AMD's Technical Marketing Director, Robert Hallock has decided to leave the company after 12+ years with the company, to "explore new opportunities and experiences" as he puts in a post on LinkedIn. He apparently left the company last Friday, but only shared the news today. "After just over 12 adventure-packed years at AMD, I'm leaving to explore new opportunities and experiences. Over the years, I've had the honor and privilege of publicly teaching others about some truly stellar innovation: the Zen core family, 3D V-Cache, chiplet packaging, HBM memory, FreeSync, low-overhead graphics APIs, and much more. After working in both graphics and processors for roughly 6 years each, I've learned so much."

He thanked several current and ex colleagues at AMD, as well as thanking the PC hardware reviewer community and the AMD community on Reddit and Discord among others. He ended his post by saying he'll be taking some time off to travel and think about what he'll be doing next, so it doesn't seem like he has any fixed plans for the future.

AMD today announced it is joining the newly created PyTorch Foundation as a founding member. The foundation, which will be part of the non-profit Linux Foundation, will drive adoption of Artificial Intelligence (AI) tooling by fostering and sustaining an ecosystem of open source projects with PyTorch, the Machine Learning (ML) software framework originally created and fostered by Meta.

As a founding member, AMD joins others in the industry to prioritize the continued growth of PyTorch's vibrant community. Supported by innovations such as the AMD ROCm open software platform, AMD Instinct accelerators, Adaptive SoCs and CPUs, AMD will help the PyTorch Foundation by working to democratize state-of-the-art tools, libraries and other components to make these ML innovations accessible to everyone.

With next-generation GPUs around the corner, the market seems to be flooded with ASICs for any board partner willing to buy them and use as they see fit—including building desktop graphics cards with mobile GPUs. Several Chinese board partners are found selling desktop graphics cards based on the mobile Radeon RX 6600M at prices ranging between the equivalent of USD $180 to $214.

The RX 6600M has essentially the same specs as the desktop RX 6600 (non-XT), with 1,792 stream processors across 28 RDNA2 compute units, 8 GB of 14 Gbps GDDR6 memory across a 128-bit wide memory bus, and similar clock-speeds of 2177 MHz (compared to 2044 MHz of the desktop RX 6600). In fact the RX 6600M has much better typical board power specs of 100 W, compared to 132 W of the desktop RX 6600. The best part of this deal has to be the price. An RX 6600 (non-XT) starts around the $250-mark in the US market. So even with shipping costs added, the $180 RX 6600M comes across as a slightly better deal.

AMD Ryzen 5 7600X "Zen 4" 6-core/12-thread processor is shaping up to be a speed-demon for purely gaming builds, with the company claiming higher gaming performance than Intel current flagship Core i9-12900K. A combination of high clock speeds (4.70 GHz nominal, 5.30 GHz max boost), high power limits from 105 W TDP (130 W limit), the "Zen 4" IPC, and the fact that all that power headroom is available to just 6 cores, means that the chip is able to sustain boost frequencies better. But what when Core Performance Boost (CPB) is disabled? VideoCardz scored screenshots of a Cinebench R23 run to answer just that.

With CPB disabled (in the motherboard BIOS), the Ryzen 5 7600X scores 1681 points in the single-threaded test, and 13003 points in the multi-threaded one. With CPB enabled (which is the default setting), the 7600X bags 1920 points single-threaded, and 14767 points multi-threaded, which is a 14% performance increase just from the processor's boosting algo. Disabling CPB is generally seen as a silver-bullet against high temperatures for AMD processors, and even here, we see the chip running under 60°C, and pulling 60.2 W peak, as measured by HWinfo; whereas with CPB enabled, the chip can run as hot as 92.1°C, pulling up to 110 W, pushing clock speeds up to 4.45 GHz.

During Evercore ISI TMT conference, Intel announced that the company would continue to lose market share, with a possible bounce back in the coming years. According to the latest report, Intel's CEO Pat Gelsinger announced that he expects the company to continue to lose its market share to AMD as the competition has "too much momentum" going for it. AMD's Ryzen and EPYC processors continue to deliver power and efficiency performance figures, which drives customers towards the company. On the other hand, Intel expects a competing product, especially in the data center business with Sapphire Rapids Xeon processors, set to arrive in 2023. Pat Gelsinger noted, "Competition just has too much momentum, and we haven't executed well enough. So we expect that bottoming. The business will be growing, but we do expect that there continues to be some share losses. We're not keeping up with the overall TAM growth until we get later into '25 and '26 when we start regaining share, material share gains."

The only down years that are supposed to show a toll of solid competition are 2022 and 2023. As far as creating a bounceback, Intel targets 2025 and 2026. "Now, obviously, in 2024, we think we're competitive. 2025, we think we're back to unquestioned leadership with our transistors and process technology," noted CEO Gelsinger. Additionally, he had a say about the emerging Arm CPUs competing for the same server market share as Intel and AMD do so, stating that "Well, when we deliver the Forest product line, we deliver power performance leadership versus all Arm alternatives, as well. So now you go to a cloud service provider, and you say, 'Well, why would I go through that butt ugly, heavy software lift to an ARM architecture versus continuing on the x86 family?"

AMD late Thursday unveiled the FidelityFX Super Resolution 2.1 (FSR 2.1) performance enhancement, which builds on the performance-quality gains of FSR 2.0, while improving the visual fidelity and correcting several kinds of upscaling artifacts visible to the keen eye. To begin with, it corrected ghosting issues with geometry carrying motion vectors not matching the underlying pixel colors, which were causing a "shimmering" effect. There are also changes to the disocclusion logic that let it detect disocclusions in areas with little depth separating objects, which again should address some ghosting issues.

Upscaled output quality has been improved by turning some upscaler computations from FP16 to FP32 (full-precision), which should improve color range and temporal stability of the upscaled image. Ghosting issues on transparent geometry has also been improved by updates to the reactive mask. Ghosting issues on geometry with motion vectors not matching underlying pixel colors have been addressed with improvements to the composition and transparency mask. AMD detailed FSR 2.1 in its GPUOpen page, and has made the software available to game developers. Any game currently implementing FSR 2.0 can release FSR 2.1 support through patches. The latest version 1.7.1 patch of Farming Simulator 2022 implements FSR 2.1.AMD also put together a video presentation with Farming Simulator 2022, highlighting the improvements made with FSR 2.1.

Kingston FURY, the gaming division of Kingston Technology Company, Inc., a world leader in memory products and technology solutions, announced today the addition of AMD EXPO certified DDR5 modules to the Kingston FURY Beast line of memory. Always aiming to provide the latest options to gamers and enthusiasts, these new overclock specs modules and kits are optimized for AMD's upcoming AM5 platform with two factory tuned profiles, plus one user customizable profile.

Qualified by the world's leading motherboard manufacturers, the Kingston FURY Beast line offers aggressive speeds up to 6000MT/s1 with a bold low-profile heatspreader design. Now with AMD EXtended Profile for Overclocking, users can trust that their selected Kingston FURY Beast DDR5 modules and kits are exactly what their AMD AM5 system needs to maximize performance, while also maintaining stability.

According to the latest TrendForce statistics, revenue of the top ten global IC design houses reached US$39.56 billion in 2Q22, growing 32% YoY. Growth was primarily driven by demand for data centers, networking, IoT, and high-end product portfolios. AMD achieved synergy through mergers and acquisitions. In addition to climbing to third place, the company also posted the highest annual revenue growth rate in 2Q22 at 70%.

Qualcomm continues in the No. 1 position worldwide, exhibiting growth in the mobile phone, RF front-end, automotive, and IoT sectors. Sales of mid/low-end mobile phone APs were weak but demand for high-end mobile phone APs was relatively stable. Company revenue reached US$9.38 billion, or 45% growth YoY. NVIDIA benefitted from expanded application of GPUs in data centers to expand this product category's revenue share past the 50% mark to 53.5%, making up for the 13% YoY slump in its game application business, bringing total revenue to US$7.09 billion, though annual growth rate slowed to 21%. AMD reorganized its business after the addition of Xilinx and Pensando. The company's embedded division revenue increased by 2,228% YoY. In addition, its data center department also made a considerable contribution. AMD posted revenue of US$6.55 billion, achieving 70% growth YoY, highest amongst the top ten. Broadcom's sales performance in semiconductor solutions remained solid and demand for cloud services, data centers, and networking is quite strong. The company's purchase order backlog is still increasing with 2Q22 revenue reaching US$6.49 billion, an annual growth rate of 31%.

Starting next year, AMD will move to a new model number scheme for its mobile processors and it appears that the company has decided to use the first digit to represent the model year, which should alleviate some past confusion. The second digit in the model name will represent where in the product stack the specific chip will sit and here we're potentially getting some new 6 and 8 models, although nothing guarantees that AMD will actually implement these segments into real products. The third digit represents the architecture, so a four equals Zen 4 for example.

The last digit in the model names is a new addition where AMD has sub SKUs that offer some performance advantage of the base SKU of a specific model and this digit will apparently only be represented by a 0 or a 5. Finally AMD has added a new suffix too, where C stands for Chromebook. This translates to 15-28 Watt chips that have been designed specifically for Chromebook usage. The current HX, HS and U suffix lettering will carry over, alongside the lower-case e for 9 W versions the U SKUs. AMD has also segmented it's mobile CPUs according to the chart below, to try and deliver a clearer use case for its various CPU models. The chart is pretty self explanatory, although some of the segmentation will apply to updated models of current designs, whereas others will only apply to new laptop designs. The new model numbering scheme will apply to at least 2025.

The PC version of "Red Dead Redemption 2" received official support for the AMD FidelityFX Super Resolution 2.0 (FSR 2.0) performance enhancement with the latest Version 1.31 patch. The game now supports FSR 2.0 as well as DLSS. The update also includes improvements to the temporal anti-aliasing (TAA) implementation in the PC version. The update comes two months following a community mod that added FSR 2.0 to the game unofficially, which required you to run the game with its DirectX 12 renderer, and add or replace certain game files. The official 1.31 patch adds FSR 2.0 support for both the DirectX 12 and Vulkan renderers. The 433 MB patch is being pushed through Steam.

EK, the market leader in high-end water cooling for PC products, wishes to inform existing and future customers regarding the compatibility of our existing cooling solutions with the highly anticipated AMD Socket AM5 platform. Compared to Socket AM4, the backplate mounting hole pattern is still 54 x 90 mm and uses UNC 6-32 threads, but the AM5 motherboards now have an integrated CPU-socket backplate. The stock backplate is best kept untouched since removing it also means fiddling with the CPU loading mechanism and exposing the socket pins. To avoid such risks, some EK products need to be updated, but fear not, as compatibility is handled for all existing EK products.

AMD Ryzen 7000 "Zen 4" processors can hit up to 95 °C at stock settings, with cooling most appropriate to the TDP level. This is because the PPT (package power tracking) limits for the 170 W TDP processors is as high as 230 W, and for the 105 W TDP models, it's 130 W. After reaching this temperature threshold, the processor begins to downclock itself to lower temperatures. Harukaze5719 discovered that higher than needed core voltages could be at play, and manually undervolting the processors could free up significant thermal headroom, letting the processors hold on to higher boost multipliers better.

A Cinebench R23 picture of AMD's recently announce Ryzen 9 7950X CPU having been put through its paces have appeared online via a post on Baidu, which has been taken down since the picture was posted. However, courtesy of @harukaze5719 it lives on, on Twitter and gives us a first glimpse into the Cinebench R23 performance of the upcoming CPU. The CPU is said to have been air cooled, so it's possible that we'll see even higher benchmark numbers with better cooling, so take these numbers with a pinch of sodium chloride, just to be on the safe side. The test system was also using Windows 10, so there's the potential of some extra performance by changing to Windows 11 here as well.

In the single score test, the Ryzen 9 7950X scores 2,205 points, which is in line with Cinebench R23 leaks for Intel's upcoming Core i9-13900K CPU, if a smidgen slower. The multi-core score is obviously not going to compete with Intel's Core i9-13900K due to the overall lower core count, but at 29,649, but it's ahead of the Core i9-12900K by a decent margin. It'll be interesting to see how AMD positions the 7000-series of CPUs, as although it seems like the company has done a good job in improving the overall performance compared to the 5000-series, it's not quite enough to take the performance crown this time around, if these early benchmark leaks from both sides are anything to go by.

Update 10:27 UTC: A new picture hjas appeared where the CPU has been kitted out with better cooling at the multi-core score has jumped from 29,649 to 36,256, which makes it competitive with the Core i9-13900K scores that have leaked in the past.

At this point, we don't know if this is a limitation at AMD's level or ASRock's, but someone with access to a retail ASRock X670E Steel Legend motherboard, with all its packaged paraphernalia in place, spotted an interesting sticker covering the board's four DDR5 DIMM slots. The sticker has some info on the ideal DIMM slot selection for dual-channel memory (4x sub-channels); but what catches our eye is a table which states just how long the motherboard will take to train the memory the first time it's booted up, or after a clear-CMOS operation (where your BIOS settings are erased).

The table says that a typical setup with two 16 GB modules (read: two single-rank modules in a 1 DIMM per channel/1DPC configuration), takes 100 seconds to train (or until first boot). Two 32 GB modules (typically a pair of dual-rank modules in 1DPC configuration) take 200 seconds, as do four 16 GB modules (four single-rank modules in a 2DPC configuration). The least optimal config, four dual-rank modules in a 2DPC configuration, takes a whopping 400 seconds (almost 7 minutes) to train. That's 100 to 400 seconds of a black screen, or no display signal, enough to unnerve anyone and assume something is DOA.Update Sep 2nd: The source behind this story confirmed that this is an ASRock-level issue, and that it's been "fixed" with the latest BIOS.

Update Sep 8th: This has been fixed according to ASRock.

With its recent announcement of the Ryzen 7000 desktop processors, the action now shifts to the server, with AMD preparing a wide launch of its EPYC "Genoa" and "Bergamo" processors this year. Powered by the "Zen 4" microarchitecture, and contemporary I/O that includes PCI-Express Gen 5, CXL, and DDR5, these processors dial the CPU core-counts per socket up to 96 in case of "Genoa," and up to 128 in case of "Bergamo." The EPYC "Genoa" series represents the main trunk of the company's server processor lineup, with various internal configurations targeting specific use-cases.

The 96 cores are spread twelve 5 nm 8-core CCDs, each with a high-bandwidth Infinity Fabric path to the sIOD (server I/O die), which is very likely built on the 6 nm node. Lower core-count models can be built either by lowering the CCD count (ensuring more cores/CCD), or by reducing the number of cores/CCD and keeping the CCD-count constant, to yield more bandwidth/core. The leaked product-stack table below shows several of these sub-classes of "Genoa" and "Bergamo," classified by use-cases. The leaked slide also details the nomenclature AMD is using with its new processors. The leaked roadmap also mentions the upcoming "Genoa-X" processor for HPC and cloud-compute uses, which features the 3D Vertical Cache technology.

The new Lenovo ThinkBook 16p Gen 3 will help content creators and power users unleash their creativity without limitations. The latest supercharged ThinkBook features up to AMD Ryzen 9 6000 H-series processors and NVIDIA GeForce RTX 3060 discrete graphics to deliver flagship performance with Windows 11. The immersive narrow-bezel 16-inch 2.5K IPS display options include TÜV Rheinland Low Blue Light and TÜV Eyesafe certifications to maximize eye comfort and include an Ambient Light Sensor that adjusts screen and keyboard backlight brightness. Two display options are available including a 400nit 60 Hz panel and a new 500nit 165 Hz VESA Certified HDR400 panel offers vivid colors and increased shadow and highlight detail. Both display options are also X-Rite Pantone Certified and support Dolby Vision content.

Super processing power of the AMD Ryzen 6000 Series Mobile Processors and NVIDIA GeForce RTX graphics help users tackle the most arduous demands of hybrid working. The addition of up to 32 GB dual-channel LPDDR5 memory, up to 2 TB through dual SSD storage and a 71Wh battery should keep users powered throughout the day. New working styles also require high-speed reliable connectivity and port availability for flexible and versatile connections. Conveniently connect to wireless networks, peripherals, and AV equipment thanks to Wi-Fi 6 support and two USB Type-C ports including one USB4, two USB-A 3.2 Gen 2 and an HDMI 2.1 port.

AMD in its Discord AMA confirmed DDR5-6000 to be the "sweetspot" memory overclock for its upcoming Ryzen 7000 "Zen 4" processors. A sweetspot frequency in AMD jargon is an inflection of performance, stability, cost, and ease. For the very first Ryzen, this was DDR4-3200. For Ryzen 2000, it was DDR4-3400. For the Ryzen 3000 "Zen 2," it climbed to DDR4-3800, the Ryzen 5000 "Zen 3" it was DDR4-4000.

At the architectural-level, it is usually the highest frequency where FClk, UClk, and MClk maintain a 1:1:1 ratio, before having to engage dividers that impact performance, making it a point of diminishing returns for investing in faster memory modules. AMD's Robert Hallock, leading the Discord AMA, recommended that FClk be left untouched at "Auto" for the best results, and overclockers look for an Auto:1:1 ratio for the FClk, UClk, and MClk. As with both AMD and Intel now, the highest frequencies are possible only with one single-rank DIMM per memory channel (1DPC), and memory overclocking yield lower results with dual-rank DIMMs, or two DIMMs per memory channel. Among the AMD EXPO-certified DIMMs announced over the past few days, some do engage memory clocks beyond DDR5-6000. It would be interesting to see how they affect the "golden ratio" for Zen 4.

The U.S. Government has imposed restrictions on the export of AI compute GPUs to China and Russia without Government-authorization in the form of a waiver or a license. This impacts sales of products such as the NVIDIA A100, H100; AMD Instinct MI100, MI200; and the upcoming Intel "Ponte Vecchio," among others. The restrictions came to light when NVIDIA on Wednesday disclosed that it has received a Government notification about licensing requirements for export of its AI compute GPUs to Russia and China.

The notification doesn't specify the A100 and H100 by name, but defines AI inference performance thresholds to meet the licensing requirements. The Government wouldn't single out NVIDIA, and so competing products such as the AMD MI200 and the upcoming Intel Xe-HP "Ponte Vecchio" would fall within these restrictions. For NVIDIA, this is impacts $400 million in TAM, unless the Government licenses specific Russian and Chinese customers to purchase these GPUs from NVIDIA. Such trade restrictions usually come with riders to prevent resale or transshipment by companies outside the restricted region (eg: a distributor in a third waived country importing these chips in bulk and reselling them to these countries).

Samsung Electronics will unveil the Odyssey OLED G8 (Model Name: G85SB)—another premium addition to the Odyssey lineup—at IFA 2022 in Berlin, Germany, further reinforcing the Odyssey's industry-leading position. The Odyssey OLED G8 is the company's first OLED gaming monitor and will be available in an ultra-thin, 34-inch form factor, delivering brilliant brightness on an OLED panel partnered with Quantum Dot Technology and packed full of premium gaming features including an incredibly low 0.1 ms response time and 175 Hz refresh rate.

The new 34-inch Odyssey OLED G8 is built to an ultra-slim thickness of 3.9 mm at its thinnest part—the slimmest in its product category—and finished with a sleek, metal frame. The monitor requires no backlighting, while delivering true RGB and true black for maximum color accuracy and brightness—all without a color filter. The lighting is controlled in pixels which can be expressed in black with a near-infinite contrast ratio.

We already know that AMD is working on a variant of the "Zen 4" CPU complex die (CCD) featuring 3D Vertical Cache (3DV-cache) memory, through company roadmaps, and AMD even confirmed to us that the technology continues to be a part of the client roadmap of the company. We're now getting news that the first Ryzen 7000X3D ("Zen 4" with 3DV cache) processors could be unveiled by the 2023 International CES (January next year). It appears like while the conventional Ryzen 7000 series beats the 12th Gen Core "Alder Lake" at gaming, it might trade blows with the 13th Gen "Raptor Lake," and AMD will count on the 3DV cache technology to give it a competitive edge.

Greymon55, a reliable source with AMD leaks, hints at the possibility of three 7000X3D-series SKUs: the Ryzen 7 7800X3D (8-core/16-thread) positioned above the 7700X; the Ryzen 9 7900X3D (12-core/24-thread), and the Ryzen 9 7950X3D (16-core/32-thread). Older reports suggest the 3DV cache on these processors will be a generation more advanced to keep sync with the on-die L3 cache of the "Zen 4" CCD, and the L3D (the die on which the 3DV cache is located), will likely be built on the 6 nm process.

With AMD announcing an October 2022 debut of its mid-range Socket AM5 motherboard chipset, the AMD B650E and B650; manufacturers appear to be ready with a fairly broad selection of products targeting various price-points. The B650E and B650 are expected to have a lighter I/O feature-set than the X670E/X670, and will enable manufacturers to sell motherboards at prices starting at $125. Two of the leading manufacturers, ASUS and ASRock, are ready with their product lists.

The initial ASUS motherboard lineup for the AMD B650E and B650 chipsets include just one product in the mainline Prime series, as many as four from the TUF Gaming series, and two from the ROG Strix series. From these, only one is based on the B650E (meaning, it gets a PCI-Express 5.0 x16 slot besides the M.2 Gen 5 slot). The others are based on the vanilla B650 (PCI-Express 4.0 x16 slot besides M.2 Gen 5 slots). None of the boards has more than 4 SATA 6 Gbps ports. The board to watch out for will be the ROG Strix B650E-E Gaming WiFi, as it could bring several high-end features into the mid-range, and if previous generations of AMD chipset are anything to go by, the B650/E retains CPU overclocking support.

At IFA 2022, MSI introduces its latest products, tailor-made for gamers, creators, and professionals, to the world. From gaming laptops, desktops, and components, to business monitors, industrial computers, and automotive and commercial solutions, MSI is revealing the most powerful, capable new products, covering every need and every aspect of technology.

Exhibition Date: Sep 2nd - Sep 6th, 2022
Opening Hours: 10:00 AM - 06:00 PM
Location: Stand 102, Hall 11.2 @ Messe Berlin, Germany
"IFA 2022 is one of the world's most important consumer electronics trade shows. After years of virtual and distanced living, MSI is especially well-prepared to support all industries and professions with our innovations and solutions, to help them adapt to new ways of working, living and entertaining," said Sam Chern, MSI Marketing Vice President.

An AMD Ryzen 9 7950X "Zen 4" 16-core/32-thread processor was put through the Geekbench 5.4.5 benchmark, and it's becoming all too clear that AMD has a highly competitive product on its hands. The 7950X yielded a single-threaded score of 2217 points, and 24396 points in the multi-threaded tests. With these scores, the 7950X is about 14% faster than the "Golden Cove" P-cores of the i9-12900K "Alder Lake" processor in the single-threaded tests, and comes out as being 41% faster than it in the multi-threaded test. Against the leaked i9-13900K "Raptor Lake," the 7950X is shown being about 4% slower in the single-threaded test (against the "Raptor Cove" P-cores); and about 7.8% slower in the multi-threaded test.

ASRock is planning to introduce a new line of motherboards probably targeted at value-conscious creators, with the new LiveMixer series. The company's first LiveMixer product is based on the AMD B650 mid-range chipset. The Socket AM5 motherboard's PCB was leaked to the web, revealing a fairly mid-range feature-set, notwithstanding the 17-phase VRM. We spy at least three M.2 slots, from which one should be Gen 5, an M.2 E-key slot for the WLAN card; addon slots that include a PCI-Express 4.0 x16, and two Gen 3 x4 slots. For all its talk of live-mixing, the onboard audio solution appears to be rather basic, with jacks for just 6-channels, and the CODEC pin-out seems to be made out for an entry-level CODEC, such as the ALC892.

AMD CEO Lisa Su, who has supervised the company's rise from the ashes, looked to assuage fears of reduced stock for the launch of AMD's next-gen Ryzen 7000 series CPUs. Hardware enthusiasts being understandably burned from the last generation of GPU and CPU's lack of availability (and ensuing scalping practices), the CEO in today's announcement of the Ryzen 7000 series carried a promise: "It is true that if you look at the past 18 months there have been a number of things, whether its capacity limitations or logistics," she said. "From an AMD standpoint, we have dramatically increased our overall capacity, in terms of wafers, as well as substrates and on the back end. So with our launch of Zen 4 we don't expect any supply constraints."

AMD's Zen 4 family is being launched with the new AM5 socket, which AMD says will live through 2025+ for subsequent CPU releases. The company has managed to increase IPC by 13% while decreasing the overall CCD size by 18% compared to that of Zen 3 (reducing the area/cost impact of adding integrated graphics throughout the lineup). Frequencies have gone up to a maximum 5.7 GHz thanks to smart circuitry redesign and TSMC's 5 nm node. AMD says its Ryzen 7000 can thus be expected to provide up to 29% higher single-core and 45% higher multi-core performance. Of course, with macroeconomics being what they are, and recent reports on lack of low-price chips throughout the market, it's not only the availability of Ryzen 7000 CPUs that matters: AM5 motherboards and DDR5 memory chip stocks have to be taken into account as well. But all in all, AMD seems to be prepared for a successful and quantity-adequate launch.