ADATA Technology Co., Ltd., the world's leading memory brand, announced a theme of "Dazzling Tomorrow" for its annual creator event " You Are a Rising Star," held from today until October 13th. Use creative techniques such as graphic design, 3D rendering, and video to weave your own moving story. Share your pieces publically on Instagram and you will have an opportunity to win excellent prizes valued at more than USD$5,700.

With the generational change of processors and chipsets, DDR5 memory entering the mainstream, the rapid rise of Gen 4 SSDs and a migration to the Gen 5 era, coupled with the rise of generative AI tools, creator software and hardware must also improve in leaps and bounds. ADATA's online creator contest officially enters its fourth year and continues to provide a platform for talent in the fields of "graphic design," "video creation," "animation," and "photography" to unleash their creativity. This year, we continue our commitment to the spirit of "Build to Create" to produce better solutions for content creators, including major international award winning high-end and comprehensive products such as the LEGEND 970 Gen 5 SSD, ACE series memory module, SE920 USB4 external SSD, and other devices to inspire creativity.

XPG, the e-sports arm of ADATA, the world's leading memory brand, specializes in creating high-performance and stunningly designed e-sports products for e-sports enthusiasts, technology-minded gamers, and overclockers. XPG today announced the launch of LANCER BLADE RGB DDR5 and LANCER BLADE DDR5 memory, emphasizing its low-profile heatsink design, freeing motherboard assembly from heatsink height, and providing a profile that is perfect for small cases with limited space. The XPG LANCER BLADE series includes two models with top speeds of 6000MT/s and 6400MT/s.

By utilizing high-quality carefully selected Hynix chips, these memory modules are low latency and easy to overclock while allowing gamers to enable a hassle-free speed boost with one-click overclocking. At the same time, The XPG LANCER BLADE series supports Intel XMP 3.0 and AMD EXPO and is compatible with the latest Intel and AMD platforms, ensuring excellent memory stability and a smoother operating experience when multitasking or running large-scale applications. In addition, the XPG LANCER BLADE series adopts a high price-performance strategy, combined with excellent operation and quality, it is definitely the foremost choice when gamers upgrade their systems.

As processors and chipsets move into a new generation, many motherboard manufacturers have launched latest-generation motherboards that have allowed the consumer market to embrace a new generation of PCIe 5.0 Solid-State Drives (SSD). ADATA Technology Co., Ltd., the world's leading memory brand, today launched its LEGEND 970 SSD. The LEGEND 970 can reach maximum sequential read/write speeds of 10,000/10,000 MB per second. Its most unique feature is a double-layer aluminium alloy heatsink with built-in micro-fan and surface crystallization that forms a patented active air-cooling system. The surface crystallization improves thermal conductivity, significantly reducing temperatures by 10% compared with fanless heatsinks to maintain stable performance during extended high-speed operation. The LEGEND 970's R&D, design, and superior cooling mechanism will be the benchmark of a new generation of storage products and it is expected to become the most influential PCIe Gen 5 storage solution in the consumer market.

ADATA ushers in a new era with its patented heat dissipation solution! From market consensus, it has become commonly accepted that active cooling is required for timely heat dissipation during high-speed PCIe 5.0 data transmission to ensure high temperatures do not affect reading and writing or slow down the system. The LEGEND 970 adopts a double-layer extruded aluminium heatsink design which features dense air ducts to divert hot and cold air. When heat is conducted upward, the rotation of the built-in micro fan circulates the confluence of hot and cold air and quickly expels exhaust heat from both ends of the extruded aluminium fins. At the same time, the LEGEND 970 increases heat dissipation through the addition of "surface crystallization " on the aluminium heatsink surface, increasing overall air contact area and maximizing the heat dissipation efficiency of its air cooling system. This unique "active heat dissipation" design significantly reduces temperatures by 10% compared to fanless heatsinks. More importantly, it can withstand high temperature stress tests and maintain stable performance even after long-term high-speed operation.

In keeping with Framework's philosophy, the Framework Laptop 16 has socketed memory and storage, making it easy for you to choose what you need on day one and upgrade to more any time later. Our pre-built configurations have set combinations of memory and storage, while on DIY Edition, you can choose any of the modules we offer in the Marketplace or bring your own if you prefer. We've taken both memory and storage to the next level on Framework Laptop 16. For memory, we've created new semi-custom Framework-branded DDR5-5600 modules. For storage, we have two M.2 slots, as well as the ability to add two more in the Expansion Bay for colossal storage capacity.

One core challenge we aimed to solve for memory on the Framework Laptop 16 was being able to offer the same modules for pre-built systems, DIY Edition, and the Framework Marketplace. Historically, we needed to source separate "OEM" modules from Samsung, SK Hynix, and Micron for use in our factory, and "Retail" modules from Crucial to offer in DIY Edition and the Marketplace. Instead, we worked with memory maker ADATA to create custom-label modules that we can use across all areas. Currently, we're leveraging SK Hynix DDR5-5600 memory chips for these modules, but may use other chips that meet the performance bar in the future as well.

ADATA and XPG, its gamer focused sub-brand, unveiled a plethora of memory and storage products at the 2023 Computex. We begin with PC memory, and we see the company showing off its upcoming models of the XPG DDR5 memory targeting enthusiasts. These include the XPG Caster RGB DDR5, which is capable of DDR5-9000, the XPG Lancer RGB ROG edition, capable of DDR5-7200, and the company's overclocking-capable DDR5-6400 R-DIMM targeting Xeon W workstations. The company also showed us "Project NeonStorm." This is an innovative new SSD cooling system that uses a self-contained liquid cooler.

The way this liquid cooler works is that a high conductivity heat spreader transfers heat to a chamber containing a coolant fluid. This coolant heats up an aluminium alloy tube via convection. The inner wall of this tube serves as an airflow channel for a 20 mm fan. ADATA claims that this solution offers "over 20% better heat dissipation compared to SSDs without water cooling." This is also one of the very first SSDs we've seen that utilize Silicon Motion SM2508 PCIe Gen 5 NVMe controller. ADATA claims sequential reads of up to 14 GB/s, with up to 12 GB/s sequential writes. The drive comes in capacity-based models of up to 8 TB (could include 2 TB, 4 TB, and 8 TB). ADATA also showed off the Legend 970 PCIe Gen 5 NVMe SSD that uses a Phison E26-series controller, and comes in capacities of 1 TB and 2 TB. This drive belts out up to 10 GB/s reads, with up to 10 GB/s writes.

ADATA Technology Co., Ltd., the world's leading memory brand, is committed to exploring breakthroughs that lead to extreme performance. PCIe Gen 5 SSDs are extremely fast but this powerful performance generates a corresponding degree of heat. In order to enhance stability and prolong product lifespan as well as maintain optimal speeds, innovative cooling solutions are a must for these latest-generation SSDs. During Computex 2023, the company will announce the launch of a number of patented SSD cooling solutions, not only speeding past the competition but also taking the lead in heat dissipation. Project NeonStorm Gen 5 solid-state drive (SSD) is the first in the industry to introduce a liquid and fan-cooled heat dissipation design on an M.2 SSD.

It uses coolant to absorb and then dual fans to dissipate heat, creating a perfect convection ecosystem. The LEGEND 970 Gen 5 SSD adopts a dual-layer aluminium alloy heatsink and fan to create active air cooling and a surface crystallization coating to improve thermal conductivity. The SE920 USB4 external SSD has a built-in micro fan to quickly discharge heat which is activated by extending the retractable casing. The structural R&D and excellent heat-dissipating characteristics of these designs are expected to become the most influential benchmark for extreme storage in the consumer market.

ADATA, the world's leading memory module and flash memory brand, in association with its subsidiary gaming performance brand, XPG, will take part in the world's largest computer trade show in Taipei from May 30 to June 2, 2023- Computex Taipei. As an industry leader, ADATA continues to implement the company's brand philosophy of "Innovating the Future" through its businesses. In addition to providing new technological products and solutions, ADATA is also committed to promoting the sustainable development of corporations in order to lead the future.

To realize this year's theme of "The Xtreme Future Leader - Infinite Innovation," ADATA has leveraged emerging technologies to launch new products that are sustainable and extraordinarily innovative including the most powerful Gen 5 SSD, industry-leading CXL (Compute Express Link) memory module, CAMM (Compression Attached Memory Module), XPG titanium power supply (XPG FUSION 1600 W), and professional industrial solutions. Be sure to visit Computex to experience a full range of new products!

XPG, a fast-growing provider of systems, components, and peripherals for Gamers, Esports Pros, and Tech Enthusiasts, today announced a winning trifecta of 2023 Red Dot Design Awards in the Product Design category. The three award-winning products include the XPG PCIe Gen 5 SSD, XPG LANCER DDR5 Memory Series and VALOR AIR MERA EDITION.

The XPG PCIe Gen 5 SSD supports the latest Intel PCIe 5.0 high-speed bus, allowing for sequential read and write speeds of up to 12,000 MB/s. In order to achieve a balance between efficient heat dissipation and product volume, the XPG PCIe Gen 5 SSD is the first-of-its-kind to introduce a carbon surface crystallization process in heatsink production. A built-in micro-fan and convective heatsink design effectively and quickly dissipate copious amounts of thermal energy. According to real-world test data, this combination can lower SSD controller temperature by approximately 26%. In addition, the relatively thin XPG PCIe Gen 5 SSD can be installed in the M.2 expansion slot of the PS5. In the interest of global environmental conservation, the surfacing technique of the XPG PCIe Gen 5 SSD adopts a new NIL (Nano Imprinting Lithography) manufacturing process. This eliminates a number of energy-wasting practices and does not generate a large amount of waste water, which is sustainable for the environment and protects the earth.

XPG, a fast-growing provider of systems, components, and peripherals for Gamers, Esports Pros, and Tech Enthusiasts, today announced its most powerful laptop to date, the XENIA 15G Gaming Laptop. This impressive laptop was designed for gamers and tech enthusiasts seeking the perfect balance between performance and value. XPG XENIA 15G comes with a 13th Gen Intel Core i7-13700H processor, up to a GeForce RTX 4070 laptop GPU, coupled with a combination of hand-picked ADATA DDR5 memory and a PCIe Gen 4 LEGEND SSD, to deliver extreme gaming experiences.

XENIA 15G takes advantage of the latest generation improvements in components on the market. At its foundation, it features a 13th Gen Intel Core i7-13700H processor with 14 cores (6 performance cores boosting up to 5 GHz, and 8 efficient cores for power saving). On the Graphics front, XENIA 15G sports an NVIDIA GeForce RTX 40-series laptop GPU based on NVIDIA Ada Lovelace architecture, a leap in computing performance with AI-powered DLSS 3, so you can enjoy higher framerates even in lifelike virtual worlds with demanding real-time ray tracing requirements.

ADATA reaffirms its commitment to a sustainable environment and reducing the carbon footprint of its products through the launch of the company's first line of green storage offerings. The HC300 ECO external hard drive (HDD) and UC310 ECO USB flash drive (UFD) represent a positive step towards renewable electronic products by featuring enclosures that consist of recycled plastic and packaged in materials certified by the FSC (Forest Stewardship Council).

The ADATA HC300 ECO and UC310 ECO are forerunners in a series of ADATA products focused on ESG concepts. The casings of these devices are made of PCR (Post-Consumer Recycled) materials, such as 5-gallon water jugs. The use of PCR materials in HC300 ECO can effectively reduce carbon emissions by 48%. Typical post-consumer materials would normally be discarded as waste having completed its consumer lifecycle. These materials are also sourced from a single location, further reducing the product's carbon footprint.

XPG, a fast-growing provider of systems, components, and peripherals for Gamers, Esports Pros, and Tech Enthusiasts, today announced the global release of the newest iteration of their Platinum certified, modular power supply series, XPG CYBERCORE II. Offering two models in 1000 W and 1300 W respectively, this power supply family caters to the needs of power hungry DIY enthusiasts, performance focused gamers, and ATX based workstations equipped with the latest high-end GPUs. Both versions are ATX 3.0 compliant with a PCIe 5.0 12VHPWR (12+4 Pin) connector, while still sporting a thermal solution designed in collaboration with Nidec. This series offers some of the coolest and quietest next-gen ready PSU performance currently on the market.

The XPG CYBERCORE ll Platinum power supply series fulfills all stringent Intel ATX 3.0 requirements and offers quick and convenient fully modular cable management, specifically designed for high-end graphics cards and systems with large power consumption needs. As such, it includes a 12VHPWR (12+4 Pin) connector and cable right out of the box for PCIe 5.0 applications, offering reliability and compatibility with the latest and upcoming components.

ADATA today released a revision of its XPG VALOR AIR mid-tower case that it had originally launched in May 2022. The revision sees the case bundle four of the company's XPG Vento 120 case fans, three of which are pre-installed along the front intake for positive air-pressure, and one at the rear exhaust. Each of these fans features a 60,000-hour rated rifle bearing, 45.3 CFM of airflow at top-speed of 1,200 RPM, and a low maximum noise output of just 23 dBA (fans with similar specs typically generate around 26 dBA noise). This aside, the design of the XPG VALOR AIR remains unchanged. The new revision could go by region-specific markings. The one bound for Japan, for example, has the name XPG VALOR AIR JP2. These cases could go on sale from mid-March, the company didn't reveal pricing.

ADATA today unveiled a 4 TB variant of its Premier series M.2 NVMe SSD with integrated heatsink (APSFG-4TCS). The drive takes advantage of PCIe Gen 4 x4 interface, and targets the crowd that wants storage upgrades for their Sony PlayStation 5 consoles. The drive offers sequential read speeds of up to 6300 MB/s when used with a PS5. It's slightly faster when used with a PC, with sequential transfer rates of up to 7400 MB/s sequential reads, with up to 6600 MB/s sequential writes. ADATA is backing the drive with an impressive 2960 TBW endurance rating, and with a 5-year warranty. The company didn't reveal pricing.

Last year it felt like DDR5-6000 to DDR5-6400 was the top of the PC memory food-chain, and in a year, this has been pushed up to DDR5-8000. Platforms such as the 13th Gen Core "Raptor Lake" can already handle such high memory speeds, and ADATA has designed such a memory module that includes an Intel XMP 3.0 profile that enables the advertised DDR5-8000 speed at the click of a button. The new ADATA XPG Caster RGB DDR5-8000 features a chunky aluminium heatspreader that's crowned by a silicone addressable RGB LED diffuser. It's been tested for compatibility with both Intel and AMD platforms, however only an XMP 3.0 profile is included.

Elsewhere across the ADATA booth, we also came across the company's latest SD 8.0 memory card that uses PCI-Express 3.0 x2 physical layer and NVMe 1.3 protocol layer, to offer sequential speeds of up to 1600 MB/s reads, with up to 1300 MB/s writes, including LDPC ECC. The card comes in 256 GB and 512 GB capacities, and is backwards-compatible with UHS-I devices. Back at the memory section, we found an XPG + ASUS ROG co-branded Lancer ROG DDR5 memory that comes at speeds of up to DDR5-6600. Lastly, there's the ACE-6400, a mid-range DDR5-6400 memory module targeting creators, that runs at DDR5-5600 native (JEDEC), and its advertised DDR5-6400 using an XMP 3.0 profile.

ADATA SE920 is the company's first portable SSD to take advantage of USB4 and offer transfer-speeds that utilize that added interface bandwidth. The drive features a 40 Gbps USB4 interface, with a single cable handling both power and host connectivity. Internally, this is an M.2 PCIe Gen 4 SSD that's been wired to an ASMedia ASM2464PD chip that converts a 40 Gbps USB4 uplink to a PCI-Express 4.0 x4 downlink, and hence the internal drive has slightly more bandwidth than PCI-Express 3.0 x4 (32 Gbps).

The ADATA SE920 comes in capacity variants of 1 TB and 2 TB. Both variants offer sequential transfer rates of up to 3800 MB/s reads, with up to 3200 MB/s writes. The brushed aluminium enclosure has a mechanism that slides out a diagonal insert with air vents for an active cooling mechanism inside, which cools the internal drive, the bridge chip, and some power components. A USB4 type-C to type-C cable is included with the drive.

Here are some of the first pictures of the yet-unnamed PCIe Gen 5-based NVMe SSD by ADATA XPG. Built in the M.2-2580 form-factor, the drive features a PCI-Express 5.0 x4 host interface and NVMe 2.0 protocol. At its core is a Silicon Motion SM2508 series controller, coupled with the latest generation 3D TLC NAND flash over a large number of flash channels; and a faster DRAM cache. The drive offers sequential transfer rates of up to 14 GB/s reads, with up to 12 GB/s writes. and 2 million IOPS 4K random transfers. It comes in capacity-based variants, with 8 TB being the largest one.

The most striking aspect about this drive is its active cooling solution. A ridged aluminium monoblock heatsink is used to cool the SM2508 controller. nestled in its center is what appears to be a miniature 10 mm lateral fan. The heatsink has surface-crystallization treatment to increase surface area for heat dissipation. A die-cast aluminium top-plate and 3-sided backplate sandwich the fan-heatsink and the main PCB. The fan is tightly controlled by temperature, and ADATA claims you should barely notice it. To use the drive to its fullest, you'll either need an AMD Ryzen 7000 "Zen 4" platform that has dedicated PCIe Gen 5 M.2 slots wired to the processor, or an Intel 700-series chipset motherboard that puts out a Gen 5 M.2 slot by subtracting lanes from the Gen 5 PEG slot.

ADATA in its exhibition on the sidelines of CES, showed off the Fusion 1600 TITANIUM, an enthusiast-segment 1600 W PSU for highly overclocked PC builds. Designed in collaboration with Delta Electronics (popular for server PSUs and laptop power bricks), the Fusion TITANIUM uses GaNFETs and a planar transformer in its switching circuitry, and is Cybenetics Titanium and 80 Plus Titanium certified. The PSU complies with both ATX 3.0 and PCIe Gen 5 specs for excursion tolerance.

The XPG Fusion 1600 TITANIUM offers two native 16-pin ATX 12VHPWR connectors that are each capable of 600 W continuous power delivery, with 200% excursions within specified limits. You also get at least twelve 6+2 pin PCIe power connectors, and multiple 4+4 pin EPS. A USB 2.0 connection interfaces the PSU with software, with a dedicated UWP app giving you real-time monitoring and data-logging for the PSU.

The COVID-19 pandemic and the emergence of next-generation Intel and AMD motherboards have incited a wave of consumer PC replacement as well as growing demand for high-efficiency PCIe 4.0 SSDs. With additional consideration towards the PS5's SSD heat dissipation requirements, ADATA Technology Co., Ltd., a leading global memory products brand, has launched the LEGEND 960 MAX as of today. The LEGEND 960 MAX SSD has won Japan's GOOD DESIGN Award and features continuous read/write speeds of up to 7,400/6,800 MB per second. Its unique 3D radiator fin design can reduce temperatures of SSDs mounted in PS5 consoles by as much as 40%. The LEGEND 960 MAX and LEGEND 960 are part of the same series of SSD products and the prior LEGEND 960 model can be installed in Intel Evo certified lightweight notebooks. In the face of Web 3.0's unlimited creative universe, this new product is expected to become the most ideal storage solution for consumers.

The LEGEND 960 MAX employs a PCIe 4.0 transmission interface conforming to NVMe 1.4 standards. The SSD features exceptional 7,400/6,800 MB per second read/write capabiliies that are 4 times that of standard PCIe 3.0 SSDs and is backward compatible with the PCIe 3.0 platform. When handling a multitude of intensive creations, the LEGEND 960 MAX delivers 750K/630K IOPS random Read/Write speeds, improving multitasking efficiency and is suitable for driving exceptional performance in the latest Intel or AMD platforms. The professionally designed thermal convection effect produced by a 3D radiator fin profile enables an additional 40% cooling on motherboard installed SSDs and is an optimal solution for highly complex design tasks such as 3D animation, game development, and visual virtualization.

Affected by tight wafer supply, lead time for SSD controller IC and PMIC components was prolonged to 32 weeks in 2021. All controller IC suppliers generally give priority to supplying NAND Flash manufacturers, so production at module factories could not meet SSD demand in the retail market during that time. In 2H21, the supply of SSD-related components improved quarter by quarter and various module manufacturers boosted their SSD shipments in order to upsurge their annual performance. According to TrendForce research, SSD shipments through global distribution channels reached 127 million units in 2021, with an annual growth rate of 11%.

This global SSD ranking is based on the shipment volume of module houses' own in-house brands in the distribution channel market as a standard for calculation and NAND Flash manufacturers are not included. NAND Flash manufacturer supply accounts for approximately 42% of the overall distribution channel market while module factory shipments account for approximately 58%. When SSD-related components were hard to come by, NAND manufacturers' supply chain management occupied a superior position compared to module houses, so NAND manufacturers' market share in the overall distribution channel market increased compared with 2020.

XPG, a fast-growing provider of systems, components, and peripherals for Gamers, Esports Pros, and Tech Enthusiasts, today is responding to the needs of toughening market conditions by launching a slew of entry-level peripherals products: XPG PRECOG S GAMING HEADSET, XPG SLINGSHOT GAMING MOUSE, and XPG BATTLEGROUND L GAMING MOUSE PAD. With these new products, XPG is making the "Gamer's Tax" a thing of the past, targeting first time users, internet cafés, and users in need of all-round peripherals with clean and trendy designs and solid performance at a more accessible price point.

XPG is expanding its PRECOG family of high quality, immersive audio headsets with the XPG PRECOG S. Positioned as an entry level offering, this gaming headset delivers clean and crisp audio with its 50 mm superb quality sound drivers to deliver a gaming experience that rivals higher tier devices. It has a very sturdy and lightweight design construction with an auto-adjusting headband and large, rotateable earcups, offering long-term gaming sessions without distractions or discomfort. XPG PRECOG S comes with a standard combo audio jack and a splitter cable in box to provide the largest range of compatibility from consoles and portable gaming devices to any Gaming PC. It's available in Black at launch with Pink and White options coming at a later date.

XPG, a fast-growing provider of systems, components, and peripherals for Gamers, Esports Pros, and Tech Enthusiasts, today announces announced the launch of the new XPG LANCER 5600 DDR5 memory module, its first DDR5 to support AMD EXPO (Extended Profiles for Overclocking); What's more, all ADATA's and XPG's full lineup of DDR5 memory modules are compatible with AMD's latest platforms, ensuring optimal stability and performance.

XPG LANCER DDR5-5600 is capable of delivering performance of up to 5600 MT/s and comes in variants with or without RGB lighting. They also come with two heat sink color options to choose from to meet different preferences, including Midnight Black and Snow White. As AMD Ryzen 7000 series processors have been announced, XPG took the initiative to launch the XPG LANCER DDR5-5600 to allow gamers who are still on the sidelines to upgrade to DDR5 and enjoy the benefits of AMD EXPO for easy overclocking. XPG's full range of DDR5 memory models, including CASTER, LANCER, and HUNTER will all support AMD EXPO and be available globally in October.

ADATA Technology, a leading manufacturer of industrial-grade DRAM modules and NAND Flash products today announces its first industrial-grade PCIe Gen4 x4 M.2 2280 solid state drive, the IM2P41B8. Utilizing the ultra-high-speed PCIe Gen4 x4 interface, it delivers excellent read and write performance for processing large data loads, and the durability and security industrial-grade applications require.

The IM2P41B8 M.2 2280 is equipped with WDC's 112-layer 3D TLC flash memory with a maximum capacity of 4 TB. With the PCIe Gen4 x4 interface and NVMe 1.4 support, the IM2P41B8 offers performance that is 230% higher than PCIe 3.0, random read and write speeds of up to 220,000/175,000 IOPS, and sustained read and write speeds of up to 7000/6500 MB/s. What's more, it feature 3K P/E cycle rating for excellent durability.

ADATA Technology, a leading manufacturer of memory modules, USB flash drives, memory cards, solid state drives, portable hard drives, and gaming peripherals, today announces the ADATA ELITE UE800 USB Flash Drive. With USB 3.2 Gen2 for read and write speeds of up to 1,000 MB/s and capacities of up to 512 GB, this drive makes digital life easier. With USB Type-C, users will enjoy easy compatibility with all their devices, from PCs, smartphones, to tablets.
The compact UE800 features read/write speeds of up to 1,000 MB/s, which is 10 times faster than the average USB 3.2 Gen1 drive. Along with bandwidth of up to 10 Gb/s, users can plug and play the UE800 to read and write files, large and small, in an instant. What's more, it's backward compatible with USB 2.0 devices for added convenience.

ADATA XPG, a fast-growing provider of systems, components, and peripherals for Gamers, Esports Pros, and Tech Enthusiasts, today announced their new HURRICANE ARGB PWM cooling fans. This new line comes in both 120 mm and 140 mm sizes and It was built for users that require top cooling performance without foregoing aesthetics and without compromises.

XPG has made great strides in the development of their cooling portfolio with both AIO liquid coolers and the market leading XPG VENTO fan series, culminating with the top of the line XPG VENTO PRO. Today, XPG is proud to announce the addition of a new family of high performance cooling fans, named XPG HURRICANE.

ADATA, today unveils its latest series of memory modules for creators, the ADATA ACE series. Creators can choose from two models depending on their budget and performance requirements, namely the ADATA ACE 6400 DDR5 and ACE 3600 DDR4. The series also includes a limited-edition ACE 6500 DDR5 module that features a one-of-a-kind pattern design created in conjunction with a designer from Germany. All three modules support Intel XMP for hassle-free overclocking, are built with high-quality, low-latency chips, and are compatible with the latest Intel and AMD platforms.

As a creator, it is often necessary to switch between different applications to perform multiple tasks such as loading files, editing, rendering, or transferring files. What's more, frequent software updates take up valuable memory resources and thus impact memory performance. ADATA understands that creativity should never be restricted and therefore developed the ADATA ACE series memory. With ACE series memory modules, creators will enjoy enhanced performance that will allow them to be more productive and creative. Supporting Intel XMP, the modules can overclock for blazing-fast performance, whether for graphic design, video editing, or even more demanding 3D computing needs. The ADATA ACE DDR4 3600 and DDR5 6400 come in a 16 GB dual-kit.