According to a new research report from the analyst firm Jon Peddie Research, unit shipments of add-in boards increased in Q2'21 from last year, while Nvidia increased market share to 80% from last quarter a 0.3% increase as well as 2% year-over-year.. Over $11.8 billion AIBs shipped in the quarter—an increase of 179% year-over-year.

Add-in boards (AIBs) use discrete GPUs (dGPU) with dedicated memory. Desktop PCs, workstations, servers, rendering and mining farms, and scientific instruments use AIBs. Consumers and enterprises buy AIBs from resellers or OEMs. They can be part of a new system or installed as an upgrade to an existing system. Systems with AIBs represent the higher end of the graphics industry. Entry-level systems use integrated GPUs (iGPU) in CPUs that share slower system memory.

Graphics cards may be on their way to becoming unicorns that you can only pay for after finding the proverbial pot of gold from under a rainbow, but that doesn't mean AMD and NVIDIA will slow down their competition any time soon - especially in this market, there's a huge profit to be made. And AMD may just be finally readying their true halo product - a graphics card that aims to beat NVIDIA's RTX 3090 across the board. Twitter user CyberPunkCat shared an alleged AMD slide showcasing a new, overpowered RX 6900 XTX graphics card. AMD's naming scheme for their RX 6900 series may be slightly confusing nowadays: the original RX 6900 XT carries the Navi 21 XTX die, and AMD has recently released a higher-performance version of that Navi 21 chip in the form of the Navi 21 XTXH - which power the liquid-cooled versions of the RX 6900 XT, with higher overall clocks than the original GPU release. However, there hasn't been a change in the RX 6900 XT nomenclature - but this new slide suggests otherwise.

If the leaked slide is real (keep your NaCl ready, as always), it appears that the RX 6900 XTX might pair both the higher-performance Navi 21 XTXH chip with higher memory speeds. While both Navi 21 XT and Navi 21 XTXH both make use of 16 Gbps GDDR6 memory, the slide indicates that the RX 6900 XTX will feature 18 Gbps memory speeds, exploring another avenue for increased performance. This decision would bring an increase in maximum theoretical memory subsystem bandwidth from the 512 Gbps in the RX 6900 XT up to 576 Gbps - a 13% increase, which would not translate into a proportional increase in final performance. However, considering how our own reviews show that AMD's RX 6900 XT with the Navi 21 XTXH silicon is already between one and three percent faster than NVIDIA's RTX 3090, even a slight, 5% performance increase over that cards' performance means that AMD might be able to claim the performance crown for the mainstream market. It's been a while since that happened, hasn't it?

ID-COOLING today announced SE-226-XT ARGB and SE-226-XT BLACK CPU air coolers. Both coolers include the same black heatsink with 6 heatpipes and copper base. 120 mm ARGB fan and Black fan are used on ARGB / BLACK version respectively. SE-226-XT Series is designed to cool those processors with a TDP up to 250 W. Both models are built with a solid heatsink which is specially design with 100% RAM compatibility. Black coating is applied for a stealthy looking.

For SE-226-XT ARGB, the included 120x120x25mm fan is built with 2Ball bearing and has 8pcs rubber dampeners on all corners of both sides, running at 800 to 2000rpm with PWM support while pushing 56.6CFM air at maximum speed, noise level measured 16.2 to 31.5dB (A). For SE-226-XT BLACK, the included standard 120x120x25mm fan has 8pcs rubber dampeners on all corners of both sides, running at 700 to 1800rpm with PWM support while pushing 76.16CFM air at maximum speed, noise level measured 15.2 to 35.2dB (A).

According to the latest market pricing analysis conducted by 3DCenter, the falling GPU prices we reported two months ago are now in the midst of a reversal. The latest figures show an increase in average pricing for both AMD's RX 6000 series and NVIDIA's RTX 30-series graphics cards. The hike has been most felt on the NVIDIA camp, with average pricing increasing around 9%, while AMD graphics cards saw an increase of 6%. This places the latest pricing average for graphics cards from both companies at 59% above MSRP for NVIDIA, and 64% for AMD.

While the increase is still a far-cry from the ridiculous markups felt during the month of May (where NVIDIA graphics cards were being sold at an average 304% of their MSRP value and AMD's where going for around 202% of their MSRP), this trend reversal is a clear indicator of a continued inability to cater to the pent-up demand that's still being trickle-filled since the original release of these GPU families. And this happens despite numerous positive signals happening within the last few months, such as the crypto crackdown in China, which saw hundreds upon hundred of mining-bound graphics cards being resold towards the secondary market. Also of note for an eventual positive price action was the recent reduction in Ethereum profits for miners due to the implementation of Ethereum's EIP-1559 proposal - which has already seen 136,619 ETH being burned as a part of transactions run on the network - the equivalent of $433,768,155 at current ETH pricing. And with news that shipments of NVIDIA's RTX 3060 and 3060 Ti graphics cards will be halved throughout September, paired with a TSMC price hike for newly minted wafers, it seems that an upwards pressure on GPU pricing is inescapable.

AMD announced that the U.S. Department of Energy's (DOE) Argonne National Laboratory (Argonne) has chosen AMD EPYC processors to power a new supercomputer, called Polaris, which will prepare researchers for the forthcoming exascale supercomputer at Argonne called Aurora. Polaris is built by Hewlett Packard Enterprise (HPE), will use 2nd Gen EPYC processors and then upgrade to 3rd Gen AMD EPYC processors, and will allow scientists and developers to test and optimize software codes and applications to tackle a range of AI, engineering, and scientific projects.

"AMD EPYC server processors continue to be the leading choice for modern HPC research, delivering the performance and capabilities needed to help solve the complex problems that pre-exascale and exascale computing will address," said Forrest Norrod, senior vice president and general manager, Datacenter and Embedded Solutions Business Group, AMD. "We are extremely proud to support Argonne National Laboratory and their critical research into areas including low carbon technologies, medical research, astronomy, solar power and more as we draw closer to the exascale era."

Genesis Mining, one of the largest cloud providers of cryptocurrency mining services headquartered in Iceland, has today won a great deal with China's Supreme Court. According to the reports, Genesis is now getting back the 485,000 AMD Radeon RX 470 8 GB graphics cards returned to its mining facilities in hopes of soon usage. What leads to this you might wonder? Previously, Genesis Mining partner, Chuangshiji Technology Limited, which provides hosting services for Genesis, took the company's mining hardware and started listing it without consent from the Iceland-based firm.

As the company filed a lawsuit in China supreme court, the legal disputes were going on for some time and today Genesis has won. According to the report, Genesis is getting back as much as 485,000 AMD Radeon RX 470 8 GB graphics cards with a total mining power of 14.5 TH/s. All these GPUs are now looking for a new home inside Genesis Mining facilities and will be able to provide a bit over a million dollars in mined Ethereum, at today's prices.

Cybersecurity researchers Saidgani Musaev and Christof Fetzer with the Dresden Technology University discovered a novel method of forcing illegal data-flow between microarchitectural elements on AMD processors based on the "Zen+" and "Zen 2" microarchitectures, titled "Transient Execution of Non-canonical Accesses." The method was discovered in October 2020, but the researchers followed responsible-disclosure norms, giving AMD time to address the vulnerability and develop a mitigation. The vulnerability is chronicled under CVE-2020-12965 and AMD Security Bulletin ID "AMD-SB-1010."

The one-line summary of this vulnerability from AMD reads: "When combined with specific software sequences, AMD CPUs may transiently execute non-canonical loads and store using only the lower 48 address bits, potentially resulting in data leakage." The researchers studied this vulnerability on three processors, namely the EPYC 7262 based on "Zen 2," and Ryzen 7 2700X and Ryzen Threadripper 2990WX, based on "Zen+." They mention that all Intel processors that are vulnerable to MDS attacks "inherently have the same flaw." AMD is the subject of the paper as AMD "Zen+" (and later) processors are immune to MDS as demonstrated on Intel processors. AMD developed a mitigation for the vulnerability, which includes ways of patching vulnerable software.

Find the security research paper here (PDF), and the AMD security bulletin here. AMD's mitigation blueprint can be accessed here.

Jon Peddie Research reports the growth of the global PC-based Graphics Processor Units (GPU) market reached 123 million units in Q2'21 and PC CPU shipments increased by 42% year-over-year. Overall, the installed base of GPUs will grow at a compound annual growth rate of 3.5% during 2020-2025 to reach a total of 3,318 million units at the end of the forecast period. Over the next five years, the penetration of discrete GPUs (dGPU) in the PC will grow to reach a level of 25%.

AMD's overall market share percentage from last quarter decreased by -0.2%, Intel's market share increased 0.1%, and Nvidia's market share increased 0.06%, as indicated in the following chart. Overall GPU unit shipments increased by 3.4% from last quarter, AMD shipments increased 2.3%, Intel's shipments rose 3.6%, and Nvidia's shipments increased 3.8%.

AMD is looking to launch a substantial lineup of HEDT and workstation processors before the end of 2021, based on its latest "Zen 3" microarchitecture. These processors are categorized in two distinct lines—the Ryzen Threadripper 5000X targeting HEDTs, and the Ryzen Threadripper Pro 5000WX targeting workstations. Both are based on different sockets, sTRX4 and sWRX8, respectively, with the latter featuring 8-channel DDR4 memory, compared to the former's 4-channel. Two Ryzen Threadripper Pro 5000WX series chips surfaced on the Milky Way@Home distributed computing database, the 5945WX and 5995WX.

The application identifies the 5945WX as a 12-core/24-thread processor, while the 5995WX is the top-dog 64-core/128-thread part. AMD maintains lower core-count Threadrippers to target the section of the market that seeks I/O capabilities over core-counts (memory bandwidth, a large number of PCIe lanes supporting NVMe RAID or multiple AIC compute accelerators, etc,). The lower core counts also come with higher CPU clock-speeds, benefiting less-parallelized applications. At this point it's not known if the Threadripper 5000 family features the conventional "Zen 3" CCD chiplet, or the new "Zen 3+" chiplets with 64 MB 3D Vertical Cache (3DV cache), but the company is planning to monetize the new chiplet across its EPYC enterprise line as the additional cache benefits certain applications with large streaming data-sets. It's conceivable that the Threadripper Pro series could benefit from 3DV cache, too.

According to this Reddit thread, multiple AMD customers are reporting that the latest stock update on AMD's web store has left them without a desired product, and anger over the broken functionality. As AMD operates its own web-based storefront with all the latest CPUs and GPUs, users are constantly checking if the store has anything to offer in these times of processor scarcity, where it is impossible to purchase the latest generation of graphics cards or processors. AMD updated the website today with the newest batch of Ryzen processors and Radeon graphics cards, users have been reporting that the website functionality has been broken.

Multiple users tried to purchase their desired product, but the AMD website notified them that the queue is paused for about 30 minutes, and seemingly no one was able to purchase anything. People have been reporting that the Captcha used to verify that you are not a robot has failed as well, and adding the product to the cart was impossible, as seen in the image below. As there are multiple such comments posted in the thread, it leads us to write a report on it, wondering what is going on with AMD's storefront operations and what AMD is doing about it. With multiple users trying to purchase an AMD product, they were left with their hands empty, to wonder what is going on.

AMD today released the latest version of Radeon Software Adrenalin. Version 21.8.2 beta comes with optimization for "Myst," with up to 6% performance improvement seen at 4K medium settings on a machine powered by a Radeon RX 6800 XT, compared to the previous 21.8.1 drivers. The drivers also feature optimization for "Aliens: Fireteam Elite."

The drivers also fix a handful of issues. Difficulties ending an OBS recording session with h.265 or HEVC codec on some of the newer Radeon GPUs, such as the RX 6800 XT, have been fixed. An image corruption bug with split-screen multiplayer on "F1 2021," has been fixed. Unresponsive behavior with Radeon Software in rare cases, has been fixed. Lighting corruption noticed in "Control" with DirectX 12 on cards such as the RX 6600 XT, has been fixed. Upgrading to the lastest Radeon Software causing auto-updates in Ryzen Master to stop working, has been fixed. Grab the drivers from the link below.

DOWNLOAD: AMD Radeon Software Adrenalin 21.8.2 beta

CPU-Z, the software of choice for monitoring the CPU and its attributes, has yesterday been updated to version 1.97, which brings much-needed and interesting features. For starters, the new version adds support to detect Intel Core i9-12900K, Core i7-12700K, and Core i5-12600K "Alder Lake" CPUs and the Intel Z6xx chipset platform. Those specific SKUs are the top of the line in their respective categories, and it is only logical that support for the new generation starts there.

Next up, the software now supports detection of the latest DDR5 DRAM technology, which can now also be detected along with the new XMP 3.0 profile format. Last but not least, the software is adding detection for AMD's Radeon RX 6600 XT GPU as well.

To download the latest update, head over to our downloads section. If you wanna get pinged automagically when a new version is released, select the yellow "Get Notified" button on that same page.

The first desktop processors to implement AMD's "Zen 4" microarchitecture will feature integrated graphics as standard across the lineup, according to a Chips and Cheese report citing leaked AMD design documents. Currently, most of the Socket AM4 desktop processor lineup lacks integrated graphics, and specialized "G" SKUs with integrated graphics dot it. These SKUs almost always come with compromises in CPU performance or PCIe I/O. With its 5 nm "Raphael" Socket AM5 desktop processor, AMD is planning to change this, in a bid to match up to Intel on the universality of integrated graphics.

Built in the 5 nm silicon fabrication process, the "Raphael" silicon combines "Zen 4" CPU cores along with an iGPU based on the RDNA2 graphics architecture. This would be the first time AMD updated the SIMD architecture of its Ryzen iGPUs since 2017. The RDNA2-based iGPU will come with a more advanced DCN (Display CoreNext) component than current RDNA2-based discrete GPUs, with some SKUs even featuring DisplayPort 2.0 support, besides HDMI 2.1. By the time "Raphael" is out (2022-23), it is expected that USB4 type-C would gain popularity, and mainstream motherboards as well as pre-built desktops could ship with USB4 with DisplayPort 2.0 passthrough. AMD relies on a discrete USB4 controller with PCI-Express 4.0 x4 wiring, for its first Socket AM5 platform.

"The focus of our development has always been to improve the deliverable performance." (Rico Weber, WATERCOOL CEO, Sep.2020). This quote marked the beginning of the development of the new HEATKILLER V VGA cooler. In addition to an increase of performance, the focus also lay on improvements in handling and durability. The HEATKILLER VGA coolers, known for their outstanding workmanship, have also been visually enhanced. In the latest revision for AMD graphics cards of the RX 6800/6900XT series, the HEATKILLER V has been further optimized.

The inflow to the cooling structure has been completely reworked. It now is placed with a vertical offset above a second level. The inlet and outlet channels cross each other, but are spatially separated from each other. The new design allows a symmetrical arrangement of the cooling channels. The advantage of the symmetrical design is a steady flow through the heat sink. Dead zones and hotspots are thus effectively avoided. At the same time the windage is reduced. The HEATKILLER V for RX 6800/6900XT features a vertical cooling structure, which significantly improves the cooling performance even more. The enlarged cooling surface ensures exceptionally low GPU temperatures. To reduce turbulences, all cooling channels were manufactured in a rounded design.

AMD in its HotChips 33 presentation shed light on the the company's efforts to stay on the cutting edge of 3D silicon packaging technology, especially as rival Intel takes giant strides with 2.5D and 3D packaging on its latest "Ponte Vecchio" and "Sapphire Rapids" packages. The company revealed that it co-developed a pioneering new die-on-die stacking technique with TSMC for its upcoming "Zen 3" CCDs with 3D Vertical Caches, which are 64 MB SRAM dies stacked on top of "Zen 3" CCDs to serve as an extension of the 32 MB on-die L3 cache. The micro-bumps connecting the 3D Vertical Cache die with the CCD are 9-micron in pitch, compared to 10-micron on the production variant of Intel Foveros.

AMD believes that no single packaging technology works for all products, and depend entirely on what it is you're trying to stack. The company spoke on the future of die-on-die stacking. For over a decade, package-on-package stacking has been possible (as in the case of smartphones. Currently, it's possible to put memory-on-logic within a single package, between the logic die and an SRAM die for additional cache memory; a logic die an DRAM for RAM integrated with package; or even logic with NAND flash for extreme-density server devices.

Intel in its 2021 Architecture Day presentation put out fine technical details of its Xe HPC Ponte Vecchio accelerator, including some [very] preliminary performance claims for its current A0-silicon-based prototype. The prototype operates at 1.37 GHz, but achieves out at least 45 TFLOPs of FP32 throughput. We calculated the clock speed based on simple math. Intel obtained the 45 TFLOPs number on a machine running a single Ponte Vecchio OAM (single MCM with two stacks), and a Xeon "Sapphire Rapids" CPU. 45 TFLOPs sees the processor already beat the advertised 19.5 TFLOPs of the NVIDIA "Ampere" A100 Tensor Core 40 GB processor. AMD isn't faring any better, with its production Instinct MI100 processor only offering 23.1 TFLOPs FP32.

AMD might fall behind Intel on PCI-Express Gen 5 support, say sources familiar with the recent GIGABYTE ransomware attack and ensuing leak of confidential documents. If you recall, AMD had extensively marketed the fact that it was first-to-market with PCI-Express Gen 4, over a year ahead of Intel's "Rocket Lake" processor. The platform block-diagram for Socket AM5 states that the AM5 SoC puts out a total of 28 PCI-Express Gen 4 lanes. 16 of these are allocated toward PCI-Express discrete graphics, 4 toward a CPU-attached M.2 NVMe slot, another 4 lanes toward a discrete USB4 controller, and the remaining 4 lanes as chipset-bus.

Socket AM5 SoCs appear to have an additional 4 lanes to spare than the outgoing "Matisse" and "Vermeer" SoCs, which on higher-end platforms are used up by the USB4 controller, but can be left unused for the purpose, and instead wired to an additional M.2 NVMe slot on lower-end motherboards. Thankfully, memory is one area where AMD will maintain parity with Intel, as Socket AM5 is being designed for dual-channel DDR5. The other SoC-integrated I/O, as well as I/O from the chipset, appear to be identical to "Vermeer," with minor exceptions such as support for 20 Gbps USB 3.2x2. The Socket has preparation for display I/O for APUs from the generation. Intel's upcoming "Alder Lake-S" processor implements PCI-Express Gen 5, but only for the 16-lane PEG port. The CPU-attached NVMe slot, as well as downstream PCIe connectivity, are limited to PCIe Gen 4.

EK, the European manufacturer of premium liquid cooling gear, and MSI, a world-leading gaming brand, have partnered up yet again, to launch an X570S-based motherboard that comes with a pre-installed Quantum design monoblock that offers unparalleled cooling for the VRM section and AMD Ryzen series CPUs. MSI's world-class engineering team and EK's industry-leading thermal engineers worked together to apply EK's technology and know-how to bring you the coolest AMD gaming motherboard. The EK-Quantum MSI MPG X570S CARBON EK X is a response to the market's desire for an out-of-the-box water-cooled motherboard for Ryzen CPUs. It allows maximum performance without the noisy environment that air coolers offer, providing countless hours of uninterrupted gameplay. As an added benefit, it looks as great as it performs.

The EK-Quantum monoblock design aesthetically blends in with the motherboard, giving it a unique look that sets it apart from the rest. The sleek, stealthy look accompanied by the carbon fiber pattern is there to remind all hard-core gamers that pushing the limit is what gaming is all about. A powerful 14+2 Duet Rail Power System with 75 A power stages provides stable power to the Ryzen CPU. The massive power delivery system allows for high overclocks and, by proxy, a great boost in performance. The only downside is increased heat generation. This is where the EK monoblock with an integrated flow indicator kicks in - to cool down not just the CPU, but the power delivery system as well.

With AMD launching the latest Ryzen 5000 Series processors, MSI X570S motherboards will also hit the market in the coming days. The new series of MSI X570S motherboards have not only upgraded specifications but also included brand-new designs. The following are detailed introductions that you must not miss. The whole series of MSI X570S motherboards all support AMD's latest Ryzen 5000 Series processors. To unleash the impressive performance, MSI offers a comprehensive upgrade for the power phase. MEG X570S motherboards have direct 16+2 phases with 90 A SPS and MPG X570S motherboards have at least 12+2 Duet Rail Power System with 75 A SPS. Both the MAG X570S TORPEDO MAX and the MAG X570S TOMAHAWK MAX WIFI have Mirrored Power Arrangement 12+2 phases with 60 A SPS as well.

s for heatsink design, the major change is to remove fans on the chipsets, which helps reduce dust and noise. In order to dissipate heat effectively without fans, the area of the heatsink that covers the chipset is enlarged considerably. Also, all MSI X570S Series motherboards feature at least 1 M.2 Shield Frozr which prevents throttling by offering the best thermal protection to help maintain SSD maximum performance. For hard-core users, we have the MEG X570S ACE MAX with 4 Gen 4 M.2 slots covered with M.2 Shield Frozr and Double Side M.2 Thermal.

AMD is slowly preparing to launch its next-generation of graphics cards based on the RDNA3 architecture, and it could bring some new connectivity options as well. Currently, the graphics cards we are using today use DisplayPort 1.4 connector for their DP output. However, the more advanced DisplayPort 2.0 could land in RDNA3 GPUs, bringing much-needed improvements to the video output system. What DP 2.0 brings to the table is an upgrade to an Ultra High Bit Rate individual lane speed of 20 GB/s, totaling 80 GB/s with four of those. The DP 2.0 capable system would be able to output a 10K uncompressed resolution at 60 Hz, or two 4K 144 Hz monitors at the same time. With compression, that would be extended much further. We have to wait and see what AMD does and if the next-generation RDNA3 brings this new DisplayPort standard to the masses.

AMD's upcoming desktop processor Socket AM5 could retain cooler compatibility with the outgoing Socket AM4, according to a leaked technical document related to the socket. If true, this would be the first time that two fundamentally different sockets—one a PGA, and the other an LGA—are designed for cooler cross-compatibility. The document reveals that with a processor installed, Socket AM5 would align with the retention clip and mount-hole spacing identical to that of Socket AM4. This could mean you can carry over your expensive liquid-cooling setup or pricey AIO CLC over from your current Ryzen desktop build.

New renders of Socket AM5 also reveal that the socket locking mechanism is mostly similar to that of Intel sockets, such as the LGA1200, and isn't a downscale of TR4/sTRX4 as was feared in social media. The top retention brace swings along a hinge, and held in place by pressure from a lever that locks into a hook. Depending on the model, AMD Socket AM5 processors could come in TDP values of 45 W, 65 W, 95 W, 105 W, 125 W, and 170 W.

ASUS today introduced a trio of new motherboards based on AMD's X570 chipset, which join the latest ROG Crosshair VIII Extreme as the latest offerings from ASUS on the X570 platform.

The ROG Strix X570-E Gaming WiFi II pairs the latest tech with essential ROG DNA
Elite gamers and enthusiasts who prefer the finer things in life will want to take a look at the new ROG Strix X570-E Gaming WiFi II. Building on the legacy of the ROG Strix X570-E Gaming WiFi before it, this fresh new board distills high-end components, smart software, and passive chipset cooling into one luxurious board. This revision of the X570-E makes a splash with revised ROG graphics running across the I/O shroud and the chipset heatsink. The CPU VRM also gets a boost to a 12+4-phase design, fueled by ProCool II auxiliary connectors. No matter your choice of Ryzen CPU, the new Strix-E will handle it with aplomb.

We have recently seen the first high-resolution die shots of AMD's Ryzen 5 5600G Cezanne APU thanks to the work of Fritzchens Fritz. The photos show the internal layout of the processor with its Zen 3 CPU, Vega GPU, and corresponding components. To get these shots, the chip had to be delidded by removing the IHS which has been made harder with the move to a soldered design. The Ryzen 5 5600G is a 6 core, 12 thread part with 7 Vega GPU cores which can all be seen in the annotated diagram of the die created by Locuza. The diagram also shows the suspected locations of various PCIe 3.0, and memory controllers along with cache placements for the CPU and GPU. The processor is manufactured on TSMC's 7 nm process and features a total of 10.7 Billion transistors packed into the 180 mm² die.

AMD has hit its highest "PC processor" market share since 2006, according to the latest market analysis report by Mercury Research. The firm's PC processor metric only covers client-segment processors (excludes the strides AMD has made in the enterprise space with EPYC). According to the report, AMD now holds 16.9% of the market, its highest since 2006. This is a 0.8 percentage points increase sequentially, and 7.3 percentage points growth year-over-year.

When looking at the overall x86 processor market (which now includes enterprise chips), AMD holds 15.8 percent, which is a 0.7 percentage point sequential gain, and 4.1 percentage points gain YoY. AMD holds 11.6% of the server processor market. Market share only paints part of the picture. Guru3D notes that AMD is trading market share for margins, by reducing shipments of low-cost processors in favor of premium processors with higher margins.

While the server industry transitions to the latest generation of processors based on the x86 platform, the Intel Ice Lake and AMD Milan CPUs entered mass production earlier this year and were shipped to certain customers, such as North American CSPs and telecommunication companies, at a low volume in 1Q21, according to TrendForce's latest investigations. These processors are expected to begin seeing widespread adoption in the server market in 3Q21. TrendForce believes that Ice Lake represents a step-up in computing performance from the previous generation due to its higher scalability and support for more memory channels. On the other hand, the new normal that emerged in the post-pandemic era is expected to drive clients in the server sector to partially migrate to the Ice Lake platform, whose share in the server market is expected to surpass 30% in 4Q21.