Back at CES 2019 we shared a story on Kingston's then upcoming A2000 series NVMe drives. The company's development strategy for these was to undercut SATA SSDs in pricing while delivering non SATA-bound speeds. The company planned to leverage component cost falls for NVMe controllers, pairing that with the reduced materials cost of NVMe drives (smaller than their SATA counterparts) so as to be able to achieve below-SATA price points. The choice of Toshiba's BiCS4 3D TLC NAND also aimed to keep costs down, whilst delivering performance that's "at least three times as high as SATA-bound drives".

The company is offering a limited 5-year warranty on their A2000 series, which in itself is a sign of the company's confidence in these products - despite their entry-level classification and overall development strategy. The A2000 series will be available in 250 GB, 500 GB and 1 TB capacities, with speeds claimed of up to 2,200/2,000MB/s sequential read/writes; up to 250,000/220,000 IOPS in random 4K read/writes; and 600 TBW rating (all of these values are for the 1 TB solution, with TBW falling to 350 TBW for the 500 GB part and 150 TBW for the 250 GB drive. These drives make use of a PCIe 3.0 4x controller, which means savings weren't at the expense of 2x PCIe channels, as some solutions have done in the past in order to cut costs. Pricing is being quoted at $40 for the 250 GB part, $60 for the 500 GB one, and a mere $100 for the 1 TB part. The true democratization of NVMe SSDs has just caught some heavy favorable winds on its sails.

Western Digital today announced two new 96-layer 3D flash NVMe SSD families, the Ultrastar DC SN640 and Ultrastar DC SN340. Both are purpose-built for either mixed-use-case workloads or very read-intensive applications, respectively. The new Ultrastar drives help meet the evolving, and increasingly specific workload demands placed on data centers today, while building a strong, flexible foundation for the zettabyte-scale era of the future. Leveraging Western Digital's in-house SSD controller designs, firmware development and vertical integration, these new solutions underscore the company's strengths in developing innovations that allow customers' data to thrive, from edge to core to cloud.

NVMe is having a great impact on enterprises and what they can do with data, particularly for real-time analytics, M2M and IoT, and emerging technologies like composable infrastructure. Data center customers understand the nature of their data streams and application workloads and are realizing that today's general-purpose architectures are inefficient and can carry resource and cost overhead.

Marvell today released the industry's lowest power PCIe Gen4 NVMe solid-state drive (SSD) controller portfolio. Marvell's newest SSD controllers are designed to meet the need for lower power and higher performance in next-generation data centers and edge devices as artificial intelligence (AI) and 5G gain momentum. This breakthrough technology delivers unparalleled performance in an ultra-compact footprint, leveraging the company's complex system-on-chip (SoC) design expertise and groundbreaking storage IP to help data center, notebook, tablet, gaming and edge computing platform architects advance their solutions for the highly distributed data era.

"Marvell's latest family of storage controllers has been architected to optimally address edge computing and data center pain points of power-performance and capacity-performance," said Nigel Alvares, vice president of marketing for the Flash Business Unit at Marvell Semiconductor, Inc. "With today's launch, we're once again demonstrating Marvell's leadership in storage, delivering the industry's first 4-Channel PCIe Gen4 NVMe SSD controllers with the industry's lowest power consumption that will help revolutionize SSD solutions for the data economy."

ADATA Technology, a leading manufacturer of high-performance DRAM modules, NAND Flash products, and mobile accessories is pleased to announce the ADATA HD770G durable external hard drive, the world first with RGB lighting. With the HD770G, users can not only store all their games and data, but store them with flair. What is more, the HD770G exceeds the IP68 standard meaning it is waterproof and dustproof as well as shock-resistant with its robust triple-layer construction.

The HD770G sports a design like no other external HDD thanks to its distinct chamfered edges and two light-beam-shaped RGB strips that'll show off users' personal flair. What's more, in between the two light strips is a centerpiece that features a perforated pattern that comes to life as the RGB lighting pulsates. With plenty of storage capacity, users can carry all their games or supplement the limited storage on their PS4 or Xbox console. Not only is the HD770G great for console gaming, but also great for PC gaming too.

SK Hynix Inc. announced today that it has developed and starts mass-producing the world's first 128-Layer 1 Tb (Terabit) TLC (Triple-Level Cell) 4D NAND Flash, only eight months after the Company announced the 96-Layer 4D NAND Flash last year.

The 128-Layer 1 Tb NAND chip offers the industry's highest vertical stacking with more than 360 billion NAND cells, each of which stores 3 bits, per one chip. To achieve this, SK Hynix applied innovative technologies, such as "ultra-homogeneous vertical etching technology," "high-reliability multi-layer thin-film cell formation technology," and ultra-fast low-power circuit design, to its own 4D NAND technology.

SK hynix Inc. today announced financial results for its second quarter 2019 ended on June 30, 2019. The consolidated second quarter revenue was 6.45 trillion won while the operating profit amounted to 638 billion won and the net income 537 billion won. Operating margin for the quarter was 10% and net margin was 8%.

As demand recovery did not meet expectations and price declines were steeper than expected, the revenue and the operating profit in the second quarter fell by 5% and 53%, respectively, quarter-over-quarter (QoQ). DRAM bit shipments increased by 13% QoQ as the Company actively responded to the mobile and PC DRAM markets, where demand growth was relatively high. However, DRAM prices remained weak and the average selling price dropped by 24%. For NAND Flash, the bit shipments increased by 40% QoQ because of demand recovery due to price declines, while the average selling price decreased by 25%.

First seen at Computex this year, Corsair seems to be first to market with a PCI-Express x4 Gen 4 SSD. Amazon Japan has the Corsair MP600 listed now for pre-order, with a "July 13" release date - it was also listed on Amazon US earlier today, but the product page has vanished since then. Corsair's MP600 SSD comes in capacities of 1 TB and 2 TB, and will be priced at $250 for the 1 TB version, and $450 for the 2 TB model. With PCIe 4.0, the bandwidth per pin is once again doubled over what 3.0 offered. According to Corsair, the MP600 SSD will reach up to 4.95 GB/s sequential write speed and up to 4.25 GB/s sequential read. Like most other PCI-E Gen 4 SSDs that we saw at Computex, the MP600 is based on Phison's PS5016-E16 controller and uses 3D TLC NAND memory.

Update Jul 1st: The drive is now listed at Amazon US, release date is "July 1st", so today: MP600 1 TB ($249.99) and 2 TB ($449.99). It is sold and shipped by Amazon itself.

SK hynix Inc. announced today that it has developed and started mass-producing the world's first 128-Layer 1 Tb (Terabit) TLC (Triple-Level Cell) 4D NAND Flash, only eight months after the Company announced the 96-Layer 4D NAND Flash last year.

The 128-Layer 1 Tb NAND chip offers the industry's highest vertical stacking with more than 360 billion NAND cells, each of which stores 3 bits, per one chip. To achieve this, SK hynix applied innovative technologies, such as "ultra-homogeneous vertical etching technology," "high-reliability multi-layer thin-film cell formation technology," and ultra-fast low-power circuit design, to its own 4D NAND technology.

The new product provides the industry's highest density of 1 Tb for TLC NAND Flash. A number of companies including SK hynix have developed 1 Tb QLC (Quad-Level Cell) NAND products, but SK hynix is the first to commercialize the 1 Tb TLC NAND Flash. TLC accounts for more than 85% of the NAND Flash market with excellent performance and reliability.

SK hynix Inc. announced today that it launched a new low-power Non-Volatile Memory express (NVMe) Enterprise SSD (eSSD) with the 72-layer TLC 3D NAND flash that offers best-in-class performance for power as well as Quality of Service. The product features an in-house NVMe controller on top of the 72-layer 3D NAND technology currently in mass production. With the launch, SK hynix has established itself as a memory producer that designs, develops, and mass-produces all key components, from NAND and DRAM to controllers, in-house, for not only Client but also Enterprise applications.

Meanwhile, power consumption of datacenters is an increasingly important concern in terms of energy and environmental preservation, as their footprint grows amid rising enterprise demand for cloud, Artificial Intelligence (AI), and Machine Learning (ML). As datacenters are expected to account for one-fifth of the world's energy consumption in 2025, low-power components that enable datacenter energy efficiency are expected to only grow in importance.

Microsoft at its E3 2019 keynote dropped a huge teaser of its next-generation gaming console development, codenamed "Project Scarlett." The console is expected to pack some serious hardware that powers gaming at 8K resolution (that's four times 4K, sixteen times Full HD). That's not all, it will also feature real-time ray-tracing. Microsoft's performance target for the console is to be 4 times higher than that of the Xbox One X. The company is also giving the console its first major storage sub-system performance update in years.

At its heart is a new 7 nm semi-custom SoC by AMD and a high degree of customization by Microsoft. This chip features CPU cores based on the "Zen 2" microarchitecture, which provide a massive leap in CPU performance over the current Scorpio Engine SoC that uses low-power "Jaguar Enhanced" cores. At the helm of graphics is a new iGPU based on the RDNA architecture that powers AMD's upcoming Radeon RX 5000 "Navi" graphics cards. It's interesting here to note that Microsoft talks about real-time ray-tracing while we're yet to see evidence of any specialized ray-tracing hardware on "Navi." In its teaser, however, Microsoft stressed on the ray-tracing feature being "hardware-accelerated."

A report from DigiTimes pits NAND manufacturers as accelerating their 120/128 layer 3D NAND technologies, aiming for volume production as early as 2020. Even as SK Hynix has begun sampling its 96-layer 4D NAND flash in March, Toshiba and Western Digital already had plans to introduce 128-layer technology, built on a TLC (Triple Level Cell) process technology so as to increase density while avoiding yield issues present with current QLC (Quad Level Cell) implementations.

The decision to accelerate deployment of the next generation of NAND comes from the fact that the market still faces an oversupply of NAND flash, mostly driven by the mature process of 64-layer NAND technology. With new technologies, higher ASPs and lower production scales are sustainable, which should enable supply to reduce enough so as to increase pricing of NAND-based technologies - and allow manufacturers to somewhat reset asking prices for new NAND chips.

It looks like SSDs will beat graphics cards to utilizing (and benefiting) from the bandwidth of PCI-Express gen 4.0 bus. AMD X570 platform motherboards offer 2-3 M.2 slots with PCIe gen 4.0 x4 wiring (64 Gbps). Corsair formally launched the MP600, and now ADATA joins the party with its unnamed drive. Based on the Silicon Motion SM2267 controller, the drive comes in an unbelievable capacity of up to 8 TB, probably using 96-layer QLC NAND flash.

The controller features DRAM cache, and dynamic SLC caching (all of the NAND flash is treated as SLC until storage demands force portions of them to be treated as MLC, TLC, and eventually QLC). It takes advantage of NVMe 1.3 protocol. As for performance, ADATA claims sequential speeds of up to 4000 MB/s reads. Such speeds were impossible of PCIe gen 3.0 x4 due to various overheads. Sequential writes are still up to 3000 MB/s. 4K random read/write access is rated at 400k IOPS. The company didn't reveal availability details.

Intel was the historic leader in silicon manufacturing and sales from 1993 through 2016, the year it lost its lead to Samsung. The issue wasn't so much to do with Intel, but more to do with market demands at the time - if you'll remember, it was the time of booming DRAM pricing alongside the smartphone demand increase that propagated stiff competition and manufacturers trying to outgun one another in the form of specs. The DRAM demand - and its ridiculous prices, at the time - propelled Samsung towards the top spot in terms of revenue, leaving Intel in the dust.

However, with the decrease in DRAM pricing following the reduce in smartphone demand and increased manufacturing capabilities of semiconductor manufacturers, which flooded the market with product that is being more slowly digested, has led to the drop of the previously-inflated Dram pricing, thus hitting Samsung's revenues enough for Intel to again become "top dog" in the silicon manufacturing world - even as the company struggles with its 10 nm rollout and faced supply issues of their own. As IC Insights puts it, "Intel replaced Samsung as the number one quarterly semiconductor supplier in 4Q18 after losing the lead spot to Samsung in 2Q17. (...) With the collapse of the DRAM and NAND flash markets over the past year, a complete switch has occurred, with Samsung having 23% more total semiconductor sales than Intel in 1Q18 but Intel having 23% more semiconductor sales than Samsung just one year later in 1Q19!".

Kingston Digital, Inc., the Flash memory affiliate of Kingston Technology Company, Inc., a world leader in memory products and technology solutions, today announced KC2000, its next generation M.2 NVMe PCIe SSD for enterprise and power users. Kingston's KC2000 NVMe PCIe SSD delivers powerful performance using the latest Gen 3.0 x 4 controller and 96-layer 3D TLC NAND. Offering superior read and write speeds up to 3,200 and 2,200MB/s, respectively, KC2000 delivers outstanding performance and endurance, and improves workflow in desktop, workstations and high-performance computing (HPC) systems.

KC2000 is a self-encrypting drive that supports end-to-end data protection using 256-bit AES Hardware-based encryption and allows the usage of independent software vendors with TCG Opal 2.0 security management solutions such as Symantec , McAfee , WinMagic and others. KC2000 also has built-in Microsoft eDrive support, a security storage specification for use with BitLocker.

ADATA Technology, a leading manufacturer of high-performance DRAM modules, NAND Flash products, and mobile accessories today announces that the XPG Overclocking Lab (XOCL) has overclocked the SPECTRIX D60G RGB DDR4 memory module to a frequency of 5738 MT/s, a new world record. The previous record was 5726 MT/s, which was set only a few days prior. The new record was achieved with an Intel Core i9 chipset and MSI MPG Z390I GAMING EDGE AC motherboard in an LN2-cooled configuration.

Toshiba Memory Corporation and Western Digital Corp. have finalized a formal agreement to jointly invest in the "K1" manufacturing facility that Toshiba Memory is currently constructing in Kitakami, Iwate Prefecture, Japan. The K1 facility will produce 3D flash memory to support growing demand for storage in applications such as data centers, smartphones and autonomous cars. Construction of the K1 facility is expected to be completed in the fall of calendar 2019. The companies' joint capital investments in equipment for the K1 facility will enable initial production output of 96-layer 3D flash memory beginning in calendar 2020, with meaningful output expected to begin later in the year.

Toshiba Memory and Western Digital will continue to cultivate and extend their leadership in their respective memory businesses by actively developing initiatives aimed at strengthening technology competitiveness, advancing joint development of 3D flash memory, and making capital investments according to market trends.

With its IMFlash Technology joint-venture with Micron coming to an end, Intel is finding itself with manufacturing challenges for its memory businesses. The company holds IP to both 3D NAND flash and its own invention 3D XPoint memory, which it believes will succeed NAND flash in performance and endurance. The company is now mulling to move manufacturing of 3D XPoint to a foundry in China. Intel currently manufactures this exotic new memory at an IMFlash Technology facility in Utah. Intel's $1.3 billion stake-sale to Micron pushes it out of this facility.

Under the terms of the stake-sale, Micron allows Intel to continue to manufacture 3D XPoint at IMFlash for a year, after which it must manufacture it elsewhere. The transfer of stake is scheduled for October 31st, which means Intel's manufacturing in Utah will continue till October 2020. In the meantime, Intel is planning to move manufacturing to its Fab 68, located in Dalian, China. Intel is now manufacturing 1st and 2nd generation 3D Xpoint, while its 3rd generation is under development, and was earlier slated for initial manufacturing at Intel's Fab 11X in New Mexico, USA. It's not known if Intel has changed these plans. 3rd generation 3D XPoint hits mass-production in 2021.

Western Digital Corp. is addressing the automotive industry's increasing need for storage by equipping vehicle manufacturers and system solution providers with the technology and capacity to support both current and future applications including e-cockpits, Artificial Intelligence (AI) databases, ADAS, advanced infotainment systems, and autonomous computers. As the first 256GB e.MMC using 64-Layer 3D NAND TLC flash technology in the automotive market, the new Western Digital iNAND AT EM132 EFD extends the life of e.MMC beyond 2D NAND to meet evolving application needs and growing capacity requirements.

According to Neil Shah, partner and research director, Counterpoint Research, "Storage is one of the fastest growing semiconductor applications in a connected autonomous car. The advanced in-vehicle infotainment (IVI), AI and sensor-driven autonomous driving systems generate large amounts of data that needs to be processed and stored locally at the edge. The average capacity of storage required per vehicle is expected to balloon beyond 2TB by 2022."

SK Hynix Inc., announced today that it has delivered samples of new 1Tb (Terabit) QLC (Quadruple Level Cell) product to major SSD (Solid State Drive) Controller companies. The Company applied its own QLC technology to its world's first 96-Layer "CTF (Charge Trap Flash) based 4D (Four-Dimensional) NAND Flash (or 4D NAND)." SK Hynix intends to expand its NAND portfolio to 96-layer-based 1Tb QLC products in time for the QLC market opening and strengthen its responsiveness to the next-generation high-density memory market.

QLC stores four bits of data in one NAND cell, allowing higher density compared to TLC (Triple Level Cell) that stores three bits per cell. Using QLC, it is possible to develop high-density products with cost competitiveness. SK Hynix is able to secure the industry's top-level cost competitiveness through this product, which has reduced the area to less than 90% of the existing 3D-based QLC products.

Western Digital is launching a behemoth, consumer-oriented 4 TB SSD based on its WD Blue product line. The WD Blue 4 TB uses the SATA interface (for which controllers are still slightly cheaper than for NVMe solutions) with a Marvell 88SS1074 4-channel controller with a 64-layer 3D TLC NAND from SanDisk. Read and write speeds are basically SATA III-bound (sequential 560MB/s read and 530MB/s write speeds, with random 4K read/write of 95K/82K IOPS.)

The WD Blue 4TB SATA SSD has its official availability date on May 13th, but it's already popping up here and there around retailers' shops in Europe. The 4 TB SSD is being priced at €545, which seems to be inline with expectations for such a capacity level. Quick napkin math saying that these should find a home at the sub-$500 level is very likely accurate, considering past pricing practices from manufacturers between the European and US markets.

Intel Corporation today reported first-quarter 2019 financial results. "Results for the first quarter were slightly higher than our January expectations. We shipped a strong mix of high performance products and continued spending discipline while ramping 10nm and managing a challenging NAND pricing environment. Looking ahead, we're taking a more cautious view of the year, although we expect market conditions to improve in the second half," said Bob Swan, Intel CEO. "Our team is focused on expanding our market opportunity, accelerating our innovation and improving execution while evolving our culture. We aim to capitalize on key technology inflections that set us up to play a larger role in our customers' success, while improving returns for our owners."

In the first quarter, the company generated approximately $5.0 billion in cash from operations, paid dividends of $1.4 billion and used $2.5 billion to repurchase 49 million shares of stock. In the first quarter, Intel achieved 4 percent growth in the PC-centric business while data-centric revenue declined 5 percent.

SK Hynix Inc. today announced financial results for its first quarter 2019 ended on March 31, 2019. The consolidated first quarter revenue was 6.77 trillion won while the operating profit amounted to 1.37 trillion won and the net income 1.1 trillion won. Operating margin for the quarter was 20% and net margin was 16%.

Because of a faster-than-expected price decline and lower shipments due to slowing memory demand, the revenue and the operating profit in the first quarter fell by 32% and 69%, respectively, quarter-over-quarter (QoQ). Due to seasonal slowdown and conservative server purchases, DRAM bit shipments decreased by 8% QoQ. The average selling price dropped by 27%. For NAND Flash, the average selling price decreased by 32% due to high inventory levels and intensifying competition among suppliers. The bit shipments declined by 6% QoQ.

Intel today revealed details about Intel Optane memory H10 with solid-state storage - an innovative device that combines the superior responsiveness of Intel Optane technology with the storage capacity of Intel Quad Level Cell (QLC) 3D NAND technology in a single space-saver M.2 form factor. "Intel Optane memory H10 with solid-state storage features the unique combination of Intel Optane technology and Intel QLC 3D NAND - exemplifying our disruptive approach to memory and storage that unleashes the full power of Intel-connected platforms in a way no else can provide," said Rob Crooke, Intel senior vice president and general manager of the Non-Volatile Memory Solutions Group.

Combining Intel Optane technology with Intel QLC 3D NAND technology on a single M.2 module enables Intel Optane memory expansion into thin and light notebooks and certain space-constrained desktop form factors - such as all-in-one PCs and mini PCs. The new product also offers a higher level of performance not met by traditional Triple Level Cell (TLC) 3D NAND SSDs today and eliminates the need for a secondary storage device.

Western Digital Corp. today unveiled the new Western Digital WD Purple SC QD312 Extreme Endurance microSD card for designers and manufacturers of AI-enabled security cameras, smart video surveillance and advanced edge devices that capture and store video at higher bit rates than mainstream cameras. According to IHS Markit, global shipments of professional video surveillance cameras are expected to grow from 127 million to over 200 million between 2017 and 2022, and those with on-board storage are expected to grow by an average of approximately 19 percent per year.

With the migration to 4K and higher video resolutions, and the introduction of more smart cameras with built-in AI and improved local processing capabilities, surveillance cameras need to be able to store both video and raw data to facilitate these AI capabilities. As a result, storage with higher capacity, more intelligence and greater durability is increasingly required.

Intel Tuesday unveiled a new portfolio of data-centric solutions consisting of 2nd-Generation Intel Xeon Scalable processors, Intel Optane DC memory and storage solutions, and software and platform technologies optimized to help its customers extract more value from their data. Intel's latest data center solutions target a wide range of use cases within cloud computing, network infrastructure and intelligent edge applications, and support high-growth workloads, including AI and 5G.

Building on more than 20 years of world-class data center platforms and deep customer collaboration, Intel's data center solutions target server, network, storage, internet of things (IoT) applications and workstations. The portfolio of products advances Intel's data-centric strategy to pursue a massive $300 billion data-driven market opportunity.