With only a couple of days to go until the AMD RX 7900-series benchmarks go live, some alleged benchmarks from both the RX 7900 XTX and RX 7900 XT have leaked on Twitter. The two cards are being compared to a NVIDIA RTX 4080 card in no less than seven different game titles, all running at 4K resolution. The games are God of War, Cyberpunk 2077, Assassin's Creed Valhalla, Watchdogs Legion, Red Dead Redemption 2, Doom Eternal and Horizon Zero Dawn. The cards were tested on a system with a Core i9-12900K CPU which was paired with 32 GB of RAM of unknown type.

It's too early to draw any real conclusions from this test, but in general, the RX 7900 XTX comes out on top, ahead of the RTX 4080, so no surprises here. The RX 7900 XT is either tied with the RTX 4080 or a fair bit slower, with the exception being Red Dead Redemption 2, where the RTX 4080 is the slowest card, although it also appears to have some issues, since the one percent lows are hitting 2 FPS. Soon, the reviews will be out and everything will become more clear, but it appears that AMD's RX 7900 XTX will give NVIDIA's RTX 4080 a run for its money, if these benchmarks are anything to go by.

Update Dec 11th: The original tweet has been removed, for unknown reasons. It could be because the numbers were fake, or because they were in breach of AMD's NDA.

Three weeks ago, PowerColor teased its Radeon RX 7900-series Red Devil cards on social media, but now the company has revealed more details of its upcoming cards. Oddly enough, PowerColor hasn't gone for RGB fans here, unlike its Hellhound cards, although the Red Devil cards do have a lot of RGB accents. A unique, if somewhat pointless feature is that the Red Devil cards come with a removable backplate cover, so you can choose to have a "plain" metal backplate, or a rather unusual looking backplate that appears to be made mostly out of plastic.

As with the Hellhound cards, PowerColour has used a 14-layer PCB for the Red Devil cards, but has added a 21st VRM for some reason, as the Hellhound cards "only" have 20 VRMs. The heatsinks with eight heatpipes appear to be nigh on identical to the one used on the Hellhound cards. PowerColour has also installed a side-mounted metal bracket to help prevent GPU sag, but it appears as if the bracket only reaches half way down the length of the card. The Red Devil cards have three 8-pin power connectors. What is unclear is what type of display interfaces the cards will have, as PowerColor didn't provide an image of that side of the cards, but based on the PCB picture, USB-C doesn't appear to be part of the mix.

GIGABYTE TECHNOLOGY Co. Ltd, a leading manufacturer of premium gaming hardware, today announced the new AMD Radeon RX 7900 Series graphics cards powered by the high-performance, energy-efficient AMD RDNA 3 architecture - the AORUS Radeon RX 7900 XTX ELITE 24G, Radeon RX 7900 XTX GAMING OC 24G, Radeon RX 7900 XTX 24G, Radeon RX 7900 XT GAMING OC 20G and Radeon RX 7900 XT 20G graphics cards. The new graphics cards will be available for purchase on December 13, 2022.

The new graphics cards are the world's first gaming graphics cards to feature an advanced AMD chiplet design, delivering exceptional performance and superb energy efficiency to power high-framerate 4K and higher resolution gaming in the most demanding titles.

Courtesy of VideoCardz, we now know what Gigabyte's and Sapphire's upcoming Radeon RX 7900-series cards will look like. Gigabyte will offer at least two different custom designed models, with the Aorus Elite being the higher-end one and the Gaming OC being the mainstream one. Both appear to come in RX 7900 XTX and RX 7900 XT SKUs. The Aorus Elite is said to be a 3.5-slot card sporting three 8-pin power connectors, whereas the Gaming OC is a 2.5-slot card with two 8-pin power connectors.

The Sapphire card in question is the Nitro+ which has been given a design overhaul compared to the Radeon RX 6000-series cards and it's quite a bright card thanks to its silver coloured shroud. We're once again looking at a massive cooler here, which is wider than three slots, but maybe not quite 3.5-slots wide. Unsurprisingly, Sapphire has kitted out the card with three 8-pin power connectors. None of the three cards have a USB-C port and it appears that those looking to get an AMD Radeon RX 7900-series card with a USB-C port, would have to go for the reference design cards.

ASRock, the leading global motherboard, graphics card and mini PC manufacturer, today launched the new AQUA, Taichi and Phantom Gaming series graphics cards based on AMD Radeon RX 7900 Series GPUs.

The new graphics cards are built on the groundbreaking AMD RDNA 3 architecture with chiplet technology. AMD RDNA 3 architecture delivers up to 54% more performance per watt than AMD RDNA 2, features the world's fastest interconnect linking the graphics and memory system chiplets at up to 5.3 TB/s, and offers up to 96 new unified compute units and second-generation AMD Infinity Cache technology. It also delivers increased AI throughput that provides up to 2.7X higher AI performance, and rearchitected compute units with second-generation ray tracing technology that provides up to 1.8X higher ray tracing architectural performance in select titles versus AMD RDNA 2 architecture.

As we're getting closer to the official launch date, pictures of AMD Radeon RX 7900-series cards from both ASRock and XFX have tipped up online. The ASRock cards are part of its Phantom Gaming and Taichi series of cards, whereas the XFX card is part of the MERC line. Sadly none of the cards appear to sport a USB-C port, suggesting that it's not a feature that any of the OEM's have thought worthwhile to include in their custom board designs.

The ASRock Phantom Gaming cards appear to be 2.5-slot cards, whereas the Taichi cards are triple slot. The Phantom Gaming cards seem to be equipped with a short backplate that only covers the rear of the PCB, rather than the full length of the card, with the Taichi cards seemingly having a full-length backplate. The XFX MERC 310 also appears to be a 2.5-slot design, but it has a very different backplate design which appears to act much more as a heatsink than most backplate designs we've seen to date. The fact that it appears to be made of a large chunk of aluminium that wraps around the back edge of the card is also rather unusual. XFX also appears to have gone with the same size for its RX 7900 XT and RX 7900 XTX cards. We can also see that XFX has gone for three 8-pin power connectors for their cards.

TSMC today announced that in addition to TSMC Arizona's first fab, which is scheduled to begin production of N4 process technology in 2024, TSMC has also started the construction of a second fab which is scheduled to begin production of 3 nm process technology in 2026. The overall investment for these two fabs will be approximately US$40 billion, representing the largest foreign direct investment in Arizona history and one of the largest foreign direct investments in the history of the United States.

In addition to the over 10,000 construction workers who helped with construction of the site, TSMC Arizona's two fabs are expected to create an additional 10,000 high-paying high-tech jobs, including 4,500 direct TSMC jobs. When complete, TSMC Arizona's two fabs will manufacture over 600,000 wafers per year, with estimated end-product value of more than US $40 billion.

AMD's next-generation Radeon RX 7900 high-end graphics cards are set to arrive next week and bring the new RDNA3 GPU architecture to the masses. However, it seems like the customers will have to fight for their purchase as the availability could be scarce at launch, leading to potentially increased prices with low stocks. According to Igor's Lab report, Germany will receive only 3,000 reference MBA (Made By AMD) units of Radeon RX 7900 series cards. In contrast, the rest of the EMEA region will receive only 7,000 MBA units. These numbers are lower than expected, so AIB partners may improve the supply once their designs hit shelves.

On the other hand, mainland China will not receive any MBA units of the new cards as a sign of increasing tension with Taiwan. Of course, AMD's board partners will supply their designs to China, and they are allowed to; however, it seems that only AMD is making a statement here. In addition to supply issues, the launch is rumored to be covered in BIOS issues such as memory leaks and the COVID-19 outbreak affecting production in closed factories. Of course, all of this information should be taken with a grain of salt, and we must wait for the official launch before making any further assumptions.

Back in September, NVIDIA's Jensen Huang said that Moore's Law is dead, but it seems like AMD disagrees with NVIDIA, at least for now. According to an interview with AMD's CTO, Mark Papermaster, AMD still believes that Moore's Law will be alive for another six to eight years. However, AMD no longer believes that transistor density can be doubled every 18 to 24 months, while remaining in the same cost envelope. "I can see exciting new transistor technology for the next - as far as you can really plot these things out - about six to eight years, and it's very, very clear to me the advances that we're going to make to keep improving the transistor technology, but they're more expensive," Papermaster said.

AMD believes we'll see a change in how chips are being designed and put together, with chiplets being the future of semiconductors. Papermaster calls this "a Moore's Law equivalent, meaning that you continue to really double that capability every 18 to 24 months" although it's not exactly Moore's Law in the traditional sense. AMD also appears to be betting heavily on FPGA technology in some of its market segments, for something the company calls adaptive computing. As to how things will play out, time will tell, but with both AMD and Intel going down the chiplet route, albeit in slightly different ways, we should continue to see new innovations from both companies, with or without Moore's Law.

NVIDIA GeForce RTX 4080 graphics card has been out since mid-November and is a great performer in many resolutions and titles. However, with NVIDIA setting its price tag at $1200, it is an expensive product to afford and represents a considerable price jump compared to older xx80 GPU generations. According to MyDrivers, NVIDIA could lower the price starting in mid-December, to better suit the needs of consumers and have a competitive product. With AMD's RDNA3-based graphics cards releasing in the following days, the Radeon RX 7900 XTX costing $999 is a direct competitor to GeForce RTX 4080. If NVIDIA plans to cut the massive MSRP of the RTX 4080, then we expect it to be in the range of Radeon RX 7900 XTX to create better market competition.

Of course, this is only wishful thinking and a rumor that MyDrivers has reported, so we have to wait until the middle of this month to find out if NVIDIA announces the alleged price cut.

AMD is planning to give its Ryzen 7000 "Zen 4" Socket AM5 desktop processor lineup a significant expansion in January, as rival Intel plans to do the same with its 13th Gen Core "Raptor Lake." AMD's lineup expansion will be in both directions—toward the higher end with its 7000X3D series; and toward the lower end, with its 7000 non-X series. It is now becoming clear that the 7000 non-X series will see a retail-channel launch, and won't be relegated to the OEM/SI channel. This would mean boxed versions of these processors, probably including a stock cooling solution.

The Ryzen 7000 non-X series in the retail channel is expected to include the 6-core/12-thread Ryzen 5 7600, the 8-core/16-thread Ryzen 7 7700, and the 12-core/24-thread Ryzen 9 7900. The defining feature of these SKUs is their significantly lower TDP of just 65 W, which would put their PPT (package power tracking) value around 90 W. Their maximum boost frequencies are still north of the 5 GHz-mark, with the 7600 boosting up to 5.10 GHz, the 7700 going up to 5.30 GHz and the 7900 up to 5.40 GHz, however their base frequencies are significantly lower, with the 7600 around 3.80 GHz, the 7700 and 7900 between 3.60-3.80 GHz. The three are expected to feature aggressive power-management to meet their lower power limits, which should also lower their cooling requirements. Wccftech predicts that AMD could announce these processors in its January 4 International CES Keynote address, followed by availability on January 10. In related news, the 7000X3D could see an announcement in the same January 4 keynote, but with a slightly later product availability date.

AMD is firing full cylinders to release a new line of Ryzen 7000-series "Zen 4" Socket AM5 desktop processors featuring 3D Vertical Cache, at the earliest. Faced with a significant drop in demand due to the slump in the PC industry, and renewed competition from Intel in the form of its 13th Gen Core "Raptor Lake" processors, the company is looking to launch the Ryzen 7000X3D desktop processors within January 2023, with product unveiling expected at AMD's 2023 International CES event. The 3D Vertical Cache technology had a profound impact on the gaming performance of the older "Zen 3" architecture, bringing it up to levels competitive with those of the 12th Gen Core "Alder Lake" processors, and while gaming performance of the Ryzen 7000 "Zen 4" processors launched till take match or beat "Alder Lake," they fall behind those of the 13th Gen "Raptor Lake," which is exactly what AMD hopes to remedy with the Ryzen 7000X3D series.

In a report, Korean tech publication Quasar Zone states that AMD is planning to release 16-core/32-thread, 12-core/24-thread, and 8-core/16-thread SKUs in the Ryzen 7000X3D series. These would use one or two "Zen 4" chiplets with stacked 3D Vertical Cache memory. A large amount of cache memory operating at the same speed as the on-die L3 cache, is made contiguous with it and stacked on top of the region of the CCD (chiplet) that has the L3 cache, while the region with the CPU cores has structural silicon that conveys heat to the surface. On "Zen 3," the 32 MB on-die cache is appended with 64 MB of stacked cache memory operating at the same speed, giving the processor 96 MB of L3 cache that's uniformly accessible by all CPU cores on the CCD. This large cache memory positively impacts gaming performance on the Ryzen 7 5800X3D in comparison to the 5800X; and a similar uplift is expected for the 7000X3D series over their regular 7000-series counterparts.

With 11 days to go until the official launch of AMD's Radeon 7900-series graphics cards, PowerColor decided to share some more details about its upcoming cards. The two models appear to be the Hellhound Radeon RX 7900 XTX and the Hellhound Radeon RX 7900 XT, with both cards apparently sharing the same design and cooler. The cards appear to be at least triple-slot, but it's not entirely clear from the provided pictures. PowerColor is using a nine-blade fan design and the fans are of course kitted out with LEDs, where PowerColor is pushing what it calls an "amethyst purple" colour for this generation of Hellhound cards. The new fans are said to improve the GPU temperatures by as much as three degrees Celsius compared to the previous generation of fans.

More importantly, the cards have been given an improved backplate, as well as a larger copper plate for the heatsink, for improved cooling. The new copper plate doesn't just cover the GPU now, but also the VRAM chips. The copper plate is connected to eight 6 mm heatpipes. PowerColor also shared that it's using a 14-layer high TG PCB, which uses a two ounce copper power layer. The RX 7900 XTX is kitted out with 20 VRMs, although this appears to be straight from the AMD reference design. PowerColor appears to have implemented a dual BIOS on the card, as there's a switch for OC/Silent operation and the card also appears to have a hardware LED switch, which is nice for those that don't care about lighting up their computer like a Christmas tree. Keep in mind that this is not PowerColor's top-of-the-range card, which is the Red Devil, so we should expect more details on those cards in the future too.

AMD released the latest version of the AMD Software Adrenalin drivers. Although released in December, the drivers bear the version number 22.11.2 (as opposed to something like 22.12.1); as they were probably finalized late last month. Version 22.11.2 beta adds optimization for "The Callisto Protocol," "Need for Speed Unbound," and "The Witcher 3: Wild Hunt" Next-Gen Update. Among the issues fixed with this release are intermittent driver timeout or black-screen occurring with Radeon RX 6000-series during video playback and window switching on machines powered by RX 6000-series graphics and 240 Hz monitors.

Online video stuttering noticed in Firefox with hardware-acceleration on machines with RX 6000 series graphics, has been fixed. GPU utilization remaining at 100% after closing games on machines powered by RX 570 "Polaris" graphics cards caused due to buggy AMDRSServ.exe, has been fixed. A driver timeout or black-screen while videos are playing with VRChat on RX 6000-series GPU powered machines, has been fixed. Grapb the driver from the link below.

DOWNLOAD: AMD Software Adrenalin 22.11.2 Beta

Lenovo started offering the Ryzen 9 7900 and Ryzen 7 7700 processors as options for its prebuilt desktops, confirming that the 7900 and 7700 will be OEM-exclusives, at least initially. That doesn't mean these chips won't make it to the retail channel, as OEM-only parts from AMD in the past have somehow found their way to retailers, who bought them in trays, and sold them piecemeal as combos with motherboards and CPU coolers. The 7900 is a 12-core/24-thread part, just like its retail-channel sibling, the 7900X. The 7700 is an 8-core/16-thread part, again, similar to the 7700X. Not much else is known about these chips, except for their base frequency of just 3.60 GHz (compared to 4.70 GHz for the 7900X, and 4.50 GHz for the 7700X). Both chips are expected to feature a lowered TDP, with just 65 W for the 7700 (down from 105 W for the 7700X), and possibly 65 W or 105 W for the 7900 (down from 170 W for the 7900X).

The unified shader (stream processor) counts of AMD's upcoming second- and third-largest GPUs based on the RDNA3 graphics architecture, have been leaked in some ROCm code, discovered by Kepler_L2 on Twitter. The "performance.hpp" file references "Navi 32" with a compute unit count of 60, and the "Navi 33" with 32 compute units. We know from the "Navi 31" specifications that an RDNA3 compute unit still amounts to 64 stream processors (although with significant IPC uplifts over the RDNA2 stream processor due to dual-instruction issue-rate).

60 compute units would give the "Navi 32" silicon a stream processor count of 3,840, a 50% numerical increase over the 2,560 of its predecessor, the "Navi 22," powering graphics cards such as the Radeon RX 6750 XT. Meanwhile, the 32 CU count of the "Navi 33" amounts to 2,048 stream processors, which is numerically unchanged from that of the "Navi 23" powering the RX 6650 XT. The new RDNA3 compute unit has significant changes over RDNA2, besides the dual-issue stream processors—it gets second-generation Ray Accelerators, and two AI accelerators for matrix-multiplication.

Xilinx Field Programmable Gate Arrays (FPGAs), now part of AMD, are always in demand in the semiconductor industry. Today, AMD has shared a letter to Xilinx customers that the selected FPGA device series will receive an 8-25% price increase. Citing AMD's investment into the supply chain, along with increased prices from the suppliers, Xilinx FPGAs will get more expensive. From January 9, 2023, the cost of the Spartan 6 series will increase by 25%, the price of the Versal series will not increase, and all other Xilinx products will increase by 8%. Interestingly, the older series manufactured on 40-28 nm nodes will increase while the latest Versal series doesn't experience any change.

Regarding lead times, the 16 nm UltraScale+ series, 20 nm UltraScale series, and 28 nm 7 series all take 20 weeks from order to delivery, which will remain until the third quarter of 2023. You can read the entire document below.

Semiconductor manufacturing is a significant investment that requires long lead times and constant improvement. According to the latest DigiTimes report, the pricing of a 3 nm wafer is expected to reach $20,000, which is a 25% increase in price over a 5 nm wafer. For 7 nm, TSMC managed to produce it for "just" $10,000; for 5 nm, it costs the company to make it for the $16,000 mark. And finally, the latest and greatest technology will get an even higher price point at $20,000, a new record in wafer pricing. Since TSMC has a proven track record of delivering constant innovation, clients are expected to remain on the latest tech purchasing spree.

Companies like Apple, AMD, and NVIDIA are known for securing orders for the latest semiconductor manufacturing node capacities. With a 25% increase in wafer pricing, we can expect the next-generation hardware to be even more expensive. Chip manufacturing price is a significant price-determining factor for many products, so the 3 nm edition of CPUs, GPUs, etc., will get the highest difference.

Innodisk, a leading global provider of industrial-grade flash storage, DRAM memory and embedded peripherals, has announced its latest step into the AI market, with the launch of EXMU-X261, an FPGA Machine Vision Platform. Powered by AMD's Xilinx Kria K26 SOM, which was designed to enable smart city and smart factory applications, Innodisk's FPGA Machine Vision Platform is set to lead the way for industrial system integrators looking to develop machine vision applications.

Automated defect inspection, a key machine vision application, is an essential technology in modern manufacturing. Automated visual inspection guarantees that the product works as expected and meets specifications. In these cases, it is vital that a fast and highly accurate inspection system is used. Without AI, operators must manually inspect each product, taking an average of three seconds per item. Now, with the help of AI solutions such as Innodisk's FPGA Machine Vision Platform, product inspection in factories can be automated, and the end result is not only faster and cheaper, but can be completely free of human error.

AMD Radeon RX 7900 XTX and RX 7900 XT RDNA3 graphics cards debut on December 13, 2022. This is when you will be able to buy one, at an MSRP of $999 for the RX 7900 XTX, and $899 for the RX 7900 XT. These will, however, only be reference-design MBA (made by AMD) graphics cards sold though the company's various add-in board (AIB) partners. The non-reference (custom design) RX 7900 series reportedly releases to the market 1 to 2 weeks after December 13, according to a Board Channels report seen by Wccftech.

Unlike the NVIDIA Founders Edition graphics card that's sold exclusively under the NVIDIA marquee, AMD's reference-design cards are sold by its AIB partners, with minimal or nil partner branding on the cards. The after-sales support, including product warranties and other brand-specific inclusions, are handled by the AIBs themselves. Custom-design cards are those designed by the AIB partners, with customization extending to both the cooling solution and the PCB; and with some cards even featuring factory-overclocked speeds. These are the ones that could launch 1 to 2 weeks after December 13, which would put their launch anywhere between December 20 to 27 (our yikes go out to reviewers).

AMD late Tuesday released the AMD Software Adrenalin 22.11.1 WHQL drivers. These are essentially identical to the Adrenalin 22.11.1 beta drivers the company released on November 16, but with the added WHQL certification. Compared to the previous 22.10.3 beta drivers, these add optimization for Call of Duty: Warzone 2.0, and Marvel's Spider-Man: Miles Morales. It also comes with the same set of fixed and discovered issues as the 22.11.1 beta; including missing prediction lines in World of Warships on Radeon RX 6000 series GPUs; an beep heard in the background when you hold down shift + backspace key with Radeon Anti-Lag enabled; visual corruption in OpenGL applications with MSAA enabled; higher than expected idle memory clocks on multi-monitor setups; and missing objects in Edificius.

DOWNLOAD: AMD Software Adrenalin 22.11.1 WHQL

Based on the latest data and research, TrendForce has further corrected down the projected YoY growth rate of whole server shipments for 2023 to 2.8%. Three factors are behind this revision. First, lead time has started to return to its usual length for most orders related to server components from 3Q23 onward. Seeing this, server OEMs and cloud service providers (CSPs) have also begun to correct the component mismatch issue by lowering demand for items that are in excess while maintaining a constant inventory level for items that are still in tight supply. This development, in turn, has reduced the flow of server orders going to ODMs. Second, the wave of demand that was generated earlier from the effects of the COVID-19 pandemic is dissipating. Hence, expansion activities have cooled off noticeably for services such as video streaming, e-commerce, etc. Among CSPs, Meta, Google, and ByteDance (TikTok) have lowered their server procurement quantities for next year. Lastly, the global economic outlook has remained fairly negative, so companies across most industry sectors have formulated a more conservative expenditure plan and scaled back IT-related spending for next year.

Jon Peddie Research reports the growth of the global PC-based graphics processor unit (GPU) market reached 75.5 million units in Q3'22 and PC CPU shipments decreased by -19% year over year. Overall, GPUs will have a compound annual growth rate of 2.8% during 2022-2026 and reach an installed base of 3,138 million units at the end of the forecast period. Over the next five years, the penetration of discrete GPUs (dGPUs) in the PC will grow to reach a level of 26%.

Year-to-year total GPU shipments, which include all platforms and all types of GPUs, decreased by -25.1%, desktop graphics decreased by -15.43%, and notebooks decreased by -30%—the biggest drop since the 2009 recession. AMD's overall market share percentage from last quarter decreased by -8.5%, Intel's market share increased by 10.3%, and NVIDIA's market share decreased by -1.87%, as indicated in the following chart.

AMD and Analog Devices, Inc. today announced that they have resolved all their ongoing patent litigations, based on mutually agreed upon terms. As part of this resolution, the two companies have committed to pursue technology collaborations to bring next generation solutions to their communications and data center customers.

For more than 50 years AMD has driven innovation in high-performance computing, graphics and visualization technologies. Billions of people, leading Fortune 500 businesses and cutting-edge scientific research institutions around the world rely on AMD technology daily to improve how they live, work and play. AMD employees are focused on building leadership high-performance and adaptive products that push the boundaries of what is possible. Analog Devices, Inc. operates at the center of the modern digital economy, converting real-world phenomena into actionable insight with its comprehensive suite of analog and mixed signal, power management, radio frequency (RF), and digital and sensor technologies. ADI serves 125,000 customers worldwide with more than 75,000 products in the industrial, communications, automotive, and consumer markets. ADI is headquartered in Wilmington, MA.

AMD Ryzen 7000-series "Zen 4" desktop processors got their first round of price-cuts on leading retailer Newegg, as the company has a hard time justifying their launch-prices in the wake of Intel's 13th Gen Core "Raptor Lake" and declining demand in the PC components market. The new pricing sees the top Ryzen 9 7950X 16-core/32-thread chip priced at USD $574, down from $700 (an 18% price-cut). The 12-core/24-thread Ryzen 9 7900X sees its price go down from $550 to $474 (down 14%).

The 8-core/16-thread Ryzen 7 7700X gets a $50 price-cut sending its price down from $400 to roughly $350. The 6-core/12-thread Ryzen 5 7600X gets a similar $50 cut, which means the chip can now be had for roughly $250, down from its $300 launch price. All four SKUs face stiff competition from the aggressively priced 13th Gen Core SKUs, which include the i9-13900K, the i7-13700K, and the i5-13600K. Prices of Socket AM5 motherboards are another big put-off as they're a major contributor to platform costs, which is restricted to DDR5 memory. The Intel platform currently includes entry-level chipset options, as well as motherboards with DDR4 support.