoCs and modems designed for 7 nm EUV. NVIDIA, too, is expected to built its next-gen 7 nm EUV GPUs on Samsung instead of TSMC. These moves by big players could free up significant foundry allocation at TSMC for AMD's volumes to grow in 2020.

A prominent Taiwanese newspaper reported that AMD will formally unveil its next-generation "Zen 3" CPU microarchitecture at the 2020 International CES. Company CEO Dr Lisa Su will head an address revealing three key client-segment products under the new 4th generation Ryzen processor family, and the company's 3rd generation EPYC enterprise processor family based on the "Milan" MCM that succeeds "Rome." AMD is keen on developing an HEDT version of "Milan" for the 4th generation Ryzen Threadripper family, codenamed "Genesis Peak."

The bulk of the client-segment will be addressed by two distinct developments, "Vermeer" and "Renoir." The "Vermeer" processor is a client-desktop MCM that succeeds "Matisse," and will implement "Zen 3" chiplets. "Renoir," on the other hand, is expected to be a monolithic APU that combines "Zen 2" CPU cores with an iGPU based on the "Vega" graphics architecture, with updated display- and multimedia-engines from "Navi." The common thread between "Milan," "Genesis Peak," and "Vermeer" is the "Zen 3" chiplet, which AMD will build on the new 7 nm EUV silicon fabrication process at TSMC. AMD stated that "Zen 3" will have IPC increases in line with a new microarchitecture.

AMD's upcoming Radeon RX 5600 XT graphics card features the same exact stream processor count as the $350 RX 5700, according to a leaked specs sheet of a an AIB partner's custom-design graphics card. With a stream processor count of 2,304, it's safe to assume that the RX 5600 XT is based on the same 7 nm "Navi 10" silicon as the RX 5700 series. What set the RX 5600 XT apart from the RX 5700, besides lower clock-speeds, is the memory subsystem, which is severely stripped down. The Radeon RX 5600 XT will be equipped with 6 GB of GDDR6 memory across a 192-bit wide memory interface. What's more, the memory ticks at 12 Gbps, compared to 14 Gbps on the RX 5700 series.

With these specs, the RX 5600 XT has 288 GB/s of memory bandwidth at its disposal, same as NVIDIA's GeForce GTX 1660 Ti. In contrast, with 8 GB of 256-bit GDDR6 running at 14 Gbps, the RX 5700 enjoys 448 GB/s. The specs sheet suggests that AMD has also dialed down the engine clock-speeds (GPU clocks) a bit, with up to 1620 MHz boost, up to 1460 MHz gaming, and 1235 MHz base. With these specs, it's highly likely that the RX 5600 XT outperforms the GTX 1660 Ti and gets close to the RTX 2060. It all boils down to pricing. The RX 5500 XT is a decent GTX 1650-series alternative with a lukewarm price thanks to NVIDIA's aggressive product-stack management by getting its partners to lower prices of the GTX 1660 and GTX 1660 Super. It would be interesting to see if AMD can outfox NVIDIA in the sub-$300 market.

AMD's upcoming Ryzen 4000 series processors will be based on the company's Zen 3 design, which will feature a deeply revised architecture aiming to offer increased performance (surprising no-one). AMD themselves have already said that Zen 3 will offer performance increases in line with the release of new architectures - and we all remember the around 15% increase achieved with the release of Zen 2 Ryzen 3000 series, which surprised even AMD on its performance capabilities. Several sources around the web are quoting an around 17% increase in performance, taking into account increased operating frequencies of Zen 3 (100 to 200 MHz at least for the enterprise solutions, which could pave the way for even higher increases in consumer-geared products) and increased IPC of its core design. The utilization of EUV in the 7 nm process shouldn't have much to do with the increased frequencies of the CPUs, and will mostly be used to reduce the number of masks that are required for production of AMD's Zen 3 CPUs (which in turn will lead to increased yields).

Sources are claiming an increase of up to 50% in Zen 3's Floating Point Units (FPU) compared to Zen 2, while integer operations should make do with a 10-12% increase. Cores should remain stable across the board - and with that increase in performance, I'd say an upper limit of 16 physical and 32 logic cores in a consumer-geared CPU is more than enough. Increased IPCs and frequencies will definitely make AMD an even better proposition for all markets - gaming in particular, where Intel still has a (slightly virtual) hold in consumer's minds.

PowerColor is readying a small form-factor friendly custom-design Radeon RX 5700 graphics card, called simply the PowerColor RX 5700 ITX. With a length of 17.5 cm, standard 11 cm height, and strictly 2-slot thickness, the card uses a dense aluminium fin-stack heatsink with four 6 mm-thick nickel-plated copper heat pipes that make direct contact with the GPU at the base, ventilated by a single 80 mm fan. More interestingly, the card draws power from a single 8-pin PCIe power connector (225 W max power input for the connector + PCIe slot).

Unsurprisingly, the PowerColor RX 5700 ITX sticks to AMD-reference clock-speeds of 1465 MHz base, 1625 MHz gaming, and 1725 MHz boost, with the memory ticking at 14 Gbps (GDDR6-effective). Despite its compact cooling solution, the card does not skimp on idle-fan-off. Display outputs include two DisplayPort 1.4, and one HDMI 2.0. Based on the 7 nm "Navi 10" silicon, the RX 5700 features 2,304 stream processors across 36 RDNA compute units, 144 TMUs, 64 ROPs, and a 256-bit wide GDDR6 memory interface, holding 8 GB of memory. PowerColor didn't reveal pricing of the card, as it will formally launch it later this month.

Broadcom has today started shipping its latest Tomahawk 4 chip for network switches, used by all hyperscale cloud providers like Google, Microsoft, and Amazon. The Tomahawk 4 is a processor built using a 7 nm manufacturing node from TSMC. Featuring over 31 billion transistors, the chip is one of the largest ever Broadcom built. It is an improvement to the Tomahawk 3, which achieved 12.8Tbps. This new chip is having two times the bandwidth available, resulting in 25.6 Tbps speeds while still achieving the form of a single die.

To achieve the massive throughput of 25.6 Tbps, Broadcom put 512 PAM4 SerDes blocks running at 50 Gbps on a single monolithic design. Capable of supporting 64 ports of 400GbE or 256 ports of 100GbE, the Tomahawk 4 is said to bring costs of operations down by 75% due to the less required power and hardware to operate 25.6 Tbps switch, where in the past it was required to run multiple switches to achieve such throughput. Additionally, to control all the telemetry processing and run the switch firmware, four Arm CPUs running at 1 GHz are embedded in die to help out.

As the world's most popular GAMING graphics card vendor, MSI is proud to introduce its full line up of graphics cards based on the new AMD Radeon RX 5500 XT series with remarkable performance. Furnished with the new AMD RDNA gaming architecture - Efficiently energetic, RDNA architecture was designed to deliver incredible performance, scalability and power efficiency. Built on the 7 nm FinFET process and delivering higher performance-per-watt compared to the previous architecture, the Radeon RX 5500 XT Series will be available as GAMING and MECH.

TUL Corporation, parent of the leading and innovative AMD Graphics Card Manufacturing brand, PowerColor, announces their latest cards in their lineup, PowerColor Red Dragon RX 5500 XT 8 GB and PowerColor RX 5500 XT 4 GB. Powered by the the newest and most advanced 7 nm RDNA architecture with GDDR6 VRAM, the RX 5500 series features performance delivery optimized for better visuals such as volumetric lighting, motion blurring effects, depth of field, and multi-level cache hierarchy for reduced latency and a highly responsive gaming experience.

PowerColor's newest RX 5500 XT series is a perfect match for 1080p gaming, reaching 60 FPS on AAA gaming titles on high graphics settings, and over 90 FPS on the leading e-sports titles. AMD's newest lineup of features on their Radeon Graphics Drivers enhances the experience further with settings such as Radeon Image Sharpening and FidelityFX for maximum performance and insane immersive gaming experiences as well Radeon Anti-Lag for highly responsive gaming.

TSMC is delivering record results day after day, with a 5 nm manufacturing process starting High Volume Manufacturing (HVM) in Q2 next year, 7 nm process getting plenty of orders and the fact that TSMC just became the biggest company publicly trading in Asia. Continuing with the goal to match or even beat the famous Moore's Law, TSMC is already planning for future 3 nm node manufacturing, promised to start HVM as soon as 2022 arrives, according to JK Wang, TSMC's senior vice president of fab operations. Delivering 3 nm a whole year before originally planned in 2023, TSMC is working hard, with fab construction work doing quite well, judging by all the news that the company is releasing recently.

We can hope to see the first wave of products built using 3 nm manufacturing process sometime around end of year 2022, when the holiday season arrives. Usual customers like Apple and HiSilicon will surely utilize the new node and deliver their smartphones with 3 nm processors inside as soon as the process is ready for HVM.

Qualcomm Technologies, Inc., a subsidiary of Qualcomm Incorporated, announces a broad Qualcomm Snapdragon Compute platform portfolio with long battery life, cellular connectivity, and AI accelerated performance to enable fanless, thin and light designs for modern computing. Built with mobility in mind, the portfolio accommodates the evolving needs of mobile consumers. The Snapdragon 7c and 8c now join the previously announced Snapdragon 8cx, delivering lightning fast cellular connectivity to premium, mainstream, and entry-level notebook PCs. The portfolio is available in various price points allowing partners to design always on, always connected PCs for a wide array of consumers. In addition, the Snapdragon 8cx enterprise compute platform brings connected security software and secured-core PC support for modern enterprises looking to bring mobility to their workers.

Amazon Web Services, a part of Amazon that is in charge of all things cloud, has announced plans to release 32 core CPU based on Arm Neoverse N1 microarchitecture that is designed to handle a diverse workload that today's cloud infrastructure needs. This new CPU should be the second iteration of AWS'es custom CPU based on the Arm architecture. First-generation AWS CPU was a processor called Graviton, which Amazon offered on-demand in the cloud.

The still-unnamed second-gen CPU will utilize a 7 nm manufacturing process if the Neoverce N1 core at its base is to be believed. Additionally, everything from the Neoverse line should translate to this next-gen CPU as well, meaning that there will be features like high frequency and high single-threaded performance, cache coherency, and interconnect fabric designed to connect special-purpose accelerators to the CPU complex. For reference, Arm's design of Neoverce N1 has a TDP of 105 W for the whole SoC and its packs 64 cores running at 3.1 GHz, delivering amazing power efficiency and high core count.

MediaTek today unveiled Dimensity, MediaTek's family of powerful 5G system-on-chips (SoCs) offering an unrivaled combination of connectivity, multimedia, AI and imaging innovations for premium and flagship smartphones.

The MediaTek Dimensity 5G chipset family brings smart and fast together to power the world's most capable 5G devices. Dimensity represents a step toward a new era of mobility - the fifth dimension - to spur industry innovation and let consumers unlock the possibilities of 5G connectivity.

At its recent SC19 talk, AMD touched upon its upcoming "Zen 3" CPU microarchitecture. Designed for the 7 nm EUV silicon fabrication process that significantly increases transistor densities, "Zen 3" could post performance gains "right in line with what you would expect from an entirely new architecture," states AMD, referring to the roughly 15 percent IPC gains that were expected of "Zen 2" prior to its launch. "Zen 2" IPC ended up slightly over 15 percent higher than that of the original "Zen" microarchitecture. AMD's SC19 comments need not be a guidance on the IPC itself, but rather performance gains of end-products versus their predecessors.

The 7 nm EUV process, with its 20 percent transistor-density increase could give AMD designers significant headroom to increase clock speeds to meet the company's generational performance improvement targets. Another direction in which "Zen 3" could go is utilizing the additional transistor density to bolster its core components to support demanding instruction-sets such as AVX-512. The company's microarchitecture is also missing something analogous to Intel's DLBoost, an instruction-set that leverages fixed-function hardware to accelerate AI-DNN building and training. Even VIA announced an x86 microarchitecture with AI hardware and AVX-512 support. In either case, the design of "Zen 3" is complete. We'll have to wait until 2020 to find out how fast "Zen 3" is, and the route taken to get there.

According to the findings of a Chiphell user called "wjm47196", AMD is supposedly going to host an event at CES 2020 to showcase its next generation of Radeon graphics cards. Having seen huge success with its first-generation "RDNA" GPUs, AMD is expected to showcase improved lineup utilizing new and improved RDNA 2 graphics card architecture.

Judging by the previous information, second generation of RDNA graphics cards will get much-needed features like ray tracing, to remain competitive with existing offers from NVIDIA and soon Intel. Supposed to be built using the 7 nm+ manufacturing process, the new GPU architecture will get around 10-15% performance improvement due to the new manufacturing process alone, with possibly higher numbers if there are changes to the GPU core.

AMD today announced the AMD Radeon Pro W5700, the world's first 7 nm professional PC workstation graphics card. It delivers new levels of performance and advanced features that enable 3D designers, architects and engineers to visualize, review and interact with their designs in real time, dramatically accelerating decision-making processes and product development cycles.

The AMD Radeon Pro W5700 workstation graphics card features the high-performance, energy-efficient AMD RDNA architecture and state-of-the-art GDDR6 memory to handle large models and datasets, and is the first PC workstation graphics card to support high-bandwidth PCIe 4.0 technology. It is ideal for professionals who push performance beyond traditional 3D design by generating photorealistic renders of their concepts and reviewing virtual prototypes of their designs in virtual reality (VR) environments.