Yesterday, NVIDIA announced its next-generation Hopper architecture designed for data center applications and workloads. There is always a question of availability, as the previous period showed everyone that the supply chain is overbooked and semiconductors are in very high demand. During the Q&A press session today, NVIDIA's CEO, Jensen Huang, tried to answer as many questions as possible. However, an exciting topic arose regarding the potential collaboration with Intel. As a part of Intel's IDM 2.0 strategy, the company plans to offer its chip manufacturing capabilities to the third-party companies willing to make efforts and port their designs to Intel's semiconductor nodes. NVIDIA, one of the largest TSMC customers, could be a new Intel customer. Below, we compiled a few quotes that highlight Jensen Huang's opinions, taking the quotes from Tom's Hardware.

NVIDIA CEO Jensen HuangOur strategy is to expand our supply base with diversity and redundancy at every single layer. At the chip layer, at the substrate layer, the system layer, at every single layer. We've diversified the number of nodes, we've diversified the number of foundries, and Intel is an excellent partner of ours[…]. They're interested in us using their foundries, and we're very interested in exploring it. [...] I am encouraged by the work that is done at Intel, I think this is a direction they have to go, and we're interested in looking at their process technology. Our relationship with Intel is quite long; we work with them across a whole lot of different areas, every single PC, every single laptop, every single PC, supercomputer, we collaborate. [...] We have been working closely with Intel, sharing with them our roadmap long before we share it with the public, for years. Intel has known our secrets for years. AMD has known our secrets for years. We are sophisticated and mature enough to realize that we have to collaborate.[...] We share roadmaps, of course, under confidentiality and a very selective channel of communications. The industry has just learned how to work in that way.

Someone with access to an AMD Ryzen 7 5800X3D processor sample posted some of the first Geekbench 5 performance numbers for the chip, where it ends up 9% faster than the Ryzen 7 5800X, on average. AMD claimed that the 5800X3D is "the world's fastest gaming processor," with the 3D Vertical Cache (3D V-cache) technology offering gaming performance uplifts over the 5800X akin to a new generation, despite being based on the same "Zen 3" microarchitecture, and lower clock speeds. The Ryzen 7 5800X3D is shown posting scores of 1633 points 1T and 11250 points nT in one run; and 1637/11198 points in the other; when paired with 32 GB of dual-channel DDR4-3200 memory.

These are 9% faster than a typical 5800X score on this benchmark. AMD's own gaming performance claims see the 5800X3D score a performance uplift above 20% over the 5800X, closing the gap with the Intel Core i9-12900K. The 3D V-cache technology debuted earlier this week with the EPYC "Milan-X" processors, where the additional cache provides huge performance gains for applications with large data-sets. AMD isn't boasting too much about the multi-threaded productivity performance of the 5800X3D because this is ultimately an 8-core/16-thread processor that's bound to lose to the Ryzen 9 5900X/5950X, and the i9-12900K, on account of its lower core-count.

AMD recently announced the latest "Zen 3" and "Zen 2" new processors are coming to the market very soon for DIY users, which includes the ground-breaking AMD 3D V-Cache technology processor, the AMD Ryzen 7 5800X3D. Moreover, the mainstream Ryzen 7 5700X, Ryzen 5 5600, Ryzen 5 5500, Ryzen 5 4600G, Ryzen 5 4500, and Ryzen 3 4100 are all here for different levels of system builds.

MSI is committed to deliver gamers and creators the best experiences. This is why BIOS update is always great for most users. The latest AMD AGESA COMBO PI V2 1.2.0.6c BIOS was released for some MSI 500- and 400-series motherboards. The purpose of AGESA 1.2.0.6c is not only for better compatibility but also for maximizing AMD Ryzen 7 5800X3D performance. For the older 300-series motherboards, we will release the AGESA COMBO PI V2 1.2.0.6c beta BIOS by the end of April. Please refer to the following chart for more information.

AMD today announced a new addition to the Instinct MI200 family of accelerators. Officially titled Instinct MI210 accelerator, AMD tries to bring exascale-class technologies to mainstream HPC and AI customers with this model. Based on CDNA2 compute architecture built for heavy HPC and AI workloads, the card features 104 compute units (CUs), totaling 6656 Streaming Processors (SPs). With a peak engine clock of 1700 MHz, the card can output 181 TeraFLOPs of FP16 half-precision peak compute, 22.6 TeraFLOPs peak FP32 single-precision, and 22.6 TFLOPs peak FP62 double-precision compute. For single-precision matrix (FP32) compute, the card can deliver a peak of 45.3 TFLOPs. The INT4/INT8 precision settings provide 181 TOPs, while MI210 can compute the bfloat16 precision format with 181 TeraFLOPs at peak.

The card uses a 4096-bit memory interface connecting 64 GBs of HMB2e to the compute silicon. The total memory bandwidth is 1638.4 GB/s, while memory modules run at a 1.6 GHz frequency. It is important to note that the ECC is supported on the entire chip. AMD provides an Instinct MI210 accelerator as a PCIe solution, based on a PCIe 4.0 standard. The card is rated for a TDP of 300 Watts and is cooled passively. There are three infinity fabric links enabled, and the maximum bandwidth of the infinity fabric link is 100 GB/s. Pricing is unknown; however, availability is March 22nd, which is the immediate launch date.

AMD places this card directly aiming at NVIDIA A100 80 GB accelerator as far as the targeted segment, with emphasis on half-precision and INT4/INT8 heavy applications.

BIOSTAR, a leading manufacturer of motherboards, graphics cards, and storage devices today, announces product support for the latest AMD Ryzen 5000/ 4000 series processors. With the announcement of AMD's latest Ryzen 5000/ 4000 series processors, the industry is abuzz with the search for viable motherboards that support these latest chips. AMD's latest processors, engineered on their groundbreaking ZEN 2 and ZEN 3 architectures, are built to perform, catering to a wide range of use cases.

BIOSTAR proudly presents the first batch of motherboards ready to support the latest AMD Ryzen 5000/4000 series processors. Addressing the high demand of the mid-range market first, BIOSTAR launches a comprehensive BIOS update for the B550, A520, B450, and A320 motherboards, that makes them compatible with the latest AMD Ryzen 5000/ 4000 series processors.

TYAN, an industry-leading server platform design manufacturer and a MiTAC Computing Technology Corporation subsidiary, today announced availability of high-performance server platforms supporting new 3rd Gen AMD EPYC Processors with AMD 3D V-Cache technology for the modern data center. "The modern data center requires a powerful foundation to balance compute, storage, memory and IO that can efficiently manage growing volumes in the digital transformation trend," said Danny Hsu, Vice President of MiTAC Computing Technology Corporation's Server Infrastructure Business Unit. "TYAN's industry-leading server platforms powered by 3rd Gen AMD EPYC processors with AMD 3D V-Cache technology give our customers better energy efficiency and increased performance for a current and future of highly complex workloads."

"3rd Gen AMD EPYC processors with AMD 3D V-Cache technology continue to drive a new standard for the modern data center with breakthrough performance for technical computing workloads due to 768 MB of L3 cache, enabling faster time-to-results on targeted workloads. Fully socket compatible with our 3rd Gen AMD EPYC platforms, customers can adopt these processors to transform their data center operations to achieve faster product development along with exceptional energy savings," said Ram Peddibhotla, corporate vice president, EPYC product management, AMD.

Super Micro Computer, Inc. (SMCI), a global leader in high-performance computing, storage, networking solutions, and green computing technology, announces breakthrough performance with the 3rd Gen AMD EPYC Processors with AMD 3D V-Cache Technology in Supermicro advanced servers. The high density, performance-optimized, and environmentally friendly SuperBlade and multi-node optimized TwinPro and the dual-processor optimized Ultra systems will show significant performance improvement when using the new AMD EPYC 7003 Processors with AMD 3D V-Cache for technical computing applications.

"Supermicro servers, leveraging new AMD CPUs, will deliver the increased performance gains our manufacturing customers are looking for to run higher-resolution simulations to design better and more optimized products using the latest CAE applications," said Vik Malyala, President, EMEA, senior vice president, WW FAE, solutions and business. "Our high-performance server platforms will solve more complex problems for engineers and researchers with the new 3rd Gen AMD EPYC Processors with AMD 3D V-Cache."

AMD announced the general availability of the world's first data center CPU using 3D die stacking, the 3rd Gen AMD EPYC processors with AMD 3D V-Cache technology, formerly codenamed "Milan-X." Built on the "Zen 3" core architecture, these processors expand the 3rd Gen EPYC CPU family and can deliver up to 66 percent performance uplift across a variety of targeted technical computing workloads versus comparable, non-stacked 3rd Gen AMD EPYC processors.

These new processors feature the industry's largest L3 cache delivering the same socket, software compatibility and modern security features as 3rd Gen AMD EPYC CPUs while providing outstanding performance for technical computing workloads such as computational fluid dynamics (CFD), finite element analysis (FEA), electronic design automation (EDA) and structural analysis. These workloads are critical design tools for companies that must model the complexities of the physical world to create simulations that test and validate engineering designs for some of the world's most innovate products.

Super Micro Computer, Inc. (SMCI), a global leader in enterprise computing, storage, networking solutions, and green computing technology, has announced a revolutionary technology that simplifies large scale GPU deployments and is a future proof design that supports yet to be announced technologies. The Universal GPU server provides the ultimate flexibility in a resource-saving server.

The Universal GPU system architecture combines the latest technologies supporting multiple GPU form factors, CPU choices, storage, and networking options optimized together to deliver uniquely-configured and highly scalable systems. Systems can be optimized for each customer's specific Artificial Intelligence (AI), Machine Learning (ML), and High-Performance Computing (HPC) applications. Organizations worldwide are demanding new options for their next generation of computing environments, which have the thermal headroom for the next generation of CPUs and GPUs.

AMD today released the latest version of AMD Software Adrenalin. Version 22.3.1 sees the company drop "Radeon" from the name, and introduce several new features, including Radeon Super Resolution (RSR), Radeon Image Sharpening (RIS) for desktop applications, an updated AMD Link that now lets up to four players and an updated AMD Software interface that includes improved Toast Notifications, an updated AMD Link version that allows up to four players from different platforms to remotely join in and play multiplayer.

Among the issues fixed are DWM transparency effects missing for some users in Windows 10; incorrect preset selections after a driver update in AMD Software Tuning page; longer than expected game load times in Forza Horizon 5 with medium or high ray tracing enabled; and inconsistent performance when Radeon Chill is enabled for SteamVR. Grab the drivers from the link below.

DOWNDLOAD: AMD Software Adrenalin 22.3.1

AMD today unveiled FidelityFX Super Resolution 2.0 (FSR 2.0), the second major update to the company's ambitious gaming performance enhancement that seeks to improve performance with minimal loss of image quality, by lowering game render resolution, and applying a high-quality upscaling algorithm. The star-attraction with FSR 2.0 is its new upscaling algorithm that leverages temporal data. Data from past generated frames is used to predict and add details to the current frame. This improves image quality across all presets of FSR, and at all resolutions. In some cases, the "Performance" preset of FSR 2.0 may end up looking on par with the "Quality" preset of FSR 1.0. AMD's temporal upscaling algorithm doesn't need any machine-learning hardware on the GPU.

AMD is working to integrate FSR 2.0 with several contemporary game engines, and titles that are both already released or in development. It seems like an upcoming patch of "Deathloop" will add FSR 2.0 support, since the company exclusively used the game in its image-quality comparison previews. AMD will deliver a more elaborate presentation, with an under-the-hood look at how FSR 2.0 works, in its GDC 2022 presentation slated for March 23, 2022. The company is looking to release FSR 2.0 to gamers within Q2-2022 (between April to June).

Besides Radeon Super Resolution, AMD announced Radeon Image Sharpening (RIS) for desktop applications (non-gaming applications). When enabled in AMD Software (or through the Overlay), RIS attempts to improve quality though image sharpening, of whatever is on screen. This would benefit media playback, office, and web-browsing, and not just for accelerated video playback. This should prove particularly useful when trying to view low-resolution assets on a web-page, or a video live-stream, or pretty much anything you feel could so with some image quality improvement. RIS requires Windows 10 or Windows 11, and a Radeon RX 5000 series (or later) graphics card. AMD is releasing RIS for desktop applications with the AMD Software Adrenalin 22.3.1 suite, which you can grab today.

AMD today introduced Radeon Super Resolution (RSR), a new performance enhancement feature that's designed to improve frame-rates of thousands of games, whether or not they feature support for it. Put simply, RSR is a high-quality upscaling algorithm derived from FidelityFX Super Resolution 1.0, which is located on the driver-side, rather than game-side. In games that support FSR, the 3D scene rendered at a lower resolution is put through the FSR upscaler algorithm before post-processing and HUD are applied to its result. RSR doesn't require game-level integration, because it requires the game to simply run at a lower resolution than the display's native resolution; so it could act like a high-quality image upscaling algorithm.

This means that thousands of games can benefit from RSR, as the feature is agnostic to what it's upscaling. There are a couple of wrinkles, though. First, you'll need a Radeon RX 5000 or RX 6000 series GPU, based on the RDNA or RDNA2 graphics architectures. The older "Vega" or "Polaris" architectures don't support it. "Vega" is still a current architecture, given that Ryzen 5000 series processors with Radeon Graphics, use a "Vega" based iGPU. The feature should, however, work with the RDNA2-based iGPU of the Ryzen 6000 "Rembrandt" processor. The second big catch is that since RSR comes later down the rendering pipeline than even HUD application, you may notice low-quality HUDs in some games—especially RTS or RPGs with large cluttered HUDs and inventory icons. RSR is being released through the AMD Software 22.3.1 update today.

We explored RSR in greater technical detail, and tested its performance and image quality for you in our Radeon Super Resolution article.

AMD with its Version 22.3.1 driver release, announced the re-branding of AMD Radeon Software to simply AMD Software. Over the years, Radeon Software grew into something beyond simply GPU drivers and software strictly related to the GPU and display—it is now an all-encompassing suite of software relevant to gamers and creators, helping them organize and optimize their software, share their gameplay among multiple devices locally or over the Internet; and record or stream their experiences, all using software AMD provides to go with its hardware. Going forward, the nomenclature of AMD Software will be practically identical to that of AMD Radeon Software, just without the "Radeon" part. Today (17th March), the company is releasing AMD Software Adrenalin 22.3.1 to introduce several new features and updates. Although not part of the 22.3.1 release, we predict that AMD Software in the future could integrate components beyond graphics and gaming; including platform drivers, overclocking tools, processor-related components, and more.

In a livestream talking about AMD's mobile CPUs with HotHardware, Robert Hallock shone some light on the rumours about the Ryzen 7 5800X3D lacking manual overclocking. As per earlier rumours, something TechPowerUp! confirmed with our own sources, AMD's Ryzen 7 5800X3D lacks support for manual CPU overclocking and AMD asked its motherboard partners to remove these features in the UEFI. According to the livestream, these CPUs are said to be hard locked, so there's no workaround when it comes to adjusting the CPU multiplier or Voltage, but at least AMD has a good reason for it.

It turns out that the 3D V-Cache is Voltage limited to a maximum of 1.3 to 1.35 Volts, which means that the regular boost Voltage of individual Ryzen CPU cores, which can hit 1.45 to 1.5 Volts, would be too high for the 3D V-Cache to handle. As such, AMD implemented the restrictions for this CPU. However, the Infinity Fabric and memory bus can still be manually overclocked. The lower Voltage boost also helps explain why the Ryzen 7 5800X3D has lower boost clocks, as it's possible that the higher Voltages are needed to hit the higher frequencies.

AMD is preparing to announce their FidelityFX Super Resolution (FSR) successor tomorrow, on March 17th before a showcase of the technology at GDC 2022 as we previously reported on according to leaked slides obtained by VideoCardz. AMD FSR 2.0 will use temporal data and optimized anti-aliasing to improve image quality in all presents and resolutions compared to its predecessor making it a worthy component against NVIDIA DLSS 2.0. The slides also confirm that FSR 2.0 doesn't require dedicated machine learning hardware acceleration and will be compatible with a "wide range of products and platforms, both AMD and competitors".

The technology has been implemented in Deathloop where FSR 2.0 "Performance" mode with ray tracing increased frame rates from 53 FPS to 101 FPS compared to 4K native resolution with ray tracing. The slides do not reveal if AMD will make the source code for FSR 2.0 open-source as they have done for FSR and Intel is planning to do with XeSS. AMD is also expected to release Radeon Super Resolution which is an FSR driver implementation available for all games on March 17th.

ASUS today announced BIOS support and updates for a variety of motherboards supporting the new AMD Ryzen 5000 and 4000 series CPUs. Matching the new Ryzen 7 5800X3D, which has a dedicated 96 MB L3 cache, AMD has released AGESA version 1.2.0.6b to improve system performance. Many ASUS 500, 400, A320 and X370 series motherboards already have BIOS updates with this new AGESA version. Other compatible models will receive corresponding BIOS updates by March 25th.

All CPUs in this series are recognized by ASUS mainboards of the 400 and 500 series via existing BIOS updates - also with AGESA version 1.2.0.6b. The updates can be downloaded from the ASUS support website. Previous generation ASUS motherboards will receive support for these new CPUs according to the table below:

Leading memory provider TEAMGROUP not only brings complete storage solutions to consumers worldwide but also strives to provide the best cooling options. In response to greater demands in the next generation of PC hardware for faster and more efficient cooling, its gaming sub-brand T-FORCE has announced the world's first ARGB All-In-One liquid cooling system that dissipates heat from two main heat sources, the CPU and SSD, at the same time.

The dual-cooling system of the T-FORCE SIREN Series All-in-One ARGB Liquid Cooler supports a wide range of Intel and AMD sockets, including the latest LGA1700 and AM5 sockets, and its meticulously-designed water blocks are made for mainstream M.2 2280 SSDs, making the cooler perfect for a large variety of gaming PC setups. The T-FORCE SIREN Series All-in-One liquid cooling system allows gamers to solve both CPU and SSD heating issues with an easy installation and helps provide stable operation when both components are under heavy loads, contributing to longer hardware lifespans. Its ARGB dual water block design can also display a wide array of dazzling lights, giving players the freedom to create their own unique, eye-catching PC rig.

GIGABYTE TECHNOLOGY Co. Ltd, a leading manufacturer of motherboards, graphics cards, and hardware solutions, today announced X570, B550, A520, X470, B450, and A320 motherboards can support the newly launched Ryzen 5000 and Ryzen 4000 series processors without updating BIOS. Users can customize their system according to personal budget, performance request, and accustomed configuration to enjoy the full advantages of GIGABYTE motherboards.

The new launched AMD processors include Ryzen 7 5700X, Ryzen 5 5600, Ryzen 5 4600G and Ryzen 5 5500, Ryzen 5 4500, Ryzen 3 4100, bring users more comprehensive options with various performance and pricing segment. To fully support and unleash all advantages of the new processors, GIGABYTE X570, B550, A520, X470, B450, and A320 motherboards are shipped to market with the latest BIOS. Users can either get the optimal performance by X series motherboards with Ryzen 7 5700X processors, or build a price-competitive platform of A series motherboards with Ryzen 3 4100 processors.

Today Lenovo announced the latest additions to the ThinkPad portfolio: the X13 and X13 Yoga Gen 3, plus refreshed third generation ThinkPad L series laptops designed to empower a hybrid workforce with enhanced collaboration and connectivity features. Following the unveiling of the latest ThinkPad X1 and all-new Z series at CES, and more recently the innovative ThinkPad X13s and updated workhorse T series, refreshing ThinkPad X series and L series completes one of the most comprehensive business laptop portfolios available. Devised to offer customers the best choice, ThinkPad is built leveraging the core tenets of design, innovation and quality. Focused on enhancing the fundamental features that power hybrid working, the latest laptops deliver enhancements including Dolby Voice, FHD cameras, Wi-Fi 6E1, 5G sub6 and 4G LTE wireless WAN, and battery options on select models for the best choice between lightweight mobility and the flexibility of extended battery life.

With more distributed workforces, security remains the number one concern amongst IT decision makers. ThinkShield hardware and software protection that integrates a Trusted Platform Module (TPM) with Windows 11 Secured core PCs enhances security from every angle. Complementary security features embedded in Intel Hardware Shield available exclusively on Intel vPro platform-based devices or AMD Ryzen PRO 6000 Series processors with AMD PRO Security demonstrate the ThinkPad "secure by design" philosophy. Furthermore, ThinkPad is integrating the optional fingerprint reader into the power button for added convenience.

In addition to the Ryzen 7 5800X3D, which AMD claims to be the world's fastest gaming processor, AMD gave its desktop processor product-stack a major update, with as many as six other processor models spanning a wide range of price-points that help the company better compete with the bulk of the 12th Gen Core "Alder Lake" processor lineup. The new lineup sees the introduction of the Ryzen 7 5700X (not to be confused with the Ryzen 7 5700G). The 5700X is based on the same "Vermeer" multi-chip module (MCM) as the Ryzen 7 5800X, unlike the 5700G, which is a desktop APU based on the "Cezanne" monolithic silicon. Both "Vermeer" and "Cezanne" are based on the "Zen 3" microarchitecture.

The Ryzen 7 5700X is an 8-core/16-thread processor clocked at 3.40 GHz base and 4.60 GHz boost, compared to the 3.80 GHz base and 4.80 GHz boost frequency of the 5800X. Another key difference is its 65 W TDP, compared to 105 W of the 5800X, which could differentiate its boosting behavior and overclocking headroom compared to the 5800X. AMD is pricing the 5700X at USD $299 (MSRP), making it a competitor to the Intel Core i5-12600KF. Interestingly, the retail PIB (processor-in-box) package of the 5700X does not include a stock cooler despite its 65 W TDP. A 95 W-capable Wraith Spire wouldn't have hurt.

AMD announced that it is bringing official Ryzen 5000 "Zen 3" desktop processor support to the oldest of Socket AM4 motherboards out there, which are based on AMD 300-series chipset models—the X370, B350, and A320. The company is working with motherboard and pre-built gaming desktop OEMs to push UEFI firmware updates with support. In addition to Ryzen 5000, this would also add Ryzen 3000 and Ryzen 4000 "Zen 2" support across the board. Motherboard firmware updates that add Ryzen 5000 support will encapsulate AGESA V2 PI 1.2.0.7 microcode, so look for this AGESA version in the change-log of the firmware update. AMD expects that motherboard and pre-built vendors will start pushing these updates from May 2022.

AMD today announced its Spring 2022 update for the company's Ryzen desktop processors, with as many as seven new processor models in the retail channel. The lineup is led by the Ryzen 7 5800X3D 8-core/16-thread processor, which AMD claims is the "world's fastest gaming processor." This processor introduces the 3D Vertical Cache (3DV Cache) to the consumer space.

64 MB of fast SRAM is stacked on top of the region of the CCD (8-core chiplet) that has 32 MB of on-die L3 cache, with structural silicon leveling the region over the CPU cores with it. This SRAM is tied directly with the bi-directional ring-bus that interconnects the CPU cores, L3 cache, and IFOP (Infinity Fabric Over Package) interconnect. The result is 96 MB of seamless L3 cache, with each of the 8 "Zen 3" CPU cores having equal access to all of it.

You're not going to get an award for guessing who TSMC's biggest customer is, but based on details in TSMC's latest earnings report, its biggest customer stands for no less than 26 percent of TSMC's total revenue. That's up a whole percentage in 2021 over 2020 and as you most likely have already guessed, that company should be Apple. TSMC doesn't, for obvious reasons, reveal who their customers are, but it's no secret that Apple is spending a lot of money with the company. TSMC had a consolidated revenue of NT$1.587 trillion (US$55.73 billion) in 2021, or up 18.53 percent from 2020. The second largest source of revenue for TSMC might surprise some, at least based on the kind of information that the usual analysts tend to claim in their reports.

Although second place in terms of revenue only accounts for another 10 percent of TSMC's total revenue, we're still looking at some serious money here. However, as both Qualcomm and NVIDIA departed for Samsung in 2021, second place is said to be taken by AMD, which might not have been everyone's first guess. Unsurprisingly, 64 percent of TSMC's revenue is coming from companies in the USA, with Taiwan being the second largest source of revenue at 12.8 percent. As far as the PRC is concerned, revenue is said to be down by 29.6 percent and only makes up 10.3 percent of TSMC's revenues for 2021. This is largely due to the US sanctions against Huawei, according to the Taipei Times. The 7 nm node is still the big money maker for TSMC, which pulled in over NT$440 billion, followed by the 5 nm node at over NT$262 billion. However, the 5 nm node revenue grew by 188 percent in 2021, while the 7 nm node only had a revenue growth of 11.5 percent.

AMD is scheduled to hold an event discussing "Next-Generation Image Upscaling for Games" at the Game Developers Conference on March 23. The event only includes a brief description that "AMD will present some of the results of their research in the domain of next-generation image upscaling technology" but the developer of CapFrameX has recently claimed to see footage from FidelityFX Super Resolution (FSR) 2.0 so AMD may be preparing to announce the technology imminently.

The developer claims that FSR 2.0 switches to a temporal upscaling approach with optimized anti-aliasing that doesn't require AI acceleration unlike DLSS & XeSS meaning that it can work with GPUs from multiple vendors. The technology can also allegedly improve image quality beyond native resolution but we will need to wait for the official announcement and reviews before reaching any conclusions.