TSMC vice chairman and CEO C.C. Wei announced the company's plans for 5 nm are on track, which means High Volume manufacturing (HVM) on the node is expected to be achieved by 2Q 2020. The company has increased expenditures in ramping up its various nodes from an initially projected $10 billion to something along the lines of $14 billion - 15 billion; the company is really banking on quick uptake and design wins on its most modern process technologies - and the increased demand that follows.

TSMC's 5 nm process (N5) will use extreme ultraviolet lithography (EUVL) in many more layers than its N7+ and N6 processes, with up to 14 layers being etched in the N5 silicon compared to five and six, respectively, for its "older" N7+ and N6 processes. As the company increases capital expenditure in acquiring EUVL-capable equipment that sets up its production nodes for the market they foresee will just gobble up the chips in 2020, the company is optimistic they can achieve growth in the 5-10% number.

AMD late Thursday released the Radeon Software Adrenalin 19.10.1 WHQL. These drivers are identical to the Adrenalin 19.10.1 Beta drivers released earlier this month, with the only difference being WHQL certification. AMD is picking up the pace with WHQL releases of Radeon Software, as more OEMs are implementing Radeon RX 5700-series and upcoming RX 5500-series GPUs, and prefer WHQL-signed drivers. The 19.10.1 drivers introduce support for AMD's new Radeon RX 5500 series graphics cards based on its new 7 nm "Navi 11" silicon, along with fixes for "Borderlands 3" running in DirectX 12 mode, optimization for "GRID," and fixes certain display problems with high refresh-rate settings.

DOWNLOAD: AMD Radeon Software Adrenalin 19.10.1 WHQLChange-log for 19.10.1 follows.

AMD's latest Product Master guide (since taken down but immortalized in the interweb) has a surprise in store for AMD's Ryzen 7 desktop CPU lineup. Sandwiched in-between the Ryzen 7 3700X and the Ryzen 7 3800X, a new entry has reared its head, in the form of the Ryzen 7 3750X. The new CPU is specified to keep the same 105 W TDP of its elder sibling Ryzen 7 3800X, instead of keeping the Ryzen 7 3700X's 65 W TDP. Technically, this is possible to achieve in both pricing and performance: the Ryzen 7 3750X, if it ever is launched (it could be a specific release for system integrators or other interested parties outside the usual mainstream desktop suspects) could sport increased base clocks compared to the Ryzen 7 3700X's 3.6 GHz base / 4.4 GHz boost clocks... But not easily, considering the Ryzen 7 3800X starts at 3.9 GHz base / 4.5 GHz boost. It's possible to release the 3750X with a 200 MHz boost on base clocks and the same 4.4 GHz boost, but does it make any sense to do so?

It could - even if with some forced optimism - should AMD price it closer to the Ryzen 7 3700X than to the Ryzen 7 3800X. The $329 and $399 prices for those CPUs, respectively, leave a gap that could be filled by the Ryzen 7 3750X at around the $349 mark, for example. It's likely most users would be making the jump from the 65 W CPU than dropping less cash compared to the 3800X, so AMD's margins per sale would definitely improve. At the same time, this could be a way for AMD to cope with TSMC's 7 nm increase in lead-times and lower availability of CPUs by moving stock from the 65 W CPU to the pricier 3750X in parts that can actually run at those frequencies. Driving their lineup's ASP up ensures AMD can keep a steady stream of income should availability decline - less parts sold at a greater price can shore up some of the lost cash influx.

These could very well be the first pictures of a custom-design Radeon RX 5500 graphics card. Pictures of the purported XFX Radeon RX 5500 THICC II made it to the web courtesy VideoCardz. It's very likely that this is the RX 5500 looking at its power-connectivity, which includes just a single 8-pin PCIe input. An RX 5700-series product would at least feature an 8+6-pin input design. The display I/O is also peculiar, with not one but two dual-link DVI-D connectors (no analog pins on either), and one each of DisplayPort and HDMI. The card has the same design language as its THICC series siblings from the RX 5700-series.

The cooling solution uses two shrouds (the front shroud and the back-plate) that meet in the middle in symmetry. Two fans ventilate an aluminium fin-stack heatsink that features two or three 8 mm-thick copper heat pipes. The cooler is longer than the card itself. Based on the 7 nm "Navi 11" silicon, the Radeon RX 5500 features 22 RDNA compute units working out to 1,408 stream processors, boost frequencies of up to 1848 MHz, and up to 8 GB of GDDR6 memory across a 128-bit wide memory interface.

TSMC has increased its 7 nm delivery time by as much as three times because of extra demand from customers who want their products made on 7 nm manufacturing process. While we thought the struggles with the delivery of 7 nm will only be present for that node, it turns out that TSMC is facing some issues with the delivery of its 16 nm node as well.

There is no clear indication of why is TSMC having issues meeting demand for its 16 nm node, just now. What might be the reason is that a large number of manufacturers are still designing and manufacturing their products on 16 nm, as it is quite cheaper than smaller nodes, so the 16 nm manufacturing facilities may be "overloaded". Another possible reason is that wafer output faced some issues that are now affecting both the 7 and 16 nm node delivery time being extended. That can be anything from a small power cut to a large issue like contamination of cleanrooms where processors are made.

In a shocking piece of news, Intel has reportedly scrapped plans to launch its 10 nm "Ice Lake" microarchitecture on the client desktop platform. The company will confine its 10 nm microarchitectures, "Ice Lake" and "Tiger Lake" to only the mobile platform, while the desktop platform will see derivatives of "Skylake" hold Intel's fort under the year 2022! Intel gambles that with HyperThreading enabled across the board and increased clock-speeds, it can restore competitiveness with AMD's 7 nm "Zen 2" Ryzen processors with its "Comet Lake" silicon that offers core-counts of up to 10.

"Comet Lake" will be succeeded in 2021 by the 14 nm "Rocket Lake" silicon, which somehow combines a Gen12 iGPU with "Skylake" derived CPU cores, and possibly increased core-counts and clock speeds over "Comet Lake." It's only 2022 that Intel will ship out a truly new microarchitecture on the desktop platform, with "Meteor Lake." This chip will be built on Intel's swanky 7 nm EUV silicon fabrication node, and possibly integrate CPU cores more advanced than even "Willow Cove," possibly "Golden Cove."

MSI, the world's No.1 gaming brand, has just announced its latest Alpha 15 gaming laptop. Armed with the new AMD Radeon RX 5500M graphics, the Alpha 15 is the first gaming laptop to feature 7 nm technology, bringing cutting-edge hardware to the mainstream. MSI even created a dedicated category and a new logo for the unique yet innovative segment. The new logo takes form of a thunderbird with rising wings, representing strength, innovation and prosperity. Being the first and dominant of its kind, MSI has presented the new beast with the name "Alpha".

As typical MSI gaming tradition, the laptop also packs ample gaming features from powerful cooling system, per-key RGB keyboard, Giant Speaker, High-Res audio, and more. Gamers who purchase the Alpha 15 via selected channels will also be eligible for a complimentary copy of either Borderlands 3 or Tom Clancy's Ghost Recon Breakpoint."

Today, AMD announced the Radeon RX 5500 series graphics products, harnessing groundbreaking RDNA gaming architecture to deliver the ultimate in high-performance, high-fidelity 1080p gaming. The AMD Radeon RX 5500 series includes the Radeon RX 5500 graphics card that will be available in desktop PCs from leading manufacturers and graphics cards from board partners, as well as the Radeon RX 5500M GPU for notebook PCs. Top system providers worldwide are embracing the new products, with HP and Lenovo planning to offer Radeon RX 5500 graphics cards in their high performance desktop gaming PCs beginning this November, and Acer planning to offer systems with the cards beginning this December. In addition, later this month MSI is expected to launch the world's first gaming notebook powered by AMD Ryzen processors and Radeon RX 5500M GPUs.

"Based on feedback and insights from global gaming communities, gamers rank graphics as the most critical component for speed and performance," said Johnson Jia, senior vice president and general manager, Consumer Business of Intelligent Devices Group, Lenovo. "That's why the Lenovo Legion T730 and T530 gaming towers and the IdeaCentre T540 Gaming desktop pack in AMD's latest Radeon RX graphics - satisfying players' need for high-fidelity visuals and lightning-fast frame-rates to fully immerse into their gameplay." "MSI Alpha 15 is a new chapter for us, and we're excited to partner with AMD to combine the latest 7 nm technology found in the Radeon RX 5500M GPU and MSI's gaming DNA for our gamers," said Charles Chiang, CEO of MSI.

According to the sources over at Igor's Lab, NVIDIA could launch its next generation of GPUs, codenamed "Ampere", as soon as first half of the 2020 arrives. Having just recently launched GeForce RTX Super lineup, NVIDIA could surprise us again in the coming months with replacement for it's Turing lineup of graphics cards. Expected to directly replace high-end GPU models that are currently present, like GeForce RTX 2080 Ti and RTX 2080 Super, Ampere should bring many performance and technology advancements a new graphics card generation is usually associated with.

For starters, we could expect a notable die shrink to take place in form of 7 nm node, which will replace the aging 12 nm process that Turing is currently being built on. This alone should bring more than 50% increase in transistor density, resulting in much more performance and lower power consumption compared to previous generation. NVIDIA's foundry of choice is still unknown, however current speculations are predicting that Samsung will manufacture Ampere, possibly due to delivery issues that are taking place at TSMC. Architectural improvements should take place as well. Ray tracing is expected to persist and get enhanced with possibly more hardware allocated for it, along with better software to support the ray tracing ecosystem of applications.

It turns out that the Radeon RX 5500 is arriving a lot sooner than expected, with VideoCardz reporting an October 7th product launch for the card. It's also being reported that the SKU will launch as the Radeon RX 5500 XT, with board partner GIGABYTE being ready with half a dozen custom-design cards, all of which with 8 GB of memory. In a separate report, VideoCardz also confirmed that the RX 5500 series will be based on the latest "Navi" family of GPUs that use the company's latest RDNA architecture, and will be built on the 7 nm silicon fabrication process. What's more, the RX 5500 will reportedly use 8 GB of modern GDDR6 memory across a 128-bit wide memory bus. A WCCFTech report predicts the RX 5500 (XT) will feature 22 RDNA compute units, which works out to 1,408 stream processors.

With these specs, we can see where AMD is going with the RX 5500 (XT). The company wants a viable successor to the Radeon RX 580 or even the RX 590, which it can sell around the $200-250 price-range, competing with a spectrum of NVIDIA GPUs, including the GeForce GTX 1650 and the GTX 1660. The card would target 1080p AAA gaming with high-thru-ultra settings, and 1080p eSports gaming at high refresh-rates. NVIDIA is already preparing a response to the RX 5500 in the form of the GTX 1650 Super and the GTX 1660 Super, which come with beefed up specs.

GlobalFoundries is planning to sell a minority stake in the company through an IPO (initial public offering) in 2022, company CEO Tom Caulfield told the Wall Street Journal. In February, it was reported that with the discontinuation of the 7 nm development and sale of certain facilities, the perception was made that GloFo was looking to be acquired by another semiconductor company. The same course of actions could have also served as prelude to taking the company public, and as it turns out, GloFo is heading toward the latter.

TimesUnion comments that the decision to discontinue 7 nm development and shedding some assets slowed down development of future technologies, but returned the company to profitability, so it could be put up for an IPO. Caulfield didn't comment on what is the size of the stake sale, but the source comments it could be aimed at alleviating the strain on GloFo's original investors, the Abu Dhabi government, which has invested over $21 billion in the company over the past 10 years. GlobalFoundries was formed as AMD spun off its semiconductor business in 2009, with seed capital from the Abu Dhabi government. Over the decade, the company built fabs in New York state, and acquired fabs across Vermont, and Singapore, along with tech acquisition from IBM.

Today, AMD announced the global availability of its new AMD Ryzen PRO 3000 Series desktop processor lineup, along with new AMD Ryzen PRO processors with Radeon Vega Graphics and AMD Athlon PRO processors with Radeon Vega Graphics. The AMD Ryzen PRO and Athlon PRO desktop processors combine powerful performance, built-in security features, and commercial-grade reliability to get the job done. Starting in Q4 2019, robust enterprise desktops from HP and Lenovo powered by AMD Ryzen PRO and Athlon PRO desktop processors are slated to be available.

"The launch of the Ryzen PRO 3000 Series processors for commercial and small business users is the latest demonstration of our commitment to technology leadership in 2019," said Saied Moshkelani, senior vice president and general manager, AMD Client Compute. "Designed specifically to efficiently data-crunch, design, compose, and create - AMD Ryzen PRO and Athlon PRO processors accelerate enhanced business productivity while offering protection safeguards with built-in security features, such as full system memory encryption and a dedicated, on-die security processor."

The third known implementation of AMD's "Navi" generation of GPUs with RDNA architecture is codenamed "Navi 14." This 7 nm chip is expected to be a cut-down, mainstream chip designed to compete with a spectrum of NVIDIA GeForce GTX 16-series SKUs, according to a 3DCenter.org report. The same report sheds more light on the larger "Navi 12" GPU that could power faster SKUs competing with the likes of the GeForce RTX 2080 and RTX 2080 Super. The two follow the July launch of the architecture debut with "Navi 10." There doesn't appear to be any guiding logic behind the numerical portion of the GPU codename. When launched, the pecking order of the three Navi GPUs will be "Navi 12," followed by "Navi 10," and "Navi 14."

"Navi 14" is expected to be the smallest of the three, with an estimated 170 mm² die-area, about 24 RDNA compute units (1,536 stream processors), and expected to feature a 128-bit wide GDDR6 memory interface. It will be interesting to see how AMD carves out an SKU that can compete with the GTX 1660 Ti, which has 6 GB of 192-bit GDDR6 memory. The company would have to wait for 16 Gbit (2 GB) GDDR6 memory chips, or piggy-back eight 8 Gbit chips to achieve 8 GB, or risk falling short of recommended system requirements of several games at 1080p, if it packs just 4 GB of memory.

"Moore's Law" is a term coined in 1965 by Gordon Moore, who presented a paper which predicts that semiconductor scaling will allow integrated circuits to feature twice as many transistors present per same area as opposed to a chip manufactured two years ago. That means we could get same performance at half the power than the previous chip, or double the performance at same power/price in only two years time. Today we'll investigate if Moore's Law stayed true to its cause over the years and how much longer can it keep going.

According to industry sources over at DigiTimes, TSMC will begin mass production of its 5 nm node in March 2020, when companies using the 5 nm PDK can tape out their designs and integrate them into future products. Going into volume production two years after the 7 nm node, 5 nm is trying to put Moore's Law back on track again.

Built using the Extreme Ultra-Violet lithography (also known as EUV), 5 nm node is supposed to utilize existing FinFET transistors along with many improvements in speed, power and density when compared to existing 7 nm node. Speed is supposed to increase by around 15%, while density will improve by as much as 80%, which is excellent news for everyone. Noticeable power reduction is also present and it is now possible to have about 30% reduction in power consumption, while also enjoying additional speed and density improvements that new node brings.

TSMC is on the vanguard of chipset fabrication technology at this exact point in time - its 7 nm technology is the leading-edge of all large volume processes, and is being tapped by a number of companies for 7 nm silicon. One of its most relevant clients for our purposes, of course, is AMD - the company now enjoys a fabrication process lead over arch-rival Intel much due to its strategy of fabrication spin-off and becoming a fabless designer of chips. AMD's current product stack has made waves in the market by taking advantage of 7 nm's benefits, but it seems this may actually become a slight problem in the not so distant future.

TSMC has announced a threefold increase in its delivery lead times for 7 nm orders, from two months to nearly six months, which means that orders will now have to wait three times longer to be fulfilled than they once did. This means that current channel supplies and orders made after the decision from TSMC will take longer to materialize in actual silicon, which may lead to availability slumps should demand increase or maintain. AMD has its entire modern product stack built under the 7 nm process, so this could potentially affect both CPUs and GPUs from the company - and let's not forget AMD's Zen 3 and next-gen RDNA GPUs which are all being designed for the 7 nm+ process node. TSMC is expected to set aside further budget to expand capacity of its most advanced nodes, whilst accelerating investment on their N7+, N6, N5, and N3 nodes.

AMD is expected to bring back its low-power APU family in 2020 with the new "Dali" silicon. Updated company roadmap slides see the inclusion of "Dali" as a "value mobile APU," positioned under "Renoir," a performance APU targeting both the mainstream notebook and desktop (socket AM4) platforms. AMD looks keen to branch out its APU business in two directions.

"Renoir" is expected to be a "Zen 2" based APU with CPU performance matching at least the Ryzen 5 3600 or 3700X, and a faster "Vega" based iGPU. It wouldn't surprise us if "Dali" is a monolithic 7 nm die with two "Zen 2" CPU cores and a tiny iGPU with 3-4 compute units. "Renoir," on the other hand, could be an MCM with an 8-core "Zen 2" chiplet and an enlarged I/O controller die that has the iGPU. "Dali" could see the light of the day only in 2020, by which time TSMC could substantially increase its 7 nm volumes and clear the decks for its new 7 nm EUV mass-production.

AMD updated its technology roadmaps to reflect a 2020 launch window for its upcoming CPU and graphics architectures, "Zen 3" and RDNA2. The two will be based on 7 nm+ , which is AMD-speak for the 7 nanometer EUV silicon fabrication process at TSMC, that promises a significant 20 percent increase in transistor-densities, giving AMD high transistor budgets and more clock-speed headroom. The roadmap slides however hint that unlike the "Zen 2" and RDNA simultaneous launch on 7th July 2019, the next-generation launches may not be simultaneous.

The slide for CPU microarchitecture states that the design phase of "Zen 3" is complete, and that the microarchitecture team has already moved on to develop "Zen 4." This means AMD is now developing products that implement "Zen 3." On the other hand, RDNA2 is still in design phase. The crude x-axis on both slides that denotes year of expected shipping, too appears to suggest that "Zen 3" based products will precede RDNA2 based ones. "Zen 3" will be AMD's first response to Intel's "Comet Lake-S" or even "Ice Lake-S," if the latter comes to fruition before Computex 2020. In the run up to RDNA2, AMD will scale up RDNA a notch larger with the "Navi 12" silicon to compete with graphics cards based on NVIDIA's "TU104" silicon. "Zen 2" will receive product stack additions in the form of a new 16-core Ryzen 9-series chip later this month, and the 3rd generation Ryzen Threadripper family.

AMD's next-generation "Renoir" APU, which succeeds the company's 12 nm "Picasso," will be the company's truly next-generation chip to feature an integrated graphics solution. It's unclear as of now, if the chip will be based on a monolithic die, or if it will be a multi-chip module of a 7 nm "Zen 2" chiplet paired with an enlarged I/O controller die that has the iGPU. We're getting confirmation on two key specs - one, that the iGPU will be based on the older "Vega" graphics architecture, albeit with an updated display engine to support the latest display standards; and two, that the processor's memory controller will support the latest LPDDR4X memory standard, at speeds of up to 4266 MHz DDR. In comparison, Intel's "Ice Lake-U" chip supports LPDDX4X up to 3733 MHz.

Code-lines pointing toward "Vega" graphics with an updated display controller mention the new DCN 2.1, found in AMD's new "Navi 10" GPU. This controller supports resolutions of up to 8K, DSC 1.2a, and new resolutions of 4K up to 240 Hz and 8K 60 Hz over a single cable, along with 30 bits per pixel color. The multimedia engine is also suitably updated to VCN 2.1 standard, and provides hardware-accelerated decoding for some of the newer video formats, such as VP9 and H.265 at up to 90 fps at 4K, and 8K up to 24 fps, and H.264 up to 150 fps at 4K. There's no word on when "Renoir" comes out, but a 2020 International CES unveil is likely.

AMD in its 2nd generation EPYC processor launch event announced that it has completed the design phase of its next-generation "Zen 3" CPU microarchitecture, and is currently working on its successor, the "Zen 4." AMD debuted its "Zen 2" microarchitecture with the client-segment 3rd generation Ryzen desktop processor family, it made its enterprise debut with the 2nd generation EPYC. This is the first x86 CPU microarchitecture designed for the 7 nanometer silicon fabrication process, and is being built on a 7 nm DUV (deep ultraviolet) node at TSMC. It brings about double-digit percentage IPC improvements over "Zen+."

The "Zen 3" microarchitecture is designed for the next big process technology change within 7 nm, EUV (extreme ultraviolet), which allows significant increases in transistor densities, and could facilitate big improvements in energy-efficiency that could be leveraged to increase clock-speeds and performance. It could also feature new ISA instruction-sets. With "Zen 3" passing design phase, AMD will work on prototyping and testing it. The first "Zen 3" products could debut in 2020. "Zen 4" is being designed for a different era.

At a launch event today, AMD was joined by an expansive ecosystem of datacenter partners and customers to introduce the 2nd Generation AMD EPYC family of processors that deliver performance leadership across a broad number of enterprise, cloud and high-performance computing (HPC) workloads. 2nd Gen AMD EPYC processors feature up to 64 "Zen 2" cores in leading-edge 7 nm process technology to deliver record-setting performance while helping reduce total cost of ownership (TCO) by up to 50% across numerous workloads. At the event, Google and Twitter announced new 2nd Gen AMD EPYC processor deployments and HPE and Lenovo announced immediate availability of new platforms.

"Today, we set a new standard for the modern datacenter with the launch of our 2nd Gen AMD EPYC processors that deliver record-setting performance and significantly lower total cost of ownership across a broad set of workloads," said Dr. Lisa Su, president and CEO, AMD. "Adoption of our new leadership server processors is accelerating with multiple new enterprise, cloud and HPC customers choosing EPYC processors to meet their most demanding server computing needs."

AMD invited TechPowerUp to their launch event and editor's day coverage of Zen 2 EPYC processors based on the 7 nm process. The event was a day-long affair which included product demos and tours, and capped off with an official launch presentation which we are able to share with you live as the event goes on. Zen 2 with the Ryzen 3000-series processors ushered in a lot of excitement, and for good reason too as our own reviews show, but questions remained on how the platform would scale to the other end of the market. We already knew, for example, that AMD secured many contracts based on their first-generation EPYC processors, and no doubt the IPC increase and expected increased core count would cause similar, if not higher, interest here. We also expect to know shortly about the various SKUs and pricing involved, and also if AMD wants to shed more light on the future of the Threadripper processor family. Read below, and continue past the break, for our live coverage.21:00 UTC: Lisa Su is on the stage at the Palace of Fine Arts events venue in San Francisco to present AMD's latest developments on EPYC for datacenters, using the Zen 2 microarchitecture.21:10 UTC: AMD focuses not just on delivering a single chip, but it's goal is to deliver a complete solution for the enterprise.

AMD's president and CEO Dr. Lisa Su was talking during AMD's Q2 earnings Q&A conference and got asked a very interesting question. When prompted about high end Navi GPUs, Dr. Su answered with "I would say they are coming. You should expect that our execution on those are on track and we have a rich 7 nm portfolio beyond the products that we have already announced in the upcoming quarters."

This answer gives us hope to see more powerful Navi GPUs possibly by the end of the year, meaning that AMD's answer to Turing is almost ready. As we saw earlier in the rumors, we might get additional higher end GPU models in form of alleged RX 5800 and RX 5900, with XT variants available for both of those models. The RX 5800 is supposed to utilize a new GPU core called Navi 12, while the core for RX 5900 is still unknown.

AMD is planning to surprise Intel by unveiling its 3rd generation Ryzen Threadripper HEDT (high-end desktop) processor lineup around the same time Intel launches its 10th generation Core "Cascade Lake-X" processor and the "Glacial Falls" HEDT platform, according to sources in the motherboard industry, speaking with DigiTimes. We're fairly sure the sources aren't referring to AMD's 16-core Ryzen 9 3950X processor, because it has already been announced and will be available in September.

The 3rd generation Ryzen Threadripper will likely be a derivative of the company's "Rome" multi-chip module, and compatible with existing socket TR4 motherboards with a BIOS update, although a new chipset could also be launched to enable PCI-Express gen 4.0. AMD has the option to deploy up to 64 CPU cores across eight 7 nm "Zen 2" chiplets, while the 12 nm I/O controller die will be likely reconfigured for the HEDT platform with a monolithic 4-channel DDR4 memory interface and 64 PCIe gen 4.0 lanes. It's capable of 8 memory channels on the 2nd generation EPYC.

During Fortune's Brainstorm Tech conference in Aspen, Colorado, Intel's CEO Bob Swan took stage and talked about the company, about where Intel is now and where they are headed in the future and how the company plans to evolve. Particular focus was put on how Intel became "data centric" from "PC centric," and the struggles it encountered.

However, when asked about the demise of Moore's Law, Swan detailed the aggressiveness that they approached the challenge with. Instead of the regular two times improvement in transistor density every two years, Swan said that Intel has always targeted better and greater densities so that it would stay the leader in the business.