Unfortunately there's no pricing attached to this leak, unlike the earlier pricing details for MSI's B650 motherboards from B&H, but Videocardz has managed to get the specs for ASRocks upcoming B650 and B650E motherboards. Once again we're looking at a collection of seven models, four B650E and three B650 models in total. Something interesting to note that Videocardz is pointing out, is that only the cheapest board in the lineup has a six layer PCB, with most models using an eight layer PCB and the Mini-ITX board is going up to 10 layers. In other words it seems like most entry level boards are now using high-end PCBs, due to the transition to PCIe 5.0.

The base model is the B650 PG Lightning, which is a pretty feature stripped motherboard, yet all PCIe slots are said to be PCIe 4.0 and it has a pre-installed I/O shield. It comes with 2.5 Gbps Ethernet, but WiFi is optional. At least there's a rear mounted 20 Gbps USB-C port here and the board has a total of three M.2 slots, of which one is PCIe 5.0. On the same kind of level sits B650 Pro RS, which is a step down in the sense that one of the M.2 slots PCIe 3.0 x2 and it has fewer PCIe slot, but it appears to have slightly fancier cooling for the VRMs and it gains a DisplayPort output around the back.

This one is likely to go down ASRock's internal history as a failure of sticking proportions. Namely, it seems that some ASRock motherboards in the newly-released AM5 X670 / X670E family carry stickers overlaid on the DDR5 slots. The idea was to provide users with a handy, visually informative guide on DDR5 memory stick installations and a warning on abnormally long boot times that were to be expected, according to RAM stick capacity. But it seems that these low-quality stickers are being torn apart as users attempt to remove them, leaving behind remnants that are extremely difficult to clean up and which can block DRAM installation entirely or partially. I, for one, would never install a DDR5 module if I thought there was a chance for some paper bits to have fallen on to the DRAM slots - paper and glue bits within the DRAM slots don't seem particularly conducive to a successful motherboard POST.

In the meantime, the company has already announced that it's not only aware of the problem, it's willing to accept RMAs for motherboards that sport the impossible-to-cleanly-peel stickers (consumers should contact their retailers and e-tailers for the exchange). Information around forums where this issue is being discussed don't seem to point to any instance of actual motherboard damage resulting from the stickers - enough patience or an entire motherboard exchange seem to be two solutions to this problem. The company also announced that its latest motherboard batches on AMD's X670 chipsets no longer carry the stickers themselves, due to several BIOS-level improvements that have brought down the boot times, making the informative stickers unneeded. Still, when one takes into account the consumer and company cost of activating an RMA process, it seems that the company shouldn't have skimped on the sticker quality itself.

EK, the European manufacturer of premium liquid cooling gear, and MSI, a world-leading gaming brand, have traditionally partnered up to launch an X670E-based motherboard that comes packaged with a Quantum-design monoblock. This time, it will come in a Limited Edition run. The monoblock offers unparalleled cooling for the VRM section and the AMD Ryzen 7000 series CPUs, as well as a plethora of other nifty features, like the integrated flow meter and temperature sensor, allowing users to have precise checks on their loop status.

Cooling the Ryzen 7000 CPUs is no small feat, and air coolers struggle to get the most out of them. The new Ryzen 7000 series CPUs don't have a fixed frequency as CPUs used to. Instead, the boost clock is primarily contingent on thermals and, secondarily, power. Here's where liquid-cooled EK-Quantum Momentum² Monoblock comes into play. Not only does it make sure that your CPU is properly cooled, but it also ensures the power delivery system is as cool as possible. This allows the user to push performance to the limits while having a quiet system that stays as cool as possible.

GIGABYTE Technology, (TWSE: 2376), an industry leader in high-performance servers and workstations, today announced supporting products for the new AMD AM5 platform starting with two GIGABYTE motherboards, MC13-LE0 & MC13-LE1, that pair a consumer CPU with IPMI management functionalities via BMC. Additionally, a new desktop workstation, W332-Z00, was released using the same motherboard series platform that supports remote management, but the W332 does so with a Realtek NIC that enables DASH.

The new GIGABYTE products designed to support host systems are deceivingly powerful with a small micro-ATX form factor motherboard and enterprise rich out-of-band management features on top of PCIe Gen 5 and DDR5 technologies. These new client friendly products will be found in office settings under a desk rather than a rack in a data center, as they be managed from anywhere, provided there is a network connection. Furthermore, these new products are purpose built for the mainstream AMD B650E chipset with AMD Zen 4 architecture for AMD Ryzen 7000 Series desktop processors.

An alleged AMD client product roadmap slide leaked to the web confirms the Ryzen 7000X3D series. This also builds on a confirmation by Robert Hallock that 3DV Cache technology remains a continued part of the company's client processor roadmap. The 3DV Cache tech played in instrumental role in shoring up gaming performance of AMD's previous-generation "Zen 3" microarchitecture to levels matching or exceeding those of the Intel "Alder Lake," with a performance uplift in the range of 10 to 25 percent. The expectations for 3DV Cache to work a similar miracle with "Zen 4" are set rather high.

While "Zen 4" has achieved gaming performance parity with "Alder Lake," Intel's next-generation "Raptor Lake" is right around the corner, with the company claiming 10-15% single-threaded performance uplifts that should restore the its gaming performance leadership over AMD. The alleged AMD roadmap does not specify when exactly the Ryzen 7000X3D comes out, but is part of the block that spans Q3-2022, deep into 2023. Rumors are abuzz that the company could unveil the 7000X3D in the first half of 2023.

DFI, the world's leading brand in embedded motherboards and industrial computers, was invited to participate in "AMD Datacenter Solutions Day" in September, based on the theme of high-performance computing (HPC). As the first in the world to launch the smallest industrial motherboard equipped with AMD products, DFI partnered with its subsidiary, AEWIN, to present their star products and share how ultra-small products can help the trend of software virtualization technologies in the forum. We hope to optimize the development of diverse services in IoT applications.

AMD invited industry giants to the event to discuss the future of high-performance computing and conduct in-depth discussions with their partners related to high-performance computing, cloud computing, and AI. DFI was a speaker in the digital learning AI session during the event. DFI shared their views on software-defined IoT and explained the role of ultra-small products in the application environment.

Intel in the second day of its InnovatiON event, turned attention to its next-generation Xeon Scalable "Sapphire Rapids" server processors, and demonstrated on-package accelerators. These are fixed-function hardware components that accelerate specific kinds of popular server workloads (i.e. run them faster than a CPU core can). With these, Intel hopes to close the CPU core-count gap it has with AMD EPYC, with the upcoming "Zen 4" EPYC chips expected to launch with up to 96 cores per socket in its conventional variant, and up to 128 cores per socket in its cloud-optimized variant.

Intel's on-package accelerators include AMX (advanced matrix extensions), which accelerate recommendation-engines, natural language processing (NLP), image-recognition, etc; DLB (dynamic load-balancing), which accelerates security-gateway and load-balancing; DSA (data-streaming accelerator), which speeds up the network stack, guest OS, and migration; IAA (in-memory analysis accelerator), which speeds up big-data (Apache Hadoop), IMDB, and warehousing applications; a feature-rich implementation of the AVX-512 instruction-set for a plethora of content-creation and scientific applications; and lastly, the QAT (QuickAssist Technology), with speed-ups for data compression, OpenSSL, nginx, IPsec, etc. Unlike "Ice Lake-SP," QAT is now implemented on the processor package instead of the PCH.

The latest CFI-1202 series hardware revisions of the Sony PlayStation 5 entertainment system receive new "Oberon Plus" SoCs built on the TSMC N6 (6 nm) silicon fabrication node, and could include several new power-management features of the kind seen in AMD Ryzen 6000 mobile-processors, which could bring down the overall weight of the console as it could shed anywhere between 200-300 grams (6.25-6.5 percent) compared to older 2021 models. The CFI-1202B is the Digital-only variant that lacks an optical drive; while the CFI-1202A is the slightly heavier model that comes with a Blu-ray ROM drive. The 6% reduction in weight may not seem like much to the end-user, but has a cumulative effect for Sony to ship them by the thousands.

The popular PlayStation 3 emulator for PCs, RPCS3, just received a major update that lets it take advantage of the AVX-512 instruction-set on processors based on the AMD Zen 4 microarchitecture (the recently launched Ryzen 7000 series). RPCS3 emulates the PS3's CELL Broadband Engine SoC entirely on CPU, and does not use your GPU to draw any raster graphics. To emulate both a CPU and GPU of that time entirely on a multi-threaded CPU of today is no easy task, but is helped greatly by leveraging the latest instruction-sets. RPCS3 supports an AVX-512 code-path on Intel processors such as the Core i9-11900K "Rocket Lake," but the company has been fidgeting with AVX-512 support on its client processors since 12th Gen "Alder Lake." The developer of RPCS3 in a tweet confirmed that they have enabled AVX-512 support for AMD Zen 4 with the latest build.

Today, Alienware continues its mission to create premier gaming experiences with a triple-threat of new devices, including: a revamped Aurora R15 Gaming Desktop, a compact and feature-rich Tenkeyless Gaming Keyboard, and our second QD-OLED Gaming Monitor positioned at a lower price point. The new Alienware Aurora R15 desktop sees a significant performance boost, thanks to the latest 13th Gen Intel Core processors, NVIDIA GeForce RTX 40 Series GPUs and an armada of system refinements.

The Aurora R15 now also includes up to a 1350 W power supply (up from 1000 W in the previous generation), designed to support NVIDIA's flagship GeForce RTX 4090 graphics card. Speaking of the graphics card, we repositioned the graphics slot to enable larger card designs (up to triple wide cards). In addition to offering NVIDIA GeForce RTX 40 Series and 30 Series GPUs, Aurora R15 will also be configurable with AMD Radeon RX 6000 Series graphics which pair nicely with our first QD-OLED AMD FreeSync monitor… more on that below.

CORSAIR, a world leader in enthusiast components for gamers, creators, and PC builders, today announced its comprehensive product readiness for the newly available AMD Ryzen 7000 series of processors and the accompanying X670 and B650 chipset motherboards. From a new dedicated range of CORSAIR DDR5 memory for AMD platforms, to a huge lineup of award-winning CPU coolers, PC power supplies, cases and accessories, CORSAIR has the complete lineup of products to help enthusiasts build their new AMD-powered PC.

New AMD Ryzen 7000 processors and their supporting X670 and B650 chipset motherboards bring with them a huge change from past generations in the adoption of DDR5 memory, substantially increasing memory frequency versus DDR4. CORSAIR has a complete range of performance DDR5 created especially for AMD platforms, including the illustrious DOMINATOR PLATINUM RGB DDR5, the panoramically lit VENGEANCE RGB DDR5, or minimalist VENGEANCE DDR5. Available in a range of frequencies up to 6,000 MHz and capacities up to 64 GB, all CORSAIR DDR5 memory for AMD supports the new AMD EXPO (Extended Profiles for Overclocking) standard, offering single-setting-setup to ensure owners can easily run their memory at the speed it was created to run at.

AMD today released the Adrenalin 22.9.2 drivers. These drivers add support for the Radeon Graphics iGPU of the new Ryzen 7000 desktop processors that go on sale today. Game optimization is added for "Grounded." A handful of issues have been identified with the release. Radeon Super Resolution failing to trigger after changing resolution in games such as Nioh 2, has been identified. Improper rendering of Oculus dashboard menus with RX 6000-series graphics cards has been identified. GPU utilization being stuck at 100% in Performance Metrics after closing games in some cards such as the RX 570, has been identified. Display briefly showing corruption when switching between video and games in some GPUs such as the RX 6700 XT, has been identified. Vertical Refresh Sync being set to "off" globally causing stuttering or driver timeouts, has been identified. Dropped frames in video playback have been identified.

DOWNLOAD: AMD Software Adreanlin 22.9.2 beta

Gamers everywhere trust AMD Ryzen CPUs for their battlestations. Packed to the brim with cores, these chips excel at tasks that call for an extra dose of parallel computing power, like heavy multitasking, livestreaming game sessions on Twitch—and, of course, powering through the latest games at high frame rates. Now, AMD has fired off its fourth salvo of AMD Ryzen CPUs, and we've readied the X670E and X670 motherboards you'll need to harness the full potential of these new chips.

Our X670E and X670 motherboard lineup includes a wide range of tempting choices for gamers everywhere. The ROG Crosshair series returns to offer uncompromising performance and style for those who dare to build a gaming PC like none other. ROG Strix boards deliver gaming prowess in a wide range of designs. We've also added X670E and X670 motherboards to our TUF Gaming, ProArt, and Prime motherboard families? Ready to find the perfect partner for your new AMD Ryzen CPU? In this guide, we'll walk you through the core features of the platform and introduce you to our ROG X670E and X670 motherboards. Whether you're an experienced PC enthusiast or a newcomer planning out your first build, we'll help you find the best Ryzen motherboard for your needs and budget.

GIGABYTE TECHNOLOGY Co. Ltd, a leading manufacturer of motherboards, graphics cards, and hardware solutions announced the launch of their latest AMD X670 motherboards, including two segments of X670E and X670 chipsets which showcase an abundance of notable features. High-end X670E models natively support PCIe 5.0 graphics cards with enhanced slot design, while mainstream X670 models adopt PCIe 4.0 graphics card slot design. The lineup supports PCIe 5.0 M.2 slots with PCIe and M.2 EZ-Latch design, which makes it easier for users to upgrade graphics cards and M.2 SSDs, avoiding accidental damage to the surrounding components. Further, the features of 18+2+2 direct power, 105 Amps Smart Power Stage, and 8 layer PCB provide higher stability, optimal compatibility, and performance for coming AMD Ryzen 7000 Series processors. With the advanced thermal design, VRM temperature is reduced. This stabilizes the power and performance of the PCIe x16 slot and M.2 SSD, avoiding thermal throttling. Meanwhile, the enhanced shielding design of SMD slots strengthens the reliability of signals and slot structure. In addition, the lineup takes advantage of Active OC Tuner technology and all-new GCC (GIGABYTE Control Center) software to align with GIGABYTE's new PCIe 5.0 M.2 SSD and EXPO/ XMP dual mode DDR, delivering extreme performance with more user- friendly experience.

"The new GIGABYTE X670 motherboard lineup offers exclusive features and new designs, enhancing the excellent performance and multifunctioning capabilities for AMD Ryzen 7000 Series processors," said David McAfee, Corporate Vice President and General Manager, Client Channel Business Unit, AMD. "The AM5 platform is well-supported to bring the best-in-class experience that AMD users have come to expect."

MSI announced the brand new Socket AM5 motherboards which includes MEG X670E GODLIKE, MEG X670E ACE, MPG X670E CARBON WIFI and PRO X670-P WIFI to the brand-new AMD X670 Motherboard product lineup. MSI's X670 motherboards and AMD Ryzen 7000 Series processors are here for a new generation of high-speed and efficient computing. As a world-leading motherboard brand MSI's X670 motherboards are designed to provide the best every performance for gamers, creators and users. With the latest AMD Ryzen 7000 Series processors, MSI is ready to push this platform by provided the best performance available for everyone. In use of the 5 nm architecture and an all-new DDR5 platform, AMD Ryzen 7950X processors will have a ~13% IPC uplift with a boost frequency of up to 5.70 GHz and an average 29% Single Thread Performance gain compared to last generation,. Let's take a look at some of the new features from MSI X670 Motherboards.

"MSI's new lineup of X670 motherboards are purposefully designed to give users a new generation of high-speed, efficient computing with AMD Ryzen 7000 Series Desktop processors," said David McAfee, Corporate Vice President and General Manager, Client Channel Business Unit, AMD. "Optimized for performance-enhancing features like AMD EXPO and Precision Boost Overdrive, together AMD and MSI are pushing the boundaries of performant computing."

AMD today introduced the Ryzen Embedded V3000 Series processors, adding the high-performance "Zen 3" core to the V-Series portfolio to deliver reliable, scalable processing performance for a wide range of storage and networking system applications. With greater CPU performance, DRAM memory transfer rate, CPU core count and I/O connectivity when compared to the AMD Ryzen Embedded V1000 series, the new AMD Ryzen Embedded V3000 Series processors deliver the performance and low-power options required for some of the most demanding 24x7 operating environments and workloads.

Now shipping to leading embedded ODMs and OEMs, AMD Ryzen Embedded V3000 processors address the growing demands of enterprise and cloud storage, as well as data center network routing, switching and firewall security features. AMD Ryzen Embedded V3000 processors can power a variety of diverse use-cases ranging from virtual hyper-converged infrastructure to advanced systems at the edge.

According to TrendForce research, due to steady weakening of overall demand for consumer electronics, inventory pressure has increased among downstream distributors and brands. Although there are still sporadic shortages of specific components, the curtain has officially fallen on a two-year wave of shortages in general, and brands have gradually suspended stocking in response to changes in market conditions. However, stable demand for automotive and industrial equipment is key to supporting the ongoing growth of foundry output value. At the same time, since the creation of a marginal amount of new capacity in 2Q22 led to growth in wafer shipments and a price hike for certain wafers, this drove output value among top ten foundries to reach US$33.20 billion in 2Q22. Quarterly growth fell to 3.9% on a weakening consumer market.

A prelude to inventory correction was officially revealed in 3Q22. In addition to intensifying severity in the initial wave of order slashing for LDDI/TDDI, and TV SoC, diminishing order volume also extended to non-Apple smartphone APs and peripheral IC PMIC, CIS, and consumer electronics PMICs, and mid-to-low-end MCUs, posing a challenge for foundry capacity utilization. However, the launch of the new iPhone in 3Q22 is expected to prop up a certain amount of stocking momentum for the sluggish market. Therefore, top ten foundry revenue in 3Q22 is expected to maintain a growth trend driven by high-priced processes and quarterly growth rate is expected to be slightly higher than in 2Q22.

The AM5 motherboard prices that cropped up over the weekend do indeed appear to be placeholders or early cash grab pricing, as MSI has revealed its official pricing for four of its upcoming motherboards in a live stream. Although the pricing is still very high, it's not as insanely high as the early listing suggested. Starting at the bottom with the Pro X670-P WiFi, we're looking at a US MSRP of US$329 excluding tax and an EU MSRP of €395 including VAT. Next up we have the MPG X670E Carbon WiFi for US$499/€599, which is a steep jump in the eurozone, but it's actually less than what the current exchange rate from US dollar to Euro is, if you add 20 percent VAT.

This is followed by the MEG X670E ACE for US$799/€969, which doesn't look like a particularly attractive option. Finally we have the MEG X670E Godlike, which retails for US$1299/€1599, but with early listings in Europe showing it at €2399. It puts the Godlike more in line with the previous Godlike board from MSI, but it's likely to be one of the most expensive X670E boards on the market. It's mentioned in the live stream that prices are expected to come down sometime after the initial launch and this is something we've also heard from other motherboard vendors. MSI aren't mincing any words about their pricing, but that's not going to help anyone interested in getting onboard AMD's AM5 platform. The live stream is linked below for those that are interested in more details about these boards from MSI.

The world-records set by those with access to AMD Ryzen 9 7950X "Zen 4" 16-core/32-thread processors, keep tumbling in. The latest such is a Cinebench R23 nT score of a stunning 50395 points. This was achieved with a 6.70 GHz overclock under extreme cooling using an LN2 evaporator. Another feat from the same source sees a 6.45 GHz all-core overclock under extreme cooling, which yields an impressive 48235 points in the same test. Both feats come from Sampson, who's been leading HWBot charts under the AMD Overclocking team.

The highest known/leaked Cinebench R23 score yielded with a Core i9-13900K "Raptor Lake" sample so far, is 40616 points, although serious official OC feats with the processor are yet to start. The Intel chip is already in the news for an 8 GHz frequency record. Any attempt to take the crown from the 7950X will involve pushing the 8 P-cores to insane frequencies, but then it will boil down to the 16 E-cores, and just how far those can be pushed. The highest post-launch CB R23 score obtained on a current-gen i9-12900K is 26299, and for the 5950X this is 26291.

With only a couple of days to go until the official retail availability of the Ryzen 7000-series CPUs and accompanying X670 and X670E motherboards, early pricing of the motherboards are starting to crop up in Europe. Courtesy of @momomo_us we now have pricing from an unknown European retailer for 11 ASUS models, as well as MSI's Godlike board. We also managed to dig up some additional pricing over at Geizhals, which is a European price comparison site, for five ASRock models and one from Gigabyte. Hopefully we're looking at placeholder pricing here, as it's not looking good in terms of value for money. Admittedly, ASUS is known for charging a premium over its competitors, but it's not looking good anywhere right now.

Starting with @momomo_us pricing and MSI for no specific reason, its upcoming MEG X670E Godlike is listed at €2,399 and that doesn't include any kind of liquid cooling accessories. This has to be one of the most expensive consumer motherboards ever, if this is the actual retail pricing it'll sell for. Moving over to ASUS, its Prime X670-P model is listed at €418.53, with the WiFi version jumping to €446.89. This is the first indicator that these are not the actual retail prices, as WiFi versions of motherboards tend to have a $/€/£10-20 premium over non-WiFi models. We're not going to go over every individual board price here, simply look at the attached pictures, but based on these early prices, ASUS has two models for well over €1,000, the ROG Crosshair X670E Hero and the ROG Crosshair X670E Extreme, with the latter being listed at €1,486.95.

BIOSTAR, a leading brand of motherboards, graphics cards, and storage devices, today announces the brand new X670E VALKYRIE ATX motherboard. Designed based on the AMD X670 chipset, the X670E VALKYRIE supports all new AMD AM5 Ryzen 7000 Processors, capable of extracting unprecedented performance for gaming, content creation, or any compute-heavy task thrown at it.

The X670E VALKYRIE motherboard carries BIOSTAR's top-shelf VALKYRIE range styling with a heavy emphasis on performance and cooling. DDR5 RAM support, PCIe 5.0, and PCIe 5.0 M.2 are essential features of any high-end motherboard in 2022. The new X670E VALKYRIE has it all with exceptional performance and synergy enabled by BIOSTAR's signature 22-phase power design and Digital PWM technology.

Based on a report by Tom's Hardware, AMD's CEO Lisa Su is planning a trip to Taiwan in the next couple of months. It is said that she is planning to meet with multiple partners in Taiwan, such as ASUS, Acer and maybe more importantly, ASMedia, which will be the sole maker of chipsets for AMD, once the X570 chipset is discontinued. AMD is apparently also seeing various less well known partners that deliver parts for its CPUs, such as Nan Ya PCB, Unimicron Technologies and Kinsus Interconnects.

However, it appears that the main reason for Lisa Su herself to visit Taiwan will be to meet with TSMC, to discuss future collaboration with CC Wei, TSMC's chief executive. This is so AMD can secure enough wafer allocation on future nodes, such as its 3 nm and 2 nm class nodes. The move to these nodes is obviously not happening in the near future for AMD, but considering that TSMC is currently the leading foundry and is operating at capacity, it makes sense to get in early, as the competition is stiff when it comes to getting wafer allocation on cutting edge nodes. It's unclear which exact 3 nm class node AMD will be aiming for, but it might be the N3P node, which is said to kick off production sometime next year. Lisa Su is also said to have meetings with TSMC, SPIL and Ase Technology when it comes to advanced packaging for AMD's products. This includes technologies such as chip-on-wafer-on-substrate (CoWoS) and fan-out embedded bridge (FO-EB), with AMD already being expected to use some of these technologies in its upcoming Navi 3x GPUs.

The first reliable benchmark figures of AMD's Ryzen 7000-series CPUs have arrived, courtesy of SiSoftware. The benchmark suite software developer has released benchmark figures for the Ryzen 5 7600X and Ryzen 9 7950X. Keep in mind that these benchmarks are limited to the different tests in SiSoftware Sandra. Also note that the graphs for the Ryzen 5 7600X have typos, as the SiSoftware wrote Ryzen 5 7760X instead of 7600X and the Core i5-12600K is listed as a Core i7 CPU. Starting with the 7600X, the CPU appears to perform similar to, or slightly slower than the Intel Core i5-12600K in the arithmetic tests. On the other hand, it handily crushes the older Ryzen 5 5600X in every test here, by somewhere between 17 and 36 percent depending on the test.

Moving on to the vector SIMD tests, AMD's Zen 4 architecture shows much greater performance improvements, beating the Intel Core i5-12600K in all but one of the tests, where it loses by a fairly small margin. Here it beats the Ryzen 5 5600X by anything from 28 to a massive 86 percent. Where AMD's Zen 4 architecture really kicks things up a notch is in the image processing test, at least compared to the Zen 3 architecture, thanks to its AVX512 capabilities. As such, it's over twice as fast in many of the tests, but it still loses out in half of the tests to Intel's Core i5-12600K. AMD has also improved the inter-thread/core latency in the same module, by a not insignificant amount. Where the Ryzen 5 7600X doesn't fare so well is when it comes to performance vs. power, largely due to the fact that AMD moved the TDP from 65 to 105 W, but it still offers better performance per Watt than Intel's current models.

Update 17:31 UTC: Updated with the Ryzen 7 7700X results.

DeepCool, a global brand and manufacturer of computer hardware and peripherals for enthusiasts, announces that it will provide free-of-charge mounting kits for AMD's upcoming AM5 platform, enabling customers to continue using their existing DeepCool CPU coolers on the newest generation AMD CPUs (LGA1718). Additionally, current and future DeepCool coolers will also include the new mounting hardware where necessary.

The new processor will have a new IHS design, and will feature support for DDR5 RAM and PCI-E 5.0. The AM5 socket will utilize the same mounting pattern as the AM4 socket, but there is a slight variance in the height of the installed processor. Due to the slight variance, some DeepCool coolers will need to utilize upgraded mounting hardware. To help with the transition, DeepCool is releasing mounting upgrade kits that will be compatible with AM5 socket. These kits will feature hardware associated for the socket and include components required to perform the installation.

Today, Dough - the world's first community-powered gaming hardware creator - showcased its bar-setting Dough Spectrum 4K 144 Hz gaming monitor. This groundbreaking display is available in matte and glossy finishes worldwide.

The Dough Spectrum 4K 144 Hz is the very definition of trailblazing, with individually-calibrated color gamuts and exemplary refresh rates. The Dough Spectrum 4K is ready for anything you run on it, thanks to compatibility with systems like AMD FreeSync Pro and NVIDIA G-SYNC. It features integer upscaling that's perfect for retro games, a frame rate counter overlay, and crosshair overlay options, to ensure every game you're playing looks and performs at its best.