Corsair DIY Marketing Director, George Makris recently confirmed in a recent video that DDR5 memory could "conceivably could run much hotter than DDR4" due to voltage regulation being moved to the memory modules from the motherboard. This was reiterated by Corsair Memory Product Manager, Matt Woithe, who notes that they are prepared to handle this increased heat in Corsair DDR5 modules using their Dual-path Heat Xchange (DHX) technology. The next generation of memory also mandates the inclusion of on-die EEC which while not confirmed by Corsair will also add to the power budget of the modules. Corsair is expecting to release their first DDR5 memory modules towards the end of this year which will coincide with the launch of Intel's 12th Generation Alder Lake processors. AMD fans will need to wait until 2022 with the launch of Zen 4 to take advantage of the new DDR5 memory modules.

ADATA Technology, a manufacturer of high-performance DRAM modules, NAND Flash products, mobile accessories, gaming products, electric power trains, and industrial solutions, today unveiled a host of new products at its "Xtreme Innovation" online product launch event. The online event showcased the latest products and solutions from both ADATA and XPG, including solid state drives, DRAM modules, memory cards, and PC components, and systems. The event was hosted by XPG's own Mera and coincides with ADATA's twentieth anniversary celebrations taking place throughout 2021.

ADATA also unveiled its next-generation DDR5 memory module, which sports frequencies of 8400 MT/s, up to 163% faster than DDR4. This performance boost will allow files and tools to load faster for seamless multitasking and enhanced creative productivity. What's more, the module will operate at 1.1 V for improved power efficiency and comes with capacities of up to 64 GB.

As a global memory leader with a long-term focus on industrial applications, TEAMGROUP has recognized the tremendous processing needs of the HPC market. To meet the demand for industrial memory can handle sustained high-speed data transmission with low latency, TEAMGROUP has utilized the in-house developed and patent-protected TRUST+ wide temperature technology to provide customers with high stability, durability and wide temperature industrial memory.

Applications for the first DDR5 UDIMM and SODIMM industrial wide temperature memory products include usage in edge computing, Internet of Vehicles, servers, AI, and embedded systems. In response to the stringent demands of efficient computing in the industrial control market, TEAMGROUP has been ready to launch the standard temperature DDR5 IST (TC: 0~85℃) memory series and the wide temperature DDR5 IWT (TA: -40~85℃) memory series. The latter features exclusive "Graphene-coated copper heatsink Technology" (U.S. Utility Patent US 11,051,392 B2), which helps maintain a case temperature (TC) of 85~86℃ under an ambient temperature (TA) of 85℃, ensuring low-latency high-speed computing. Without the heatsink, case temperatures (TC) can reach up to 89~90℃ or more, impairing the high performance of DDR5 and significantly reducing the life span of ICs.

The stay-at-home economy remains robust due to the ongoing COVID-19 pandemic, so the sales of gaming products such as game consoles and the demand for related components are being kept at a decent level, according to TrendForce's latest investigations. However, the values of cryptocurrencies have plummeted in the past two months because of active interventions from many governments, with the graphics DRAM market entering into a bearish turn in 3Q21 as a result. While graphics DRAM prices in the spot market will likely show the most severe fluctuations, contract prices of graphics DRAM are expected to increase by 10-15% QoQ in 3Q21 since DRAM suppliers still prioritize the production of server DRAM over other product categories, and the vast majority of graphics DRAM supply is still cornered by major purchasers.

It should be pointed out that, given the highly volatile nature of the graphics DRAM market, it is relatively normal for graphics DRAM prices to reverse course or undergo a more drastic fluctuation compared with other mainstream DRAM products. As such, should the cryptocurrency market remain bearish, and manufacturers of smartphones or PCs reduce their upcoming production volumes in light of the ongoing pandemic and component supply issues, graphics DRAM prices are unlikely to experience further increase in 4Q21. Instead, TrendForce expects prices in 4Q21 to largely hold flat compared to the third quarter.

Samsung Electronics today reported financial results for the second quarter ended June 30, 2021. Total consolidated revenue was KRW 63.67 trillion, a 20% increase from the previous year and a record for the second quarter. Operating profit increased 34% from the previous quarter to KRW 12.57 trillion as market conditions improved in the memory market, operations normalized at the Austin foundry fab, and as effective global supply chain management (SCM) helped maintain solid profitability for the finished product businesses.

The Semiconductor business saw a significant improvement in earnings as memory shipments exceeded previous guidance and price increases were higher than expected, while the Company strengthened its cost competitiveness. For the Display Panel Business, a one-off gain and an increase in overall prices boosted profits.

Intel's 12th Generation Core "Alder Lake-S" desktop processor will see a limited launch in 2021, according to an Igor's Lab report. This will be restricted to PC enthusiast-relevant SKUs bearing the -K and -KF brand extensions, and compatible Socket LGA1700 motherboards based only on the top Z690 (Z590-successor) chipset. The series will ramp up to other (locked) models, along with more affordable chipset models (B560-successor), only by Q1-2022, on the sidelines of the 2022 International CES. Sources tell Igor's Lab that these select few models could be launched between October 25 and November 19.

Intel is expected to make several technological leaps over AMD with "Alder Lake-S." To begin with, it has the first hybrid core technology that combines high-performance "Golden Cove" cores with high-efficiency "Gracemont" cores, in a heterogenous multi-core setup comparable to Arm big.LITTLE. Next up, it is expected to debut the PCI-Express Gen 5 I/O, and DDR5 memory support. While PCIe 5.0 GPUs remain under development, the first devices to take advantage of it are expected to be NVMe SSDs, benefiting from 128 Gbps bandwidth (Gen 5 x4). It is also learned that the next-gen motherboards will retain the current ATX 24-pin + EPS power interface, and Intel won't force adoption of ATX12VO. The new ATX12VO standard increases motherboard costs as it essentially transfers DC-to-DC switching components from the PSU to the motherboard (12 V to 5 V; 12 V to 3.3 V, etc), and adds output connectors.

AMD CEO Dr Lisa Su, in the company's Q2-2021 financial results call, confirmed that the company is on-track to launch the Zen 4 CPU microarchitecture and RDNA3 graphics architecture, in 2022. Zen 4 would herald the first major desktop platform change since the original Zen architecture, with the introduction of a new CPU socket, and support for DDR5 memory. The RDNA3 graphics architecture, meanwhile, is expected to nearly triple SIMD resources over the previous generation, and introduce even more fixed-function hardware for raytracing.

In the meantime, AMD is preparing a counter to Intel's 12th Gen Core "Alder Lake-S" processor, in the form of Zen 3 with 3D Vertical Cache, which is also being referred to as the Zen 3+ architecture. These processors feature additional last-level cache, and the company claims a 15% gaming performance uplift, which should help it close the gaming performance gap with Intel, and win on sheer core-count of its big cores. It remains to be seen if Zen 3+ remains on Socket AM4 or if it debuts AM5, as AMD will be under pressure to match "Alder Lake" in platform I/O, which includes DDR5. Dr Su also confirmed that AMD has started shipping the Instinct MI200 "Aldebaran" compute accelerator based on the CDNA2 architecture. AMD's first MCM GPU with two logic dies, "Aldebaran" takes the fight to NVIDIA's top A100 series compute accelerators, and has already scored wins with ongoing HPC/supercomputing projects.

SK hynix Inc. today announced financial results for its second quarter 2021 ended on June 30, 2021. The consolidated revenue of the second quarter 2021 was 10.322 trillion won, while the operating profit amounted to 2.695 trillion won and the net income 1.988 trillion won. Operating margin for the quarter was 26% and net margin was 19%.

It was the first time in three years that SK hynix recorded the quarterly revenue of more than 10 trillion won as the memory market condition, which began to recover earlier this year, continued to improve in the second quarter. The company last logged more than 10 trillion won in the third quarter of 2018 when the memory market was booming.

Qualification samples (QS) of Intel's upcoming Core i9-12900K "Alder Lake-S" desktop processors just hit the black market for the equivalent of roughly USD $1,064 to $1,157 (6,500 to 7,500 RMB), in China. The processor maxes out the 10 nm silicon, offering 8 "Golden Cove" P-cores, and 8 "Gracemont" E-cores, along with 30 MB of L3 cache, a dual-channel DDR5 memory interface, in a hybrid processor setup. You can bag yourself this QS, but you'll need to find a compatible motherboard. "Alder Lake-S" debuts the new LGA1700 socket, Intel's first major change in the physical dimensions of its mainstream-desktop CPU socket since 2009, mandating a cooler update.

Xilinx, Inc., the leader in adaptive computing, today introduced the Versal HBM adaptive compute acceleration platform (ACAP), the newest series in the Versal portfolio. The Versal HBM series enables the convergence of fast memory, secure connectivity, and adaptable compute in a single platform. Versal HBM ACAPs integrate the most advanced HBM2E DRAM, providing 820 GB/s of throughput and 32 GB of capacity for 8X more memory bandwidth and 63% lower power than DDR5 implementations. The Versal HBM series is architected to keep up with the higher memory needs of the most compute intensive, memory bound applications for data center, wired networking, test and measurement, and aerospace and defense.

"Many real-time, high-performance applications are critically bottlenecked by memory bandwidth and operate at the edge of their power and thermal limits," said Sumit Shah, senior director, Product Management and Marketing at Xilinx. "The Versal HBM series eliminates those bottlenecks to provide our customers with a solution that delivers significantly higher performance and reduced system power, latency, form factor, and total cost of ownership for data center and network operators."

If you even came across a PC system that had a problem with its Ram, there are high chances that you have used PassMark Software MemTest86 software for testing and revealing DRAM errors. The software uses a chain of algorithms, including SIMD and row hammer tests, to try to test if the memory is in a good shape or it has some problems. PC builders have used the software for years to detect and isolate any potential Ram issues that occurred. Today, makers of MemTest86, PassMark Software, previewed initial support for DDR5 memory in their internal software builds. That means that by the time DDR5 memory hits the consumer market, we will have software for testing any possible defective Ram.

The Intel Core i9-12900K is the companies upcoming flagship 12th Generation Alder Lake-S processor featuring a hybrid design with 8 high-performance cores and 8 high-efficiency cores. The qualification sample for the processor reportedly features a base clock of 3.9 GHz and a boost clock of 5.3 GHz which is less than initial rumors which claimed boost speeds could reach 5.5 GHz. The processor achieved a multi-core score of 11300 points in Cinebench R20 which is 800 points higher than AMD's flagship Ryzen 9 5950X. Intel's 12th Generation Alder Lake-S processors will be manufactured on the 10 nm Enhanced SuperFin node and will include support for PCIe 5.0 and DDR5. Intel is expected to announce the processors in Q3 2021 for a Q4 2021 release which will position them against AMD's upcoming V-Cache technology expected to arrive in early 2022.

As third quarters have typically been peak seasons for the production of various end-products, the sufficiency ratio of DRAM is expected to undergo a further decrease in 3Q21, according to TrendForce's latest investigations. However, DRAM buyers are now carrying a relatively high DRAM inventory due to their amplified purchases of electronic components in 1H21. The QoQ increase in DRAM contract prices are hence expected to slightly narrow from 18-23% in 2Q21 to 3-8% in 3Q21. Looking ahead to 4Q21, TrendForce believes that DRAM supply will continue to rise, thereby leading to either a further narrowing of price hikes or pressure constraining the potential price hike of DRAM products.

From the perspective of demand, the stay-at-home economy has resulted in persistently high demand for notebook computers. Although discrepancies still exist among notebook brands' inventory levels of various components, these brands are still making an aggressive attempt at maximizing their production of notebooks. However, as most of these brands are still carrying about 8-10 weeks' worth of PC DRAM inventory (which is relatively high), PC DRAM purchasing strategies from the buyers' side will therefore remain relatively conservative. From the perspective of supply, due to the rising demand for server DRAM, the production capacity allocated to PC DRAM is still in a severe supply crunch. Hence, DRAM suppliers are firm in their attitudes to raise PC DRAM quotes, and TrendForce expects the price negotiations between PC DRAM buyers and suppliers in 3Q21 to become both lengthier and more difficult as a result, with contract prices likely finalized at the end of July. Even so, what is now certain is that both sides have reached some level of understanding regarding the ongoing price hike of PC DRAM products. TrendForce forecasts a 3-8% increase in PC DRAM contract prices for 3Q21.

Intel is slowly preparing to launch its 4th generation of Xeon Scalable processors, with it being the first arrival of the 10 nm designs to the server market. Codenamed Sapphire Rapids, these processors are expected to bring much-needed IPC and platform improvements so Intel can keep up with AMD's EPYC processors. Today, we are getting some first performance results as well as some information about a specific 20 core, 40 threaded Intel Xeon Sapphire Rapids SKU. In a leaked Geekbench 4 submission, the latest Xeon processor was tested and we get to see even more details about the processor.

Featuring 20 cores and 40 threads, the CPU has a base clock speed of 1.5 GHz. It features as much as 40 MB of L2 cache and 75 MB of L3 cache spread across the die. The system was tested on an Intel reference platform called VulcanCity, with this configuration carrying 32 GB of DDR5 memory. The reported results of the benchmarks that this processor went through are not very impressive. These numbers are easily beaten by AMD Ryzen 9 5950X, however, this is only an engineering sample with low clock speed and it could be possible that Geekbench is not optimized to run on this processor. You can check out some of the performance numbers below, and see the submitted results here.

For gamers who are ready to go to the next level, ZADAK, a leading provider of enthusiast PC gaming components and innovative water cooling solutions under Apacer Technology announces the next step forward in gaming DRAM. The newest member of its high end SPARK lineup is a DDR5 RGB illuminated gaming DRAM module which is available in 16 GB and 32 GB capacities. Gamers who demand t he fastest clock speeds will be able to choose from modules ranging from 4800 MHz all the way up to 7200 MHz.

DDR5 also features another important upgrade: power management is no longer handled by the motherboard, but by a PMIC (power management integrated circuit) on the module itself. While DDR4 modules consume 1.2 V, DDR5 modules only require 1.1 V. It sounds like a small difference, but over hours and days of gaming, it adds up to significant power savings. The PMIC also gives overclockers more options when it comes to tweaking settings. ns when it comes to tweaking settings.

Intel's Lisa Spelman, corporate vice president and general manager of the Xeon and Memory Group at Intel Corporation, has yesterday published a blog post talking about Intel's next-generation server platform codenamed Sapphire Rapids. The SPR platform is Intel's biggest step-up in the server processor space, and it is the exact CPU that will power the Aurora exascale supercomputer. Besides improvements to the CPU microarchitecture, the platform itself is bringing many benefits with it as well. It will use the latest industry protocols like DDR5 and PCIe 5.0. This is making a strong combination designed even for exascale supercomputers to be powered by this processor. However, the availability of this CPU was a bit of a mystery until yesterday. Below, you can see the quote from Ms. Lisa Spelman about the availability of said processors.

Lisa SpelmanDemand for Sapphire Rapids continues to grow as customers learn more about the benefits of the platform. Given the breadth of enhancements in Sapphire Rapids, we are incorporating additional validation time prior to the production release, which will streamline the deployment process for our customers and partners. Based on this, we now expect Sapphire Rapids to be in production in the first quarter of 2022, with ramp beginning in the second quarter of 2022.

Intel today, in its 2021 International Supercomputing Conference presentation, revealed that certain next-generation Xeon "Sapphire Rapids" SKUs come with on-package high-bandwidth memory (HBM). Given the context of its presentation, these could be special SKUs designed for high-density HPC setups, in which the processor package includes certain amount of "PMEM" (package memory), besides the processor's 8-channel DDR5 memory interface.

The size of the HBM PMEM, and its position in the memory hierarchy, were detailed, too. Given its high-density applications, PMEM may not serve as a victim cache for the processor, but rather be capable of serving as main memory, with none of the DDR5 DRAM channels populated with DIMMs. On machines with DIMMs, the PMEM will serve as a victim cache for the processor's on-die last-level cache, accelerating the memory I/O. "The next-generation of Intel Xeon Scalable processors (code-named "Sapphire Rapids) will offer integrated High Bandwidth Memory (HBM), providing a dramatic boost in memory bandwidth and a significant performance improvement for HPC applications that operate memory bandwidth-sensitive workloads. Users can power through workloads using just High Bandwidth Memory or in combination with DDR5," says Intel.

At the 2021 International Supercomputing Conference (ISC) Intel is showcasing how the company is extending its lead in high performance computing (HPC) with a range of technology disclosures, partnerships and customer adoptions. Intel processors are the most widely deployed compute architecture in the world's supercomputers, enabling global medical discoveries and scientific breakthroughs. Intel is announcing advances in its Xeon processor for HPC and AI as well as innovations in memory, software, exascale-class storage, and networking technologies for a range of HPC use cases.

"To maximize HPC performance we must leverage all the computer resources and technology advancements available to us," said Trish Damkroger, vice president and general manager of High Performance Computing at Intel. "Intel is the driving force behind the industry's move toward exascale computing, and the advancements we're delivering with our CPUs, XPUs, oneAPI Toolkits, exascale-class DAOS storage, and high-speed networking are pushing us closer toward that realization."

Marvell today introduced its new OCTEON 10 DPU designed to accelerate and process a broad spectrum of security, networking, and storage workloads required by demanding 5G, cloud, carrier and enterprise datacenter applications. With the increasing shift of workloads to the cloud, complex security requirements and the growing number of edge devices the demand for data centric compute has accelerated. By combining compute with best-in-class hardware accelerators, Marvell's OCTEON 10 DPU offers a significant TCO advantage and features numerous industry firsts. Delivering three times the performance and 50 percent lower power compared to previous generations of OCTEON, the newly announced solution is the first to be designed on a 5 nm process to incorporate Arm Neoverse N2 cores, as well as the first inline artificial intelligence/machine learning (AI/ML) hardware acceleration, the first integrated 1 terabit switch and the first to incorporate vector packet processing (VPP) hardware accelerators.

"To meet and exceed the growing data processing requirements for network, storage, and security workloads, Marvell focused on significant DPU innovations across compute, hardware accelerators, and high speed I/O," said John Sakamoto, vice president of Marvell's Infrastructure Processors Business Unit. "The OCTEON 10 brings compute leadership, supports networking and security workloads exceeding 400G, and incorporates leading edge I/O including DDR5 and PCIe 5.0."

The release notes for the latest version of famous system utility HWiNFO have spilled the beans on an update to Intel's XMP. Currently at version 2.0, XMP (eXtreme Memory Profile) is a technology that allows the system-level BIOS to run DDR memory at speeds higher than those allowed by JEDEC, the governing specifications body for all things memory. It extends the performance profiles usually made available via SPD (Serial Presence Detect). An update to Intel's XMP (XMP 3.0) for DDR5 memory is referred to in the release notes for version 7.05 of the software. Not much more to look at here - it remains to be seen what changes are actually a part of XMP 3.0, and if any increased utility will be added to these profiles. Remember, however, that nor Intel nor AMD (via its A-XMP implementation) enable warranty coverage should XMP be enabled in your system.

Other relevant updates for the application include advanced early support for Zen 4 systems (looking at you, AMD), as well as per-core temperature monitoring for Zen-based CPUs. There are other additions to the supported hardware, which you can find in the screenshot below.

AMD's next generation Ryzen Embedded V3000 system-on-chips aren't simply "Cezanne" dies sitting on BGA packages, but rather based on a brand new silicon, according to Patrick Schur, a reliable source with leaks. The die will be built on the more advanced 6 nm silicon fabrication node, whilst still being based on the current "Zen 3" microarchitecture. There are several things that set it apart from the APU silicon of the current-generation, making it more relevant for the applications the Ryzen Embedded processor family is originally built for.

Built in the FP7r2 BGA package, the V3000 silicon features an 8-core/16-thread CPU based on the "Zen 3" microarchitecture. There are also an integrated GPU based on the RDNA2 graphics architecture, with up to 12 CUs, a dual-channel DDR5 memory interface, a 20-lane PCI-Express 4.0 root complex, with up to 8 lanes put out for PEG; two USB4 ports, and two 10 GbE PHYs. AMD could design at least three SKUs based on this silicon, spanning TDP bands of 15-30 W and 35-54 W.

At the end of 2020, TEAMGROUP reached a cooperation agreement with top DRAM wafer manufacturers and started working on DDR5 technology. Since then, TEAMGROUP has dedicated to the research and development of DDR5 modules, collaborating with various major motherboard manufacturers to ensure that each R&D stage undergoes comprehensive testing and to deliver products of the highest quality that the industry has ever seen. TEAMGROUP is leading the industry today as we announce our official launch of the world's first DDR5 memory module for desktops, the TEAMGROUP ELITE U-DIMM DDR5, which is estimated to be available on major EC platforms for consumers worldwide by the end of June and the beginning of July.

The initial launch of TEAMGROUP ELITE DDR5 memory module will support 16GBx2 of capacity at a frequency of 4800 MHz, with a voltage of 1.1 V CL40-40-40-77, which complies with the standard specifications defined by the JEDEC association. Compared to the maximum 3200 MHz standard frequency in the DDR4 generation, the DDR5 is able to increase the speed to up to 50%. The low 1.1 V voltage is also more energy efficient than its previous generation; to ensure minimum noise interference for the memory module, the power management is transferred from the motherboard onto the memory with an additional power management IC (PMIC) for more effective system load control. The most incredible feature of ELITE DDR5 is doubling the 16 banks of DDR4 to those of 32 in DDR5 to improve the IC structure, providing double access availability. An on-die ECC (error correction code) included in the DRAM IC is also available for self-recovery of the DRAM unit, ensuring that DRAM systems with DDR5 can obtain higher levels of stability.

Innodisk has officially announced the release of its industrial-grade DDR5 DRAM modules. The new standard touts a host of crucial performance improvements and power savings over its predecessor, and anticipation has been high since the official announcement of the standard. Boasting a bucketload of benefits, including the obligatory speed and storage increases, DDR5 will eventually take its place as the memory option of choice.

The JESD79-5 DDR5 SDRAM specification signaled the transition to DDR5, with significant improvements in capacity, speed, voltage, and ECC functions. The DDR5 specification details up to four times as much capacity per IC, raising the maximum achievable per die capacity to 64Gb and bringing the maximum potential capacity for a single DDR5 DIMM to 128 GB.

The latest Status of the Memory Industry report from June 2021 published by Yole Developments shows the memory market continues to grow and is expected to exceed 200 billion USD in 2026. The introduction of DDR5 memory will be extremely quick with shipments expected to exceed that of DDR4 in 2023 and will account for over 90% of bits shipped by 2026. The major DRAM manufacturers have all finalized their mainstream DDR5 designs with shipments from several having already started. The report also predicts an increase in the amount of DRAM used in all product categories which will contribute to strong revenue growth for memory manufacturers.

Tachyum Inc. today announced that it has taken delivery of an IO motherboard for its Prodigy Universal Processor hardware emulator from manufacturing. This provides the company with a complete system prototype integrating CPU, memory, PCI Express, networking and BMC management subsystems when connected to the previously announced field-programmable gate array (FPGA) emulation system board.

The Tachyum Prodigy FPGA DDR-IO Board connects to the Prodigy FPGA CPU Board to provide memory and IO connectivity for the FPGA-based CPU tiles. The fully functional Prodigy emulation system is now ready for further build out, including Linux boot and incorporation of additional test chips. It is available to customers to perform early testing and software development prior to a full four-socket reference design motherboard, which is expected to be available Q4 2021.