Leading global motherboard manufacturer, ASRock, is proud to announce its new lineup, LiveMixer. There are Z790 LiveMixer and B650 LiveMixer for Intel's and AMD's new platform separately, which are produced in partnership with content creators that need motherboards with superb reliability, cutting-edge performance and an extended connectivity mix for the many auxiliary devices required for streaming. LiveMixer is the incarnation of valiance. It sets us free from the concrete jungle with its colorful graffiti. The stylish pattern represents the courage and bravery we possess to speak up for ourselves and try new things enriching life.

"We've studied the need of live streaming for a long time, and here comes our first LiveMixer that helps streamers to stream in great quality with its well VRM design, additional PCIe slots and twenty-plus USB ports." Says Chris Lee, Vice President of ASRock Motherboard & Gaming Monitor Business Unit. With a maximum of 23 USB ports to connect external devices, users will never run short. Hook up every peripheral, whether it's mice, keyboards, microphones, headsets, multiple cameras, fill-lights, macropads, and much more. Equipped with dual PCI-Express 4x slots & Thunderbolt header, The LiveMixer allows users to connect a graphics card, a high-speed capture card and a Thunderbolt add-in card at the same time.

Today AMD (NASDAQ: AMD) announced its collaboration with the Energy Sciences Network (ESnet) on the launch of ESnet6, the newest generation of the U.S. Department of Energy's (DOE's) high-performance network dedicated to science. AMD worked closely with ESnet since 2018 to integrate powerful adaptive computing for the smart and programmable network nodes of ESnet6. ESnet6's extreme scale packet monitoring system uses AMD Alveo U280 FPGA-based network-attached accelerator cards at the core network switching nodes. This will enable high-touch packet processing and help improve the accuracy of network monitoring and management to enhance performance. The programmable hardware allows for new capabilities to be added for continuous innovation in the network.

In order to customize AMD Alveo U280 2x100Gb/s accelerators as network interface cards (NIC) for ESnet6, the OpenNIC overlay - developed by AMD - was used to provide standard network-interface and host-attachment hardware, allowing novel and experimental networking functions to be implemented easily on the Alveo card. OpenNIC has since been open-sourced after being successfully used and evolved by ESnet, as well as various leading academic research groups. Also important for rapid innovation by non-hardware experts was the use of the AMD VitisNetP4 development tools for compiling the P4 packet processing language to FPGA hardware.

AMD Alveo U280 cards, using OpenNIC and VitisNetP4, are being deployed on every node of the ESnet6 network. The high-touch approach based on FPGA-accelerated processing allows every packet in the ESnet6 network to be monitored at extremely high transfer rates to enable deep insights into the behavior of the network, as well as helping to rapidly detect and correct problems and hot spots in the network. The Alveo U280 card with OpenNIC platform also supplies the adaptability to allow the continuous roll-out of new capabilities to the end user community as needs evolve over the lifetime of ESnet6.

With the arrival of AMD's Ryzen 7000 series desktop processors based on the new Zen 4 architecture, the world's leading computer brand, GIGABYTE today announces its B650E and B650 motherboards ready to power these next-gen CPUs. Sporting the new AM5 socket, the AORUS B650E and B650 gaming motherboards are equipped with a direct digital power design and a full-covered cooling module to keep the circuitry cool. These AORUS motherboards come with PCIe 5.0 connectivity and support for DDR5 memory, which are AMD EXPO and Intel XMP capable of up to DDR5-6600 and beyond. The AORUS gaming motherboards are also equipped with the DIY-friendly PCIe and M.2 device fast installation and removal design, making future upgrades quick and easy.

Power delivery and thermal design have always been the top factors when it comes to CPU performance. To meet the needs of gamers looking for powerful yet stable system performance, the AORUS B650E and B650 gaming motherboards are designed with a maximum 16+2+2-phase twin digital power, covered by a massive heatsink that has four times more surface than the previous generation to ensure the smoothest power delivery even under loads. Other thermal designs, such as 8 mm mega-heatpipes and dedicated heatsinks on key components, greatly improves the system's stability and overall performance. With the friendly design of PCIe and M.2 EZ-Latch features on the AORUS B650 gaming motherboards, GIGABYTE makes components swapping a whole lot easier.

When AMD announced that the company would deliver the world's fastest supercomputer, Frontier, the company also took a massive task to provide a machine capable of producing one ExaFLOP of total sustained ability to perform computing tasks. While the system is finally up and running, making a machine of that size run properly is challenging. In the world of High-Performance Computing, getting the hardware is only a portion of running the HPC center. In an interview with InsideHPC, Justin Whitt, program director for the Oak Ridge Leadership Computing Facility (OLCF), provided insight into what it is like to run the world's fastest supercomputer and what kinds of issues it is facing.

The Frontier system is powered by AMD EPYC 7A53s "Trento" 64-core 2.0 GHz CPUs and Instinct MI250X GPUs. Interconnecting everything is the HPE (Cray) Slingshot 64-port switch, which is responsible for sending data in and out of compute blades. The recent interview points out a rather interesting finding: exactly AMD Instinct MI250X GPUs and Slingshot interconnect cause hardware troubles for the Frontier. "It's mostly issues of scale coupled with the breadth of applications, so the issues we're encountering mostly relate to running very, very large jobs using the entire system … and getting all the hardware to work in concert to do that," says Justin Whitt. In addition to the limits of scale "The issues span lots of different categories, the GPUs are just one. A lot of challenges are focused around those, but that's not the majority of the challenges that we're seeing," he said. "It's a pretty good spread among common culprits of parts failures that have been a big part of it. I don't think that at this point that we have a lot of concern over the AMD products. We're dealing with a lot of the early-life kind of things we've seen with other machines that we've deployed, so it's nothing too out of the ordinary."

AMD (NASDAQ:AMD) today announced selected preliminary financial results for the third quarter of 2022. Third quarter revenue is expected to be approximately $5.6 billion, an increase of 29% year-over-year. AMD previously expected revenue to increase approximately 55% year-over-year at the mid-point of guidance. Preliminary results reflect lower than expected Client segment revenue resulting from reduced processor shipments due to a weaker than expected PC market and significant inventory correction actions across the PC supply chain.

Revenue for the Data Center, Gaming, and Embedded segments each increased significantly year-over-year in-line with the company's expectations. Gross margin is expected to be approximately 42% and non-GAAP(*) gross margin is expected to be approximately 50%. AMD previously expected non-GAAP gross margin to be approximately 54%. The gross margin shortfall to expectations was primarily due to lower revenue driven by lower Client processor unit shipments and average selling price (ASP). In addition, the third quarter results are expected to include approximately $160 million of charges primarily for inventory, pricing, and related reserves in the graphics and client businesses.

With the launch of AMD AM5 X670 motherboards, GIGABYTE, the world's leading computer brand, announces today that all customers in North America region purchasing new GIGABYTE and AORUS X670 motherboards will receive an automatic extended warranty. Expanding on the leading 3-year warranty, customers will receive an upgrade of an additional 2 years warranty for a total of 5 years.

GIGABYTE X670 motherboards have long been known for their Ultra Durable pedigree. Each motherboard is the culmination of several thousand hours of design and painstaking cooperation between several teams to produce the next generation of high performance hardware. In addition to quality components such as Japanese capacitors, multi-layer PCB design, and proprietary NanoCarbon coating on critical heat dissipating surfaces, GIGABYTE continues to push the envelope with innovative features, advancing the industry and setting a new standard.

Noctua today announced its new NA-TPG1 thermal paste guard for AMD's latest AM5 based Ryzen processors. When the mounting pressure of the cooling solution is applied, excess thermal paste will be squeezed outwards. With AM5 CPUs, this excess paste tends to accumulate in the cut-outs at the sides of the heat-spreader and may become difficult to remove. Simple and risk-free to apply, the NA-TPG1 prevents this undesired phenomenon.

"While there's no denying that AMD's new Ryzen 7000 processors perform fantastic, we found that the cut-outs at the side of the heat-spreader tend to attract thermal paste that can be challenging to clean off" says Roland Mossig (Noctua CEO). "This is where our new thermal paste guard steps in: it's a simple yet highly effective tool for keeping your new Ryzen 7000 series CPU nice and clean."

BIOSTAR today introduced the Racing B650EGTQ, a Socket AM5 motherboard based on the AMD B650E chipset, in the Micro-ATX form-factor. The board offers a premium feature-set, including PCI-Express Gen 5 for both the x16 PEG slot, and the M.2 NVMe slot wired to the CPU. The board draws power from a combination of 24-pin ATX, and 8+4 pin EPS. It uses a 14-phase VRM with 90 A DrMOS to power the processor. The processor is wired to four DDR5 DIMM slots, a PCI-Express 5.0 x16, and two M.2 NVMe slots with PCI-Express 5.0 x4 wiring. Other expansion slots include a PCI-Express 4.0 x16 (electrical Gen 4 x4) wired to the B650E chipset.

Storage connectivity on the BIOSTAR Racing B650EGTQ includes two M.2 NVMe Gen 5, one M.2 NVMe Gen 4, and four SATA 6 Gbps ports. This is one of the very few motherboards to wire out both Gen 5 x4 GPP interfaces of the Socket AM5 SoC as M.2 NVMe slots. Network connectivity include a 2.5 GbE driven by a Realtek 8125B controller; and preparation for a WLAN card, although the board doesn't have any M.2 E-key slots. The onboard audio soludion features a premium Realtek ALC1220 CODEC. The company didn't reveal pricing.

AMD today released the latest version of the AMD Software Adrenalin drivers. Version 22.10.1 beta comes with optimization for "Overwatch 2," the hot new online shooter from Blizzard. The drivers also fix a couple of outstanding issues. The first one fixes "GPU for image processing" preference not being available in Adobe Lightroom, with graphics cards such as the Radeon RX 6000 series. The second one is an application crash experienced with "Street Fighter 6" beta. With this release AMD also acknowledges identifying several new issues, which it will fix in future releases.

DOWNLOAD: AMD Software Adrenalin 22.10.1 beta

GIGABYTE TECHNOLOGY Co. Ltd, a leading manufacturer of motherboards, graphics cards, and hardware solutions announced the latest AMD B650 motherboards based on the success of the X670 series. The comprehensive lineup includes AORUS, AERO, and GAMING series to provide more reasonable options with notable features for users. GIGABYTE select B650 motherboards adopt PCIe 5.0 / 4.0 x16 graphics interface and PCIe 5.0 / 4.0 M.2 slots with EZ-Latch technology, making it easier than ever for users to upgrade graphics cards and M.2 SSDs, avoiding accidental damage to the surrounding components. Further, up to 16+2+2 phase Twin Digital power, 105 Amps Smart Power Stage, and up to 12-layer PCB provide increased stability, optimal compatibility, and performance for AMD Ryzen 7000 series processors. With the advanced thermal design, VRM temperature is reduced, stabilizing the power and performance of the PCIe 5.0 slot and PCIe 4.0 M.2 SSD and avoiding performance drop due to thermal throttling. Meanwhile, the enhanced shielding design of SMD slots strengthens the reliability of signals and slot structure. In addition, select models take advantage of Active OC Tuner technology to deliver optimized performance with a more flexible and user-friendly experience.

The latest X670E motherboard platform introduced a wealth of cutting-edge features to accompany AMD's latest 7-series CPUs. Headlined by PCIe 5.0 connectivity and across-the-board DDR5 support, our X670E motherboards cater to enthusiasts ready to extract every ounce of performance they can get out of their new AMD processor. Now, mainstream PC builds can get in on the action, too. Our B650E and B650 boards offer tremendous value for anyone assembling a next-gen machine. This B650 motherboard guide walks you through our different product families to help you find the model that best fits your needs and budget.

Shopping for a gaming-first motherboard that delivers exceptional performance and exudes confident style? Start with our ROG Strix lineup. From the flagship ROG Strix B650E-E Gaming WiFi to the compact-yet-mighty ROG Strix B650E-I Gaming WiFi, these boards bring high-end features and sizzling good looks. Perhaps you'd prefer a straightforward gaming board that delivers essential features in a no-frills design? Check out our TUF Gaming family. Available in either ATX or micro-ATX form factors, these products deliver everything you need for a reliable gaming build and nothing that you don't.

Last week NZXT announced its high-end Z790 motherboard for Intel's upcoming 13th gen Core processors and this week, the company is following up that announcement with its first AM5 motherboard for the Ryzen 7000 series, in the shape of the N7 B650E. The board comes with either white or black shielding, although the PCB is black in both cases, as is the rear I/O cover. NZXT has gone for a mid-range feature set, with a 16+2+1 Smart Power Stage design rated at 90 A, which places it on par with ASRock's B650E Steel Legend. Speaking of ASRock, it has been NZXT's OEM in the past, but we can't find a board with the same general layout as the N7 B650E in ASRocks' lineup this time around, so this is either a proper custom design or NZXT has changed its OEM partner.

The board has one PCIe 5.0 x16 slot and two PCIe 4.0 x16 slots, with one having four lanes of bandwidth and the other two lanes of bandwidth. The board also features three M.2 slots, one PCIe 5.0 and two PCIe 4.0, one of which is limited to two lanes of PCIe bandwidth. Other features include 2.5 Gbps Ethernet, a WiFi 6E/Bluetooth 5.2 combo module, an HDMI 2.1 port, four SATA ports and sadly what appears to be a 10 Gbps rather than a 20 Gbps USB-C port around the back. There's also a front header for another 10 Gbps USB-C port. NZXT has all the standard features you'd expect to see on a modern motherboard such as rear mounted clear CMOS and BIOS flashing buttons, debugging LEDs, albeit the basic kind and a good spread of fan headers and RGB LED connectors. A full set of audio connectors are also present and the audio chip of choice is the Realtek ALC1220. The only real hurdle for this board to become a success is going to be the price tag, as NZXT lists the board on its site for US$349.99/€429.99/£429.99, which is a very steep asking price for what's on offer here.

Leading global motherboard manufacturer, ASRock, is proud to announce its AMD B650E/B650 motherboard series. These motherboards are targeted at the mainstream AM5 segment featuring various exciting new products such as our flagship B650E Taichi, the high-end B650E Steel Legend Wi-Fi for high end market, B650E PG Riptide Wi-Fi and B650 PRO RS for mainstream users, and B650 PG Lightning a new SKU joining the Phantom Gaming family targeted the entry level market. ASRock also offers the new B650E PG-ITX WiFi for small form factor enthusiasts.

ASRock went all-out on its VRM design by creating a 24+2+1 phase Smart Power Stage (SPS) Dr.MOS on the B650E Taichi series, providing users with the most powerful AM5 platform it can offer ready to unlock maximum CPU performance. The flagship ASRock B650E Taichi motherboards are equipped with many exciting features and technologies such as PCIe 5.0 technology for graphics cards and M.2 SSDs, an incredible IO that includes the latest USB4 offering a fast and simple level of connection for work or home.

MSI, a world leading motherboard brand in high-performance and innovative computing, announces its brand new AMD B650 Series motherboards. MSI is not only tailored for enthusiast gamers, but also offers possibilities for content creation and office use. MSI is fully dedicated to all types of PC users by satisfying their needs. This time, we carefully prepared a variety of advanced technologies and exclusive features to help our customers create the most immersive experiences and maximize every ounce of performance.

"With DDR5 memory boost and an enhanced thermal design, MSI B650 Series motherboards are built to fully support the performance and capabilities of AMD Ryzen 7000 Series processors," said David McAfee, Corporate Vice President and General Manager, Client Channel Business Unit, AMD. "Designed specifically for gamers and content creators, MSI motherboards feature advanced technologies that take full advantage of the AM5 platform."

GIGABYTE released three of the first Socket AM5 server motherboards and barebones, letting you build small-business/home servers using AMD Ryzen 7000 series processors. These boards may feature a client-segment CPU socket, but come with server-grade components for 24/7 or high-uptime operation, and remote-management features. The three are based on the AMD B650E chipset, which means it gets full PCI-Express Gen 5 (for an x16 slot and an x4 Gen 5 NVMe).

The MC13-LE0 and MC13-LE1 motherboards are built in the Micro-ATX form-factor, but with a design optimized for rack airflow. Both boards feature an identical PCB layout, but differ in their network connectivity options. The MC13-LE1 offers two 10 GbE interfaces driven by an Intel X710 controller; while the MC13-LE0 gives you two 1 GbE interfaces, each driven by an Intel i210. Both boards offer an ASPEED AST2600 remote-management chip with its dedicated 1 GbE port; one M.2 PCIe Gen 5 slot, a PCI-Express 4.0 x4 slot, and four SATA 6 Gbps ports. The W332-Z00 is an M-ATX tower server/workstation barebones (you add your own processor, DDR5 memory, and storage). This features a different motherboard than the MC13-LE#, with two M.2 PCIe Gen 5 slots, and Realtek-supplied remote-management and 2.5 GbE chips.

Unfortunately there's no pricing attached to this leak, unlike the earlier pricing details for MSI's B650 motherboards from B&H, but Videocardz has managed to get the specs for ASRocks upcoming B650 and B650E motherboards. Once again we're looking at a collection of seven models, four B650E and three B650 models in total. Something interesting to note that Videocardz is pointing out, is that only the cheapest board in the lineup has a six layer PCB, with most models using an eight layer PCB and the Mini-ITX board is going up to 10 layers. In other words it seems like most entry level boards are now using high-end PCBs, due to the transition to PCIe 5.0.

The base model is the B650 PG Lightning, which is a pretty feature stripped motherboard, yet all PCIe slots are said to be PCIe 4.0 and it has a pre-installed I/O shield. It comes with 2.5 Gbps Ethernet, but WiFi is optional. At least there's a rear mounted 20 Gbps USB-C port here and the board has a total of three M.2 slots, of which one is PCIe 5.0. On the same kind of level sits B650 Pro RS, which is a step down in the sense that one of the M.2 slots PCIe 3.0 x2 and it has fewer PCIe slot, but it appears to have slightly fancier cooling for the VRMs and it gains a DisplayPort output around the back.

This one is likely to go down ASRock's internal history as a failure of sticking proportions. Namely, it seems that some ASRock motherboards in the newly-released AM5 X670 / X670E family carry stickers overlaid on the DDR5 slots. The idea was to provide users with a handy, visually informative guide on DDR5 memory stick installations and a warning on abnormally long boot times that were to be expected, according to RAM stick capacity. But it seems that these low-quality stickers are being torn apart as users attempt to remove them, leaving behind remnants that are extremely difficult to clean up and which can block DRAM installation entirely or partially. I, for one, would never install a DDR5 module if I thought there was a chance for some paper bits to have fallen on to the DRAM slots - paper and glue bits within the DRAM slots don't seem particularly conducive to a successful motherboard POST.

In the meantime, the company has already announced that it's not only aware of the problem, it's willing to accept RMAs for motherboards that sport the impossible-to-cleanly-peel stickers (consumers should contact their retailers and e-tailers for the exchange). Information around forums where this issue is being discussed don't seem to point to any instance of actual motherboard damage resulting from the stickers - enough patience or an entire motherboard exchange seem to be two solutions to this problem. The company also announced that its latest motherboard batches on AMD's X670 chipsets no longer carry the stickers themselves, due to several BIOS-level improvements that have brought down the boot times, making the informative stickers unneeded. Still, when one takes into account the consumer and company cost of activating an RMA process, it seems that the company shouldn't have skimped on the sticker quality itself.

EK, the European manufacturer of premium liquid cooling gear, and MSI, a world-leading gaming brand, have traditionally partnered up to launch an X670E-based motherboard that comes packaged with a Quantum-design monoblock. This time, it will come in a Limited Edition run. The monoblock offers unparalleled cooling for the VRM section and the AMD Ryzen 7000 series CPUs, as well as a plethora of other nifty features, like the integrated flow meter and temperature sensor, allowing users to have precise checks on their loop status.

Cooling the Ryzen 7000 CPUs is no small feat, and air coolers struggle to get the most out of them. The new Ryzen 7000 series CPUs don't have a fixed frequency as CPUs used to. Instead, the boost clock is primarily contingent on thermals and, secondarily, power. Here's where liquid-cooled EK-Quantum Momentum² Monoblock comes into play. Not only does it make sure that your CPU is properly cooled, but it also ensures the power delivery system is as cool as possible. This allows the user to push performance to the limits while having a quiet system that stays as cool as possible.

GIGABYTE Technology, (TWSE: 2376), an industry leader in high-performance servers and workstations, today announced supporting products for the new AMD AM5 platform starting with two GIGABYTE motherboards, MC13-LE0 & MC13-LE1, that pair a consumer CPU with IPMI management functionalities via BMC. Additionally, a new desktop workstation, W332-Z00, was released using the same motherboard series platform that supports remote management, but the W332 does so with a Realtek NIC that enables DASH.

The new GIGABYTE products designed to support host systems are deceivingly powerful with a small micro-ATX form factor motherboard and enterprise rich out-of-band management features on top of PCIe Gen 5 and DDR5 technologies. These new client friendly products will be found in office settings under a desk rather than a rack in a data center, as they be managed from anywhere, provided there is a network connection. Furthermore, these new products are purpose built for the mainstream AMD B650E chipset with AMD Zen 4 architecture for AMD Ryzen 7000 Series desktop processors.

An alleged AMD client product roadmap slide leaked to the web confirms the Ryzen 7000X3D series. This also builds on a confirmation by Robert Hallock that 3DV Cache technology remains a continued part of the company's client processor roadmap. The 3DV Cache tech played in instrumental role in shoring up gaming performance of AMD's previous-generation "Zen 3" microarchitecture to levels matching or exceeding those of the Intel "Alder Lake," with a performance uplift in the range of 10 to 25 percent. The expectations for 3DV Cache to work a similar miracle with "Zen 4" are set rather high.

While "Zen 4" has achieved gaming performance parity with "Alder Lake," Intel's next-generation "Raptor Lake" is right around the corner, with the company claiming 10-15% single-threaded performance uplifts that should restore the its gaming performance leadership over AMD. The alleged AMD roadmap does not specify when exactly the Ryzen 7000X3D comes out, but is part of the block that spans Q3-2022, deep into 2023. Rumors are abuzz that the company could unveil the 7000X3D in the first half of 2023.

DFI, the world's leading brand in embedded motherboards and industrial computers, was invited to participate in "AMD Datacenter Solutions Day" in September, based on the theme of high-performance computing (HPC). As the first in the world to launch the smallest industrial motherboard equipped with AMD products, DFI partnered with its subsidiary, AEWIN, to present their star products and share how ultra-small products can help the trend of software virtualization technologies in the forum. We hope to optimize the development of diverse services in IoT applications.

AMD invited industry giants to the event to discuss the future of high-performance computing and conduct in-depth discussions with their partners related to high-performance computing, cloud computing, and AI. DFI was a speaker in the digital learning AI session during the event. DFI shared their views on software-defined IoT and explained the role of ultra-small products in the application environment.

Intel in the second day of its InnovatiON event, turned attention to its next-generation Xeon Scalable "Sapphire Rapids" server processors, and demonstrated on-package accelerators. These are fixed-function hardware components that accelerate specific kinds of popular server workloads (i.e. run them faster than a CPU core can). With these, Intel hopes to close the CPU core-count gap it has with AMD EPYC, with the upcoming "Zen 4" EPYC chips expected to launch with up to 96 cores per socket in its conventional variant, and up to 128 cores per socket in its cloud-optimized variant.

Intel's on-package accelerators include AMX (advanced matrix extensions), which accelerate recommendation-engines, natural language processing (NLP), image-recognition, etc; DLB (dynamic load-balancing), which accelerates security-gateway and load-balancing; DSA (data-streaming accelerator), which speeds up the network stack, guest OS, and migration; IAA (in-memory analysis accelerator), which speeds up big-data (Apache Hadoop), IMDB, and warehousing applications; a feature-rich implementation of the AVX-512 instruction-set for a plethora of content-creation and scientific applications; and lastly, the QAT (QuickAssist Technology), with speed-ups for data compression, OpenSSL, nginx, IPsec, etc. Unlike "Ice Lake-SP," QAT is now implemented on the processor package instead of the PCH.

The latest CFI-1202 series hardware revisions of the Sony PlayStation 5 entertainment system receive new "Oberon Plus" SoCs built on the TSMC N6 (6 nm) silicon fabrication node, and could include several new power-management features of the kind seen in AMD Ryzen 6000 mobile-processors, which could bring down the overall weight of the console as it could shed anywhere between 200-300 grams (6.25-6.5 percent) compared to older 2021 models. The CFI-1202B is the Digital-only variant that lacks an optical drive; while the CFI-1202A is the slightly heavier model that comes with a Blu-ray ROM drive. The 6% reduction in weight may not seem like much to the end-user, but has a cumulative effect for Sony to ship them by the thousands.

The popular PlayStation 3 emulator for PCs, RPCS3, just received a major update that lets it take advantage of the AVX-512 instruction-set on processors based on the AMD Zen 4 microarchitecture (the recently launched Ryzen 7000 series). RPCS3 emulates the PS3's CELL Broadband Engine SoC entirely on CPU, and does not use your GPU to draw any raster graphics. To emulate both a CPU and GPU of that time entirely on a multi-threaded CPU of today is no easy task, but is helped greatly by leveraging the latest instruction-sets. RPCS3 supports an AVX-512 code-path on Intel processors such as the Core i9-11900K "Rocket Lake," but the company has been fidgeting with AVX-512 support on its client processors since 12th Gen "Alder Lake." The developer of RPCS3 in a tweet confirmed that they have enabled AVX-512 support for AMD Zen 4 with the latest build.

Today, Alienware continues its mission to create premier gaming experiences with a triple-threat of new devices, including: a revamped Aurora R15 Gaming Desktop, a compact and feature-rich Tenkeyless Gaming Keyboard, and our second QD-OLED Gaming Monitor positioned at a lower price point. The new Alienware Aurora R15 desktop sees a significant performance boost, thanks to the latest 13th Gen Intel Core processors, NVIDIA GeForce RTX 40 Series GPUs and an armada of system refinements.

The Aurora R15 now also includes up to a 1350 W power supply (up from 1000 W in the previous generation), designed to support NVIDIA's flagship GeForce RTX 4090 graphics card. Speaking of the graphics card, we repositioned the graphics slot to enable larger card designs (up to triple wide cards). In addition to offering NVIDIA GeForce RTX 40 Series and 30 Series GPUs, Aurora R15 will also be configurable with AMD Radeon RX 6000 Series graphics which pair nicely with our first QD-OLED AMD FreeSync monitor… more on that below.