BIOSTAR, a leading manufacturer of motherboards, graphics cards, and storage devices today, is excited to unveil two brand-new Radeon RX 7900 series graphics cards. Powered by the groundbreaking AMD RDNA 3 architecture, BIOSTAR is latest Radeon RX 7900XTX-24GB and RX 7900XT-20GB graphics cards deliver up to 50% more performance per watt than their previous generation RDNA 2 GPU units. Featuring AMD is superior RDNA 3 architecture and the world is fastest interconnect technology, the all-new BIOSTAR Radeon RX 7900XTX and RX 7900XT graphics cards combine 5 nm and 6 nm process nodes with updated chiplets that leverage AMD is Infinity Links and high-performance fanout packaging to deliver blazingly fast 5.3 TB/s bandwidth.

Unleash jaw-droppingly high frame-rates on AAA game titles with breathtaking 4K visuals powered by AMD is most advanced graphics technology with BIOSTAR is Radeon RX 7900XTX and RX 7900XT graphics cards. Ideal for gamers and content creators, they carry AMD is second-generation Infinity Cache technology and high-speed GDDR6 memory with up to a 384-bit memory interface.

In a bid to clear out inventories of its Radeon RX 6000 series RDNA2 graphics card inventory constipating its supply-chain, AMD decided to bundle "The Callisto Protocol" and "Dead Island 2" with these graphics cards, for a promotion period between February 4, 2023 and March 4, 2023. Buyers of the Radeon RX 6600, RX 6600 XT, RX 6650 XT, RX 6700, RX 6700 XT, RX 6750 XT, RX 6800, RX 6800 XT, RX 6900 XT, and RX 6950 XT get both games on new purchases; whereas just "Dead Island 2" is bundled with the RX 6400 and RX 6500 XT. Both are fairly recently launched AAA titles. "The Callisto Protocol" is a story-driven survival horror, while "Dead Island 2" is an online multiplayer zombie-apocalypse shooter. As with all game bundles, this latest promotion is limited to certain market regions, and participating retailers. To find out if your favorite retailer is eligible, visit this page.

FinalWire Ltd. today announced the immediate availability of AIDA64 Extreme 6.85 software, a streamlined diagnostic and benchmarking tool for home users; the immediate availability of AIDA64 Engineer 6.85 software, a professional diagnostic and benchmarking solution for corporate IT technicians and engineers; the immediate availability of AIDA64 Business 6.85 software, an essential network management solution for small and medium scale enterprises; and the immediate availability of AIDA64 Network Audit 6.85 software, a dedicated network audit toolset to collect and manage corporate network inventories.

The new AIDA64 update introduces AVX-512 optimized stress testing for AMD Ryzen 7000 Series processors, and supports the latest AMD and Intel CPU platforms as well as the new graphics and GPGPU computing technologies by both AMD and NVIDIA.

DOWNLOAD: FinalWire AIDA64 Extreme v6.85

Team Group's gaming brand, T-FORCE, launches T-FORCE DELTAα RGB DDR5, a gaming memory built for AMD Ryzen 7000 Series Processors and 600 Series Motherboard. DELTAα RGB DDR5 supports the latest overclocking technology from AMD EXPO, enhancing memory performance through excellent compatibility and delivering fast and reliable OC speeds with a single click. T-FORCE is dedicated to providing outstanding performances for gamers around the world and is proud to join forces with AMD to create the ultimate gaming experience.

Modeled after a stealth aircraft, T-FORCE DELTAα RGB DDR5 features a strong and clean geometric silhouette with 120° ultra-wide lighting to deliver a fierce military style. The new gaming memory is compatible with lighting effect software such as ASUS Aura Sync, GIGABYTE RGB Fusion 2.0, MSI Mystic Light Sync, ASROCK-Polychrome Sync, and BIOSTAR Advanced VIVID LED DJ[1]. With the RGB DDR5, gamers can design their own lighting effects and create an incredibly stunning RGB system. T-FORCE DELTAα RGB DDR5 is equipped with PMIC for better power management and a strengthened PMIC cooling design using thermally conductive silicon or more effective cooling and stable PMIC operations. The memory also supports on-die ECC and one-click overclocking with AMD EXPO so that gamers can enjoy the extreme speeds of overclocking with one simple click.

The new AMD Radeon RX 7900 XT (X) GPU is here! And Alphacool offers its new Eisblock Aurora cooler, a new, innovative active water cooler for custom layouts of AMD Radeon graphics cards. With significant improvements over the previous Aurora generation, Alphacool now takes it a big step further. What's new. Going forward, Alphacool is now using chrome plating on the copper radiators for all graphics card coolers instead of nickel plating. This is significantly harder and more resistant than nickel plating. The addressable RGB LED lighting also shines better because the chrome plating is much smoother and distributes the light even more beautifully in the cooler.

To dissipate the enormous amount of waste heat, the water flow has been completely redesigned. The jetplate is embedded in the cooling fins and is pressed onto them by a completely redesigned inlet with an O-ring. This ensures that the water is reliably forced through the cooling fins. Optimization of the cooling fins leads to a further increase in performance. The cooling fins were reduced to 0.4 mm and the distance between the fins was minimized to 0.4 mm. This creates a larger cooling surface and reduces the flow resistance of the cooler. This results in a performance plus.

AMD is preparing the launch of the Radeon RX 7900 series of graphics cards for December 13th. And, of course, with recent launches being coated in uncertainty regarding availability, we are getting more rumors about what the availability could look like. According to Kyle Bennett, founder of HardOCP, we have information that AMD is allegedly preparing 200,000 Radeon RX 7900 SKUs for launch day. If the information is truthful, among the 200,000 launch-day SKUs, there should be 30,000 Made-by-AMD (MBA) cards, while the rest are AIB partner cards. This number indicates that AMD's market research has shown that there will be a great demand for these new GPUs and that the scarcity problem should be long gone.

A few days ago, we reported that the availability of the new AMD Radeon generation is reportedly scarce, with Germany receiving only 3,000 MBA designs and the rest of the EMEA region getting only 7,000 MBA SKUs as well. With today's rumor going around, we would like to know if this is correct and if more SKUs will circulate. America's region could receive most of the MBA designs, and AIB partners will take care of other regions. Of course, we must wait for tomorrow's launch and see how AMD plans to execute its strategy.

With only a couple of days to go until the AMD RX 7900-series benchmarks go live, some alleged benchmarks from both the RX 7900 XTX and RX 7900 XT have leaked on Twitter. The two cards are being compared to a NVIDIA RTX 4080 card in no less than seven different game titles, all running at 4K resolution. The games are God of War, Cyberpunk 2077, Assassin's Creed Valhalla, Watchdogs Legion, Red Dead Redemption 2, Doom Eternal and Horizon Zero Dawn. The cards were tested on a system with a Core i9-12900K CPU which was paired with 32 GB of RAM of unknown type.

It's too early to draw any real conclusions from this test, but in general, the RX 7900 XTX comes out on top, ahead of the RTX 4080, so no surprises here. The RX 7900 XT is either tied with the RTX 4080 or a fair bit slower, with the exception being Red Dead Redemption 2, where the RTX 4080 is the slowest card, although it also appears to have some issues, since the one percent lows are hitting 2 FPS. Soon, the reviews will be out and everything will become more clear, but it appears that AMD's RX 7900 XTX will give NVIDIA's RTX 4080 a run for its money, if these benchmarks are anything to go by.

Update Dec 11th: The original tweet has been removed, for unknown reasons. It could be because the numbers were fake, or because they were in breach of AMD's NDA.

Three weeks ago, PowerColor teased its Radeon RX 7900-series Red Devil cards on social media, but now the company has revealed more details of its upcoming cards. Oddly enough, PowerColor hasn't gone for RGB fans here, unlike its Hellhound cards, although the Red Devil cards do have a lot of RGB accents. A unique, if somewhat pointless feature is that the Red Devil cards come with a removable backplate cover, so you can choose to have a "plain" metal backplate, or a rather unusual looking backplate that appears to be made mostly out of plastic.

As with the Hellhound cards, PowerColour has used a 14-layer PCB for the Red Devil cards, but has added a 21st VRM for some reason, as the Hellhound cards "only" have 20 VRMs. The heatsinks with eight heatpipes appear to be nigh on identical to the one used on the Hellhound cards. PowerColour has also installed a side-mounted metal bracket to help prevent GPU sag, but it appears as if the bracket only reaches half way down the length of the card. The Red Devil cards have three 8-pin power connectors. What is unclear is what type of display interfaces the cards will have, as PowerColor didn't provide an image of that side of the cards, but based on the PCB picture, USB-C doesn't appear to be part of the mix.

GIGABYTE TECHNOLOGY Co. Ltd, a leading manufacturer of premium gaming hardware, today announced the new AMD Radeon RX 7900 Series graphics cards powered by the high-performance, energy-efficient AMD RDNA 3 architecture - the AORUS Radeon RX 7900 XTX ELITE 24G, Radeon RX 7900 XTX GAMING OC 24G, Radeon RX 7900 XTX 24G, Radeon RX 7900 XT GAMING OC 20G and Radeon RX 7900 XT 20G graphics cards. The new graphics cards will be available for purchase on December 13, 2022.

The new graphics cards are the world's first gaming graphics cards to feature an advanced AMD chiplet design, delivering exceptional performance and superb energy efficiency to power high-framerate 4K and higher resolution gaming in the most demanding titles.

Courtesy of VideoCardz, we now know what Gigabyte's and Sapphire's upcoming Radeon RX 7900-series cards will look like. Gigabyte will offer at least two different custom designed models, with the Aorus Elite being the higher-end one and the Gaming OC being the mainstream one. Both appear to come in RX 7900 XTX and RX 7900 XT SKUs. The Aorus Elite is said to be a 3.5-slot card sporting three 8-pin power connectors, whereas the Gaming OC is a 2.5-slot card with two 8-pin power connectors.

The Sapphire card in question is the Nitro+ which has been given a design overhaul compared to the Radeon RX 6000-series cards and it's quite a bright card thanks to its silver coloured shroud. We're once again looking at a massive cooler here, which is wider than three slots, but maybe not quite 3.5-slots wide. Unsurprisingly, Sapphire has kitted out the card with three 8-pin power connectors. None of the three cards have a USB-C port and it appears that those looking to get an AMD Radeon RX 7900-series card with a USB-C port, would have to go for the reference design cards.

ASRock, the leading global motherboard, graphics card and mini PC manufacturer, today launched the new AQUA, Taichi and Phantom Gaming series graphics cards based on AMD Radeon RX 7900 Series GPUs.

The new graphics cards are built on the groundbreaking AMD RDNA 3 architecture with chiplet technology. AMD RDNA 3 architecture delivers up to 54% more performance per watt than AMD RDNA 2, features the world's fastest interconnect linking the graphics and memory system chiplets at up to 5.3 TB/s, and offers up to 96 new unified compute units and second-generation AMD Infinity Cache technology. It also delivers increased AI throughput that provides up to 2.7X higher AI performance, and rearchitected compute units with second-generation ray tracing technology that provides up to 1.8X higher ray tracing architectural performance in select titles versus AMD RDNA 2 architecture.

As we're getting closer to the official launch date, pictures of AMD Radeon RX 7900-series cards from both ASRock and XFX have tipped up online. The ASRock cards are part of its Phantom Gaming and Taichi series of cards, whereas the XFX card is part of the MERC line. Sadly none of the cards appear to sport a USB-C port, suggesting that it's not a feature that any of the OEM's have thought worthwhile to include in their custom board designs.

The ASRock Phantom Gaming cards appear to be 2.5-slot cards, whereas the Taichi cards are triple slot. The Phantom Gaming cards seem to be equipped with a short backplate that only covers the rear of the PCB, rather than the full length of the card, with the Taichi cards seemingly having a full-length backplate. The XFX MERC 310 also appears to be a 2.5-slot design, but it has a very different backplate design which appears to act much more as a heatsink than most backplate designs we've seen to date. The fact that it appears to be made of a large chunk of aluminium that wraps around the back edge of the card is also rather unusual. XFX also appears to have gone with the same size for its RX 7900 XT and RX 7900 XTX cards. We can also see that XFX has gone for three 8-pin power connectors for their cards.

TSMC today announced that in addition to TSMC Arizona's first fab, which is scheduled to begin production of N4 process technology in 2024, TSMC has also started the construction of a second fab which is scheduled to begin production of 3 nm process technology in 2026. The overall investment for these two fabs will be approximately US$40 billion, representing the largest foreign direct investment in Arizona history and one of the largest foreign direct investments in the history of the United States.

In addition to the over 10,000 construction workers who helped with construction of the site, TSMC Arizona's two fabs are expected to create an additional 10,000 high-paying high-tech jobs, including 4,500 direct TSMC jobs. When complete, TSMC Arizona's two fabs will manufacture over 600,000 wafers per year, with estimated end-product value of more than US $40 billion.

AMD's next-generation Radeon RX 7900 high-end graphics cards are set to arrive next week and bring the new RDNA3 GPU architecture to the masses. However, it seems like the customers will have to fight for their purchase as the availability could be scarce at launch, leading to potentially increased prices with low stocks. According to Igor's Lab report, Germany will receive only 3,000 reference MBA (Made By AMD) units of Radeon RX 7900 series cards. In contrast, the rest of the EMEA region will receive only 7,000 MBA units. These numbers are lower than expected, so AIB partners may improve the supply once their designs hit shelves.

On the other hand, mainland China will not receive any MBA units of the new cards as a sign of increasing tension with Taiwan. Of course, AMD's board partners will supply their designs to China, and they are allowed to; however, it seems that only AMD is making a statement here. In addition to supply issues, the launch is rumored to be covered in BIOS issues such as memory leaks and the COVID-19 outbreak affecting production in closed factories. Of course, all of this information should be taken with a grain of salt, and we must wait for the official launch before making any further assumptions.

Back in September, NVIDIA's Jensen Huang said that Moore's Law is dead, but it seems like AMD disagrees with NVIDIA, at least for now. According to an interview with AMD's CTO, Mark Papermaster, AMD still believes that Moore's Law will be alive for another six to eight years. However, AMD no longer believes that transistor density can be doubled every 18 to 24 months, while remaining in the same cost envelope. "I can see exciting new transistor technology for the next - as far as you can really plot these things out - about six to eight years, and it's very, very clear to me the advances that we're going to make to keep improving the transistor technology, but they're more expensive," Papermaster said.

AMD believes we'll see a change in how chips are being designed and put together, with chiplets being the future of semiconductors. Papermaster calls this "a Moore's Law equivalent, meaning that you continue to really double that capability every 18 to 24 months" although it's not exactly Moore's Law in the traditional sense. AMD also appears to be betting heavily on FPGA technology in some of its market segments, for something the company calls adaptive computing. As to how things will play out, time will tell, but with both AMD and Intel going down the chiplet route, albeit in slightly different ways, we should continue to see new innovations from both companies, with or without Moore's Law.

NVIDIA GeForce RTX 4080 graphics card has been out since mid-November and is a great performer in many resolutions and titles. However, with NVIDIA setting its price tag at $1200, it is an expensive product to afford and represents a considerable price jump compared to older xx80 GPU generations. According to MyDrivers, NVIDIA could lower the price starting in mid-December, to better suit the needs of consumers and have a competitive product. With AMD's RDNA3-based graphics cards releasing in the following days, the Radeon RX 7900 XTX costing $999 is a direct competitor to GeForce RTX 4080. If NVIDIA plans to cut the massive MSRP of the RTX 4080, then we expect it to be in the range of Radeon RX 7900 XTX to create better market competition.

Of course, this is only wishful thinking and a rumor that MyDrivers has reported, so we have to wait until the middle of this month to find out if NVIDIA announces the alleged price cut.

AMD is planning to give its Ryzen 7000 "Zen 4" Socket AM5 desktop processor lineup a significant expansion in January, as rival Intel plans to do the same with its 13th Gen Core "Raptor Lake." AMD's lineup expansion will be in both directions—toward the higher end with its 7000X3D series; and toward the lower end, with its 7000 non-X series. It is now becoming clear that the 7000 non-X series will see a retail-channel launch, and won't be relegated to the OEM/SI channel. This would mean boxed versions of these processors, probably including a stock cooling solution.

The Ryzen 7000 non-X series in the retail channel is expected to include the 6-core/12-thread Ryzen 5 7600, the 8-core/16-thread Ryzen 7 7700, and the 12-core/24-thread Ryzen 9 7900. The defining feature of these SKUs is their significantly lower TDP of just 65 W, which would put their PPT (package power tracking) value around 90 W. Their maximum boost frequencies are still north of the 5 GHz-mark, with the 7600 boosting up to 5.10 GHz, the 7700 going up to 5.30 GHz and the 7900 up to 5.40 GHz, however their base frequencies are significantly lower, with the 7600 around 3.80 GHz, the 7700 and 7900 between 3.60-3.80 GHz. The three are expected to feature aggressive power-management to meet their lower power limits, which should also lower their cooling requirements. Wccftech predicts that AMD could announce these processors in its January 4 International CES Keynote address, followed by availability on January 10. In related news, the 7000X3D could see an announcement in the same January 4 keynote, but with a slightly later product availability date.

AMD is firing full cylinders to release a new line of Ryzen 7000-series "Zen 4" Socket AM5 desktop processors featuring 3D Vertical Cache, at the earliest. Faced with a significant drop in demand due to the slump in the PC industry, and renewed competition from Intel in the form of its 13th Gen Core "Raptor Lake" processors, the company is looking to launch the Ryzen 7000X3D desktop processors within January 2023, with product unveiling expected at AMD's 2023 International CES event. The 3D Vertical Cache technology had a profound impact on the gaming performance of the older "Zen 3" architecture, bringing it up to levels competitive with those of the 12th Gen Core "Alder Lake" processors, and while gaming performance of the Ryzen 7000 "Zen 4" processors launched till take match or beat "Alder Lake," they fall behind those of the 13th Gen "Raptor Lake," which is exactly what AMD hopes to remedy with the Ryzen 7000X3D series.

In a report, Korean tech publication Quasar Zone states that AMD is planning to release 16-core/32-thread, 12-core/24-thread, and 8-core/16-thread SKUs in the Ryzen 7000X3D series. These would use one or two "Zen 4" chiplets with stacked 3D Vertical Cache memory. A large amount of cache memory operating at the same speed as the on-die L3 cache, is made contiguous with it and stacked on top of the region of the CCD (chiplet) that has the L3 cache, while the region with the CPU cores has structural silicon that conveys heat to the surface. On "Zen 3," the 32 MB on-die cache is appended with 64 MB of stacked cache memory operating at the same speed, giving the processor 96 MB of L3 cache that's uniformly accessible by all CPU cores on the CCD. This large cache memory positively impacts gaming performance on the Ryzen 7 5800X3D in comparison to the 5800X; and a similar uplift is expected for the 7000X3D series over their regular 7000-series counterparts.

With 11 days to go until the official launch of AMD's Radeon 7900-series graphics cards, PowerColor decided to share some more details about its upcoming cards. The two models appear to be the Hellhound Radeon RX 7900 XTX and the Hellhound Radeon RX 7900 XT, with both cards apparently sharing the same design and cooler. The cards appear to be at least triple-slot, but it's not entirely clear from the provided pictures. PowerColor is using a nine-blade fan design and the fans are of course kitted out with LEDs, where PowerColor is pushing what it calls an "amethyst purple" colour for this generation of Hellhound cards. The new fans are said to improve the GPU temperatures by as much as three degrees Celsius compared to the previous generation of fans.

More importantly, the cards have been given an improved backplate, as well as a larger copper plate for the heatsink, for improved cooling. The new copper plate doesn't just cover the GPU now, but also the VRAM chips. The copper plate is connected to eight 6 mm heatpipes. PowerColor also shared that it's using a 14-layer high TG PCB, which uses a two ounce copper power layer. The RX 7900 XTX is kitted out with 20 VRMs, although this appears to be straight from the AMD reference design. PowerColor appears to have implemented a dual BIOS on the card, as there's a switch for OC/Silent operation and the card also appears to have a hardware LED switch, which is nice for those that don't care about lighting up their computer like a Christmas tree. Keep in mind that this is not PowerColor's top-of-the-range card, which is the Red Devil, so we should expect more details on those cards in the future too.

AMD released the latest version of the AMD Software Adrenalin drivers. Although released in December, the drivers bear the version number 22.11.2 (as opposed to something like 22.12.1); as they were probably finalized late last month. Version 22.11.2 beta adds optimization for "The Callisto Protocol," "Need for Speed Unbound," and "The Witcher 3: Wild Hunt" Next-Gen Update. Among the issues fixed with this release are intermittent driver timeout or black-screen occurring with Radeon RX 6000-series during video playback and window switching on machines powered by RX 6000-series graphics and 240 Hz monitors.

Online video stuttering noticed in Firefox with hardware-acceleration on machines with RX 6000 series graphics, has been fixed. GPU utilization remaining at 100% after closing games on machines powered by RX 570 "Polaris" graphics cards caused due to buggy AMDRSServ.exe, has been fixed. A driver timeout or black-screen while videos are playing with VRChat on RX 6000-series GPU powered machines, has been fixed. Grapb the driver from the link below.

DOWNLOAD: AMD Software Adrenalin 22.11.2 Beta

Lenovo started offering the Ryzen 9 7900 and Ryzen 7 7700 processors as options for its prebuilt desktops, confirming that the 7900 and 7700 will be OEM-exclusives, at least initially. That doesn't mean these chips won't make it to the retail channel, as OEM-only parts from AMD in the past have somehow found their way to retailers, who bought them in trays, and sold them piecemeal as combos with motherboards and CPU coolers. The 7900 is a 12-core/24-thread part, just like its retail-channel sibling, the 7900X. The 7700 is an 8-core/16-thread part, again, similar to the 7700X. Not much else is known about these chips, except for their base frequency of just 3.60 GHz (compared to 4.70 GHz for the 7900X, and 4.50 GHz for the 7700X). Both chips are expected to feature a lowered TDP, with just 65 W for the 7700 (down from 105 W for the 7700X), and possibly 65 W or 105 W for the 7900 (down from 170 W for the 7900X).

The unified shader (stream processor) counts of AMD's upcoming second- and third-largest GPUs based on the RDNA3 graphics architecture, have been leaked in some ROCm code, discovered by Kepler_L2 on Twitter. The "performance.hpp" file references "Navi 32" with a compute unit count of 60, and the "Navi 33" with 32 compute units. We know from the "Navi 31" specifications that an RDNA3 compute unit still amounts to 64 stream processors (although with significant IPC uplifts over the RDNA2 stream processor due to dual-instruction issue-rate).

60 compute units would give the "Navi 32" silicon a stream processor count of 3,840, a 50% numerical increase over the 2,560 of its predecessor, the "Navi 22," powering graphics cards such as the Radeon RX 6750 XT. Meanwhile, the 32 CU count of the "Navi 33" amounts to 2,048 stream processors, which is numerically unchanged from that of the "Navi 23" powering the RX 6650 XT. The new RDNA3 compute unit has significant changes over RDNA2, besides the dual-issue stream processors—it gets second-generation Ray Accelerators, and two AI accelerators for matrix-multiplication.

Xilinx Field Programmable Gate Arrays (FPGAs), now part of AMD, are always in demand in the semiconductor industry. Today, AMD has shared a letter to Xilinx customers that the selected FPGA device series will receive an 8-25% price increase. Citing AMD's investment into the supply chain, along with increased prices from the suppliers, Xilinx FPGAs will get more expensive. From January 9, 2023, the cost of the Spartan 6 series will increase by 25%, the price of the Versal series will not increase, and all other Xilinx products will increase by 8%. Interestingly, the older series manufactured on 40-28 nm nodes will increase while the latest Versal series doesn't experience any change.

Regarding lead times, the 16 nm UltraScale+ series, 20 nm UltraScale series, and 28 nm 7 series all take 20 weeks from order to delivery, which will remain until the third quarter of 2023. You can read the entire document below.

Semiconductor manufacturing is a significant investment that requires long lead times and constant improvement. According to the latest DigiTimes report, the pricing of a 3 nm wafer is expected to reach $20,000, which is a 25% increase in price over a 5 nm wafer. For 7 nm, TSMC managed to produce it for "just" $10,000; for 5 nm, it costs the company to make it for the $16,000 mark. And finally, the latest and greatest technology will get an even higher price point at $20,000, a new record in wafer pricing. Since TSMC has a proven track record of delivering constant innovation, clients are expected to remain on the latest tech purchasing spree.

Companies like Apple, AMD, and NVIDIA are known for securing orders for the latest semiconductor manufacturing node capacities. With a 25% increase in wafer pricing, we can expect the next-generation hardware to be even more expensive. Chip manufacturing price is a significant price-determining factor for many products, so the 3 nm edition of CPUs, GPUs, etc., will get the highest difference.

Innodisk, a leading global provider of industrial-grade flash storage, DRAM memory and embedded peripherals, has announced its latest step into the AI market, with the launch of EXMU-X261, an FPGA Machine Vision Platform. Powered by AMD's Xilinx Kria K26 SOM, which was designed to enable smart city and smart factory applications, Innodisk's FPGA Machine Vision Platform is set to lead the way for industrial system integrators looking to develop machine vision applications.

Automated defect inspection, a key machine vision application, is an essential technology in modern manufacturing. Automated visual inspection guarantees that the product works as expected and meets specifications. In these cases, it is vital that a fast and highly accurate inspection system is used. Without AI, operators must manually inspect each product, taking an average of three seconds per item. Now, with the help of AI solutions such as Innodisk's FPGA Machine Vision Platform, product inspection in factories can be automated, and the end result is not only faster and cheaper, but can be completely free of human error.