Leading storage device brand, Team Group, is releasing its industrial wide temperature storage product series, ULTRA, in view of the fast-developing electric vehicle market. Consumer products typically operate within a temperature range of 0-70℃. However, industrial products are designed to withstand harsh environments and operate within a temperature range of -40-85℃. Because of the extreme temperature differences in applications such as vehicle computer systems, storage products with higher tolerance and compliance with automotive temperature grades are required. In response to the developments in EVs, Team Group has launched a new storage product series that includes an SSD and memory module and can handle temperatures of up to 105℃, the highest in the industry. The company is targeting the vehicle, fanless embedded, and rugged computer markets.

Team Group's industrial ULTRA wide-temperature storage product series uses Major Grade high-quality ICs and patented testing and grading technology (Taiwan Invention Patent No. I751093; US Invention Patent No. US11488679) and ultra-thin graphene cooling technology (Taiwan Invention Patent No. I703921; US Invention Patent No. US11051392B2), allowing stable operation in harsh temperatures. In addition, the ULTRA wide-temperature storage product series has passed the ISO-16750 Road Vehicles (environmental conditions and testing for electrical and electronic equipment in road vehicles) - 5.1.2 high-temperature 105℃ verification test. Both products also meet standards for military-grade impact resistance (MIL-STD-202G, MIL-STD-883K) and shock resistance (MIL-STD810G), guaranteeing their stability and durability. Whether it's maintaining data security or overcoming extreme conditions in automotive and industrial applications, the ULTRA storage product series will fully satisfy your needs.

GeIL, one of the world's leading PC components & peripheral manufacturers today announced the latest Pristine R5 series as well as Spear R5 series server memory products, providing solutions not only for the needs of standard Registered DIMMs which fully complies with the JEDEC specifications but also the market of high-end applications which requires high-performance server memory.

GeIL stated that the popularity of online games and the metaverse brings not simply the growth momentum of the server market, related requirements such as the gaming service, the big data analysis, and AI applications also create the massive needs of cloud computing which customers are now asking for great performance rather than just focusing on stability, reliability and security when it comes to the server products. GeIL further pointed out that the demand for high-bandwidth and large-capacity server memory is therefore continuously and rapidly growing.

Last year, Crucial canned its Ballistix brand of gaming focused memory, but it seems like the company still wants to offer its customers a more premium product, as Crucial has just introduced its new Pro series of memory products. Crucial will offer its new Pro series in both DDR5 and DDR4 flavours at either DDR5-5600 or DDR4-3200 speeds. It should be noted that the DDR4 modules still rely on a green PCB, while the DDR5 modules get the same black PCB as Crucial's regular DDR5 modules. Beyond the heatsink, there isn't much that differs between the Pro series and Crucial's regular modules, but there is one thing that might matter to potential buyers.

Crucial has added support for AMD EXPO and Intel XMP 3.0 to its Pro series of modules. In the case of AMD EXPO this only applies to DDR5 modules, whereas the DDR4 modules support Intel XMP 2.0, in this case a feature its standard DDR4 modules lack. This should make it easier for end users to take advantage of the extra performance offered by some of these modules. That said, as Crucial has stuck to JEDEC timings, taking the Pro DDR5-5600 UDIMM kit as an example, you end up with timings of 46-46-45-45 at 1.1 Volts, where competing products have timings in the range of 36-36-36-36, although usually at 1.25 Volts or higher. Even as far as JEDEC timing goes, Crucial has chosen the middle ground for DDR5 5600, as there is a timing option from JEDEC that supports 40-40-40-40, which would make more sense for a more premium product. Price wise, a 32 GB kit with two 16 GB modules of DD5-5600 modules carries an $11 price premium over Crucials standard modules, with a retail price of US$114.99 versus US$103.99, but there are better options out there at this price point.

AMD and JEDEC are collaborating to create a new industry standard for DDR5 memory called MRDIMMs (multi-ranked buffered DIMMs). The constant need for bandwidth in server systems provides trouble that can not easily be solved. Adding more memory is difficult, as motherboards can only get so big. Incorporating on-package memory solutions like HBM is expensive and can only scale to a specific memory capacity. However, engineers of JEDEC, with the help of AMD, have come to make a new standard that will try and solve this challenge using the new MRDIMM technology. The concept of MRDIMM is, on paper, straightforward. It combines two DDR5 DIMMs on a single module to effectively double the bandwidth. Specifically, if you take two DDR5 DIMMs running at 4,400 MT/s and connect them to create a single DIMM, you get 8,800 MT/s speeds on a single module. To efficiently use it, a special data mux or buffer will effectively take two Double Data Rate (DDR) DIMMs and convert them into Quad Data Rate (QDR) DIMMs.

The design also allows simultaneous access to both ranks of memory, thanks to the added mux. First-generation MRDIMMs can produce speeds of up to 8,800 MT/s, while the second and third generations modules can go to 12,800 MT/s and 17,600 MT/s, respectively. We expect third-generation MRDIMMs after 2030, so the project is still far away. Additionally, Intel has a similar solution called Multiplexer Combined Ranks DIMM (MCRDIMM) which uses a similar approach. However, Intel's technology is expected to see the light of the day as early as 2024/2025 and beyond the generation of servers, with Granite Rapids likely representing a contender for this technology. SK Hynix already makes MCRDIMMs, and you can see the demonstration of the approach below.

Cadence, a leading developer of tools for system design and verification, has announced the industry's first GDDR7 verification solution. This in-depth software solution affords IC designers the ability to simulate and verify their GDDR7 silicon designs before printing a single chip. The challenges of designing GDDR7 stem from a rather massive leap in operating speed and advanced features, with GDDR7 targeting speeds of 36,000 MT/s and utilizing more advanced signaling methods.

Today, the Open Compute Project Foundation (OCP), the nonprofit organization bringing hyperscale innovations to all, and JEDEC Solid State Technology Association, the global leader in the development of standards for the microelectronics industry, announce a new collaboration to establish a framework for the transfer of technology captured in an OCP-approved specification to JEDEC for inclusion in one of its standards. This alliance brings together members from both the OCP and JEDEC communities to share efforts in developing and maintaining global standards needed to advance the electronics industry.

Under this new alliance, the current effort will be to provide a mechanism to standardize Chiplet part descriptions leveraging OCP Chiplet Data Extensible Markup Language (CDXML) specification to become part of JEDEC JEP30: Part Model Guidelines for use with today's EDA tools. With this updated JEDEC standard, expected to be published in 2023, Chiplet builders will be able to provide electronically a standardized Chiplet part description to their customers paving the way for automating System in Package (SiP) design and build using Chiplets. The description will include information needed by SiP builders such as Chiplet thermal properties, physical and mechanical requirements, behavior specifications, power and signal integrity properties, testing the Chiplet in package, and security parameters.

SK hynix Inc. announced today that it has developed the world's fastest mobile DRAM 'LPDDR5T (Low Power Double Data Rate 5 Turbo)' and provided sample products to customers. The new product, LPDDR5T, operates at a data rate of 9.6 gigabits per second (Gbps), 13% faster than the previous generation LPDDR5X unveiled in November 2022. To highlight the maximum speed the product features, SK hynix added 'Turbo' at the end of the standard name LPDDR5.

LPDDR5T, which operates in the ultra-low voltage range of 1.01 to 1.12 V set by the JEDEC (Joint Electron Device Engineering Council), is a product that not only features utmost speed but ultra-low power consumption. "The company pushed the technology to new limits in just two months after LPDDR5X, mobile DRAM with 8.5 Gbps specification, was introduced to the market in November 2022," SK hynix said. "We will solidify our leadership in the mobile DRAM market by providing products of various storage capacities that meet customers' needs."

NVIDIA's next GeForce RTX 40-series "Ada" graphics card launch is widely expected to be the GeForce RTX 4070 (non-Ti), and as we approach Spring 2023, the company is expected to ramp up to the meat of its new generation, with xx60-segment, beginning with the GeForce RTX 4060 Ti. This new performance-segment SKU debuts the 4 nm "AD106" silicon. A set of leaks by kopite7kimi, a reliable source with NVIDIA leaks, shed light on possible specifications.

The RTX 4060 Ti is based on the AD106 silicon, which is expected to be much smaller than the AD104 powering the RTX 4070 series. The reference board developed at NVIDIA, codenamed PG190, is reportedly tiny, and yet it features the 16-pin ATX 12VHPWR connector. This is probably set for 300 W at its signal pins, and adapters included with graphics cards could convert two 8-pin PCIe into one 300 W 16-pin connector. The RTX 4060 Ti is expected to come with a typical graphics power value of 160 W.

Laptop memory has been a controversial topic for many years. Its proprietary standard, SO-DIMM, has shown signs of aging as the decades-old JEDEC standard didn't adapt to other expanding capacities and speed trends. Today, JEDEC and Dell think that the future of laptop memory is in the new CAMM standard that both companies are working on. The introduction of CAMM comes from Dell, whose Senior Distinguished Engineer Tom Schnell is working on it. "We have unanimous approval of the 0.5 spec," said Mr. Schnell for PCWorld. One of the problems that SO-DIMM is facing is the capacity and speed issue, where the current DDR5 SO-DIMM memory stops at around 6400 MT/s. CAMM, on the other hand, starts from that speed and works its way up to offer higher capacities as well.

With Dell introducing CAMM in its laptops, it had no intentions of creating a proprietary solution but rather an expandable and upgradable memory platform with various benefits. With JEDEC's involvement in finalizing this, the CAMM standard is slowly on its way to becoming a viable option for different laptop manufacturers. Dell's Tom Schnell didn't reveal what companies are in the process of creating the final specification; however, we know that 32 of them are present, including Apple. If others join, the standard could take over future laptop designs and offer higher speeds and higher capacities, especially in the mobile workstation space where it matters. Below is an example of a CAMM memory module with a patent showing the SO-DIMM (upper left) versus CAMM (lower right) and CAMM's smaller trace path. With smaller tracing, the latency is also going down, so the new standard will bring additional efficiency. Additionally, devices that are based on LPDDR memory could have an upgrade path with the installment of CAMM.

SK hynix Inc. (or "the company", www.skhynix.com) announced today that its DDR5 product for servers using 1anm, the fourth generation of the 10 nm process technology, has been validated on the 4th Gen Intel Xeon Scalable processor (formerly codenamed Sapphire Rapids) for the first time in the industry. "The validation of the 1anm DDR5 compatibility by Intel for its newest processor that supports DDR5 for the first time is monumental," SK hynix said. "We will seek a fast turnaround in the semiconductor memory industry by actively responding to the growing server market through DDR5, which is already in mass production."

The validation of the company's 1anm DDR5 product, which adopts 1anm technology using the EUV lithography process, is for 4th Gen Intel Xeon Scalable processors, Intel's latest server CPU launched on January 10th. The 4th Gen Intel Xeon Scalable processor has been cited as a key to a turnaround in the industry, given that the launch of a next-generation server CPU requires server replacement and thus, results in a rapid increase in demand for high-performance memory chips. Experts predict that DDR5, expected to meet customers' such needs, will soon become the flagship product in the server DRAM market.

Taiwan-based memory products OEM Datotek has been in business selling flash memory and DRAM products since 2004, with one of its most notable clients being HP. At the 2023 International CES, the company showcased its latest-generation memory products spanning not just HP-branded flash drives, but also flash drives under its own marquee, besides M.2 NVMe and 2.5-inch SATA SSDs; and PC memory spanning DDR5 and DDR4 generations. The company sells various vanilla (JEDEC spec) DDR5 and DDR4 memory modules in both standard U-DIMM and SO-DIMM form-factors. For gamers and enthusiasts, the company has the Ares line of premium DDR5 and DDR4 memory products, which come in overclocked speeds such as DDR5-6000 or DDR4-4000, including with RGB LED illumination.

Among its SSD products are a new PCIe Gen 5 NVMe SSD under the Ares brand, Gen 4 NVMe drives under the Ares Dark Sword brand, and various Gen 3 NVMe SSDs under the main Datotek brand. We also spotted several USB 3.2 portable SSDs, as well as 2.5-inch SATA 6 Gbps ones under the main brand. The idea here is to attract more brands for OEM partnerships the way rival Biwin makes SSD and DRAM products for various top brands (such as HP and Acer).

World-leading memory brand, Team Group, has announced new breakthroughs in the Team Group ELITE U-DIMM DDR5 Standard Memory. To ensure compatibility with next-generation platforms, Team Group has pioneered the first high-performance 6400 MHz spec per JEDEC definitions for consumers to enjoy upgraded performances with ease in the DDR5 generation.

To ensure a stable performance of 6400 MHz and above of the DDR5, Team Group has adopted the new CKD (client clock driver) components designed to strengthen, buffer, and steadily output high-frequency signals from the CPU to DDR5 memory kits, effectively ensuring high frequencies while supporting reliable high-speed transmissions. Team Group is dedicated to R&D and working simultaneously with motherboard manufacturers for rigorous compatibility testing, offering high-quality and highly compatible memory products for desktops and laptops to consumers around the world, fulfilling user demands for PC, laptops, or other small systems.

Micron Technology, Inc., today announced that its DDR5 server memory portfolio for the data center is now fully validated on the 4th Gen Intel Xeon Scalable processor family. Micron DDR5 memory delivers up to twice the memory bandwidth over previous generations, which is essential to fueling the rapid growth of cores in today's data center processors. Transitioning to DDR5 will help alleviate a potential bottleneck for years to come by providing higher bandwidth to unlock more computer power per processor. Micron DDR5, in combination with 4th Gen Intel Xeon Scalable processors, benefits a wide range of workloads including SPECjbb, which delivers up to 49% performance improvement on benchmarking for Critical-jOPS (Java operations per second) compared to previous generations. In addition to increased memory bandwidth and performance, Micron DDR5 memory is also designed to improve reliability across the data center with features such as on-die Error Correction Code (ODECC) and bounded faults. On-die ECC corrects single-bit errors and detects multi-bit errors.

"The deep collaboration we have established with Intel as a highly valued ecosystem partner, has allowed Micron to remain at the forefront of the industry transition to DDR5," said Raj Hazra, senior vice president and general manager of Micron's Compute and Networking Business Unit. "This work has been pivotal in developing solutions that meet the complex needs and challenges of our data center customers as they convert massive amounts of data into insights."

Last year it felt like DDR5-6000 to DDR5-6400 was the top of the PC memory food-chain, and in a year, this has been pushed up to DDR5-8000. Platforms such as the 13th Gen Core "Raptor Lake" can already handle such high memory speeds, and ADATA has designed such a memory module that includes an Intel XMP 3.0 profile that enables the advertised DDR5-8000 speed at the click of a button. The new ADATA XPG Caster RGB DDR5-8000 features a chunky aluminium heatspreader that's crowned by a silicone addressable RGB LED diffuser. It's been tested for compatibility with both Intel and AMD platforms, however only an XMP 3.0 profile is included.

Elsewhere across the ADATA booth, we also came across the company's latest SD 8.0 memory card that uses PCI-Express 3.0 x2 physical layer and NVMe 1.3 protocol layer, to offer sequential speeds of up to 1600 MB/s reads, with up to 1300 MB/s writes, including LDPC ECC. The card comes in 256 GB and 512 GB capacities, and is backwards-compatible with UHS-I devices. Back at the memory section, we found an XPG + ASUS ROG co-branded Lancer ROG DDR5 memory that comes at speeds of up to DDR5-6600. Lastly, there's the ACE-6400, a mid-range DDR5-6400 memory module targeting creators, that runs at DDR5-5600 native (JEDEC), and its advertised DDR5-6400 using an XMP 3.0 profile.

YMTC today at the Flash Memory Summit (FMS) 2022 unveiled its X3-9070 TLC 3D NAND flash powered by Xtacking 3.0 architecture. Since its debut show at FMS 2018, YMTC's Xtacking technology has become a hallmark of the company's vision for innovation, and the approach to hybrid bonding has been widely recognized as one of the key enablers of the industry's future growth. Built out to be a common growth platform that drives value and innovation in the semiconductor ecosystem, YMTC's Xtacking 3.0 architecture opens up a world of opportunities for diversified applications in 5G, AloT, and beyond.

From 1.0 to 3.0, YMTC's Xtacking technology, a heterogeneous 3D integration architecture, has established a proven track record of success, as evidenced by a diverse portfolio of Xtacking NAND-based system solutions, including SATA III, PCIe Gen3 & Gen4 SSDs, as well as eMMC & UFS for mobile and embedded applications, garnering recognition from leading OEMs.

The next-generation GDDR7 memory standard is shaping up nicely, to double bandwidth and density over the current GDDR6. In a company presentation detailing upcoming memory technologies, Samsung revealed that GDDR7 uses PAM3 signalling. While ones and zeroes are stored in DRAM memory cells, it is transmitted between devices (such as the DRAM chip and the GPU) in electrical waveforms known as "signals." Ones and zeroes are interpreted by patterns in the signal waveform.

Conventional GDDR6 memory uses NRZ (non-return to zero) or PAM2 signalling to achieve data-rates starting from 14 Gbps, with 24 Gbps expected to be the fastest production GDDR6 memory speed on offer, however some of the faster GDDR6 speeds such as 18 Gbps, 20 Gbps, and 22 Gbps couldn't hit production soon enough for the development phase of the GeForce RTX 30-series "Ampere" GPU, and so NVIDIA and Micron Technology co-developed the GDDR6X standard leveraging PAM4 signalling, to offer speeds ranging between 18 Gbps to 23 Gbps (or higher) several quarters ahead of this faster JEDEC-standard GDDR6.

As advanced graphics and display technologies develop, they are blurring the lines between metaverse and our everyday experience. Much of this important shift is being made possible by the advancement of memory solutions designed for graphics products. One of the biggest challenges for improving virtual reality is taking the complexities of real-world objects and environments and recreating them in a virtual space. Doing so requires massive memory and increased computing power. At the same time, the benefits of creating more true-to-life metaverse will be far reaching, including real-life simulations of complicated scenarios and more, sparking innovation across a number of industries.

This is the central idea behind one of the most popular concepts in virtual reality: digital twin. A digital twin is a virtual representation of an object or space. Updated in real-time in accordance with the actual environment, a digital twin spans the lifecycle of its source and uses simulation, machine learning and reasoning to help decision-making. While until recently this was not feasible proposition due to limitations on data processing and transference, digital twins are now gaining traction thanks to availability of high bandwidth technologies.

SK hynix has developed LPDDR5X (Low Power Double Data Rate 5X), the world's first-ever mobile DRAM with an integrated HKMG (High-K Metal Gate) process, which was just recently introduced to the market. The LPDDR5X boasts the industry's highest energy-efficiency as SK hynix succeeded in reducing power consumption by 25% compared to the previous generation and operates in the ultra-low voltage range of 1.01 V to 1.12 V set by the JEDEC (Joint Electron Device Engineering Council).
For the LPDDR, which is also called a mobile DRAM, having a low power consumption is its greatest asset, just as its standard name—LP (Low Power)—suggests. As power is limited in mobile devices, it's necessary to reduce power consumption as much as possible to extend the usage time.

This is why lowering power consumption is just as important as increasing operating speed. LPDDR5X was the first among mobile DRAMs to integrate the HKMG process and see improved performance and a reduction in power consumption, essentially killing two birds with one stone. As the power consumption of DRAM gets lowered by LPDDR5X, mobile devices can be used for a longer time with a single charge. The reduction in power consumption of such products can subsequently lead to a reduction in the power used by consumers, which is in line with the value of SK hynix's ESG-centered business management.

Micron Technology, Inc., announced today that it is shipping qualification samples of its 1β (1-beta) DRAM technology to select smartphone manufacturers and chipset partners and has achieved mass production readiness with the world's most advanced DRAM technology node. The company is debuting its next generation of process technology on its low-power double data rate 5X (LPDDR5X) mobile memory, delivering top speed grades of 8.5 gigabits (Gb) per second. The node delivers significant gains across performance, bit density and power efficiency that will have sweeping market benefits. Beyond mobile, 1β delivers the low-latency, low-power, high-performance DRAM that is essential to support highly responsive applications, real-time services, personalization and contextualization of experiences, from intelligent vehicles to data centers.

The world's most advanced DRAM process node, 1β represents an advancement of the company's market leadership cemented with the volume shipment of 1α (1-alpha) in 2021. The node delivers around a 15% power efficiency improvement and more than a 35% bit density improvement with a 16Gb per die capacity. "The launch of our 1-beta DRAM signals yet another leap forward for memory innovation, brought to life by our proprietary multi-patterning lithography in combination with leading-edge process technology and advanced materials capabilities," said Scott DeBoer, executive vice president of technology and products at Micron. "In delivering the world's most advanced DRAM technology with more bits per memory wafer than ever before, this node lays the foundation to usher in a new generation of data-rich, intelligent and energy-efficient technologies from the edge to the cloud."

ASUS today announced the availability of new Intel Z790 motherboards, including the ROG Maximus Z790 Apex, TUF Gaming Z790-PLUS WiFi and ProArt Z790-Creator WiFi - all of which provide DDR5 memory module support and PCIe 5.0 slots for video cards and storage.ASUS Z790 motherboards offer tremendous value to anyone assembling an Intel 13th Gen machine that includes AEMP II, AI Overclocking, AI Cooling II, PCIe 5.0 M.2 slots, Thunderbolt 4, WiFi 6E, Quick Charge 4+ technology and comprehensive connectivity. Overall, new ASUS Z790 motherboards are ideal solutions for any user who wants to build a next-gen machine or upgrade their existing system.

First up is the ROG Maximus Z790 Apex. The ultimate option for memory overclocking enthusiasts, this motherboard boasts a cutting-edge feature set. Then, for creative professionals of all kinds, ASUS offers the ProArt Z790-Creator WiFi. This motherboard offers premium connectivity and bespoke style, and it's fully ready for next-gen graphics cards and ultra-fast PCIe 5.0 storage. Finally, ASUS is bolstering its TUF Gaming lineup with the TUF Gaming Z790-Plus WiFi, which brings DDR5 support to the family.

SK Hynix at the 2022 Intel InnovatiON event, showed off some unconventional server memory capacities. The company presented DDR5 RDIMMs in 48 GB and 96 GB densities, besides the usual 32 GB, 64 GB, and 128 GB ones. These are being offered in data-rates of DDR5-5600 and DDR5-6400, which indicates that DDR5-5600 (JEDEC-standard) could be the standard memory speed supported by Xeon Scalable "Sapphire Rapids" processors, with some (or all) models also supporting DDR5-6400. These are not XMP or overclocking SPDs, but JEDEC-standard ones that the processors can automatically train to. The flagship product among SK Hynix's booth would have to be a mammoth 256 GB DDR5-5600 RDIMM, which should enable servers with up to 4 TB of memory per socket (@2 RDIMMs per channel).

Montage Technology, a leading data processing and interconnect IC design company, today announced that it is delivering the world's first Gen1 DDR5 Clock Driver (CKD or DDR5CK01) samples to the top DRAM memory vendors for their development of memory modules used in new-generation desktop and notebook computers.

For a long time, the clock driver functions have been integrated onto the register clock driver (RCD) device, which is used in the server platforms, rather than the PC computers. With the boost of the DDR5 data rate, the frequency of the clock signal becomes higher and higher, and the signal integrity issue of the clock becomes more and more challenging. As the DDR5 data rate reaches 6400MT/s and above, the memory modules such as UDIMMs and SODIMMs used in desktop and notebook computers, will need an on-DIMM clock driver to buffer and re-drive the clock signal of the memory modules, to meet the signal integrity and reliability requirement of the high-speed clock signal.

KIOXIA America, Inc. today announced that it has begun sampling the latest generation of its JEDEC e-MMC Ver. 5.1-compliant embedded flash memory products for consumer applications. The new products are available in capacities of 64 and 128 gigabytes (GB) and integrate the company's BiCS FLASH 3D flash memory and a controller in a single package.

Demand for mid-range capacities in consumer products such as tablets and IoT devices continues to grow, and though the market continues to shift to UFS, there are cases where e-MMC may still be used. The new KIOXIA e-MMC devices expand the available options. A leading provider of flash memory and storage for consumer applications and mobile devices, KIOXIA has been supporting e-MMC since 2007 and was the first supplier to introduce the higher performance follow-on solution to e-MMC, UFS, in early 2013. Today, the broad KIOXIA lineup of e-MMC and UFS solutions provides support across a wide range of densities (4 GB-1 TB).

Intel 700-series chipset motherboards could come with improved memory overclocking capabilities, suggest an alleged leaked specs-sheet of an MSI Intel Z790 chipset motherboard. As the pioneering platform for DDR5, Intel 600-series chipset motherboards, particularly those based on the Z690, typically marketed DDR5 memory overclock speeds of around DDR5-6000 or DDR5-6200 in their specs sheets, as the then-expensive DDR5 memory kits started at JEDEC-spec speeds of DDR5-4800 in the entry-level, with performance-segment kits around the DDR5-6000 mark.

The unnamed MSI Z790 chipset motherboard supports DDR5 overclocked frequencies of over DDR5-6800 at 1DPC (one DIMM per channel) with single-rank modules; over DDR5-6400 with 1DPC + dual-rank modules; over DDR5-6400 with 2DPC + single-rank modules; and over DDR5-5600 with 2DPC + dual-rank. Earlier reports suggested that Intel is "discouraging" motherboard vendors from coming up with 700-series motherboards that feature DDR4 memory slots, but this doesn't mean there won't be any. MSI has an Intel Z790 motherboard with DDR4 slots in the works, and it's capable of overclocks of up to DDR4-5000 in the most optimal configuration, and DDR4-4000 in the least optimal one.

JEDEC Solid State Technology Association and Compute Express Link (CXL) Consortium today announced the signing of a Memorandum of Understanding (MOU) to formalize collaboration between the two organizations. The agreement outlines the formation of a joint work group to provide a forum that facilitates communication and sharing of information, requirements, recommendations and requests with the intent that this exchange of information will help standards developed by each organization augment one another.

"The MOU between JEDEC and CXL Consortium will establish a framework for ongoing communication to align future efforts between the two organizations. The joint work group will collaborate on useful solutions for form factors, management, security, and DRAM and other memory technologies," said Siamak Tavallaei, CXL Consortium President.