AMD's upcoming large post-Navi graphics chip, codenamed "Arcturus," will debut as "Radeon Instinct MI100", which is an AI-ML accelerator under the Radeon Instinct brand, which AMD calls "Server Accelerators." TechPowerUp accessed its BIOS, which is now up on our VGA BIOS database. The card goes with the device ID "0x1002 0x738C," which confirms "AMD" and "Arcturus,". The BIOS also confirms that memory size is at a massive 32 GB HBM2, clocked at 1000 MHz real (possibly 1 TB/s bandwidth, if memory bus width is 4096-bit).

Both Samsung (KHA884901X) and Hynix memory (H5VR64ESA8H) is supported, which is an important capability for AMD's supply chain. From the ID string "MI100 D34303 A1 XL 200W 32GB 1000m" we can derive that the TDP limit is set to a surprisingly low 200 W, especially considering this is a 128 CU / 8,192 shader count design. Vega 64 and Radeon Instinct MI60 for comparison have around 300 W power budget with 4,096 shaders, 5700 XT has 225 W with 2560 shaders, so either AMD achieved some monumental efficiency improvements with Arcturus or the whole design is intentionally running constrained, so that AMD doesn't reveal their hand to these partners, doing early testing of the card.

Samsung Electronics, the world leader in advanced memory technology, today announced the market launch of 'Flashbolt', its third-generation High Bandwidth Memory 2E (HBM2E). The new 16-gigabyte (GB) HBM2E is uniquely suited to maximize high performance computing (HPC) systems and help system manufacturers to advance their supercomputers, AI-driven data analytics and state-of-the-art graphics systems in a timely manner.

"With the introduction of the highest performing DRAM available today, we are taking a critical step to enhance our role as the leading innovator in the fast-growing premium memory market," said Cheol Choi, executive vice president of Memory Sales & Marketing at Samsung Electronics. "Samsung will continue to deliver on its commitment to bring truly differentiated solutions as we reinforce our edge in the global memory marketplace."

NVIDIA updated its compute accelerator product stack with the new Tesla V100s. Available only in the PCIe add-in card (AIC) form-factor for now, the V100s is positioned above the V100 PCIe, and is equipped with faster memory, besides a few silicon-level changes (possibly higher clock-speeds), to facilitate significant increases in throughput. To begin with, the V100s is equipped with 32 GB of HBM2 memory across a 4096-bit memory interface, with higher 553 MHz (1106 MHz effective) memory clock, compared to the 876 MHz memory clock of the V100. This yields a memory bandwidth of roughly 1,134 GB/s compared to 900 GB/s of the V100 PCIe.

NVIDIA did not detail changes to the GPU's core clock-speed, but mentioned the performance throughput numbers on offer: 8.2 TFLOP/s double-precision floating-point performance versus 7 TFLOP/s on the original V100 PCIe; 16.4 TFLOP/s single-precision compared to 14 TFLOP/s on the V100 PCIe; and 130 TFLOP/s deep-learning ops versus 112 TFLOP/s on the V100 PCIe. Company-rated power figures remain unchanged at 250 W typical board power. The company didn't reveal pricing.

Global supercomputer leader Cray, a Hewlett Packard Enterprise company, and leading Japanese information and communication technology company Fujitsu, today announced a partnership to offer high performance technologies for the Exascale Era. Under the alliance agreement, Cray is developing the first-ever commercial supercomputer powered by the Fujitsu A64FX Arm -based processor with high-memory bandwidth (HBM) and supported on the proven Cray CS500 supercomputer architecture and programming environment. Initial customers include Los Alamos National Laboratory, Oak Ridge National Laboratory, RIKEN Center for Computational Science, Stony Brook University, and University of Bristol. As part of this new partnership, Cray and Fujitsu will explore engineering collaboration, co-development, and joint go-to-market to meet customer demand in the supercomputing space.

"Our partnership with Fujitsu means customers now have a broader choice of processor technology to address their pressing computational needs," said Fred Kohout, senior vice president and CMO at Cray, a Hewlett Packard Enterprise company. "We are delivering the development-to-deployment experience customers have come to expect from Cray, including exploratory development to the Cray Programming Environment (CPE) for Arm processors to optimize performance and scalability with additional support for Scalable Vector Extensions and high bandwidth memory."

GLOBALFOUNDRIES (GF ) and SiFive, Inc. announced today at GLOBALFOUNDRIES Technology Conference (GTC) in Taiwan that they are working to extend high DRAM performance levels with High Bandwidth Memory (HBM2E) on GF's recently announced 12LP+ FinFET solution, with 2.5D packaging design services to enable fast time-to-market for Artificial Intelligence (AI) applications.

In order to achieve the capacity and bandwidth for data-intensive AI training applications, system designers are challenged with squeezing more bandwidth into a smaller area while maintaining a reasonable power profile. SiFive's customizable high bandwidth memory interface on GF's 12LP platform and 12LP+ solution will enable easy integration of high bandwidth memory into a single System-on-Chip (SoC) solutions to deliver fast, power-efficient data processing for AI applications in the computing and wired infrastructure markets.

SK hynix Inc. today announced financial results for its third quarter 2019 ended on September 30, 2019. The consolidated third quarter revenue was 6.84 trillion won while the operating profit amounted to 473 billion won and the net income 495 billion won. Operating margin and net margin for the quarter was 7%.

The revenue in the third quarter increased by 6% quarter-over-quarter (QoQ) as demand began to pick up. However, the operating profit fell by 26% QoQ as DRAM unit cost reduction was not enough to offset the price drop. DRAM bit shipments increased by 23% QoQ as the Company actively responded to the new products in the mobile market and purchases from some data center customers also increased. DRAM prices remained weak during the quarter, leading to a 16% drop in the average selling price, with the decline smaller than the previous quarter.

Samsung Electronics Co., Ltd., a world leader in advanced semiconductor technology, today announced that it has developed the industry's first 12-layer 3D-TSV (Through Silicon Via) technology. Samsung's new innovation is considered one of the most challenging packaging technologies for mass production of high-performance chips, as it requires pinpoint accuracy to vertically interconnect 12 DRAM chips through a three-dimensional configuration of more than 60,000 TSV holes, each of which is one-twentieth the thickness of a single strand of human hair.

The thickness of the package (720 µm) remains the same as current 8-layer High Bandwidth Memory-2 (HBM2) products, which is a substantial advancement in component design. This will help customers release next-generation, high-capacity products with higher performance capacity without having to change their system configuration designs. In addition, the 3D packaging technology also features a shorter data transmission time between chips than the currently existing wire bonding technology, resulting in significantly faster speed and lower power consumption.

The third known implementation of AMD's "Navi" generation of GPUs with RDNA architecture is codenamed "Navi 14." This 7 nm chip is expected to be a cut-down, mainstream chip designed to compete with a spectrum of NVIDIA GeForce GTX 16-series SKUs, according to a 3DCenter.org report. The same report sheds more light on the larger "Navi 12" GPU that could power faster SKUs competing with the likes of the GeForce RTX 2080 and RTX 2080 Super. The two follow the July launch of the architecture debut with "Navi 10." There doesn't appear to be any guiding logic behind the numerical portion of the GPU codename. When launched, the pecking order of the three Navi GPUs will be "Navi 12," followed by "Navi 10," and "Navi 14."

"Navi 14" is expected to be the smallest of the three, with an estimated 170 mm² die-area, about 24 RDNA compute units (1,536 stream processors), and expected to feature a 128-bit wide GDDR6 memory interface. It will be interesting to see how AMD carves out an SKU that can compete with the GTX 1660 Ti, which has 6 GB of 192-bit GDDR6 memory. The company would have to wait for 16 Gbit (2 GB) GDDR6 memory chips, or piggy-back eight 8 Gbit chips to achieve 8 GB, or risk falling short of recommended system requirements of several games at 1080p, if it packs just 4 GB of memory.

Intel today announced shipments of new Intel Stratix 10 DX field programmable gate arrays (FPGA). The new FPGAs are designed to support Intel Ultra Path Interconnect (Intel UPI), PCI-Express (PCIe) Gen4 x16 and a new controller for Intel Optane technology to provide flexible, high-performance acceleration. VMware is one of many early access program participants.

"Intel Stratix 10 DX FPGAs are the first FPGAs designed to combine key features that dramatically boost acceleration of workloads in the cloud and enterprise when used with Intel's portfolio of data center solutions. No other FPGA currently offers this combination of features for server designs based on future select Intel Xeon Scalable processors," said David Moore, Intel vice president and general manager, FPGA and Power Products, Network and Custom Logic Group.

"Control" by Remedy is the season's hottest AAA release, not just because it's an above-average story-driven action RPG, but also because it's an eye candy-shop. With the ability to use NVIDIA RTX real-time raytracing across a multitude of features, the game is particularly heavy on graphics hardware. Tweaktown tested the game's stability at extremely high display resolutions, including 8K, and found that the game can use up to 18.5 GB of video memory, when running in DirectX 12 with RTX enabled. There's only one client-segment graphics card capable of that much memory, the $2,499 NVIDIA TITAN RTX, which ships with 24 GB of GDDR6 memory. Its nearest client-segment neighbor is the AMD Radeon VII, but it only packs 16 GB of HBM2.

When a game needs more video memory than your graphics card has, Windows has an elaborate memory management system that sheds some of that memory onto your system's main memory, and the swap file progressively (at reduced performance, of course). Video memory usage drops like a rock between 8K and 4K UHD (which is 1/4th the pixels as 8K). With all RTX features enabled and other settings maxed out, "Control" only uses 8.1 GB of video memory. What this also means is that video cards with just 8 GB of memory are beginning fall short of what it takes to game at 4K. The $699 GeForce RTX 2080 Super only has 8 GB. The RTX 2080 Ti, with its 11 GB of memory has plenty of headroom and muscle. Find other interesting observations in the source link below.

AMD has reportedly discontinued production of its flagship Radeon VII graphics card. According to a Cowcotland report, AMD no longer finds it viable to produce and sell the Radeon VII at prices competitive to NVIDIA's RTX 2080, especially when its latest Radeon RX 5700 XT performs within 5-12 percent of the Radeon VII at less than half its price. AMD probably expects custom-design RX 5700 XT cards to narrow the gap even more. The RX 5700 XT has a much lesser BOM (bill of materials) cost compared to the Radeon VII, due to the simplicity of its ASIC, a conventional GDDR6 memory setup, and far lighter electrical requirements.

In stark contrast to the RX 5700 XT, the Radeon VII is based on a complex MCM (multi-chip module) that has not just a 7 nm GPU die, but also four 32 Gbit HBM2 stacks, and a silicon interposer. It also has much steeper VRM requirements. Making matters worse is the now-obsolete "Vega" architecture it's based on, which loses big time against "Navi" at performance/Watt. The future of AMD's high-end VGA lineup is uncertain. Looking at the way "Navi" comes close to performance/Watt parity with NVIDIA on the RX 5700, AMD may be tempted to design a larger GPU die based on "Navi," with a conventional GDDR6-based memory sub-system, to take another swing at NVIDIA's high-end.

AMD today announced the Radeon Pro Vega II and Pro Vega II Duo graphics cards, making their debut with the new Apple Mac Pro workstation. Based on an enhanced 32 GB variant of the 7 nm "Vega 20" MCM, the Radeon Pro Vega II maxes out its GPU silicon, with 4,096 stream processors, 1.70 GHz peak engine clock, 32 GB of 4096-bit HBM2 memory, and 1 TB/s of memory bandwidth. The card features both PCI-Express 3.0 x16 and InfinityFabric interfaces. As its name suggests, the Pro Vega II is designed for professional workloads, and comes with certifications for nearly all professional content creation applications.

The Radeon Pro Vega II Duo is the first dual-GPU graphics card from AMD in ages. Purpose built for the Mac Pro (and available on the Apple workstation only), this card puts two fully unlocked "Vega 20" MCMs with 32 GB HBM2 memory each on a single PCB. The card uses a bridge chip to connect the two GPUs to the system bus, but in addition, has an 84.5 GB/s InfinityFabric link running between the two GPUs, for rapid memory access, GPU and memory virtualization, and interoperability between the two GPUs, bypassing the host system bus. In addition to certifications for every conceivable content creation suite for the MacOS platform, AMD dropped in heavy optimization for the Metal 3D graphics API. For now the two graphics cards are only available as options for the Apple Mac Pro. The single-GPU Pro Vega II may see standalone product availability later this year, but the Pro Vega II Duo will remain a Mac Pro-exclusive.

Eliovp, who describes himself on GitHub as a Belgian [crypto] mining enthusiast, created what could go down as the best thing that happened to AMD Radeon users all decade. The AMD Memory Tweak Tool is a Windows and Linux based GUI utility that lets you not just overclock AMD Radeon graphics card memory on the fly, but also lets you tweak its memory timings. Most timings apply live, while your machine is running within Windows/Linux GUI, some require memory retraining via a reboot, which means they can't be changed at this time, because rebooting reverts the timings to default. The author is trying to figure out a way to run memory training at runtime, which would let you change those timings, too, in the future. While you're at it, the tool also lets you play with GPU core frequency and fan-control.

The AMD Memory Tweak tool supports both Windows and Linux (GUI), and works with all recent AMD Radeon GPUs with GDDR5 and HBM2 memory types. It requires Radeon Software Adrenalin 19.4.1 or later in case of Windows, or amdgpu-pro ROCM to be actively handling the GPU in case of Linux. The Linux version further has some dependencies, such as pciutils-dev, libpci-dev, build-essential, and git. The source-code for the utility is up on GitHub for you to inspect and test.

DOWNLOAD: AMD Memory Tweak Tool by Eliovp

EK Water Blocks, the leading premium computer liquid cooling gear manufacturer, is releasing EK-Vector Radeon VII water blocks that are compatible with reference design AMD Radeon VII graphics cards. This kind of efficient cooling will allow your high-end graphics card to reach higher boost clocks, thus providing more overclocking headroom and more performance during gaming or other GPU intense tasks.

This water block directly cools the GPU, 16GB of HBM2 memory, and VRM (voltage regulation module) as cooling liquid is channeled directly over these critical areas. These newly developed water blocks feature a redesigned cooling engine that has a larger footprint compared to the previous generation of EK Full Cover water blocks. This results in a larger surface area for heat transfer which increases the thermal performance of these water blocks.

Samsung Electronics Co., Ltd., the world leader in advanced semiconductor technology, today announced its new High Bandwidth Memory (HBM2E) product at NVIDIA's GPU Technology Conference (GTC) to deliver the highest DRAM performance levels for use in next-generation supercomputers, graphics systems, and artificial intelligence (AI).

The new solution, Flashbolt , is the industry's first HBM2E to deliver a 3.2 gigabits-per-second (Gbps) data transfer speed per pin, which is 33 percent faster than the previous-generation HBM2. Flashbolt has a density of 16Gb per die, double the capacity of the previous generation. With these improvements, a single Samsung HBM2E package will offer a 410 gigabytes-per-second (GBps) data bandwidth and 16 GB of memory.

GIGABYTE, the world's leading premium gaming hardware manufacturer, today announced the launch of Radeon VII HBM2 16G, the latest Radeon VII graphics cards built upon the world's first 7nm gaming GPU. Based on the enhanced second-generation AMD 'Vega' architecture, Radeon VII is equipped with 3840 stream processors and 16GB of ultra-fast HBM2 memory (second-generation High-Bandwidth Memory). It is designed to deliver exceptional performance and amazing experiences for the latest AAA, e-sports and Virtual Reality (VR) titles, demanding 3D rendering and video editing applications, and next-generation compute workloads.

According to the AMD official website, the Radeon VII graphics card enables high-performance gaming and ultra-high quality visuals. Ground-breaking 1 TB/s memory bandwidth and a 4,096-bit memory interface paves the way for ultra-high resolution textures, hyper-realistic settings and life-like characters. With the high speeds of today's graphics cards, framerates often exceed the monitor refresh rate, causing stuttering and tearing.

Amidst breaking news about PowerColor designing what could be the first custom-design Radeon VII graphics card, the company also unveiled its reference-design Radeon VII card, the AXVII 16GBHBM2-3DH. This card sticks to AMD's reference design clock speeds of up to 1750 MHz boost, and up to 1800 MHz "peak" clock speeds, with the memory ticking at 1000 MHz. It implements the slick, solid-aluminium triple-fan stock cooling solution AMD designed for this card. Drawing power from a pair of 8-pin PCIe power connectors, the card puts out three DisplayPort 1.4 and an HDMI 2.0b. Based on the 7 nm "Vega 20" silicon, the Radeon VII packs 3,840 stream processors, 240 TMUs, 64 ROPs, and a 4096-bit wide HBM2 memory interface, holding 16 GB of memory. It's likely that PowerColor will sell this card close to AMD's MSRP for this card, USD $699.

Sapphire is among the first AMD add-in-board (AIB) partners to launch a Radeon VII graphics card. The card sticks to AMD reference board design, which the company unveiled at its CES 2019 keynote. Interestingly, its GPU engine boost frequency is set at 1750 MHz, which is less than the 1800 MHz boost frequency figure that was mentioned by the company earlier. Could it be that AMD is reserving 1800 MHz for cards directly sold on AMD.com? The memory frequency is unchanged at 1000 MHz, which works out to an HBM2 memory bandwidth of 1 TB/s. Sapphire's box for this card lists out key specifications upfront, and also features the Vega II logo. It's likely that the card will be sold at the baseline price of $699, given that there are no other variants of this card, not even custom-design.

AMD pulled off a surprise at its CES 2019 keynote address, with the announcement of the Radeon VII client-segment graphics card targeted at gamers. We went hands-on with the card earlier this week. The company revealed a few more technical details of the card in its press-deck for the card. To begin with, the company talks about the immediate dividends of switching from 14 nm to 7 nm, with a reduction in die-size from 495 mm² on the "Vega 10" silicon to 331 mm² on the new "Vega 20" silicon. The company has reworked the die to feature a 4096-bit wide HBM2 memory interface, the "Vega 20" MCM now features four 32 Gbit HBM2 memory stacks, which make up the card's 16 GB of memory. The memory clock has been dialed up to 1000 MHz from 945 MHz on the RX Vega 64, which when coupled with the doubled bus-width, works out to a phenomenal 1 TB/s memory bandwidth.

We know from AMD's late-2018 announcement of the Radeon Instinct MI60 machine-learning accelerator based on the same silicon that "Vega 20" features a total of 64 NGCUs (next-generation compute units). To carve out the Radeon VII, AMD disabled 4 of these, resulting in an NGCU count of 60, which is halfway between the RX Vega 56 and RX Vega 64, resulting in a stream-processor count of 3,840. The reduced NGCU count could help AMD harvest the TSMC-built 7 nm GPU die better. AMD is attempting to make up the vast 44 percent performance gap between the RX Vega 64 and the GeForce RTX 2080 with a combination of factors.

While many have watched or at the very least seen our coverage of AMD's live stream at CES 2019, it just can't compare to seeing the latest graphics card from the company up close and personal. Therefore as soon as we had the opportunity, we took a closer look at the AMD Radeon VII and let us just say the reference card is indeed a bit fancy. The shroud itself is made of metal and has a very similar look and feel to the one used on the Radeon RX Vega 64 liquid cooled reference cards. However, instead of using an AIO for this release AMD instead opted for three uniform fans and a massive heatsink. Not only does this make the card more compatible with small form factor systems, it is also less of a hassle to install. Display outputs consist of 3x DisplayPort and 1x HDMI. Sadly AMD did not include a VirtualLink port (USB Type-C) like NVIDIA for VR headsets, which is rather odd considering AMD is also part of the VirtualLink consortium.

Power delivery is handled by two 8-pin PCIe power connectors giving the card access to a theoretical limit of 375-watts which is 75-watts more than its 300-watt TDP. Considering the Radeon VII has the same power level as the Vega 64 it offers 25% more performance at the same power level. Compute unit count falls between the Vega 56 and Vega 64 at precisely 60 CUs. That said, a few missing CUs are of no consequence when you consider how close the Vega 56 performed to the Vega 64 once tweaked. As for clock speeds AMD has stated the Radeon VII will have a 1.8 GHz core clock, while the 16 GB of HBM2 will deliver 1 TB/s of memory bandwidth over the 4096-bit memory interface.

AMD today announced the Radeon VII (Radeon Seven) graphics card, implementing the world's first GPU built on the 7 nm silicon fabrication process. Based on the 7 nm "Vega 20" silicon with 60 compute units (3,840 stream processors), and a 4096-bit HBM2 memory interface, the chip leverages 7 nm to dial up engine clock speeds to unprecedented levels (above 1.80 GHz possibly). CEO Lisa Su states that the Radeon VII performs competitively with NVIDIA's GeForce RTX 2080 graphics card. The card features a gamer-friendly triple-fan cooling solution with a design focus on low noise. AMD is using 16 GB of 4096-bit HBM2 memory. Available from February 7th, the Radeon VII will be priced at USD $699.

Update: We went hands on with the Radeon VII card at CES.

CPUs or GPUs? Ryzen 3000 series up to 16 cores or keeping their eight? Support for raytracing? Navi or die-shrunk Vega for consumer graphics? The questions around AMD's plans for 2019 are still very much in the open, but AMD's Lisa Su's impending livestream should field the answers to many of these questions, so be sure to watch the full livestream, happening in just a moment.You can find the live stream here, at YouTube.

18:33 UTC: Looking forward, Lisa mentioned a few technology names without giving additional details: "... when you're talking about future cores, Zen 2, Zen 3, Zen 4, Zen 5, Navi, we're putting all of these architectures together, in new ways".

18:20 UTC: New Ryzen 3rd generation processors have been teased. The upcoming processors are based on Zen 2, using 7 nanometer technology. AMD showed a live demo of Forza Horizon 4, using Ryzen third generation, paired with Radeon Vega VII, which is running "consistently over 100 FPS at highest details at 1080p resolution". A second demo, using Cinebench, pitted an 8-core/16-thread Ryzen 3rd generation processor against the Intel Core i9-9900K. The Ryzen CPU was "not final frequency, an early sample". Ryzen achieved a score of 2057 using 135 W, while Intel achieved a score of 2040 using 180 W.. things are looking good for Ryzen 3rd generation indeed. Lisa also confirmed that next-gen Ryzen will support PCI-Express 4.0, which doubles the bandwidth per lane over PCI-Express 3.0. Ryzen third generation will run on the same AM4 infrastructure as current Ryzen; all existing users of Ryzen can simply upgrade to the new processors, when they launch in the middle of 2019 (we think Computex).Ryzen third generation uses a chiplet design. The smaller die on the right contains 8-cores/16-threads using 7 nanometer technology. The larger die on the left is the IO die, which consists of things like the memory controller and PCI-Express connectivity, to shuffle data between the CPU core die and the rest of the system.

AMD late November filed a trademark application with the USPTO for a new logo, for its second generation "Vega" graphics architecture, built around the 7 nm silicon fabrication process. The logo looks similar to the original Vega "V," with two bands marking out the Roman numeral II (2). This logo could appear on the product and marketing on a series of new Radeon Pro and Radeon Instinct (and possibly even gaming-grade Radeon RX?) graphics cards based on AMD's new "Vega 20" multi-chip module. This chip features a doubling in memory bandwidth thanks to its 4096-bit wide HBM2 interface, and the optical shrink of the GPU die to the 7 nm node could enable AMD to dial up engine clocks significantly.

AMD recently announced the Radeon Instinct MI60, a GPU-based data-center compute processor with hardware virtualization features. It takes the crown for "the world's first 7 nm GPU." The company also put out specifications of the "Vega 20" GPU it's based on: 4,096 stream processors, 4096-bit HBM2 memory interface, 1800 MHz engine clock-speed, 1 TB/s memory bandwidth, 7.4 TFLOP/s peak double-precision (FP64) performance, and the works. Here's the kicker: the company isn't launching this accelerator with Windows support. At launch, AMD is only releasing x86-64 Linux drivers, with API support for OpenGL 4.6, Vulkan 1.0, and OpenCL 2.0, along with AMD's ROCm open ecosystem. The lack of display connector already disqualifies this card for most workstation applications, but with the lack of Windows support, it is also the most expensive graphics card that "can't run Crysis." AMD could release Radeon Pro branded graphics cards based on "Vega 20," which will ship with Windows and MacOS drivers.

AMD today announced the AMD Radeon Instinct MI60 and MI50 accelerators, the world's first 7nm datacenter GPUs, designed to deliver the compute performance required for next-generation deep learning, HPC, cloud computing and rendering applications. Researchers, scientists and developers will use AMD Radeon Instinct accelerators to solve tough and interesting challenges, including large-scale simulations, climate change, computational biology, disease prevention and more.

"Legacy GPU architectures limit IT managers from effectively addressing the constantly evolving demands of processing and analyzing huge datasets for modern cloud datacenter workloads," said David Wang, senior vice president of engineering, Radeon Technologies Group at AMD. "Combining world-class performance and a flexible architecture with a robust software platform and the industry's leading-edge ROCm open software ecosystem, the new AMD Radeon Instinct accelerators provide the critical components needed to solve the most difficult cloud computing challenges today and into the future."