QNAP Systems, Inc., a leading computing, networking, and storage solution innovator, today launched the TS-h1290FX NAS. Providing QNAP's first PCIe 4.0 and U.2 NVMe/SATA all-flash NAS in a tower form factor, the TS-h1290FX excels in the most demanding work environments such as collaborative high-resolution video workflows. Featuring AMD EPYC 8/16-core processors, built-in 25 GbE and 10GbE connectivity, PCIe Gen 4 expansion, and up to petabyte-scale storage capacity, the TS-h1290FX provides up to 816K/318K iSCSI 4K random read/write IOPS for tackling data-intensive and latency-sensitive applications, such as large media file transfer, real-time editing of 4K/8K media, and virtualization applications.

"Modern businesses and studios shouldn't need to dedicate entire rooms to accommodate hot and loud servers, and that's where the TS-h1290FX comes in. Contained within a unique tower form factor and utilizing quiet cooling is exceptional performance driven by a server-grade processor, all-flash U.2 NVMe SSD storage, and QNAP's enterprise-grade QuTS hero operating system," said Jason Hsu, Product Manager of QNAP, adding "the TS-h1290FX is a remarkable storage solution that provides exceptional power to deal with the modern demands of businesses and studios - including high-resolution media editing and online collaborative workflows."

Handheld portable consoles now enable a new way for people to play PC games, with flexibility. More and more brands have entered this market with constant evolution of the devices. AOKZOE, an emerging gaming&tech company in Shanghai, has now announced the world's first AMD 6800U console AOKZOE A1. In addition to A1's superior performance, the design details and console features will also surprise you.

AOKZOE will be the first to bring the portable console with AMD Ryzen 7 6800U to mass production. The much anticipated 6800U powered console will surely bring advancement to the gaming experience. With the combination of AMD Ryzen 7 6800U, the Radeon 680M graphics, along with LPDDR5X memory, AOKZOE A1 is able to deliver Elden Ring at 60 FPS and Forza over 100FPS in the official video demo.

NVIDIA is reportedly looking to reduce orders for 5 nm wafers from TSMC as it anticipates a significant drop in demand from both gamers and crypto-currency miners. Miners are flooding the market with used GeForce RTX 30-series graphics cards, which gamers are all too happy to buy, affecting NVIDIA's sales to both segments of the market. Before the crypto-currency crash of Q1-2022, NVIDIA had projected good sales of its next-generation GeForce GPUs, and prospectively placed orders for a large allocation of 5 nm wafers from TSMC. The company had switched back over to TSMC from Samsung, which makes 8 nm GPUs from the RTX 30-series.

With NVIDIA changing its mind on 5 nm orders, it is at the mercy of TSMC, which has made those allocations (and now faces a loss). It's incumbent on NVIDIA to find a replacement customer for the 5 nm volumes it wants to back out from. Chiakokhua (aka Retired Engineer), interpreted a DigiTimes article originally written in Chinese, which says that NVIDIA has made pre-payments to TSMC for its 5 nm allocation, and now wants to withdraw from some of it. TSMC is unwilling to budge—it could at best hold off shipments by a quarter to Q1-2023, allowing NVIDIA to get the market to digest inventory of 8 nm GPUs; and NVIDIA is responsible for finding replacement customers for the cancelled allocation.

AMD is looking to expand its Socket AM4 Ryzen 5000X3D processor lineup, according to Greymon55, a reliable source with AMD rumors. The current Ryzen 7 5800X3D 8-core processor was well received by the tech-press for its 3D Vertical Cache innovation that significantly improved gaming performance, putting it in the same league as Intel's fastest 12th Gen Core "Alder Lake" processors, despite being based on the older "Zen 3" microarchitecture. AMD uses the same 8-core 3DV Cache chiplet (CCD) in its EPYC "Milan-X" enterprise processors. This lineup could see an expansion, with announcements expected in July.

If true, it could see the introduction of SKUs such as the Ryzen 5 5600X3D, Ryzen 9 5900X3D, or perhaps even the 5950X3D, with the latter two featuring a mind-boggling 200 MB of Total Cache (L2+L3). This would provide a tempting upgrade path to everyone with a Socket AM4 platform, now that AMD has extended official "Zen 3" support to even the oldest AMD 300-series chipset motherboards. There is yet another rumor that predicts AMD could develop certain "Zen 4" SKUs on the AM4 package, which sees a "Zen 4" CCD paired with a current-gen cIOD that has DDR4 and PCIe Gen 4 connectivity. Regardless of which rumor is true, AMD's support for AM4 isn't ending anytime soon.

AMD today released AMD Software Adrenalin 22.6.1 Legacy. This is a special branch of AMD software designed for older GPUs based on the Graphics CoreNext architecture—Fury series, 300 series, 200 series, and HD 7000/8000 series. The driver only supports Windows 10 64-bit, there's no official support for Windows 11. Legacy branch drivers correct outstanding bugs, security vulnerabilities, and some other software-level updates, but the company doesn't advertise any new game-specific optimizations. This is probably because these GPU generations fall outside the minimum system requirements of the latest games. Still, if you'd like to reminisce with an older GPU you have lying around, or want to build a period-specific project (2010 to 2015); here's your chance. If however, you're looking for the regular Adrenalin 22.6.1 WHQL drivers for the latest GPUs, check out this page.

DOWNLOAD: AMD Software Adrenalin 22.6.1 Legacy

Last week, AMD announced that its Ryzen Threadripper Pro 5900WX-series of processors were going to be available from more OEMs, with an eventual retail version of the three models going to be available. Now the company has shared the retail pricing for the new workstation processors and it would appear that AMD's HEDT platform has become unobtanium for most consumers, after having been one of the cheapest platforms out there only a couple of generations ago. According to Tom's Hardware, whom AMD shared the pricing with, the Ryzen Threadripper Pro 5965WX, the 24 core, 48 thread entry level model, will start at US$2,399, which is more than a 32 core, 64 thread Threadripper 3970X, which has a retail price of US$1,999.

A step up is the 32 core, 64 thread Threadripper Pro 5975WX for US$3,299 and at the top of the stacks, sits the 64 core, 128 thread Threadripper Pro 5995WX for the hefty price of US$6,499. All three models have 128 PCIe lanes and a 280 W TDP. AMD seems to have decided to cash in on its core and thread advantage over Intel, as Intel's highest-end workstation chip is the Xeon W-3375, with 38 cores and 76 threads, which comes in at US$4,499, but only has half the PCIe lane count and a much smaller cache. That said, Intel is expected to launch its 4th generation of Xeon W processors, codenamed Sapphire Rapids later this year, which is expected to feature a 56 core, 112 thread SKU, which should bring some competition to AMD in this market segment.

With the new VIA 15 Pro, SCHENKER has put together a unique overall package: The 1.45 kg ultrabook integrates AMD's efficient eight-core Ryzen 7 5700U, a 15.6 inch WQHD IPS display and two freely accessible and upgradeable M.2 SSD and RAM slots - a combination that is usually only found in significantly heavier gaming laptops with dedicated graphics cards. Unlike these, however, the VIA 15 Pro features AMD's energy-efficient, integrated Radeon graphics unit. With this outfit, the ultrabook is aimed at developers, programmers, and creative professionals, among others. The all-round office laptops SCHENKER WORK 15 and WORK 17 are also being updated with Intel's Alder Lake-P processors.

One of the most striking features of the SCHENKER VIA 15 Pro is a performance-enhanced AMD Ryzen 7 5700U with eight cores and 16 threads: instead of running the CPU with a TDP of 15 watts, which is common in the ultrabook sector, it can operate permanently at 35 watts in the highest performance profile ("enthusiast") - this way, it outperforms the majority of ULV processors and achieves a multi-score of 3937 points in Cinebench R20. The laptop's dual-fan cooling system was adopted from the 2020 predecessor model of the VIA 15 Pro, so it is designed for less efficient CPUs from the 54 watt TDP class and therefore guarantees superior and quiet cooling. Those who require somewhat less performance may select the medium performance profile ("balanced") for particularly quiet operation. Switching is possible in real time at the touch of a button via a keyboard shortcut.

AMD's RDNA3 graphics IP is just around the corner, and we are hearing more information about the upcoming architecture. Historically, as GPUs advance, it is not unusual for companies to add dedicated hardware blocks to accelerate a specific task. Today, AMD engineers have updated the backend of the LLVM compiler to include a new instruction called Wave Matrix Multiply-Accumulate (WMMA). This instruction will be present on GFX11, which is the RDNA3 GPU architecture. With WMMA, AMD will offer support for processing 16x16x16 size tensors in FP16 and BF16 precision formats. With these instructions, AMD is adding new arrangements to support the processing of matrix multiply-accumulate operations. This is closely mimicking the work NVIDIA is doing with Tensor Cores.

AMD ROCm 5.2 API update lists the use case for this type of instruction, which you can see below:

rocWMMA provides a C++ API to facilitate breaking down matrix multiply accumulate problems into fragments and using them in block-wise operations that are distributed in parallel across GPU wavefronts. The API is a header library of GPU device code, meaning matrix core acceleration may be compiled directly into your kernel device code. This can benefit from compiler optimization in the generation of kernel assembly and does not incur additional overhead costs of linking to external runtime libraries or having to launch separate kernels.

rocWMMA is released as a header library and includes test and sample projects to validate and illustrate example usages of the C++ API. GEMM matrix multiplication is used as primary validation given the heavy precedent for the library. However, the usage portfolio is growing significantly and demonstrates different ways rocWMMA may be consumed.

AMD today released the latest version of AMD Software Adrenalin. Version 22.6.1 WHQL adds support for Windows 11 22H2. It also adds optimization for F1 2022. Among the issues fixed are a performance drop noticed when playing "Fortnite" with multi-threaded rendering and DirectX 11 API; a stuttering issue noticed in "Overwatch" with cards such as the RX 6700 XT; higher than expected CPU usage with Instant Replay; and missing fan-tuning options on graphics cards such as the RX 590. Grab the drivers from the link below.

DOWNLOAD: AMD Software Adrenalin 22.6.1 WHQL

AMD has recently released new chipset drivers for Ryzen processors on a wide range of platforms including A320, B350, X370, B450, X470, X399, A520, B550, X570, TRX40, and WRX80 that are running Windows 10 & 11. The new drivers include additional program support, display & airplane mode notifications, Ryzen 9 Mobile improvements, and various bug fixes. This latest release also sees the introduction of six new drivers including official USB 4.0 support, the complete changelog and download link can be found below.

Download: AMD Ryzen Chipset Drivers (4.06.10.651)

Valve, handlers of the world's most popular digital games store and manufacturers of the Steam Deck, have announced that they've been able to more than double weekly production of the handheld console. Due to the production "picking up", as Valve says it, the company expects to double the number of handhelds shipped each week. This is especially good news for users that were expecting to receive their devices in the 3Q - shipments for these particular orders will begin on June 30th.

Valve doesn't make it clear what exactly was bottlenecking production. Manufacturing and logistics have been showing signs of normalization following a couple of years with snag after snag due to the COVID-19 pandemic and the recent war in Ukraine. Overwhelming demand for graphics chips across the product spectrum may have pushed Valve to accept a smaller pie of AMD chips than the company would like to, and might be one of the reasons the company was forced to extend deliveries of pre-orders for the device.

AMD has recently released two new plugins for Unreal Engine 4 and 5 that help developers easily add support for FidelityFX Super Resolution (FSR) 2.0 to their games. The first FSR 2.0 games only started to arrive this month but with over 20 titles already announced to be receiving the technology we expect that this latest development will greatly increase that number. AMD joins NVIDIA in offering Unreal Engine plugins to simplify the implementation of their respective temporal upscaling solutions with AMD claiming that adding FSR 2.0 support only takes days for games that already use motion vectors. AMD has published developer guides on how to install and use the plugins on which can be found below.

AMD is preparing to update its mobile sector with the latest IP in the form of Zen4 CPU cores and RDNA3 graphics. According to Red Gaming Tech, we have specifications of upcoming processor families. First, we have AMD Dragon Range mobile processors representing a downsized Raphael design for laptops. Carrying Zen4 CPU cores and RDNA2 integrated graphics, these processors are meant to power high-performance laptops with up to 16 cores and 32 threads. Being a direct competitor to Intel's Alder Lake-HX, these processors also carry an interesting naming convention. The available SKUs include AMD Ryzen 5 7600HX, Ryzen 7 7800HX, Ryzen 9 7900HX, and Ryzen 9 7980HX design with a massive 16-core configuration. These CPUs are envisioned to run along with more powerful dedicated graphics, with clock speeds of 4.8-5.0+ GHz.

Next, we have AMD Phoenix processors, which take Dragon Range's design to a higher level thanks to the newer graphics IP. Having Zen4 cores, Phoenix processors carry upgraded RDNA3 graphics chips to provide a performance level similar to NVIDIA's GeForce RTX 3060 Max-Q SKU, all in one package. These APUs will come in four initial configurations: Ryzen 5 7600HS, Ryzen 7 7800HS, Ryzen 9 7900HS, and Ryzen 9 7980HS. While maxing out at eight cores, these APUs will compensate with additional GPU compute units with a modular chiplet design. AMD Phoenix is set to become AMD's first chiplet design launching for the laptop market, and we can expect more details as we approach the launch date.

An AMD Ryzen 7 5800X3D processor that's been de-lidded (has its integrated heatspreader or IHS removed), posts vastly better thermals, according to Madness7771 on Twitter, who succeeded in de-lidding their 5800X3D. The stock 5800X3D posts significantly higher CPU core temperatures than a regular 5800X, due to its 3D Vertical Cache (3DV Cache) chiplet design, in which heat from the CPU cores is conducted through structural silicon, to the surface of the die-stack, from where the STIM conducts heat onward to the IHS.

A de-lidded 5800X3D reveals the 8-core "Zen 3" 3DV chiplet (CCD) next to a blob of structural material in the vacant area meant for a second CCD. With the residual STIM cleaned off, Madness7771 used a Conductonaut TIM and a Noctua NH-D14 to cool the processor. Madness7771 also posted some before and after temperature numbers for the processor (using the same cooler). It sees a maximum temperature drop from 80 °C to 70 °C, and average temperature drop from 78 °C to 67 °C, tested with a Forza Horizon 5 gaming workload. They also note that the peak temperature of the 5800X3D no longer reaches over 90 °C. De-lidding processors with STIM is a very risky process, and will destroy your processor if not done right.

It would appear that we're slowly getting closer to the launch of AMD's AM5 platform, as ASRock just put up its first X670E motherboard on its website. The page still has very limited information and there's only a single picture of the motherboard, which is the same one that the company shared at Computex. However, we now get a few more details with regards to what to expect in terms of additional features. For starters, ASRock has gone for a 26-phase SPS Dr.MOS power design, which should be plenty even for the most avid overclocker. The board has a pair of PCIe 5.0 x16 slots that operate in dual x8 mode when both slots are used. In addition to this there are four M.2 slots, where ASRock has decided to call the CPU connected slot for Blazing, as it's PCIe 5.0, whereas the three PCIe 4.0 slots are using the Hyper name the company has used so far.

The board also has eight SATA ports, two Thunderbolt 4 ports, which apparently are USB4 certified as well and a header for a USB 3.2 Gen 2x2 (20 Gbps) case mounted port. Furthermore the board has five rear USB 3.2 Gen 2 (10 Gbps) USB-A ports around the back, plus three USB 3.2 Gen 1 (5 Gbps) ports and a further four via headers, as well as a single HDMI port of unknown version. ASRock has gone for an Intel Killer E3100G 2.5 Gbps Ethernet controller and an Intel Killer AX1675X WiFi 6E and Bluetooth card, with the combo having Killer DoubleShot Pro support. Finally audio is via a Realtek ALC4082 USB connected audio codec and an ESS Sabre 9218 DAC. Overall this looks like a pretty kitted out board without too much excessive bling and will hopefully be priced accordingly.

According to fresh benchmark numbers from someone on bilibili, Intel's Arc A380 cards perform even worse when paired with an AMD CPU compared to when paired with an Intel CPU. The card was tested using an AMD Ryzen 5 5600 on an ASUS TUF B550M motherboard paired with 16 GB of DDR4 3600 MHz memory. The Intel system it was tested against consisted of a Core i5-12400 on an ASUS TUF B660M motherboard with the same type of memory. Both test systems had resizable BAR support set to auto and above 4G decoding enabled. Windows 11 21H2 was also installed on both systems.

In every single game out of the 10 games tested, except League of Legends, the AMD system was behind the Intel system by anything from a mere one percent to as much as 15 percent. The worst performance disadvantage was in Forza Horizon 5 and Total War Three Kingdoms, both were 14 to 15 percent behind. The games that were tested, in order of the graph below are: League of Legends, Dota 2, Rainbow 6 Extraction, Watch Dogs Legions, Far Cry 6, Assassin's Creed Valhalla, Total War Three Kingdoms, Shadow of the Tomb Raider, CS:GO and Forza Horizon 5. For comparison, an NVIDIA GeForce GTX 1650 was also used, but only tested on the Intel based system and the Arc A380 only beat it on Total War Three Kingdoms, albeit by a seven percent margin. It appears Intel has a lot of work to do when it comes to its drivers, but at last right now, mixing Intel Arc graphics cards and AMD processors seems to be a bad idea.

Kontron, a leading global provider of IoT/Embedded Computing Technology (ECT), introduces the D3723-R Mini-ITX industrial motherboard at embedded world 2022, based on the AMD Ryzen Embedded R2000 line, which was developed in Germany and will also be produced there in the future. Compared to V/R1000 APUs (Accelerated Processing Units) from AMD, it delivers higher performance. Besides the lower price, the new model also convinces with Windows 11 support and a long life cycle of seven years. Like all Kontron motherboards with the denomination D3xxx or K3xxx, the D3723-R is produced in Germany.

Thanks to AMD Radeon Vega Graphics, the solution is particularly suitable for embedded graphics applications such as professional casino gaming systems, medical displays, thin clients and industrial PCs as well as for kiosk, infotainment or digital signage systems. Compared to the previous model based on the R1000 and V1000 series, the R2000 shows similar features to the V1000 SKUs. These include 16 PCIe lanes, up to four display ports and scalability of the available APU SKUs (R2312, R2314, R2514 and R2544) from 12 to 54 W (TDP - Thermal Design Power). Windows 11 support and an attractive price/performance ratio clearly speak for the R2000.

The Exascale supercomputing race is now well underway, as the US-based Frontier supercomputer got delivered, and now we wait to see the remaining systems join the race. Today, during 79th HPC User Forum at Oak Ridge National Laboratory (ORNL), Terri Quinn at Lawrence Livermore National Laboratory (LLNL) delivered a few insights into what El Capitan exascale machine will look like. And it seems like the new powerhouse will be based on AMD's Instinct MI300 APU. LLNL targets peak performance of over two exaFLOPs and a sustained performance of more than one exaFLOP, under 40 megawatts of power. This should require a very dense and efficient computing solution, just like the MI300 APU is.

As a reminder, the AMD Instinct MI300 is an APU that combines Zen 4 x86-64 CPU cores, CDNA3 compute-oriented graphics, large cache structures, and HBM memory used as DRAM on a single package. This is achieved using a multi-chip module design with 2.5D and 3D chiplet integration using Infinity architecture. The system will essentially utilize thousands of these APUs to become one large Linux cluster. It is slated for installation in 2023, with an operating lifespan from 2024 to 2030.

Today marks a year since gamers could try out AMD FidelityFX Super Resolution technology for themselves with our spatial upscaler - FSR 1. With the introduction of FSR 2, our temporal upscaling solution earlier this year, there are now over 110 games that support FSR. The rate of uptake has been very impressive - FSR is AMD's fastest adopted software gaming technology to date.

So it seems fitting that we should pick this anniversary day to share the source code for FSR 2, opening up the opportunity for every game developer to integrate FSR 2 if they wish, and add their title to the 24 games which have already announced support. As always, the source code is being made available via GPUOpen under the MIT license, and you can now find links to it on our dedicated FSR 2 page.

Back in January, Intel overturned an antitrust ruling by the EU and didn't have to pay the $1.2 billion fine, but it seems like the company isn't satisfied with getting out of having to pay a huge fine, but is now asking the EU to compensate the company for interest lost. As such, Intel has filed for "payment of compensation and consequential interest for the damage sustained because of the European Commissions refusal to pay Intel default interest" with the EU General Court. The sum of money Intel is asking for is based on the European Central Bank's refinancing rate and as the original fine was levied back in 2009, Intel claims they're owed more than half of the value of the fine.

Intel is also expecting further interest on the money, if the payment is late from the EU. It should be noted that the European Commission has already paid Intel €38 million in interest on the fine that was paid back in 2009, but Intel is clearly not happy and is asking for a much greater sum. However, the battle between the European Commission and Intel isn't over, as the Commission is working on appealing the ruling, so depending on the outcome of that appeal, Intel might have to pay back the fine to the EU. For those that don't remember the original reason for the antitrust fine, Intel was accused of giving rebates to certain partners and system integrators to make sure they didn't use AMD products in their systems, among other things.

YouTuber Matt Perks, known as DIY Perks on Google's video-sharing platform, has achieved the title of owning the world's first "PS5 Slim" console... by creating a custom watercooling system that's aimed at keeping the AMD-designed chip in check while rendering some of the most impressive games of this generation. Thanks to the custom watercooling unit, the PS5's usual 4-inch width was reduced to a mere inch - and due to improved operating temperatures, it's likely the hardware will see increased longevity. Barring any catastrophic leakage, of course.

Perks made use of a copper sheet to channel water over the PS5's APU, while also including thermal bridges that distributed the contained water throughout the consoles' SSD and power delivery subsystem. There is a secret to the consoles' slim profile, however, which should also answer one question you're holding on your mind: where, in that single inch frame, did he fit the pump and radiator for the embedded watercooling?

AMD today announced the Ryzen Embedded R2000 Series, second-generation mid-range system-on-chip (SoC) processors optimized for a wide range of industrial and robotics systems, machine vision, IoT and thin-client equipment. Ryzen Embedded R2000 Series doubles the core count and delivers a significant performance uplift compared to the prior generation, with the new R2514 model exhibiting up to 81 percent higher CPU and graphics performance than the comparable R1000 series processor. Performance-per-watt efficiency is also optimized using "Zen+" core architecture with AMD Radeon graphics for rich and versatile multimedia capabilities. Ryzen Embedded R2000 processors can power up to four independent displays in brilliant 4K resolution.

Embedded R2000 Series processors are scalable up to four "Zen+" CPU cores with eight threads, 2 MB of L2 cache and 4 MB of shared L3 cache. This gives embedded system designers great flexibility to scale performance and power efficiencies with a single processing platform. With support for up to 3200 MT/s DDR4 dual-channel memory and expanded I/O connectivity, the Ryzen Embedded R2000 Series processors deliver 33 percent higher memory bandwidth and up to 2X greater I/O connectivity compared to R1000 series processors.

Graphics card prices have been on a steady decline in the past few months, following their peak in May of last year when we saw double and triple pricing compared to the baseline MSRP value. According to the 3DCenter.org report, which tracks graphics card prices in Germany and Austria, we have information that AMD GPU prices have dipped below MSRP, while NVIDIA GPUs are very close to baseline listed prices. The report tracks Ethereum mining profitability and displays it in the yellow line. As the line is declining, so are the GPU prices. For AMD, the prices are now 8% below the 100% of MSRP. At 92%, consumers can find AMD GPUs at a slight discount. While AMD cards are slightly cheaper, NVIDIA GPUs are now at 102% of the MSRP, the lowest price point since the launch.

AMD is allegedly preparing an upgraded quad-core APU with Zen 4 and RDNA3 architectures for a next-generation Steam Deck device according to Moore's Law is Dead. The report claims that the chip is referred to as a "Van Gogh Successor" internally with a die size between 110 mm² and 150 mm² resulting in an increased production cost. The chip should feature 4 Zen 4 cores and 8 threads offering 25% - 35% higher performance per clock (PPC) with a maximum boost of 4 GHz. The RDNA3 graphics will include 8 Compute Units with significantly higher PPC compared to their RDNA2 counterparts which combined with the updated CPU could see a performance improvement up to 50%. These rumors have not been confirmed with any potential Steam Deck processor far from being announced or released anytime soon.

15th September, 2022, is when AMD will debut its Ryzen 7000 "Zen 4" desktop processors. The launch strategy of these chips looks similar to that of the Ryzen 5000 series. The company is preparing a lean launch lineup with just four SKUs—the Ryzen 9 7950X, the Ryzen 9 7900X, Ryzen 7 7800X, and the Ryzen 5 7600X. These SKUs succeed the 5950X, 5900X, 5800X, and 5600X, which made up the previous launch lineup. AMD in its recent interview with us, made it clear that 16-core/32-thread is the maximum core-count for the 7000 series, which would make the 7950X such a chip. The core-counts of the other SKUs are not known. All these models are built in the Socket AM5 package, featuring PCI-Express Gen 5 and DDR5 interfaces. But wait, there's more.

Although AMD led us to believe that it's going all-in with DDR5, we're hearing a spectacular rumor that suggests otherwise. Apparently, the company is designing Socket AM4 processors with "Zen 4" chiplets, possibly paired with the existing cIOD that supports PCI-Express Gen 4 and DDR4 interfaces. The rumor surfaced among sources lower down the supply-chain (resellers). It seems like AMD isn't convinced it could target the lower-end of the market with AM5 just yet, and isn't 100% confident that affordable DDR5 memory will come through in time. The "Zen 4" + AM4 processors would compete with Intel 600-series chipset motherboards that have DDR4 and PCIe Gen 4 connectivity. Trouble is, you can upgrade your Intel LGA1700 motherboard to one that has DDR5+PCIe Gen5 while keeping your processor; but you can't do so with an AM4 Zen 4 processor (you're stuck on AM4). AMD still gets to sell some processors, and those with AM4 platforms can rejoice.