AMD in its technical presentation confirmed the reference clock speeds of the Radeon RX 7900 XTX and RX 7900 XT RDNA3 graphics cards. The company also made its first reference to a GeForce RTX 40-series "Ada" product, the RTX 4080 (16 GB), which is going to launch later today. The RX 7900 XTX maxes out the "Navi 31" silicon, featuring all 96 RDNA3 compute units or 6,144 stream processors; while the RX 7900 XT is configured with 84 compute units, or 5,376 stream processors. The two cards also differ with memory configuration. While the RX 7900 XTX gets 24 GB of 20 Gbps GDDR6 across a 384-bit memory interface (960 GB/s); the RX 7900 XT gets 20 GB of 20 Gbps GDDR6 across 320-bit (800 GB/s).

The RX 7900 XTX comes with a Game Clocks frequency of 2300 MHz, and 2500 MHz boost clocks, whereas the RX 7900 XT comes with 2000 MHz Game Clocks, and 2400 MHz boost clocks. The Game Clocks frequency is more relevant between the two. AMD achieves 20 GB memory on the RX 7900 XT by using ten 16 Gbit GDDR6 memory chips across a 320-bit wide memory bus created by disabling one of the six 64-bit MCDs, which also subtracts 16 MB from the GPU's 96 MB Infinity Cache memory, leaving the RX 7900 XT with 80 MB of it. The slide describing the specs of the two cards compares them to the GeForce RTX 4080, which is what the two could compete more against, especially given their pricing. The RX 7900 XTX is 16% cheaper than the RTX 4080, and the RX 7900 XT is 25% cheaper.

AMD Radeon RX 7900 XTX reference-design isn't a first-party product with limited availability like the NVIDIA Founders Edition; but rather a classic reference-design that's sold by AMD's add-in board partners under their marquee (without sticking their own labels on the product). AMD and its partners internally refer to reference-design cards as "MBA cards" (made by AMD cards). The company gave us a technical overview of the reference-design PCB. As with every reference AMD PCB for the past several generations, the RX 7900 XTX PCB has a premium selection of components. The card uses an expensive 14-layer PCB with 4 additional layers of 2-oz copper. 14-layer PCBs are typically used with enterprise-grade products, and graphics cards typically tend to have PCB layer counts of around 10. The PCB also uses ITEQ IT-170GRA epoxy and laminate materials, which enable a glass transition temperature (Tg) of 175 °C (no, the GPU won't get anywhere near as hot).

The reference-design RX 7900 XTX PCB draws power from two 8-pin PCIe power connectors. With the typical board power of the RX 7900 XTX rated at 355 W, this falls inside the 375 total power-draw capability when you add up the 150 W input from the two connectors, and 75 W from the PCIe slot. AMD worked to minimize power-draw spikes at least from the PCIe slot. Excursions, if any, should be localized to the 8-pin power connectors. The card features 20-phase VRM solution, using "high efficiency" DrMOS power-stage phases (could be very high current). The "Navi 31" GPU is surrounded by 12 GDDR6 memory chips given the GPU's 384-bit memory interface. Two of these memory pads could end up unused on the RX 7900 XT, which has a 320-bit memory interface. Display outputs of the RX 7900 series include two standard-size DisplayPort 2.1, one USB type-C with DisplayPort passthrough; and one HDMI 2.1a.

Cerebras Systems, the pioneer in accelerating artificial intelligence (AI) compute, today unveiled Andromeda, a 13.5 million core AI supercomputer, now available and being used for commercial and academic work. Built with a cluster of 16 Cerebras CS-2 systems and leveraging Cerebras MemoryX and SwarmX technologies, Andromeda delivers more than 1 Exaflop of AI compute and 120 Petaflops of dense compute at 16-bit half precision. It is the only AI supercomputer to ever demonstrate near-perfect linear scaling on large language model workloads relying on simple data parallelism alone.

With more than 13.5 million AI-optimized compute cores and fed by 18,176 3rd Gen AMD EPYC processors, Andromeda features more cores than 1,953 Nvidia A100 GPUs and 1.6 times as many cores as the largest supercomputer in the world, Frontier, which has 8.7 million cores. Unlike any known GPU-based cluster, Andromeda delivers near-perfect scaling via simple data parallelism across GPT-class large language models, including GPT-3, GPT-J and GPT-NeoX.

AMD, in its technical presentation for the new Radeon RX 7900 series "Navi 31" GPU, gave us an elaborate explanation on why it had to take the chiplets route for high-end GPUs, devices that are far more complex than CPUs. The company also enlightened us on what sets chiplet-based packages apart from classic multi-chip modules (MCMs). An MCM is a package that consists of multiple independent devices sharing a fiberglass substrate.

An example of an MCM would be a mobile Intel Core processor, in which the CPU die and the PCH die share a substrate. Here, the CPU and the PCH are independent pieces of silicon that can otherwise exist on their own packages (as they do on the desktop platform), but have been paired together on a single substrate to minimize PCB footprint, which is precious on a mobile platform. A chiplet-based device is one where a substrate is made up of multiple dies that cannot otherwise independently exist on their own packages without an impact on inter-die bandwidth or latency. They are essentially what should have been components on a monolithic die, but disintegrated into separate dies built on different semiconductor foundry nodes, with a purely cost-driven motive.

PowerColor put out its first teaser of a custom-design Radeon RX 7900 XTX graphics card, the RX 7900 XTX HellHound. The teaser is a back 3-quarter picture of the card, revealing its well-ventilated dual aluminium fin-stack heatsink and a triple fan setup, which make up a triple-slot cooling solution. The cooler's fans, and the HellHound logo on the backplate, are illuminated.

A striking aspect of this card is that it has the same set of power connectors as the AMD reference design, with just two 8-pin PCIe power connectors for a power-delivery capability of 375 W. It's possible that PowerColor is using a common board design for both the RX 7900 XTX and RX 7900 XT HellHound products. Besides the two power connectors, we spot a switch to control the LED illumination. There's another switch toward the front-end of the card, which works as a dual-BIOS selector.

AIC Inc., (from now on referred to as "AIC"), a leading provider in enterprise storage and server solutions, today revealed its new edge server appliance powered by 4th Gen AMD EPYC processors (codename Genoa). The new server, EB202-CP, is designed to deliver superior performance in a compact size while offering excellent cost efficiency. Combined with the 4th Gen AMD EPYC processors, EB202-CP is expected to drive the innovations in AI, training simulation, autonomous vehicles and edge applications. AIC will showcase EB202-CP at SC22 expo from November 14th to 17th, 2022.

AIC EB202-CP is a 2U rackmount server with 22 inches in depth. It supports eight E1.S/ E3.S or U.2 SSDs which are front-serviceable and hot-swappable. The E1.S/ E3.S drives are Enterprise and Datacenter SSD Form Factor (EDSFF) that enables EB202-CP to provide high-density all-flash NVMe for half petabyte storage capabilities and enhance IOPS and space utilization. EB202-CP has great expansion functionality and supports up to two double-stack GPU or accelerator cards, two FHHL/HHHL PCIe 5.0 cards and an OCP 3.0 card. Based on AIC server board Capella, EB202-CP supports single 4th Gen AMD EPYC processor and eight DDR5 DIMMs. The 4th Gen AMD EPYC processors, built on "Zen 4" architecture, are optimized for general-purpose workloads across enterprise, cloud and edge. This new generation of AMD EPYC features the world's highest-performing x86 processor, PCIe 5.0 ready, and enables low TCO. It also delivers leadership energy efficiency as well as state-of-the-art security features.

Yesterday, AMD announced its latest addition to the data center family of processors called EPYC Genoa. Named the 4th generation EPYC processors, they feature a Zen 4 design and bring additional I/O connectivity like PCIe 5.0, DDR5, and CXL support. To disrupt the cloud, enterprise, and HPC offerings, AMD decided to manufacture SKUs with up to 96 cores and 192 threads, an increase from the previous generation's 64C/128T designs. Today, we are learning more about the performance and power aspects of the 4th generation AMD EPYC Genoa 9654, 9554, and 9374F SKUs from 3rd party sources, and not the official AMD presentation. Tom's Hardware published a heap of benchmarks consisting of rendering, compilation, encoding, parallel computing, molecular dynamics, and much more.

In the comparison tests, we have AMD EPYC Milan 7763, 75F3, and Intel Xeon Platinum 8380, a current top-end Intel offering until Sapphire Rapids arrives. Comparing 3rd-gen EPYC 64C/128T SKUs with 4th-gen 64C/128T EPYC SKUs, the new generation brings about a 30% increase in compression and parallel compute benchmarks performance. When scaling to the 96C/192T SKU, the gap is widened, and AMD has a clear performance leader in the server marketplace. For more details about the benchmark results, go here to explore. As far as comparison to Intel offerings, AMD leads the pack as it has a more performant single and multi-threaded design. Of course, beating the Sapphire Rapids to market is a significant win for team red, so we are still waiting to see how the 4th generation Xeon stacks up against Genoa.

TYAN, an industry-leading server platform design manufacturer and a MiTAC Computing Technology Corporation subsidiary, today introduced AMD EPYC 9004 Series processor-based server platforms highlighting energy efficiency and performance breakthroughs designed for next generation server architecture for data centers. "Facing the post-COVID economy world, data centers are required to build on more environmentally friendly, secure and flexible features to respond to the growing of teleworking, video streaming, IoT and 5G," said Danny Hsu, Vice President of MiTAC Computing Technology Corporation's Server Infrastructure BU. "TYAN's new server platforms powered by 4th Gen AMD EPYC processors efficiently enable data centers by doing more tasks with the same number of servers."

"We designed 4th Gen AMD EPYC processors to give our customers exactly what they said they needed, high performance, exceptional energy efficiency and low total cost of ownership," said Ram Peddibhotla, corporate vice president, EPYC product management, AMD. "With the latest "Zen 4" architecture that incorporates modern security by design, 4th Gen AMD EPYC processors are an outstanding choice for IT professionals looking to optimize their data centers for leadership performance while helping address environmental goals."

SK hynix announced that its DRAM, and CXL solutions have been validated with the new AMD EPYC 9004 Series processors, which were unveiled during the company's "together we advance_data centers" event on November 10. SK hynix has worked closely with AMD to provide fully compatible memory solutions for the 4th Gen AMD EPYC processors.

4th Gen AMD EPYC processors are built on an all-new SP5 socket and offer innovative technologies and features including support for advanced DDR5 and CXL 1.1+ memory expansion. SK hynix 1ynm, 1a nm 16 Gb DDR5 and 1a nm 24Gb DDR5 DRAM support 4800 Mbps on 4th Gen AMD EPYC processors, which deliver up to 50% more memory bandwidth than DDR4 product. SK hynix also provides CXL memory device that is a 96 GB product composed of 24 Gb DDR5 DRAMs based on 1a nm. The company expects high customer satisfaction of this product with flexible configuration of bandwidth and capacity expanded cost-efficiently.

AMD at a special media event titled "together we advance_data centers," formally launched its 4th generation EPYC "Genoa" server processors based on the "Zen 4" microarchitecture. These processors debut an all new platform, with modern I/O connectivity that includes PCI-Express Gen 5, CXL, and DDR5 memory. The processors come in CPU core-counts of up to 96-core/192-thread. There are as many as 18 processor SKUs, differentiated not just in CPU core-counts, but also the way the the cores are spread across the up to 12 "Zen 4" chiplets (CCDs). Each chiplet features up to 8 "Zen 4" CPU cores, depending on the model; up to 32 MB of L3 cache, and is built on the 5 nm EUV process at TSMC. The CCDs talk to a centralized server I/O die (sIOD), which is built on the 6 nm process.

The processors AMD is launching today are the EPYC "Genoa" series, targeting general purpose servers, although they can be deployed in large cloud data-centers, too. To large-scale cloud providers such as AWS, Azure, and Google Cloud, AMD is readying a different class of processor, codenamed "Bergamo," which is plans to launch later. In 2023, the company will launch the "Genoa-X" line of processor for technical-compute and HPC applications, which benefit from large on-die caches, as they feature the 3D Vertical Cache technology. There will also be "Siena," a class of EPYC processors targeting the telecom and edge-computing markets, which could see an integration of more Xilinx IP.

ASUS, a leading provider of server systems, server motherboards and workstations, today announced new best-in-class server solutions powered by the latest AMD EPYC 9004 Series processors. ASUS also launched superior liquid-cooling solutions that dramatically improve the data-center power-usage effectiveness (PUE).

The breakthrough thermal design in this new generation delivers superior power and thermal capabilities to support class-leading features, including up to 400-watt CPUs, up to 350-watt GPUs, and 400 Gbps networking. All ASUS liquid-cooling solutions will be demonstrated in the ASUS booth (number 3816) at SC22 from November 14-17, 2022, at Kay Bailey Hutchison Convention Center in Dallas, Texas.

The SiSoft SANDRA user database has just been pinged by two new unreleased AMD Ryzen 7000 series "Zen 4" processor models, the Ryzen 7 7700 and Ryzen 5 7600. These chips have the same 8-core/16-thread and 6-core/12-thread core-counts as the 7700X and 7600X, respectively; but with lower clock speeds, and more importantly, a lower TDP of just 65 W. This would put their package power tracking (PPT) limit around 90 W, down from the 105 W and 140 W of the their "X" siblings.

The 7600 and 7700 come with a base frequency of 3.80 GHz, as detected by SANDRA. Every other specification, such as cache size, is the unchanged from the 7600X or 7700X. There's no word on the availability, but it's likely that AMD would debut these chips in the OEM channel first, especially given that the 7600 has the potential to undercut sales of the embattled 7600X. Things could get interesting as Intel debuts the lower end of its 13th Gen Core i5 series, which are rumored to be based on the "Alder Lake" microarchitecture, and 6P+4E SKUs.

Hewlett Packard Enterprise (NYSE: HPE) today announced it is making supercomputing accessible for more enterprises to harness insights, solve problems and innovate faster by delivering its world-leading, energy-efficient supercomputers in a smaller form factor and at a lower price point.

The expanded portfolio includes new HPE Cray EX and HPE Cray XD supercomputers, which are based on HPE's exascale innovation that delivers end-to-end, purpose-built technologies in compute, accelerated compute, interconnect, storage, software, and flexible power and cooling options. The supercomputers provide significant performance and AI-at-scale capabilities to tackle demanding, data-intensive workloads, speed up AI and machine learning initiatives, and accelerate innovation to deliver products and services to market faster.

In a bid to clear inventory of its Radeon RX 6000 series RDNA2 graphics cards in the lead up to its next-generation, AMD is bundling two of the latest AAA game titles. Besides this, the company has significantly lowered prices of its RX 6000 series over several months now. The company is bundling "Dead island 2," and "The Callisto Protocol" with new purchases of Radeon RX 6000 graphics cards.

New purchases of the Radeon RX 6600, RX 6600 XT, RX 6650 XT, RX 6700, RX 6700 XT, RX 6750 XT, RX 6800, RX 6800 XT, RX 6900 XT, and RX 6950 XT, will receive both games. New purchases of the RX 6500 XT and RX 6400 will receive just "Dead Island 2." The bundle is only available in select markets, and through participating retailers. Find where you can grab it, from the source link below.

Supermicro, a Total IT Solution Provider for Cloud, AI/ML, Storage, and 5G/Edge, announces its JumpStart remote access program - Supermicro H13 JumpStart -- for workload testing and application tuning on 4th Gen AMD EPYC processor-based systems. Developers and IT administrators in AI, Deep Learning, Manufacturing, Telco, Storage, and other industries will get immediate access to leading-edge technologies to accelerate their solution deployment on Supermicro's extensive portfolio of upcoming H13 systems. Customers will be able to test compatibility with previous generations of AMD EPYC processor-based systems and optimize their applications to take advantage of DDR5 memory, PCI-E 5.0 storage, networking, accelerators, and CXL 1.1+ peripherals of the 4th Gen AMD EPYC processors.

"Supermicro's 4th Gen AMD EPYC processor JumpStart program is poised to give customers a market advantage over their competitors through quick validation of workload performance to accelerate data center deployments," said Charles Liang, president and CEO, Supermicro. "Supermicro's application-optimized servers incorporate the latest technologies to improve performance per watt, energy efficiency, and reduced TCO."

KLEVV, an emerging memory brand introduced by Essencore, unveils its latest DDR5 standard U-DIMM and SO-DIMM memory running at 5600MT/s. Designed to support both AMD's latest Ryzen 7000 series processors and AM5 platform as well as Intel's 13th Gen Raptor Lake processors and Z790 motherboards, featuring blisteringly fast speed with a highly efficient power to performance ratio.

To cater the growing demand for high-speed computing with a highly versatile product selection, KLEVV introduces a brand-new 5600 MT/s version to its DDR5 standard desktop and laptop memory lineup. Fully compliant with JEDEC standards, the new 5600MT/s DDR5 memory is the latest addition to KLEVV's DDR5 U-DIMM and SO-DIMM lineup with the pre-existing 4800 MT/s memory.

Microsoft formally released the DirectStorage 1.1 API to game developers on Monday, allowing them to take advantage of GPU-accelerated game asset decompression, to help minimize game loading times. DirectStorage establishes a path for GPUs to directly access storage devices on a system. With version 1.1, the API introduces a way by which the PC can use the GPU to decompress game assets. Microsoft is also promoting GDeflate, a new file compression format developed by NVIDIA, which is optimized for highly parallelized decompression techniques, making it suitable for GPUs. NVIDIA, Intel, and AMD, have each responded positively to this development, and rolled out early drivers with DirectStorage 1.1 support, which can be used by game developers or students. The three will add official DirectStorage 1.1 support to their regular driver update channels later.

DOWNLOAD: DirectStorage 1.1 early-support (not official) drivers for NVIDIA GeForce | AMD Radeon | Intel Arc

An alleged leaked company slide details AMD's upcoming 5 nm "Navi 31" GPU powering the next-generation Radeon RX 7900 XTX and RX 7900 XT graphics cards. The slide details the "Navi 31" MCM, with its central graphics compute die (GCD) chiplet that's built on the 5 nm EUV silicon fabrication process, surrounded by six memory cache dies (MCDs), each built on the 6 nm process. The GCD interfaces with the system over a PCI-Express 4.0 x16 host interface. It features the latest-generation multimedia engine with dual-stream encoders; and the new Radiance display engine with DisplayPort 2.1 and HDMI 2.1a support. Custom interconnects tie it with the six MCDs.

Each MCD has 16 MB of Infinity Cache (L3 cache); and a 64-bit GDDR6 memory interface (two 32-bit GDDR6 paths). Six of these add up to the GPU's 384-bit GDDR6 memory interface. In the scheme of things, the GPU has a contiguous and monolithic 384-bit wide memory bus, because every modern GPU uses multiple on-die memory controllers to achieve a wide memory bus. "Navi 31" hence has a total Infinity Cache size of 96 MB—which may be less in comparison to the 128 MB on "Navi 21," but AMD has shored up cache sizes across the GPU. The L0 caches on the compute units is now increased numerically by 240%. The L1 caches by 300%, and the L2 cache shared among the shader engines, by 50%. The RX 7900 XTX is confirmed to use 20 Gbps GDDR6 memory in this slide, for 960 GB/s of memory bandwidth.

Based on details from a PCWorld livestream following AMD's launch of the Radeon RX 7000-series, it was revealed that AMD has designed the Navi 31 GPU to be able to scale as high as 3 GHz. In other words, it appears that AMD has power limited its cards, at least for the SKUs that the company has announced so far. This could be for many reasons, but most likely to try to find a balance between power and performance. The details of the 3 GHz scaling did however not come from AMD directly, but rather from Jarred Walton over at Tom's Hardware. That said, the information was apparently shared with the media by AMD at the event.

In the livestream, it was also confirmed that partner cards will be able to overclock, so expect to see some factory overclocked cards, with higher power draw. This could be why, in part, that ASUS went with a much larger cooler on its TUF Gaming Radeon RX 7900-series cards. As ASUS didn't reveal any clock speeds or TDPs of its two cards, we don't really know what to expect, but we'd be surprised if these cards weren't factory overclocked to some degree when they launch in December.

The long-awaited 3rd of November is here with the latest AMD Radeon RX 7000-series GPUs launch. More good news is that EK, the premium water-cooling gear manufacturer, is ready with EK-Quantum Vector² water blocks for the reference models of the new AMD Radeon RX 7900 XTX GPUs. The new Radeon graphics cards come with a special memory cache dies (MCD) next to the main chip - Graphics Compute Die (GCD). The cooling engine has been modified to cool the MCDs as well, aside from the usual GPU components that are also being cooled, like the VRM, VRAM, Voltage Controllers, and the chip die.

The new Radeon RX 7900 XTX GPUs have GCD that is manufactured in a cutting edge 5 nm process, allowing 54% improvement of performance per watt. While the GPU is efficient, it does still use more power than the previous generation. At 355 W total board power that is packed in a smaller package than ever, with 300 mm² GCD that contains 165% more transistors per mm² than the previous generation. Overall these GPUs feature 58 billion transistors for 61 TFLOPs of performance.

AMD on Thursday launched the Radeon RX 7900 XTX and RX 7900 XT RDNA3 graphics cards. With these, the company claims to have repeated its feat of a 50+ percent performance/Watt gain over the previous-generation, which propelled the RX 6000-series to competitiveness with NVIDIA's fastest RTX 30-series SKUs. AMD's performance claims for the Radeon RX 7900 XTX put the card at anywhere between 50% to 70% faster than the company's current flagship, the RX 6950 XT, when tested at 4K UHD resolution. Digging through these claims, and piecing together relevant information from the Endnotes, HXL was able to draw an extrapolated performance comparison between the RX 7900 XTX, the real-world tested RTX 4090, and previous-generation flagships RTX 3090 Ti and RX 6950 XT.

The graphs put the Radeon RX 7900 XTX menacingly close to the GeForce RTX 4090. In Watch_Dogs Legion, the RTX 4090 is 6.4% faster than the RX 7900 XTX. Cyberpunk 2077 and Metro Exodus see the two cards evenly matched, with a delta under 1%. The RTX 4090 is 4.4% faster with Call of Duty: Modern Warfare II (2022). Accounting for the pinch of salt usually associated with launch-date first-party performance claims; the RX 7900 XTX would end up within 5-10% of the RTX 4090, but pricing changes everything. The RTX 4090 is a $1,599 (MSRP) card, whereas the RX 7900 XTX is $999. Assuming the upcoming RTX 4080 (16 GB) is around 10% slower than the RTX 4090; the main clash for this generation will be between the RTX 4080 and RX 7900 XTX. Even here, AMD gets ahead with pricing, as the RTX 4080 was announced with an MSRP of $1,199 (exactly 20% pricier than the RX 7900 XTX). With the FSR 3.0 Fluid Motion announcement, AMD also blunted NVIDIA's DLSS 3 Frame Generation performance advantage.

Although we're over a month away from any kind of actual availability of AMD's just announced Radeon RX 7900 cards, ASUS has already shown off what is the first custom Radeon RX 7900-series cards. The two cards are the TUF Gaming Radeon RX 7900 XTX and unsurprisingly the TUF Gaming Radeon RX 7900 XT. ASUS has gone for what the company calls a 3.63-slot design and the TUF cards appear to be a fair bit taller than the AMD reference designs. ASUS has gone with larger fans, which requires a bigger cooler shroud and the company claims they provide 13.8 percent more airflow and an eight percent increase in static pressure compared to its last gen—presumably Radeon RX 6900—cards, while maintaining the same noise level.

ASUS claims to have added wider vents on the backplate to help improve airflow and to have increased the total heat dissipation area by 22.8 percent, whatever that actually means, as ASUS didn't show off the rear of its cards. The TUF Gaming Radeon RX 7900 XTX sports three 8-pin power connectors and has a 17+4 power stage design. Unlike AMD's reference cards, the ASUS TUF cards won't have a USB-C port at the rear, as the company has gone for three DP 2.1 ports and one HDMI 2.1 port. ASUS didn't reveal clock speeds and the remaining specs are as announced by AMD.

AMD today announced the Radeon RX 7900 XTX and Radeon RX 7900 XT gaming graphics cards debuting its next-generation RDNA3 graphics architecture. The two new cards come at $999 and $899—basically targeting the $1000 high-end premium price point.Both cards will be available on December 13th, not only the AMD reference design, which is sold through AMD.com, but also custom-design variants from the many board partners on the same day. AIBs are expected to announce their products in the coming weeks.The RX 7900 XTX is priced at USD $999, and the RX 7900 XT is $899, which is a surprisingly small difference of only $100, for a performance difference that will certainly be larger, probably in the 20% range. Both Radeon RX 7900 XTX and RX 7900 XT are using the PCI-Express 4.0 interface, Gen 5 is not supported with this generation. The RX 7900 XTX has a typical board power of 355 W, or about 95 W less than that of the GeForce RTX 4090. The reference-design RX 7900 XTX uses conventional 8-pin PCIe power connectors, as would custom-design cards, when they come out. AMD's board partners will create units with three 8-pin power connectors, for higher out of the box performance and better OC potential. The decision to not use the 16-pin power connector that NVIDIA uses was made "well over a year ago", mostly because of cost, complexity and the fact that these Radeons don't require that much power anyway.

AMD today is expected to launch its next-generation RDNA3 graphics architecture and next-generation Radeon RX 7000-series graphics cards, along with new gaming technologies as part of the company's "together we advance_gaming" event, unfurled by CEO Dr Lisa Su. In this live-blog we track the various announcements made in the event.20:01 UTC: AMD's roadmap is supremely busy:20:02 UTC: "today it's all about gaming"

Here's the first picture of the "Navi 31" GPU at the heart of AMD's fastest next-generation graphics cards. Based on the RDNA3 graphics architecture, this will mark an ambitious attempt by AMD to build the first multi-chip module (MCM) client GPU featuring more than one logic die. MCM GPUs aren't new in the enterprise space with Intel's "Ponte Vecchio," but this would be the first such GPU meant for hardcore gaming graphics products. AMD had made MCM GPUs in the past, but those have been packages with just one logic die, surrounded by memory stacks. "Navi 31" is an MCM of as many as eight logic dies, and no memory stacks (no, those aren't HBM stacks in the picture below).

It's rumored that "Navi 31" features one or two SIMD chiplets dubbed GCDs, featuring the GPU's main number crunching machinery, the RDNA3 compute units. These chiplets are likely built on the most advanced silicon fabrication node, likely TSMC 5 nm EUV, but we'll see. The GDDR6 memory controllers handling the chip's 384-bit wide GDDR6 memory interface, will be located on separate chiplets built on a slightly older node, such as TSMC 6 nm. This is not multi-GPU-a-stick, because both SIMD chiplets have uniform access to the entire 384-bit wide memory bus (which is not 2x 192-bit but 1x 384-bit), besides the other ancillaries. The "Navi 31" MCM are expected to be surrounded by JEDEC-standard 20 Gbps GDDR6 memory chips.