The world's leading brand for memory modules and flash memory - ADATA Technology and its gaming brand XPG (Xtreme Performance Gear) announced today that its DDR5 CUDIMM memory has been certified compatible by the world's four leading motherboard brands - ASRock, ASUS, Gigabyte and MSI's and included on their respective Qualified Vendor Lists (QVL) while supporting the latest Intel Core Ultra 2 series desktop processors.

XPG DDR5 CUDIMM gaming memory modules can be paired with Intel Z890 series motherboards from ASRock, ASUS, Gigabyte and MSI. As a result of close three-party collaboration, it delivers excellent performance at all frequencies whether adopting of two or four CUDIMM memory kits. Stable high-speed performance reaches up to 9600 MT/s, significantly boosting transmission speed while system operation remains smooth and all without the need to tediously adjust system parameters. XPG DDR5 CUDIMM also demonstrates ADATA's unique IC selection technology and CKD (Clock Driver) are key components reinforcing stability and efficiency and driving memory transfer speeds to new levels. In order to further strengthen its DDR5 memory product line, ADATA announced the launch of the ADATA DDR5 CUDIMM 6400 memory module. At the same time, XPG also plans to launch new LANCER RGB DDR5 CUDIMM gaming memory at four ultra-high-speed clocks: 8,400, 8,800, 9,200 and 9,600 MT/s.

ADATA has launched the Legend 860 M.2 NVMe Gen 4 SSD series, aimed at mid-range users seeking a fast and reliable storage solution for PCs, laptops, or PS5 devices. Utilizing the PCIe Gen 4 x4 interface, the Legend 860 delivers sequential read and write speeds of up to 6,000 MB/s and 5,000 MB/s, respectively—three times faster than standard PCIe Gen 3 SSDs and ten times faster than SATA SSDs.

The lineup consists of three models with capacities of 500 GB, 1 TB, and 2 TB, each equipped with a slim aluminium heatsink. The ADATA Legend 860 utilizes 3D NAND flash chips and incorporates an SLC cache algorithm, HMB (Host Memory Buffer) technology, and an LDPC (Low-Density Parity Check) error correction mechanism, providing up to 640 TB TBW (Terabytes Written). ADATA offers a 5-year limited warranty, though pricing has not yet been disclosed.

XPG, a fast-growing provider of systems, components, and peripherals for Gamers, Esports Pros, and Tech Enthusiasts and gaming brand of ADATA Technology, the world's leading brand for memory modules and flash memory, has now expanded its product line and officially entered the field of workstations. Today XPG announced the launch of the first AICORE Overclocked DDR5 R-DIMM, with a maximum speed of 8,000 MT/s and a capacity of 32 GB, making challenging large-capacity workstation memory expansions a breeze. AICORE is built for improving overall system performance, process complex data, multi-tasking more quickly, and maximize the efficiency of AI computing.

Born for High-Speed Computing and AI Development
R-DIMM adopts a Register Clock Driver (RCD) and is characterized by high-speed, low-latency, and enhanced operational stability. AICORE Overclocked R-DIMM memory is designed for high speed and stability and is perfect for large-scale data processing, AI generation, 3D rendering and graphics, video post-production editing, and multitasking. AICORE is designed for securities markets that emphasize real-time data analysis and data science professionals or expert image creators to accelerate work efficiency and quickly complete various large-scale projects. AICORE Overclocked DDR5 R-DIMM memory has a maximum speed of 8,000 MT/s which is 1.6 times faster than standard R-DIMM memory, delivering more powerful performance to meet the rigorous speed requirements of high-end systems.

TrendForce's latest investigations reveal that the combined market share of the top five SSD module makers in the retail sector has surged from 59% in 2022 to 72% in 2023, reinforcing a trend of larger companies expanding their dominance. These major players are leveraging their scale to negotiate more favorable prices for NAND Flash, boosting their competitive edge and ensuring they have sufficient resources to stock up in preparation for market shifts.

TrendForce reports that shipments of branded SSDs in the retail market reached 180 million units in 2023, marking a YoY growth of 3.7%. Reflecting on the SSD market for that year, it appeared that many PCs purchased during the pandemic had entered their typical replacement cycle.

The world's leading brand for memory modules and flash memory and long-term Intel partner, ADATA Technology and its gaming brand XPG (Xtreme Performance Gear) today announced the launch of new DDR5 CUDIMM memory, including XPG LANCER RGB DDR5 CUDIMM gaming memory and ADATA DDR5 CUDIMM memory, supporting the latest Intel Core Ultra Desktop Processor (Series 2) and providing a variety of options that satisfy the needs of extreme gamers and general users.

DDR5 CUDIMM features a base clock speed starting at 6,400MT/s and is equipped with a key CKD (Clock Driver) component which ensures stable operation at high frequencies. It is compatible with existing Intel Core Desktop Processors and memory speed can easily top 9,000MT/s when overclocked on a Z890 motherboard. This DDR5 CUDIMM is expected to be a powerful next-generation DDR5 memory, greatly improving the processing efficiency and stability of desktop platforms.

The world's leading brand for memory modules and flash memory - ADATA Technology's gaming brand, XPG, a fast-growing provider of systems, components, and peripherals for Gamers, Esports Pros, and Tech Enthusiasts announced today the launch of the LANCER NEON RGB DDR5 gaming memory module. LANCER NEON RGB adopts an exclusive heat dissipating PCB coating to greatly increase heat dissipation area, improve heat dissipation efficiency, and mitigate memory heat generation when running at high clock speeds. Enjoy extreme overclocking while maintaining high performance and never compromise on speed.

At the same time, LANCER NEON RGB boasts an RGB illuminated area of 60% and employs environmentally friendly processes inside and out, including a heatsink made from PCR (post-consumer recycled) plastic, IMR (In-Mold Roller) transfer technology, and FSC certified packaging. An outer box made from sustainable paper paired with an environmentally friendly PCR plastic inner tray fully embraces the ideals of environmental protection and carbon reduction.

ADATA Technology Co., Ltd., the world's leading memory brand, launches its latest SC750 external solid-state drive (SSD) which supports the USB 3.2 Gen 2 transmission interface with read/write speeds up to 1,050/1,000 MB/s. Adopting the mainstream Type-C connector, the SC750 requires no data cable and can be directly connected to a mobile phone or tablet for plug-and-play access. It supports the latest iPhone 15 series and Android Type-C smartphones. The SC750 combines performance and portable design to meet the ever-increasing demand for transfer speed and storage produced by today's hectic lifestyles, making it a convenient companion for video creators who often venture outdoors to collect resources. The SC750 cuts down on wait time when transferring large files and improves efficiency when multitasking with several project files simultaneously.

The SC750 external SSD inherits the exterior design of the popular SE880, which sports a greatly reduced form factor and eliminates the need for an additional data cable. Users no longer need to worry about finding a matching data cable when busy working on a project. About the size of a flash drive, the SC750 is easy to carry, lightweight, and does not take up much space. It is perfect for work or travel. Slide out its Type-C connector to get started transferring large files instantly or edit and access these files directly on the SC750 to greatly improve work efficiency.

XPG, a fast-growing provider of systems, components, and peripherals for Gamers, Esports Pros, and Tech Enthusiasts, has launched the XPG INVADER X BTF Mid-Tower chassis to markets around the globe. After the award-winning success of the original XPG INVADER X case, the world is now graced with a new, updated version, adopting reverse-connector motherboard compatibility. As one of the earliest members of the ASUS BTF ALLIANCE, XPG leads the charge into a world of immaculate PC builds with ocean-view tempered glass panels and completely hidden cables. On top of ATX BTF compatibility, INVADER X BTF also supports up to ten 120 mm fans, five of which come pre-installed.

The Future is Now
Gone are the days of messy cables ruining the aesthetics of high-end builds. No longer must your system be hidden behind opaque panels, shrouds, and a collection of zip ties. INVADER X BTF leverages the new reverse-connector conventions of ASUS BTF ALLIANCE components coupled with front and side 3 mm tempered glass panels to deliver stunning views of your system from any and every angle. With additional accessories, also provided by XPG, PC builders can build systems that are beautiful, personal, and highly capable.

Handheld gaming devices are a dime a dozen these days and more and more companies are joining the fray on almost a weekly basis. At Computex, XPG was showing its upcoming handheld gaming device—currently known as the NIA—and it has several interesting features that most of their competitors haven't mentioned so far. The potentially most interesting feature that XPG has implemented is an LPCAMM2 module with support for up to 64 GB of LPDDR5x memory. XPG didn't list how much RAM the NIA will ship with, but 16 or 32 GB seems like the logical choices.

The device will be powered by AMD's Phoenix APU, but no details were given. XPG has implemented support for foveated rendering, which the company claims is an exclusive feature. This is courtesy of a front-facing camera with eye tracking, but it's unclear how exactly it'll work, since it won't be exactly the same as in a VR headset. The NIA will ship with an XPG Gammix S55 SSD, which is an M.2 2230 PCIe 4.0 NVMe drive with sizes of up to 2 TB. XPG also claims that the NIA is built for a "circular computing product lifecycle" whatever that means, but we're guessing it has something to do with using recycled materials and being recyclable. The screen size of the 1080p, 120 Hz display wasn't mentioned, but the screen can be tilted for better ergonomics and is supposed to deliver up to 500 nits brightness. The NIA also has a built-in kickstand.

Project XPG NeonStorm PCIe Gen 5 SSD, which won an award at Computex, has a dual active cooling system with an aluminium air duct, liquid cooling, and dual fans. This increases the Gen 5 SSD's cooling efficiency by 10%. The Legend 970 Pro PCIe Gen 5 SSD has read/write speeds up to 14,000/12,000 MB/s, using an aluminium heatsink and a micro fan for better heat dissipation.

The XPG Lancer Neon RGB DDR5 memory module uses a heat dissipating coating on the PCB, a heatsink made of 50% recycled materials, and an eco-friendly manufacturing process. It's the first eco-friendly RGB memory module, performing up to 8,000 MT/s with 16 GB and 24 GB capacities.

ADATA Technology, the world's leading brand for memory modules and flash memory, will team up with its gaming brand XPG and industrial-grade embedded storage brand ADATA Industrial for Computex Taipei 2024 from June 4 to June 7. ADATA's theme for 2024 is "Innovate Today, Embrace Tomorrow." At the show, ADATA will present products in three major categories tied to their vision and commitment to leading innovation and sustainable initiatives. These categories include "AI Computing," "Sustainability and Innovation," and "Immersive Reality."

ADATA and XPG brand ambassador Mera will make a surprise appearance in the "AI Computing" section. ADATA will showcase the world's first AI gaming laptop equipped with an SSD of up to 24 TB and 96 GB of DRAM, overclocked DDR5 8000 R-DIMM for handling massive computing workloads and data processing, and a complete line of Express Card storage solutions that promote AI mobile devices. ADATA will also display various high performance products that continue to lead sustainability trends in the "Sustainability and Innovation" section including the industry's only comprehensive innovative cooling solutions, and a full range of green storage products made of recycled materials. Other highlights will include the 2024 iF Design Award winning INVADER X family of gaming chassis, and gaming components that combine optimized heat dissipation, environmental awareness, and the application of future technologies. The "Immersive Reality" section features a new gaming handheld PC, the XPG NIA, a full range of gaming products and peripherals, and the industry's most powerful external SSD solutions and mobile peripherals. In order to make it easier for consumers around the world to participate in the exhibition, ADATA will simultaneously launch its online COMPUTEX event from June 4, allowing consumers to experience ADATA's full range of industry-leading products.

Following in the wake of an earthquake that struck on April 3rd, TrendForce undertook an in-depth analysis of its effects on the DRAM industry, uncovering a sector that has shown remarkable resilience and faced minimal interruptions. Despite some damage and the necessity for inspections or disposal of wafers among suppliers, the facilities' strong earthquake preparedness of the facilities has kept the overall impact to a minimum.

Leading DRAM producers, including Micron, Nanya, PSMC, and Winbond had all returned to full operational status by April 8th. In particular, Micron's progression to cutting-edge processes—specifically the 1alpha and 1beta nm technologies—is anticipated to significantly alter the landscape of DRAM bit production. In contrast, other Taiwanese DRAM manufacturers are still working with 38 and 25 nm processes, contributing less to total output. TrendForce estimates that the earthquake's effect on DRAM production for the second quarter will be limited to a manageable 1%.

XPG, a fast-growing provider of systems, components, and peripherals for Gamers, Esports Pros, and Tech Enthusiasts, today launched multiple products for the discerning gamer on a budget. In hopes of fulfilling the needs of PC builders of all levels, XPG has delivered a new line of entry level Gold efficiency power supply units and ARGB PWM fans. With the new XPG CORE REACTOR II VE and XPG VENTO PWM fans, upgrading your system has never been easier.

CORE REACTOR II VE
While it is always a challenge to strike a balance between cost and performance, XPG always puts the needs of end users first. Although the CORE REACTOR II VE is being sold as a Value Edition product, the specs on this PSU are anything but cheap. Inspired by the design of the award winning CORE REACTOR II, through the use of XPG's exclusive PSU topology, this power supply still delivers performance that surpasses Intel ATX 3.1 standards. Between the Gold efficiency, DC-DC circuit design, and the dedicated 12V-2x6 connector, this power supply unit is perfect for your modern gaming needs. With 650 W, 750 W, and 850 W models available, XPG CORE REACTOR II VE is the perfect foundation for a current gen build.

The world's leading memory module and flash memory brand, ADATA Technology's e-sports brand XPG specializes in high-performance and stylishly designed e-sports products that cater to gamers, tech enthusiasts, and overclockers. High temperatures generated by high-speed overclocked gaming memory affects system stability, performance, and reliability. Therefore, XPG is leading the industry in applying PCB (printed circuit board) thermal coating technology to overclocked memory, effectively reducing temperatures by more than 10%. This new PCB thermal coating technology will be introduced in the second quarter on high-end overclocked DDR5 gaming memory with a clock speed of 8000MT/s or more, to ensure stable and efficient operation in this grade of memory.

Revolutionary heat dissipating coating effectively reduces temperatures by more than 10%
PCB heat dissipation adopts technology that integrates heat conduction, heat radiation, and insulation into an optimized solder mask which not only insulates, but also dissipates and conducts heat to achieve a superior cooling effect. Compared with standard overclocked DDR5 gaming memory heatsinks, this coating's thermal radiation and heat dissipation effects greatly increase dissipation area and efficiency, slowing heat generation at high clock speeds. Real-world testing demonstrate a 8.5°C temperature reduction in overclocked DDR5 memory with PCB heat dissipating coating technology compared to standard overclocked memory and an enhanced heat dissipation efficiency of 10.8%. Users can enjoy extreme overclocking while maintaining high performance, meeting all challenges without compromise.

XPG, a fast-growing provider of systems, components, and peripherals for Gamers, Esports Pros, and Tech Enthusiasts, today launched the latest generation of the XPG XENIA 15G gaming laptop to markets around the globe. Designed to be an all-around price to performance laptop for gamers, developers, and content creators, XPG has worked tirelessly to deliver a product that will meet all your needs without breaking the bank. With XENIA 15G (2024), no obstacle is too great.

Do Anything and Everything
XENIA 15G is the culmination of many years of gaming laptop development. In that time, countless hours of research and testing have gone in to produce a cost-effective laptop for the modern user. With a 14th Gen Intel Core i7-14700HX processor, up to an NVIDIA GeForce RTX 4070 series GPU, high-speed ADATA DDR5 DRAM, and a 15.6" FHD IPS 144 Hz display, you can play anything and do everything without sacrificing performance.

ADATA's XPG department has been working on a consolidated solution for wireless gaming peripherals—and the resultant MOJO Ecosystem has been revealed to attendees at CES 2024. It is advertised as the world's most advanced wireless system for gaming mice, keyboards and headsets. Ultra-Wideband (UWB) technology has been utilized—this avoids the classic cases of narrowband signals being interfered with or jammed entirely. XPG demoed a single dongle solution alongside a lightweight MOJO Wireless Mouse (8000 Hz polling rate, with low latency), MOJO Wireless Headset and what we presume to be a MOJO Wireless TKL gaming keyboard.

XPG has devised a patented positional tracking algorithm that they reckon allows for easy setups and real time effect updates in 3D space. Their detection system is said to allow a greater number of adaptive lighting effects based on player movement. The XPG MOJO Wireless Headset is capable of controlling in-game fields of view (FOV) via tracking of head orientation, it also boasts a 5 ms response time.

ADATA has showcased a rather interesting XPG HYBRID COOLER at CES 2024 which actually integrates an AIO solution into the size of your standard air cooler, packing pump, loop, and a radiator into a single unit. The new cooler promises to be smaller and lighter than a standard AIO cooler but more efficient than an air cooler.

The new HYBRID COOLER is a patented dual-fan CPU cooler that can cool CPUs with TDP of up to 280 W. It will support both standard as well as Intel Xeon and AMD Ryzen Threadripper PRO sockets, and uses two high-performance 120 mm VENTO PRO PWM fans by Nidec. The entire unit is slightly taller than a 120 mm fan and looks pretty neat, but unfortunately, it is still just a concept and ADATA did not have it running inside a system. Hopefully, we'll see it officially launched soon and to see how well it compares to standard AIOs and standard air coolers.

ADATA Industrial, the world's leading brand for industrial-grade embedded storage, officially released today its SATA 31D series of industrial-grade solid-state drives including 2.5-inch ISSS31D, M.2 2280 IM2S31D8, and M.2 2242 IM2S31D4, designed for retail terminals and embedded systems.

The SATA 31D series of industrial-grade SSDs utilize 112-layer 3D TLC flash memory developed by WDC, boasting a P/E Cycle of 3,000 which is comparable to MLC. The 31D series also offers a variety of ultra-thin and compact mainstream specifications such as SATA 2.5-inch, M.2 2280, M.2 2242, and various capacity options from 128 GB to 2 TB. 112-layer 3D NAND (BiCS5) 31D series SSDs all support thermal throttling technology, which reduces SSD transmission performance in stages to effectively mitigate the risk of data damage due to overheating. Furthermore, a LDPC ECC error correction mechanism and End-to-End Data Protection technology ensure reliable data transfer and improve data integrity. The 31D series is eminently suitable for POS systems, information kiosks, digital signage, and embedded equipment.

ADATA Technology, the world's leading memory brand, has launched its latest SD810 external solid state drive, featuring triple IP68 waterproof, dustproof, and MIL-STD shockproof protection. The drive is equipped with a USB 3.2 Gen 2 x2 transmission interface with a read/write speed of up to 2000 MB/s and adopts the mainstream Type-C interface. In addition to supporting the latest series of iPhone 15 smartphones, it is also perfect for photographers or video creators who work outdoors on a regular basis. The SD810 external SSD delivers fast transfer and backup of large audio and video files while guarding against accidents and allaying the challenges of harsh working environments to perfectly protect your precious files.

The SD810 external SSD supports the USB 3.2 Gen 2 x2 high-speed transmission interface with read/write speeds up to 2000 MB/s. In order to prevent the high temperatures generated by high-speed transfer from affecting performance and stability, the body of the SD810 is constructed from aluminium alloy and its unique structure improves heat dissipation to maintain stable transfer performance even during continuous operation. Users can also edit and access large files directly on the SD810, increasing work efficiency. In addition, the SD810's elegant aluminium body is smaller than a credit card, making it lightweight, space-saving, and very convenient to carry whether you are working or traveling.

TrendForce has issued its latest findings, indicating that the global SSD market has rectified its supply and demand dynamics in 2022, following a resolution in the shortage of master control ICs that had hampered the market in 2021. Despite the normalization of supply, global SSD shipments witnessed a decline, with only 114 million units shipped in 2022—a 10.7% decrease from the prior year.

The top three SSD shipment leaders of 2022 were Kingston, ADATA, and Lexar, with Kingston and ADATA maintaining solid advantages and experiencing growth in market share over 2021. Lexar's growth was attributed to an aggressive push for revenue in anticipation of going public. Kimtigo, in 2022, made significant strides in expanding into industrial control and OEM markets, which in turn boosted its shipment volume and market share. Netac maintained its competitive edge in the SSD market alongside securing several government orders in the enterprise SSD sector, keeping its market share and ranking consistent with the previous year.

XPG, a fast-growing provider of systems, components, and peripherals for Gamers, E-sports Pros, and Tech Enthusiasts, today launched the XPG INVADER X Mid-Tower chassis to markets around the globe. Among the many cases from XPG, this model, more than any other to date, focuses on the aesthetic side of PC building. With panoramic viewing in mind, this chassis offers numerous features that make it easier to build a system that you'll feel compelled to show off. INVADER X is not a case you hide away under your desk rarely to be seen. In fact, it might be more appropriate to call this chassis a "showcase."

XPG's Exoskeleton design language has always focused on maximizing function without sacrificing form. INVADER X stays true to this calling, delivering a case that allows the form of your system to shine from any angle. With the frameless 3 mm tempered glass front and side panels, you can appreciate your system in all its RGB glory from any angle. Think of this case as an aquarium for your PC. With the highly convenient and easy-to-clean magnetic dust filters, maintaining the beauty of your system is never a problem. With INVADER X, you're not just building a machine, you're building a gaming ecosystem.

Consumer demand for transferring large high-quality files has increased significantly due to trends in AI computing. In compliance with EU regulations, USB4 is set to become the transmission standard for a new generation of devices. Quick and convenient file transfer between various devices has undoubtedly focused consumers' attention and the time for a new generation USB4 interface to unify market specifications has arrived. ADATA, the world's leading memory brand, has launched its first USB4 SE920 external SSD, which supports Thunderbolt 3 & 4 and is backward compatible with USB 3.2 and USB 2.0. Performance can reach up to 3,800 MB/s per second. In addition, it is equipped with a mainstream Type-C interface, making it easy to transfer large multimedia files across devices or quickly export videos shot on mobile phones. The SE920 external SSD features a patented spring-loaded chassis and built-in fan to provide consumers with the ultimate in high-speed performance.

USB4 supports transmission speeds up to 40 Gbps but high speeds inevitably generate high temperatures which can became a problematic issue for users. The SE920 USB4 external SSD adopts a proprietary patented active dissipation design and a built-in micro fan. Push on the telescoping casing to activate the fan and extends the chassis to increase interior space for air circulation and quickly discharge heat. Compared with fanless products with the same specifications, this patented mechanism can significantly reduce temperatures by 10% and maintain stable data transmission. Press the casing again to retract the chassis. When retracted, the SE920 is lightweight and easy to carry. This unique and ingenious design makesthe SE920 USB4 external SSD an amazing addition to anyone's everyday carry kit.

TrendForce reports that consumer appetite for electronic products took a hit from high inflation, with global DRAM module sales in 2022 reaching US$17.3 billion—a 4.6% YoY decline. Revenue performance varied significantly among module makers due to the different domains they supply.

TrendForce's data indicated that the top five memory suppliers in 2022 accounted for 90% of total sales, with the top ten collectively capturing 96% of global market revenue. Kingston maintained its dominant market share of 78%. Even with a slight revenue dip, it held steadfast to its position as the global leader. Despite poor end-market demand, Kingston's robust brand scale, along with its comprehensive product supply chain, limited its revenue decline to a modest 5.3%, keeping it firmly at the top of market share rankings.

ADATA, the world's leading brand for memory modules and flash memory and Intel recommended partner, in conjunction with its e-sports brand XPG (Xtreme Performance Gear), announces that XPG's complete range of DDR5 memory modules and ADATA Gen 5 SSDs fully support the latest Intel Core processor (14th gen) platform. The recent launch of this latest 14th Gen desktop processor platform emphasized its placing as the fastest processor in the world. Not only does this processor multi-task gaming and heavy workloads, but it also delivers amazing across-the-board performance, in line with the brand appeal fostered by ADATA and XPG. Together, we are committed to providing e-sports enthusiasts and creators with the fastest and most reliable experience available.

XPG DDR5 memory and ADATA PCIe 5.0 SSDs fully support Intel's latest desktop platform
ADATA has partnered with Intel and the world's foremost motherboard brands to conduct compatibility testing on XPG DDR5 memory modules and ADATA PCIe 5.0 SSDs in preparation for Intel Core processors (14th gen). Although the most common clock speed in the DDR5 market is currently 5600MT/s, XPG LANCER DDR5 memory modules successfully achieved an ultra-high clock speed of 8,000MT/s during testing and also support Intel XMP Ready to successfully overclock from 8,400MT/s to 9,900MT/s. The ADATA LEGEND 970 PCIe 5.0 SSD was tested at up to an ultra-high 10,000 MB/s sequential read and write speed with 4K random write speed reaching up to 1,400K, delivering a smooth and ultra-efficient desktop experience to gamers and creators alike.

XPG, a fast-growing provider of systems, components, and peripherals for Gamers, Esports Pros, and Tech Enthusiasts, today launched the XPG BATTLECRUISER II Super Mid-Tower chassis to markets around the globe. Building upon the success of the first generation premium XPG chassis, this E-ATX case features a long list of improvements based on feedback from the community, social listening from multiple platforms, media review recommendations, and key upcoming trends in both chassis design and cooling offerings and improvements.

XPG BATTLECRUISER II prioritizes convenience in the building and maintenance process, delivering an improved PCDIY experience. In addition to the 4 glass panels, there are 3 easy-to-clean magnetic dust filters, an adjustable GPU holder, and an improved Smart Cable Management design. It's everything you loved about the original award-winning XPG BATTLECRUISER with an updated touch. For more demanding builders, there's even a higher end version that comes paired with XPG PRIME BOX, for unlimited lighting customization options and thermal design control via XPG PRIME ecosystem management software.