The global PC market has been experiencing a demand downtrend after the cooling down of COVID-19 in 2022. The market saw its shipments decline 15% YoY in 2022 and is expected to see another high single-digit decline in 2023, according to Counterpoint Research's data. However, among all the PC sub-sectors, Arm-based laptops are expected to show a comparatively resilient demand throughout the coming quarters thanks to Apple's success with the MacBook series, increasing ecosystem support and vanishing performance gap with x86 offerings.

PowerColor on Wednesday formally launched its flagship graphics card, the Radeon RX 7900 XTX Liquid Devil. Designed for enthusiasts with DIY liquid-cooling setups, the Liquid Devil is essentially an RX 7900 XTX Red Devil, but with a factory-fitted full-coverage water block instead of the massive air cooler. The block has been made by EK Water Blocks, and consists of a nickel-plated copper main material, with a clear-acrylic top, and some vinyl decals. The top is studded with ARGB LEDs. The block lacks fittings, but has G 1/4" threading, and PowerColor has included goodies such as an EK-Loop Leak Tester Flex kit (lets you check for coolant leaks).

The PowerColor RX 7900 XTX has an ace up its sleeves that positions it above the Red Devil OC—the "Unleash" BIOS. The card has a dual-BIOS setup, with the default BIOS being labeled "OC" and the other one being "Unleash." OC enables speeds comparable to the Red Devil OC—2395 MHz game and 2565 MHz boost (vs. 2269 MHz game and 2499 MHz boost AMD reference speeds). PowerColor is yet to spell out the clock speeds of the "Unleash" BIOS, but we're hearing that it will be even higher (possibly the highest factory OC for the RX 7900 XTX), along with increased power-limits. The PowerColor RX 7900 XTX Liquid Devil should be available from mid-February, 2023.

ASUS Republic of Gamers (ROG) launches the ROG Strix SCAR and Strix G lineup of gaming laptops. Brand-new designs come to the Strix SCAR 16, Strix SCAR 18, Strix G16, and Strix G18, with updated internals for the Strix SCAR 17 and Strix G17. When combined with ROG's Nebula and Nebula HDR displays and an updated Intelligent Cooling thermal solution, these powerhouse laptops are prepared to power victories among esports pros and gaming enthusiasts alike.

As ROG's highest-performing laptops, the Strix series is powered by the latest and greatest chips from Intel, AMD, and NVIDIA. The Strix SCAR 16 and 18 feature up to an Intel Core i9-13980HX processor with 24 cores and 32 threads, alongside up to NVIDIA GeForce RTX 4090 GPU. A MUX Switch with NVIDIA Advanced Optimus intelligently ensures optimal framerates when plugged in, and better battery life when untethered, with no manual intervention needed. The Strix G16 and G18 are powered by up to an Intel Core i9-13980HX CPU and an NVIDIA GeForce RTX 4080 GPU and the same MUX Switch with Advanced Optimus.

ASRock Industrial announces the 4X4 BOX 7000/D5 Series Mini PCs powered by AMD Ryzen 7000U-Series APUs up to 8 Zen 3+ cores. Featuring maximum dual DDR5 4800 MHz memory up to 64 GB, the 4X4 BOX 7000/D5 Series bring about performance enhancement through unleashing higher standards of power, speed, and energy efficiency. Now poised with enriched IOs and expansions, the Series also provide quad-display outputs of up to 8K outstanding graphics with one HDMI 2.1, three DisplayPort 1.4a, and five USB ports, including two USB4 for versatile connectivity. Moreover, dual storages with one SATA 3.0, one M.2 Key M, plus dual LAN ports up to 2.5 Gigabit, Wi-Fi 6E, and Bluetooth 5.2 are supported for reliable communications. The unleashed features make this Series the leading choice for a wide range of top-notch applications such as gaming, entertainment, content creation, office productivity, business, and AIoT use cases.

Powered by AMD Ryzen 7 7735Uand Ryzen 5 7535U, ASRock Industrial presents the 4X4 BOX 7000/D5 Series selections: 4X4 BOX-7735U/D5 and 4X4 BOX-7535U/D5. Featuring up to 8 Zen 3+ cores and next-generation AMD Radeon Graphics, the Series guarantee optimal power, speed, and performance upgrades. The 4X4 BOX 7000/D5 Series showcase the very first dual-channel DDR5 4800 MHz SO-DIMM memory up to 64 GB with new features that unleash effortless multitasking abilities for higher performance, lower power consumption, and more robust data integrity for future computing.

MSI Radeon RX 7900 XTX Gaming Trio Classic, the company's first Radeon 7000 series RDNA3 graphics card, is finally listed online. American retailer Newegg put it up for sale at $1,100, a $100 premium over the $1000 AMD baseline price for the RX 7900 XTX. This is a "sold and shipped by Newegg" listing. MSI showed this card off last month, at the 2023 International CES. It pairs a custom-design PCB with a previous-generation Tri Frozr 2.0 cooling solution—the same one it used with its RX 6950 XT Gaming series. The PCB, however, is an MSI in-house design, with a meaty VRM that draws power from three 8-pin PCIe power connectors, and should hence feature a higher power-limit than the reference-design board, which has been known to scoop out a far greater overclocking headroom on other cards with a similar power setup (such as the ASUS TUF Gaming RX 7900 XTX).

The MSI RX 7900 XTX Gaming Trio Classic comes with clock speeds of 2.30 GHz game, and 2.50 GHz boost, which surprisingly are AMD's reference clocks. Perhaps MSI is saving factory-overclocks for the RX 7900 XTX Gaming X Trio Classic, which it will price even higher. Maxing out the 5 nm "Navi 31" GPU, the RX 7900 XTX offers 6,144 stream processors across 96 RDNA3 compute units, with 96 Ray Accelerators, 384 TMUs, 192 ROPs, and a 384-bit wide GDDR6 memory interface, running 24 GB of memory at 20 Gbps (960 GB/s memory bandwidth).

In the wake of its Ryzen 7000X3D series announcement, AMD cut the price of its Ryzen 7 7700X 8-core/16-thread "Zen 4" processor. The Ryzen 7000X3D series is available from February 28, however, the 8-core 7800X3D will only be available from April 6. Despite this, sales prospects of the 7700X could be affected, as the SKU faces cannibalization not just from the 7800X3D, but also the recently launched 65 W Ryzen 7 7700, which has shown decent overclocking potential with motherboard-level power limit unlocks. What's interesting is that the 105 W 7700X at $299 puts it below the 65 W 7700 that launched at $325, which means that the 7700 could get even cheaper. This series of price-cuts and SKU re-positioning could make AMD competitive against Intel's 13th Gen Core i5 SKUs such as the i5-13600 and i5-13500 6P+8E models.

AMD in its Q4-2022 earnings release call disclosed to investors that it "undershipped" chips in the second half of 2022 to keep prices (margins) high and save itself from unsold inventory, in the wake of a steep slump in the PC market. "We undershipped in Q3, we undershipped in Q4," AMD CEO Dr Lisa Su told investors. "We will undership, to a lesser extent, in Q1 [sic]," she added.

Major chipmakers are experiencing an unprecedented slump in demand compared to the spike in demand during the COVID 19 pandemic lockdowns. With high energy prices and the ebb in the pandemic causing much of the white-collar workforce to return to office, there's no longer the kind of demand the PC industry saw in 2021. On the other hand, undersupplies artificially hold prices high, with graphics cards and desktop processors still being unreasonably pricey compared to previous generations. AMD calculated that it would rather make less revenues on fewer chips shipped, than end up with a bloated unsold inventory that it would have to sell at a thin margins, or even at a loss. The company on Tuesday beat expectations to report good Q4-2022 results, which received a thumbs-up from investors.

AMD today announced the retail channel pricing of its upcoming Ryzen 7000X3D "Zen 4" line of high-performance Socket AM5 desktop processors. These processors introduce the 3D Vertical Cache (3DV cache) technology, which the company claims has a significant impact on gaming performance, making them perform competitively with 13th Gen Core "Raptor Lake" processors, including the fastest i9-13900K, and possibly even the i9-13900KS. AMD announced retail availability from February 28, 2023 for the Ryzen 9 7950X3D and 7900X3D. The Ryzen 7 7800X3D launches on April 6, 2023.

The Ryzen 7 7800X3D 8-core/16-thread processor is priced at USD $449. The 12-core/24-thread Ryzen 9 7900X3D is priced at $599. The flagship 16-core/32-thread Ryzen 9 7950X3D is priced at $699. The 7800X3D launches at a $50 higher price than the $399 price that the Ryzen 7 7700X launched at, before settling down at $349. The 7900X3D launches at $599, which again is a $50 premium over the launch price of the Ryzen 9 7900X—currently going for $475. The top-dog 7950X3D launches at the same $699 price that the 7950X launched at, which has its price slashed all the way down to $575.A video presentation by AMD follows.

Although we haven't been able to confirm these specs, full specifications of AMD's upcoming A620 chipset was posted on Twitter by @g01d3nm4ng0, who has proven to have solid details in the past. This is supposedly the cut-down version of the B650 chipset, due to the rumored delays of the actual A620 chipset. The A620 chipset will be identical to the B650 chipset when it comes to PCIe lane counts, but rather than PCIe 4.0 lanes, the chipset will only offer PCIe 3.0 lanes. What is unclear is if the PCIe 3.0 of the B650 chipset will remain or not, as they're not included in the leaked specs.

If not, then the A620 chipset will only have a total of eight usable PCIe lanes, but four lanes that are connected to the CPU, which will apparently also be limited to PCIe 3.0 speeds. There's also no mention of SATA port configurations. AMD has trimmed the amount of USB 3.x ports significantly, with the A620 chipset only getting two 10 Gbps and two 5 Gbps ports. USB 2.0 ports remain the same at a total of six. A620 motherboards will apparently also be limited to PCIe 4.0 for the lanes from the CPU, but this should be less of an issue for most consumers. As rumored, CPU overclocking is also said to be missing, but RAM overclocking will still be present.

Acer through its gamer-focused brand, Acer Predator, is reportedly preparing custom-design AMD Radeon graphics cards for launch in 2023. The company already made an entry into the DIY gaming PC components space with Intel Arc "Alchemist" graphics cards, and Predator-branded high-end memory products, such as M.2 NVMe SSDs and memory kits. The company already showed off its engineering chops with custom-design graphics cards, such the likes of its Arc A770 Predator models, and it's expected that the Taiwanese PC giant will do the same with AMD Radeon cards. 2023 will see AMD ramp up its Radeon RX 7000 series graphics cards based on the RDNA3 graphics architecture, across several price-points.

Intel's upcoming LGA-7529 socket designed for next-generation Xeon processors has been pictured, thanks to Yuuki_Ans and Hassan Mujtaba. According to the latest photos, we see the massive LGA-7529 socket with an astonishing 7,529 pins placed inside of a single socket. Made for Intel's upcoming "Birch Stream" platform, this socket is going to power Intel's next-generation "Sierra Forest" Xeon processors. With Sierra Forest representing a new way of thinking about Xeon processors, it also requires a special socket. Built on Intel 3 manufacturing process, these Xeon processors use only E-cores in their design to respond to AMD EPYC Bergamo with Zen4c.

The Intel Xeon roadmap will split in 2024, where Sierra Forest will populate dense and efficient cloud computing with E-cores, while its Granite Rapids sibling will power high-performance computing using P-cores. This interesting split will be followed by the new LGA-7529 socket pictured below, which is a step up from Intel's current LGA-4677 socket with 4677 pins used for Sapphire Rapids. With higher core densities and performance targets, the additional pins are likely to be mostly power/ground pins, while the smaller portion is picking up the additional I/O of the processor.20:20 UTC: Updated with motherboard picture of dual-socket LGA-7529 system, thanks to findings of @9550pro lurking in the Chinese forums.

EK, the premium liquid cooling gear manufacturer, is releasing a new AMD AM5 socket-based monoblock, the EK-Quantum Momentum² ROG Crosshair X670E Hero D-RGB - Plexi. The monoblock is engineered specifically for the ROG Crosshair X670E HERO motherboard from ASUS. It features addressable D-RGB LEDs compatible with ASUS Aura Sync RGB control and offers a full lighting customization experience for every single diode at any given time. This Quantum monoblock is EK-Matrix7 compliant and allows the use of the stock I/O shield with LED implementation.

This is a complete, all-in-one (CPU and motherboard) liquid cooling solution for AMD's Ryzen 7000-series processors compatible with the AM5 socket on the ROG Crosshair X670E Hero motherboard. The monoblock packs the latest generation Velocity² cooling engine to ensure the best possible CPU cooling without reducing flow to other components. It directly cools the AMD Ryzen 7000-series CPU and VRM section.

Facing global economic headwinds, the four major North American cloud service providers (CSPs) have scaled back their server procurement quantities for 2023 and could make further downward corrections in the future. Meta is the leader among the four in terms of server demand reduction, followed by Microsoft, Google, and AWS. TrendForce has lowered the YoY growth rate of their total server procurement quantity for this year from the original projection of 6.9% to the latest projection of 4.4%. With CSPs cutting demand, global server shipments are now estimated to grow by just 1.87% YoY for 2023. Regarding the server DRAM market, prices there are estimated to drop by around 20~25% QoQ for 1Q23 as CSPs' downward corrections exacerbate the oversupply situation.

Looking at the four CSPs individually, the YoY decline of Meta's server procurement quantity has been widened to 3.0% and could get larger. The instability of the global economy remains the largest variable for all CSPs. Besides this, Meta has also encountered a notable obstacle in expanding its operation in Europe. Specifically, its data center in Denmark has not met the regional standard for emissions. This issue is expected to hinder its progress in setting up additional data centers across the EU. Moreover, businesses related to e-commerce account for about 98% of Meta's revenue. Therefore, the decline in e-commerce activities amidst the recent easing of the COVID-19 pandemic has impacted Meta's growth momentum. Additionally, Meta's server demand has been affected by the high level of component inventory held by server ODMs.

ASUS today announced the 15.6-inch Vivobook Go 15 OLED (E1504F) and 14-inch Vivobook Go 14 (E1404F), two exciting and affordable lifestyle laptops that help make users productive or keep them entertained, wherever they go. These light and compact laptops feature superior OLED (E1504F) or IPS (E1404F) displays and powerful ASUS SonicMaster sound systems with DTS Audio Processing for immersive entertainment. The design is stylish and practical, with thoughtful touches that make the user's life easier, such as a 180° lay-flat hinge. Built to survive any lifestyle, these tough laptops are US military-grade tested for durability using the world's strictest test regime.

Speedy performance for any task is assured by up to AMD Ryzen 5 7000-series processors, 16 GB of LPDDR5 RAM and a 512 GB PCIe SSD. Other user-friendly features include an ASUS ErgoSense keyboard; smart conferencing via the HD webcam with ASUS 3D Noise Reduction (3DNR), AI noise cancelation, and a physical privacy shield; and a useful suite of ASUS apps including MyASUS, GlideX and ScreenXpert 3.

According to HKEPC, AMD is set to introduce two versions of the A620 chipset for its lower-end motherboards, providing a lower barrier of AM5 entry for users on a smaller budget. As the new source notes, AMD is going to use its Promontory 21 (PROM21) module for A620 motherboards, the same one used on B650 and X670 models. However, for the first time, we are hearing about Promontory 22 (PROM22), a module that will allow A620-based motherboards to start at 125 US dollars—a promise made by AMD in its marketing slides (which you can see below). Two A620 chipsets will enable users to choose basic functionality or some additional features on a reasonable budget.

With PROM21 going inside all chipset SKUs, it carries silicon functionality disabled by AMD to create different categories. However, the PROM22 is a new silicon that doesn't need bells and whistles of the high-end boards inside a feature-deprived chipset like A620. This drives down AMD's costs, making it easier for vendors to adjust pricing. We have to wait for the launch and see how much of this will be fulfilled, so stay tuned for further updates.

AMD possibly has a straightforward path to increasing the performance of the "Navi 31" RDNA3 GPU to power future high-end SKUs, according to semiconductor engineer Tom Wassick. The GPU's main SIMD machinery is located in the Graphics Compute Die (GCD) built on the 5 nm EUV foundry process, surrounded by six Memory Cache Dies (MCDs) built on 6 nm, which each contain GDDR6 memory controllers, and a 16 MB segment of the GPU's 96 MB Infinity Cache memory.

In microscopic observations, Wassick noticed structures on the MCD which he thinks look like an array of through-silicon vias (TSVs), of the kind used in "Zen 3" and "Zen 4" CCDs, to wire out stacked 3D Vertical Cache memory on the L3D (L3 cache die). If the theory holds up, it could be possible for AMD to increase the L3 cache segment size per MCD from 16 MB, and the GPU's overall Infinity Cache memory size. With its RDNA2 graphics architecture (RX 6000 series), AMD significantly enlarged on-die caches on its GPUs, particularly the last-level L3 cache, even giving them the special branding of "Infinity Cache," claiming that they had a big impact in lubricating the memory sub-system, letting GPUs with 256-bit memory buses compete with NVIDIA GPUs with wider 320-bit to 384-bit interfaces.

AMD Radeon RX 400 series and RX 500 series graphics cards based on the "Polaris" graphics architecture are simply unable to run "Forspoken," as users on Reddit report. The game has certain DirectX 12 feature-level 12_1 API requirements that the architecture does not meet. Interestingly, NVIDIA's "Maxwell" graphics architecture, which predates AMD "Polaris" by almost a year, supports FL 12_1, and is able to play the game. Popular GPUs from the "Maxwell" generation include the GeForce GTX 970 and GTX 960. Making matters much worse, AMD is yet to release an update to its Adrenalin graphics drivers for the RX Vega, RX 5000, and RX 6000 series that come with "Forspoken" optimization. Its latest 23.1.2 beta drivers that come with these optimizations only support the RX 7000 series RDNA3 graphics cards. It's now been over 50 days since the vast majority of AMD discrete GPUs have received a driver update.

Intel's server processor lineup led by the 4th Gen Xeon Scalable "Sapphire Rapids" processors face stiff competition from AMD 4th Gen EPYC "Genoa" processors that offer significantly higher multi-threaded performance per Watt on account of a higher CPU core-count. The gap is only set to widen, as AMD prepares to launch the "Bergamo" processor for cloud data-centers, with core-counts of up to 128-core/256-thread per socket. A technologically-embattled Intel is preparing quick counters as many as three new server microarchitecture launches over the next 23 months, according to Intel, in its Q4-2022 Financial Results presentation.

The 4th Gen Xeon Scalable "Sapphire Rapids," with a core-count of up to 60-core/120-thread, and various application-specific accelerators, witnessed a quiet launch earlier this month, and is shipping to Intel customers. The company says that it will be joined by the Xeon Scalable "Emerald Rapids" architecture in the second half of 2023; followed by "Granite Rapids" and "Sierra Forest" in 2024. Built on the same LGA4677 package as "Sapphire Rapids," the new "Emerald Rapids" MCM packs up to 64 "Raptor Cove" CPU cores, which support higher clock-speeds, higher memory speeds, and introduce the new Intel Trust Domain Extensions (TDX) instruction-set. The processor retains the 8-channel DDR5 memory interface, but with higher native memory speeds. The chip's main serial interface is a PCI-Express Gen 5 root-complex with 80 lanes. The processor will be built on the last foundry-level refinement of the Intel 7 node (10 nm Enhanced SuperFin); many of these refinements were introduced with the company's 13th Gen Core "Raptor Lake" client processors.

EK, the premium water-cooling gear manufacturer, is launching the EK-Quantum Vector² water block for the ASUS TUF models of the new AMD Radeon RX 7900 GPUs. This water block has been engineered to fit both versions of these GPUs, the XTX and the XT. The EK-Quantum Vector² TUF RX 7900 XTX D-RGB is a fully EK-Matrix7 compatible liquid cooling solution engineered exclusively for ASUS TUF Radeon RX 7900 XT and XTX GPUs. It encompasses a Vector² series water block and a black-anodized aluminum backplate in the same package. Like the rest of the Vector² series water blocks, its looks are dominated by minimalistic straight lines and the backplate coming around the side of the GPU to cover the PCB in its entirety.

What differs from all other Vector² water blocks is that the cooling engine for this water block has been rotated by 90°, making the fins perpendicular to the die. For optimal delta, the coolant flows over the Graphics Core Die first and Memory Cache Die after. Consequently, all MCDs get the same coolant temperature thanks to the high-precision 3D-machined acrylic jet insert.

AMD today released the Adrenalin 23.1.2 drivers exclusively for the Radeon RX 7900 series, making it the third straight driver of the kind. There has been no new driver for older GPUs, including the RX 6000 series, including the 7-month old RX 6950 XT, since December 8, 2022 (48 days now), which means the overwhelming majority of AMD Radeon users don't yet have optimization for games such as Forspoken and Valhiem. The latest 23.1.2 drivers only work with the RX 7900 XT and RX 7900 XTX. These introduce day-zero optimization for "Forspoken," and a handful background improvements for the Vulkan API. AMD fixed the "Delayed Write Failed" error noticed on Windows 11 22H2; less than expected performance with "SpaceEngine," and flickering issues noticed with "Emergency 4."

DOWNLOAD: AMD Software Adrenalin 23.1.2 for RX 7900 Series

From today, until the first of April, AMD will bundle a game code for Star Wars Jedi: Survivor with all of its Ryzen 7000-series CPUs. The promotion appears to be largely global, but limited to certain retailers, so if your favourite shop doesn't offer the bundled game code, you might have to look elsewhere. AMD offers a list on its website with participating retailers and in the US and Canada, this only appears to be Amazon and Newegg, whereas it varies much more widely in other parts of the world.

Oddly enough, many large retailers in various countries are missing and several countries are absent too, especially in Europe, for no apparent reason. What's even stranger, is that AMD doesn't appear to be offering the game code bundle through its own online shop, at least not in Europe. We should also point out that Star Wars Jedi: Survivor doesn't launch until the 17th of March, so if you jump the gun now, you're going to have to wait a few weeks before you'll be able to play the game.

Noctua today presented the latest addition to its successful NH-L9 series of low-profile CPU coolers: At a height of only 37 mm, the new NH-L9a-AM5 and NH-L9a-AM5 chromax.black are an excellent choice for quiet, ultra-compact HTPCs or Small Form Factor (SFF) systems using AMD's latest, AM5-based Ryzen processors.

"AMD's just-released 65 W Ryzen CPUs are ideal for building small yet highly powerful systems, and our new NH-L9a-AM5 is the perfect cooler to match", explains Roland Mossig (CEO). "It can easily cool the new 7900, 7700 and 7600 at ultra-quiet fan speeds and offers plenty of headroom if customers want to push them beyond 65 W - we've actually been running up to 130 W on the Ryzen 7950X and 7900X!" Since the original NH-L9a coolers for AM3 and AM4 have received more than 100 awards and recommendations from international hardware websites and magazines, the new AM5 revision builds on the same proven heatsink design to provide excellent low-profile cooling performance for AMD's latest Ryzen processors.

The product pages of the upcoming AMD Ryzen 9 7950X3D and Ryzen 7 7800X3D "Zen 4" processors went online, which say that the two chips are unlocked for overclocking. This normally implies that the processor has an unlocked base-clock multiplier, which makes it easy to overclock. The previous-generation Ryzen 7 5800X3D processors came with locked base-clock multipliers, making them complicated to overclock. Both the 16-core/32-thread 7950X3D and the 8-core/16-thread 7800X3D come with a TDP rating of 120 W, which for the 7950X3D is significantly lower than the 170 W that the 7950X is rated at. It's also worth noting that the T-junction max (TJmax) value is lower, at just 89°C, compared to 95°C of the 7950X and 7700X.

Slated for a February 2023 market release, the two chips introduce stacked 3D vertical cache technology (3DV cache). The 7800X3D comes with 64 MB of 3DV cache stacked on top of the 32 MB of on-die L3 cache, taking its L3 cache size to 96 MB, and total cache (L2+L3) to 104 MB. On the other hand, the 7950X3D and the 12-core/24-thread 7900X3D only come with the 3DV cache memory on one of the two "Zen 4" CCDs. The first CCD has 96 MB of L3 cache (including the 3DV cache), while the second CCD is a standard "Zen 4" CCD with just 32 MB of on-die L3 cache. For these chips, the L3 cache adds up to 128 MB, and total cache to 140 MB for the 7900X3D, and 144 MB for the 7950X3D.Update Jan 24th: AMD updated their product pages to remove this field altogether. It looks like we'll have to wait a bit for AMD to finalize its specs.

AMD announced that its adaptive computing technology is powering leading mobility supplier DENSO Corporation's next-generation LiDAR platform. The new platform will enable over 20X1 improvement in resolution with extremely low latency for increased precision in detecting pedestrians, vehicles, free space and more. The DENSO LiDAR platform, targeted to begin shipping in 2025, will leverage the AMD Xilinx Automotive (XA) Zynq UltraScale+ adaptive SoC and its functional safety suite of developer tools to enable ISO 26262 ASIL-B certification.

DENSO is using the AMD XA Zynq UltraScale+ multi-processor system-on-a-chip (MPSoC) platform in its Single-Photon Avalanche Diode (SPAD) LiDAR system, which generates the highest point-cloud density level of any LiDAR system on the market today. Point-cloud density describes the number of points within a given area and is analogous to image resolution, where richer data ensures that crucial decision-making details are captured.

AMD's Radeon RX 7900 XTX RDNA3 graphics card does cross the 3 GHz engine clocks barrier, but not in gaming use-cases, finds a ComputerBase.de article, in which the German publication compares the overclocking experience between the RX 7000-series RDNA3 and NVIDIA RTX 40-series "Ada" architectures. The RX 7900 XTX was found to hit engine clock speeds as high as 3455 MHz, but when handling the Blender rendering benchmark, and not typical gaming workloads.

The GPU could even be pushed to 3548 MHz with a power-draw of around 400 W, but it wasn't stable, the article notes. The top frequencies the GPUs could hit with gaming workloads were around 2.90 GHz. We could be happening with games is that more of the GPU's hardware resources are tapping into its power-limit (such as the memory controllers, caches, and other special SIMD functions, which could be impacting the engine clock boosting headroom. ComputerBase.de used a Sapphire RX 7900 XTX NITRO+ custom-design graphics card in its testing, which comes with three 8-pin PCIe power connectors, and a higher overclocking headroom than what the reference-design cards are capable of.