A WikiChip analysis of TSMC's next-generation 5 nanometer N5P silicon fabrication node estimates a massive 84-87% increase in transistor densities on offer compared to the company's first commercial 7 nm-class node, the N7 (7 nm DUV). The report estimates an 87% transistor-density increase, even though TSMC's own figure is slightly modest, at 84%. TSMC N5P node is expected to commence production later this year. Its precursor, TSMC N5, began risk production earlier this year, with production on the node commencing in April or May, unless derailed by the COVID-19 pandemic. The N5P node provides transistor densities of an estimated 171.3 million transistors per mm² die area, compared to 91.2 mTr/mm² of N7. Apple is expected to be the node's biggest customer in 2020, with the company building its A14-series SoC on it.

Sony in a YouTube stream keynote by PlayStation 5 lead system architect Mark Cerny, detailed the upcoming entertainment system's hardware. There are three key areas where the company has invested heavily in driving forward the platform by "balancing revolutionary and evolutionary" technologies. A key design focus with PlayStation 5 is storage. Cerny elaborated on how past generations of the PlayStation guided game developers' art direction as the low bandwidths and latencies of optical discs and HDDs posed crippling latencies arising out of mechanical seeks, resulting in infinitesimally lower data transfer rates than what the media is capable of in best case scenario (seeking a block of data from its outermost sectors). SSD was the #1 most requested hardware feature by game developers during the development of PS5, and Sony responded with something special.

Each PlayStation 5 ships with a PCI-Express 4.0 x4 SSD with a flash controller that has been designed in-house by Sony. The controller features 12 flash channels, and is capable of at least 5.5 GB/s transfer speeds. When you factor in the exponential gains in access time, Sony expects the SSD to provide a 100x boost in effective storage sub-system performance, resulting in practically no load times.

Here is the first die visualization of AMD's new "Renoir" processor. Having made its debut with Ryzen 4000 series mobile processors, "Renoir" succeeds a decade-long legacy of AMD APUs that combine CPUs with powerful iGPUs. AMD designed "Renoir" on TSMC's 7 nm silicon fabrication process. The die measures 156 mm², and has a transistor-count of 9.8 billion. The die shot reveals distinct areas that look like the processor's 8 CPU cores, a cluster of GPU compute units, the integrated memory controllers, southbridge, and PHYs for the chip's various I/O.

"Renoir" features 8 CPU cores based on the "Zen 2" microarchitecture, divided into two 4-core CCXs (CPU complexes). Unlike on 8-core chiplets meant for "Matisse" or "Rome" MCMs, the "Renoir" CCX only features 4 MB of shared L3 cache, probably because latencies to the memory controller are low enough. The L2 cache per core is unchanged at 512 KB. The "total cache" (L2 + L3 on silicon) adds up to 12 MB. The iGPU of "Renoir" is a hybrid between "Vega" and "Navi." The SIMD components are carried over from "Vega," while the display- and multimedia engines are from "Navi." The iGPU features 8 NGCUs that add up to 512 stream processors. Infinity Fabric covers much of the die area, connecting the various components on the die. AMD introduced a new dual-channel integrated memory controller that supports LPDDR4x at up to 4233 MHz, and standard DDR4 up to 3200 MHz.

Microsoft just put out of the complete hardware specs-sheet of its next-generation Xbox Series X entertainment system. The list of hardware can go toe to toe with any modern gaming desktop, and even at its production scale, we're not sure if Microsoft can break-even at around $500, possibly counting on game and DLC sales to recover some of the costs and turn a profit. To begin with the semi-custom SoC at the heart of the beast, Microsoft partnered with AMD to deploy its current-generation "Zen 2" x86-64 CPU cores. Microsoft confirmed that the SoC will be built on the 7 nm "enhanced" process (very likely TSMC N7P). Its die-size is 360.45 mm².

The chip packs 8 "Zen 2" cores, with SMT enabling 16 logical processors, a humongous step up from the 8-core "Jaguar enhanced" CPU driving the Xbox One X. CPU clock speeds are somewhat vague. It points to 3.80 GHz nominal and 3.66 GHz with SMT enabled. Perhaps the console can toggle SMT somehow (possibly depending on whether a game requests it). There's no word on the CPU's cache sizes.

Microsoft's upcoming Xbox Series X entertainment system is shaping up to be a technological monstrosity. Xbox group head at Microsoft, Phil Spencer, last revealed a picture of its semi-custom SoC back in January, by setting it as his Twitter display picture. Over the following weeks, many more technical details, such as the chip's 12 TFLOP/s combined compute power, would be let out. Spencer updated his display picture revealing a segment of the Xbox Series X mainboard with the SoC and memory chips surrounding it. The picture reveals the large SoC package in the center, surrounded on three sides by ten memory chips, possibly GDDR6, each with its own wiring to the SoC. This indicates that the SoC features a 320-bit wide memory interface.

As for the memory density, there's no way to tell. It could be 10 GB if those are 8 Gbit memory chips, or 20 GB if those are 16 Gbit. It boils down to which device the Xbox Series X the company wants to succeed. The Xbox One S features 8 GB of DDR3, while the spruced up Xbox One X features 12 GB of GDDR5. If the new Xbox Series X succeeds the latter, then it could very well feature 20 GB, more so given Microsoft's lofty design goals (4K UHD gaming with real-time ray-tracing). Microsoft leverages hUMA to use a common memory pool for both the CPU and GPU. Designed in collaboration with AMD on a TSMC 7 nm-class node (likely the N7P), the SoC features "Zen 2" CPU cores, and a GPU based on the RDNA2 graphics architecture.

TechPowerUp today released the latest version of GPU-Z, the popular graphics subsystem information and diagnostic utility. Version 2.30.0 introduces several new feature- and stability updates, and adds support for new GPUs. To begin with, support is added for AMD Radeon RX 590 GME, Radeon Pro W5500, Pro V7350x2, FirePro 2260, and Instinct MI25 MxGPU; Intel UHD (Core i5-10210Y), and a rare GeForce GTS 450 Rev 2. TechPowerUp GPU-Z 2.30.0 introduces support for reporting hardware-accelerated GPU scheduling in Windows 10 20H1 in the Advanced tab. The tab now also has the ability to show WDDM 2.7, Shader Model 6.6, DirectX Mesh Shaders, and DXR tier 1.1. A workaround for the DirectML detection on Windows 10 19041 built has been added. Graphics driver registry path is now displayed in the General section of the Advanced tab.

In the Sensors tab, the NVIDIA VDDC sensor has been renamed to "GPU voltage," and AMD's "GPU only power draw" sensor to "GPU chip-only power draw" to clarify that the sensor only measures the power draw of the GPU package and not the whole graphics card. AMD "Renoir" based processors and their iGPUs now show up as 7 nm. Windows Basic Display driver now no longer reports its status as WHQL or Beta. A crash during DirectX 12 detection has been fixed.DOWNLOAD: TechPowerUp GPU-Z 2.30.0

The change-log follows.

AMD at its Financial Analyst Day 2020 presentation made a major clarification about its silicon fabrication process. It was previously believed that the company's upcoming "Zen 3" CPU microarchitecture and RDNA2 graphics architectures were based on TSMC's N7+ (7 nm EUV) silicon fabrication process because AMD would mark the two as "7 nm+" in its marketing slides. Throughout its Financial Analyst Day presentation, however, AMD avoided using that marker, and resorted to an amorphous "7 nm" marker, prompting one of the financial analysts to seek a clarification. At the time, AMD responded that they were aligning their marketing with that of TSMC, and hence chose to use "7 nm" in its new slides.

It turns out that the next step to TSMC N7, the company's current-generation 7 nm DUV silicon fabrication node, isn't N7+ (7 nm EUV), but rather it has a nodelet along the way, which the foundry refers to as N7P. This is a generational refinement of N7, but does not use EUV lithography, which means it may not offer the 15-20 percent gains in transistor densities offered by N7+ over N7. AMD clarified that "7 nm+" in its past presentations did not intend to signify N7+, and that the "+" merely denoted an improvement over N7. At the same time, it won't specify whether "Zen 3" and RDNA2 are based on N7P or N7+, so the company doesn't rule out N7+, either. We'll probably learn more as we near the late-2020 launch of "Zen 3" as EPYC "Milan."

With its 7 nm RDNA architecture that debuted in July 2019, AMD achieved a nearly 50% gain in performance/Watt over the previous "Vega" architecture. At its 2020 Financial Analyst Day event, AMD made a big disclosure: that its upcoming RDNA2 architecture will offer a similar 50% performance/Watt jump over RDNA. The new RDNA2 graphics architecture is expected to leverage 7 nm+ (7 nm EUV), which offers up to 18% transistor-density increase over 7 nm DUV, among other process-level improvements. AMD could tap into this to increase price-performance by serving up more compute units at existing price-points, running at higher clock speeds.

AMD has two key design goals with RDNA2 that helps it close the feature-set gap with NVIDIA: real-time ray-tracing, and variable-rate shading, both of which have been standardized by Microsoft under DirectX 12 DXR and VRS APIs. AMD announced that RDNA2 will feature dedicated ray-tracing hardware on die. On the software side, the hardware will leverage industry-standard DXR 1.1 API. The company is supplying RDNA2 to next-generation game console manufacturers such as Sony and Microsoft, so it's highly likely that AMD's approach to standardized ray-tracing will have more takers than NVIDIA's RTX ecosystem that tops up DXR feature-sets with its own RTX feature-set.

AMD at its 2020 Financial Analyst Day event unveiled its upcoming CDNA GPU-based compute accelerator architecture. CDNA will complement the company's graphics-oriented RDNA architecture. While RDNA powers the company's Radeon Pro and Radeon RX client- and enterprise graphics products, CDNA will power compute accelerators such as Radeon Instinct, etc. AMD is having to fork its graphics IP to RDNA and CDNA due to what it described as market-based product differentiation.

Data centers and HPCs using Radeon Instinct accelerators have no use for the GPU's actual graphics rendering capabilities. And so, at a silicon level, AMD is removing the raster graphics hardware, the display and multimedia engines, and other associated components that otherwise take up significant amounts of die area. In their place, AMD is adding fixed-function tensor compute hardware, similar to the tensor cores on certain NVIDIA GPUs.

Ampere Computing, a startup focusing on making HPC and processors from cloud applications based on Arm Instruction Set Architecture, today announced the release of a first 80 core "cloud-native" processor based on the Arm ISA. The new Ampere Altra CPU is the company's first 80 core CPU meant for hyper scalers like Amazon AWS, Microsoft Azure, and Google Cloud. Being built on TSMC's 7 nm semiconductor manufacturing process, the Altra is a CPU that is utilizing a monolithic die to achieve maximum performance. Using Arm's v8.2+ instruction set, the CPU is using the Neoverse N1 platform as its core, to be ready for any data center workload needed. It also borrows a few security features from v8.3 and v8.5, namely the hardware mitigations of speculative attacks.

When it comes to the core itself, the CPU is running at 3.0 GHz frequency and has some very interesting specifications. The design of the core is such that it is 4-wide superscalar Out of Order Execution (OoOE), which Ampere refers to as "aggressive" meaning that there is a lot of data throughput going on. The cache levels are structured in a way that there is 64 KB of L1D and L1I cache per core, along with 1 MB of L2 cache per core as well. For system-level cache, there is 32 MB of L3 available to the SoC. All of the caches have Error-correcting code (ECC) built-in, giving the CPU a much-needed feature. There are two 128-bit wide Single Instruction Multiple Data (SIMD) units, which are there to do parallel processing if needed. There is no mention if they implement Arm's Scalable Vector Extensions (SVE) or not.

TSMC today announced it has collaborated with Broadcom on enhancing the Chip-on-Wafer-on-Substrate (CoWoS ) platform to support the industry's first and largest 2X reticle size interposer. With an area of approximately 1,700mm2, this next generation CoWoS interposer technology significantly boosts computing power for advanced HPC systems by supporting more SoCs as well as being ready to support TSMC's next-generation five-nanometer (N5) process technology.

This new generation CoWoS technology can accommodate multiple logic system-on-chip (SoC) dies, and up to 6 cubes of high-bandwidth memory (HBM), offering as much as 96 GB of memory. It also provides bandwidth of up to 2.7 terabytes per second, 2.7 times faster than TSMC's previously offered CoWoS solution in 2016. With higher memory capacity and bandwidth, this CoWoS solution is well-suited for memory-intensive workloads such as deep learning, as well as workloads for 5G networking, power-efficient datacenters, and more. In addition to offering additional area to increase compute, I/O, and HBM integration, this enhanced CoWoS technology provides greater design flexibility and yield for complex ASIC designs in advanced process nodes.

At its 2020 IEEE ISSCC keynote, AMD presented two slides that detail the extent of cost savings yielded by its bold decision to embrace the MCM (multi-chip module) approach to not just its enterprise and HEDT processors, but also its mainstream desktop ones. By confining only those components that tangibly benefit from cutting-edge silicon fabrication processes, namely the CPU cores, while letting other components sit on relatively inexpensive 12 nm, AMD is able to maximize its 7 nm foundry allocation, by making it produce small 8-core CCDs (CPU complex dies), which add up to AMD's target core-counts. With this approach, AMD is able to cram up to 16 cores onto its AM4 desktop socket using two chiplets, and up to 64 cores using eight chiplets on its SP3r3 and sTRX4 sockets.

In the slides below, AMD compares the cost of its current 7 nm + 12 nm MCM approach to a hypothetical monolithic die it would have had to build on 7 nm (including the I/O components). The slides suggest that the cost of a single-chiplet "Matisse" MCM (eg: Ryzen 7 3700X) is about 40% less than that of the double-chiplet "Matisse" (eg: Ryzen 9 3950X). Had AMD opted to build a monolithic 7 nm die that had 8 cores and all the I/O components of the I/O die, such a die would cost roughly 50% more than the current 1x CCD + IOD solution. On the other hand, a monolithic 7 nm die with 16 cores and I/O components would cost 125% more. AMD hence enjoys a massive headroom for cost-cutting. Prices of the flagship 3950X can be close to halved (from its current $749 MSRP), and AMD can turn up the heat on Intel's upcoming Core i9-10900K by significantly lowering price of its 12-core 3900X from its current $499 MSRP. The company will also enjoy more price-cutting headroom for its 6-core Ryzen 5 SKUs than it did with previous-generation Ryzen 5 parts based on monolithic dies.

Samsung Electronics, a world leader in advanced semiconductor technology, today announced that its new cutting-edge semiconductor fabrication line in Hwaseong, Korea, has begun mass production.

The facility, V1, is Samsung's first semiconductor production line dedicated to the extreme ultraviolet (EUV) lithography technology and produces chips using process node of 7 nanometer (nm) and below. The V1 line broke ground in February 2018, and began test wafer production in the second half of 2019. Its first products will be delivered to customers in the first quarter.

AMD today announced the AMD Radeon Pro W5500 workstation graphics card, delivering the performance and advanced features demanded by today's Design & Manufacturing and Architecture, Engineering & Construction (AEC) professionals. AMD also announced the AMD Radeon Pro W5500M GPU, designed and optimized to power next-generation, high-performance professional mobile workstations. Today's design and engineering workforce pushes the boundaries of professional design applications. These increasingly mobile professionals often use multiple graphics-intensive applications simultaneously and require no-compromise performance to visualize, review and interact with their designs in real time.

AMD Radeon Pro W5500 graphics harness the high-performance, power-efficient AMD RDNA architecture, 7 nm process technology, high-speed GDDR6 memory, high-bandwidth PCI Express 4.0 support and advanced software features. Expanding the AMD family of high-performance professional graphics products, they offer outstanding performance in real-world applications, rock-solid stability and superb energy efficiency. In addition, the AMD Radeon Pro W5500 graphics card delivers incredible multitasking performance even in demanding situations, such as allowing professionals to continue developing their designs while rendering a visualization in the background.

Since its switch to the x86 machine architecture from PowerPC in the mid-2000s, Apple has been consistent with Intel as its sole supplier of CPUs for its Macbooks, iMac desktops, and Mac Pro workstations. The company's relationship with rival AMD has been limited to sourcing discrete GPUs. If pieces of code from a MacOS beta is anything to go buy, Apple could bite the AMD bullet very soon. References to several AMD processors were found in MacOS 10.15.4 Beta 1. These include the company's "Picasso," "Renoir," and "Van Gogh" APUs.

It's very likely that with increasing CPU IPC and energy-efficiency, Apple is finally seeing the value in single-chip solutions from AMD that have a good enough combination of CPU and iGPUs. The 7 nm "Renoir" silicon in particular could change the mobile and desktop computing segments, thanks to its 8-core "Zen 2" CPU, and a "Vega" based iGPU that's highly capable in non-gaming and light-gaming tasks. AMD's proprietary SmartShift feature could also be leveraged, which dynamically switches between the iGPU and an AMD discrete GPU.

AMD is giving final touches to the Radeon Pro W5500, a mid-range professional graphics card, which surfaced on an early listing by workstation builder SabrePC. Going by AMD's new nomenclature for its Radeon Pro W-series graphics cards, the W5500 could possibly be a professional variant of the RX 5500 XT, based on the 7 nm "Navi 14" silicon. It remains to be seen however, if AMD enables all 1,536 stream processors on the silicon, or if it's strictly aligned with the core-configuration of the RX 5500 XT (1,408 stream processors). Currently the only AMD product to max out this silicon is the Radeon Pro 5500M found exclusively in the new 16-inch Apple MacBook Pro.

AMD's Radeon Pro W5500 includes 8 GB of GDDR6 memory across the chip's 128-bit wide memory interface. According to the now-redacted SabrePC listing reported by Tom's Hardware, the W5500 apparently features four DisplayPorts, one short of the W5700, and there's no mention of the card supporting USB-C. The listing also mentions a price of USD $391.57, which, although a placeholder, closely aligns with the card's competitor, the NVIDIA Quadro P2200, which retails around the $400-mark.

AMD CEO Dr Lisa Su, in her Q4-2019 and FY-2019 earnings call, confirmed that the company debut its second-generation RDNA graphics architecture in 2020. "In 2019 we launched our new architecture in GPUs, it's the RDNA architecture, and that was the Navi-based products. You should expect those will be refreshed in 2020, and we will have our new next-generation RDNA architecture that will be part our 2020 lineup."

Second-gen RDNA, or RDNA2, is expected to leverage the new 7 nm+ (EUV) silicon fabrication process at TSMC, to dial up transistor-counts, clock-speeds, and performance. Among the two anticipated feature additions are VRS (variable rate shading) and possibly ray-tracing. The fabled "big Navi" silicon, a GPU larger than "Navi 10," is also on the cards, according to an earlier statement by Dr Su. More details about these upcoming graphics cards are expected to be put out in March, at the 2020 AMD Investor Day conference.

In a 2019 earnings call ASML, a Dutch company that is currently the world's largest semiconductor lithography supplier has been talking about the company's records and what awaits them in the future. In its 2019 earning report, ASML was forecasting the delivery of as much as 35 EUV systems in 2020. It is not a forecast per se, but rather a known fact since factories order their equipment months before they need to use it. Having previously delivered 26 EUV systems in 2019, the plan for the coming years is to boost the EUV system shipments by as much as 40% yearly. With plans to ship between 45 and 50 EUV systems in the year 2021, AMSL sees a strong revenue gain in the coming years. What is driving the demand for these machines is the use of ever-smaller semiconductor manufacturing nodes. Even at 7 nm, there is almost a need to use EUV lithography, and as you drop in size the lithography challenge becomes real, the use of EUV becomes a necessity.

PowerColor today issued a press release where they present the world their new Red Devil and Red Dragon models of AMD's RX 5600 XT graphics cards. This comes after reports on AMD's move towards increasing TDP, memory and core clockspeeds on their new graphics card so as to better compete with NVIDIA's recently price-cut RTX 2060, which would make it a much better performer than AMD's RX 5600 XT at a slightly higher price ($279 vs $299).

Hence a reported strike back from AMD in increasing performance for their RX 5600 XT with increased power envelope (160 W over 150 W), faster memory (at 14 Gbps instead of the original 12 Gbps) and increased core clocks (1615 MHz gaming and 1750 MHz boost, versus 1375 MHz gaming and 1560 MHz on AMD's CES press-event slides). The change in configuration brought about changes in the card design, with the higher-powered Red Devil coming in with 1x 8-pin and 1x 6-pin power delivery inputs, instead of the firstly developed 8-pin only. The changes have been brought about by a BIOS change, and not all cards will ship with the new specifications. However, PowerColor said that a BIOS update will be made available for customers to get their RX 5600 XT on steroids. Of course, whether or not it should be the onus of users to do such an update (which may risk in bricking their graphics card) is another matter entirely. The press release follows.

NVIDIA's next-generation of graphics cards codenamed Ampere is set to arrive sometime this year, presumably around GTC 2020 which takes place on March 22nd. Before the CEO of NVIDIA, Jensen Huang officially reveals the specifications of these new GPUs, we have the latest round of rumors coming our way. According to VideoCardz, which cites multiple sources, the die configurations of the upcoming GeForce RTX 3070 and RTX 3080 have been detailed. Using the latest 7 nm manufacturing process from Samsung, this generation of NVIDIA GPU offers a big improvement from the previous generation.

For starters the two dies which have appeared have codenames like GA103 and GA104, standing for RTX 3080 and RTX 3070 respectively. Perhaps the biggest surprise is the Streaming Multiprocessor (SM) count. The smaller GA104 die has as much as 48 SMs, resulting in 3072 CUDA cores, while the bigger, oddly named, GA103 die has as much as 60 SMs that result in 3840 CUDA cores in total. These improvements in SM count should result in a notable performance increase across the board. Alongside the increase in SM count, there is also a new memory bus width. The smaller GA104 die that should end up in RTX 3070 uses a 256-bit memory bus allowing for 8/16 GB of GDDR6 memory, while its bigger brother, the GA103, has a 320-bit wide bus that allows the card to be configured with either 10 or 20 GB of GDDR6 memory. In the images below you can check out the alleged diagrams for yourself and see if this looks fake or not, however, it is recommended to take this rumor with a grain of salt.

ASUS is keeping its Radeon RX 5600 XT graphics card lineup trim, with just two SKUs, both of which are factory-overclocked. The lineup is led by the ROG Strix Radeon RX 5600 XT O6G, while its affordable sibling is the TUF Gaming X3 Radeon RX 5600 XT EVO. ASUS hasn't finalized the clock-speeds for either, as it's rumored that AMD is working with its partners to increase them across the board, to make the RX 5600 XT competitive against the GeForce RTX 2060. Both ASUS RX 5600 XT graphics cards are largely based on its RX 5700-series board designs as the RX 5600 XT is carved from the same 7 nm "Navi 10" ASIC.

The ROG Strix RX 5600 XT O6G features the company's premium triple-slot DirectCU III cooling solution with three Axial-Tech fans, idle fan-stop, plenty of RGB bling on the cooler shroud and metal back-plate, and a high-grade VRM solution that pulls power from a combination of 8-pin and 6-pin PCIe power connectors. The TUF Gaming X3 RX 5600 XT EVO, on the other hand, also features a triple-slot design, the TUF X3 cooling solution with three Axial-Tech fans (the one in the middle is smaller than the others); idle fan-stop, and a metal back-plate. This card pulls power from a single 8-pin PCIe power connector, unlike the ROG Strix.

GIGABYTE, the world's leading premium gaming hardware manufacturer, today announced the launch of the Radeon RX 5600 XT GAMING OC 6G and Radeon RX 5600 XT WINDFORCE OC 6G. The latest Radeon RX 5600 XT series graphics processing built with 7 nm processor technology with RDNA architecture is designed for the best 1080 pixel gaming experience, and supports the PCI Express 4.0 interface. It delivers extreme 1080 pixel performance so users can enjoy higher game fidelity, better gaming performance with higher frame rates, and ultra-fast response times, for a better gaming experience than ever before.

GIGABYTE Radeon RX 5600 XT GAMING OC 6G is cooled by the WINDFORCE 3X cooling system that comes with triple 90 mm unique blade fans and alternate spinning fans. The thermal cooling solution includes 5 copper heat-pipes that directly touch the GPU so the heat from the GPU will be dissipated rapidly via conductivity effect. With these thermal dissipation methods, GIGABYTE tends to each component's temperatures for VRAM and MOSFETs at the same time, keeping components at low temperatures during the stable working state and extends the lifespan. The black metal back plate not only strengthens the overall structure but also prevents the PCB from bending or losing parts and gives the external design a more textured look. Moreover, GAMING OC has LOGO lighting on the card side so gamers can synchronize 16.7 million customizable color options and numerous lighting effects with other AORUS devices by clicking on RGB Fusion 2.0. It also allows users to adjust the diversified gaming atmosphere to what they have in mind.

As the world's most popular GAMING graphics card brand, MSI is proud to introduce its full line up of graphics cards based on new AMD Radeon RX 5600 XT graphics card with considerable performance. Furnished with the new AMD RDNA gaming architecture - Efficiently energetic, RDNA architecture was designed to deliver incredible performance, scalability and power efficiency. Built on the 7 nm FinFET process and delivering higher performance-per-watt compared to the previous architecture. The Radeon RX 5600 XT Series will be available as GAMING and MECH.

These AMD RDNA architecture-powered GAMING cards feature the new MSI exclusive Innovative Power Allocation Technology. This technology ensures that the card will draw its power from the power supply rather than the PCIe slot on the motherboard, resulting in a cleaner power signal and preventing any issues with the motherboard.

SAPPHIRE Technology launches PULSE version of the AMD Radeon RX 5600 XT graphics card with powerful TriXX boost Software tool that delivers up to a 15% performance improvement in popular games when the resolution is adjusted from 1920 x 1080 to 1728 x 972. Built on the groundbreaking AMD RDNA gaming architecture and 7 nm process technology, the PULSE Radeon RX 5600 XT graphics card comes with 2304 stream processors, a Boost Clock of up to 1620 MHz and a Game Clock of 1560 MHz delivering ultra- responsive high fidelity AAA gaming @ up to 60 FPS in select titles. The SAPPHIRE Radeon RX 5600 XT Series are equipped with 6 GB GDDR6 of high speed memory and PCI Express 4.0 support for maximum game performance, exceptional power efficiency and outstanding value.

Focusing on what gamers' need, the PULSE Radeon RX 5600 XT graphics card comes with a pivotal set of exciting features that deliver a superlative gaming experience powered by the new AMD RDNA gaming architecture. Impressive clock speeds, near silent cooling and a durable design are the trademark of the PULSE series of graphics cards.

The leading global motherboard, graphics card and mini PC manufacturer, ASRock, announces the brand-new Radeon RX 5600 XT Phantom Gaming and Challenger series graphics cards, including the triple-fan Radeon RX 5600 XT Phantom Gaming D3 6G OC, the dual-fan Radeon RX 5600 XT Phantom Gaming D2 6G OC, and the dual-fan Radeon RX 5600 XT Challenger D 6G OC graphics cards.

They use AMD 7 nm Radeon RX 5600 XT GPUs, with 6 GB 192-bit GDDR6 video memory, plus support for the PCI Express 4.0 bus standard, as well as the latest thermal design and excellent default GPU/VRAM clock settings, making ASRock's Phantom Gaming & Challenger series product lines more complete, and providing gamers an excellent 1080p gaming experience.