TSMC has reportedly postponed the opening ceremony of its Arizona Fab 21 facility, initially planned for December 6, amidst the changing US political landscape. The ceremony is now expected to take place after President-elect Donald Trump's inauguration in early 2025, showing that the chipmaker is taking a cautious approach to geopolitical shifts. The delay comes as TSMC finds itself at the intersection of global semiconductor politics. The company has invested heavily in its Arizona operations (estimated at $65 billion total), with Wang Yinglang, deputy general manager of wafer factory operations, leading the project. Despite initial skepticism, Wang's team has maintained an ambitious timeline, with mass production scheduled to begin in the first half of 2025.

Rumors also suggest that TSMC's decision stems from broader concerns about the incoming administration's semiconductor policies. However, TSMC maintains a strong position due to its unmatched technological capabilities, particularly in advanced manufacturing processes, which competitors like Intel and Samsung struggled to achieve. The Arizona facility represents a crucial piece of TSMC's global expansion strategy, which includes new factories in Japan and Germany. While the company faces challenges, including labor issues and rising costs in the US, its strategic importance to the global semiconductor supply chain remains unchanged. The only thing that is changing is the timeline of the opening ceremony, while high-volume production stays on track.

Microsoft has long been rumored to be working on a gaming handheld to compete with the likes of Valve's Steam Deck and the ASUS ROG Ally and Lenovo Legion Go, but all we've had to go on until now is unfounded rumors and leaks. Now, Phil Spencer, head of Microsoft Gaming, has confirmed that the software giant is actively working on a Steam Deck challenger, although details are scant, and the timeline is unclear at best.

In a recent interview with Bloomberg, Spencer confirmed that Microsoft is working on an Xbox handheld, although he was very careful to not overpromise or provide any firm release dates, going so far as to confirm that an Xbox handheld is still years away from release. Spencer reiterated in the review that Microsoft was still looking to grow its presence in the gaming industry, which is one of the company's motivations for getting into the gaming handheld market, in the first place. He also confirmed that Microsoft will be pursuing further mergers and acquisitions in the future as part of its gaming push—a move that might not be looked upon favorably by many gamers and regulatory bodies.

Even with billions of US dollars being invested overseas, TSMC cannot legally manufacture its most advanced nodes outside of Taiwan. According to Taiwan's Minister of Economic Affairs J.W. Kuo, "Since Taiwan has regulations to protect its own technologies, TSMC cannot produce 2-nanometer chips overseas currently." He added, "Although TSMC plans to make 2-nanometer chips [abroad] in the future, its core technology will stay in Taiwan." This provides crucial insight into TSMC's strategic positioning, both in its US expansion plans and in navigating global geopolitical waters, especially with Taiwan being the major hub of silicon innovation. Taiwan's semiconductor industry follows strict regulations regarding overseas production capabilities, requiring companies to maintain their most advanced manufacturing processes within Taiwan.

The company's international expansion strategy includes significant developments in the United States. TSMC's Arizona facilities are central to these plans, with multiple fabs in different stages of development. The initial Arizona facility will begin producing 4 nm chips imminently, while a second facility, scheduled to open in 2028, will manufacture then mature 3 nm and 2 nm chips. A third planned facility aims to produce 2 nm or more sophisticated chips. Meanwhile, Taiwan-based facilities will produce more advanced chips at the same time, with volume production of A-16 chips planned for late 2026, following the rollout of 2 nm chip production in 2025. Furthermore, Taiwan-US semiconductor cooperation will continue regardless of political changes. Taiwan Semiconductor Industry Association (TSIA) Chairman and TSMC Senior Vice President Cliff Hou noted that historical evidence suggests US electoral outcomes have not significantly impacted this technological partnership, though some adjustments may occur.

Anthropic and Palantir Technologies Inc. (NYSE: PLTR) today announced a partnership with Amazon Web Services (AWS) to provide U.S. intelligence and defense agencies access to the Claude 3 and 3.5 family of models on AWS. This partnership allows for an integrated suite of technology to operationalize the use of Claude within Palantir's AI Platform (AIP) while leveraging the security, agility, flexibility, and sustainability benefits provided by AWS.

The partnership facilitates the responsible application of AI, enabling the use of Claude within Palantir's products to support government operations such as processing vast amounts of complex data rapidly, elevating data driven insights, identifying patterns and trends more effectively, streamlining document review and preparation, and helping U.S. officials to make more informed decisions in time-sensitive situations while preserving their decision-making authorities. Claude became accessible within Palantir AIP on AWS earlier this month.

The American semiconductor landscape reached a significant milestone as TSMC's new Arizona manufacturing facility demonstrated remarkable production efficiency, exceeding its Taiwanese counterparts by 4% in yield rates. This achievement, revealed at a recent industry webinar by the company's US division chief, represents a major step forward in America's push to strengthen domestic chip manufacturing capabilities. Since initiating its 4 nm node production operations this spring, the Phoenix-based facility has demonstrated impressive technical proficiency, achieving production standards that match and surpass TSMC's established Taiwanese facilities. The project, backed by substantial federal support, including $11.6 billion in combined grants and loans plus significant tax incentives, aims to establish three cutting-edge manufacturing plants in Arizona.

The company's global leadership praised the facility's performance, noting its strategic importance in demonstrating TSMC's ability to maintain exceptional manufacturing standards across international locations. This success carries particular weight given the project's earlier hurdles, which included workforce challenges and timeline adjustments that shifted the entire production schedule by approximately one year. This development gains additional significance against industry-wide challenges, particularly as competitors like Intel and Samsung face operational and financial obstacles. The semiconductor giant's plans now extend to potential further expansion, with the Phoenix site capable of hosting up to six manufacturing facilities. Future growth prospects could be enhanced by proposed additional government initiatives supporting domestic chip production.

In an interview with Reviews.org, Valve's designers Lawrence Yang and Yazan Aldehayyat discussed the Steam Deck. They talked about the console's future and confirmed that it will not have a yearly release schedule like most handheld console makers. Usually, makers of handheld PCs and gaming consoles like ASUS with its ROG Ally, GPD with its Pocket, Lenovo with Legion GO, and many others follow a yearly update structure of its products to put the latest and greatest chipsets into their products. However, Valve is taking a more conservative approach to updating its famous Steam Deck console.

"We're not going to do a bump every year," said Lawrence Yang, adding that "There's no reason to do that. And, honestly, from our perspective, that's kind of not really fair to your customers to come out with something so soon that's only incrementally better. So we really do want to wait for a generational leap in compute without sacrificing battery life before we ship the real second generation of Steam Deck. But it is something that we're excited about and we're working on." The infamous successor to the original Steam Deck, Steam Deck 2, is currently shrouded in mystery. We don't have much information about the hardware that will power it, nor is there a release date. However, as Valve notes, it will be a "generational leap in compute" bringing more gaming capability to the platform. With many competitors releasing handheld gaming consoles, we are expecting Valve to come out with a new console soon.

After Apple, we just learned that AMD is the next company in line for US-based manufacturing in the TSMC Arizona facility. Industry analyst Tim Culpan reports that TSMC's Fab 21 in Arizona will soon be producing AMD's high-performance computing (HPC) processors, with tape out and manufacturing expected to commence on TSMC's 5 nm node next year. This move comes after previously reported Apple's A16 SoC production, which is already in progress at the facility and could see shipments before the end of this year, significantly ahead of the initially projected early 2025 schedule. The production of AMD's HPC chips in Arizona marks a crucial step towards establishing an AI-hardware supply chain operating entirely on American soil, which is expected to further expand with Intel Foundry and Samsung Texas facility.

Making HPC processors domestically serves as a significant milestone in reducing dependence on overseas semiconductor manufacturing and strengthening the US's position in the global chip industry. Adding to the momentum, TSMC and Amkor recently announced a collaboration on advanced packaging technologies, including Integrated Fan-Out (InFO) and Chip-on-Wafer-on-Substrate (CoWoS), which are vital for high-performance AI chips. However, as Amkor facilities are yet to be built, these chips are going to be shipped back to Taiwan for packaging before being integrated into the final product. Once the Amkor facility is up and running, Arizona will become the birthplace of fully manufactured and packaged silicon chips.

Following Epic Games's recent victory over Apple, which effectively forced the iPhone maker to allow third-party apps on iOS in the EU, the game developer and distributor has won a similar case against Google, except in the US, this time. The ruling places several restrictions on what Google can and can't do when it comes to the Android operating system and how it positions its own apps and services on Android phones, including prohibiting Google from paying device manufacturers to include its Play software on their devices and forcing developers to use Google's payment platform.

The ruling (PDF) and its consequent restrictions will start on November 1, 2024, will last three years, and Google isn't particularly happy about the mandated changes, having already confirmed that it will appeal the decision, citing security concerns and arguing that the order would negatively affect developers: "these changes would put consumers' privacy and security at risk, make it harder for developers to promote their apps, and reduce competition on devices."

Super Flower, a leader in high-performance power supply units (PSUs), is thrilled to announce the launch of a full product lineup that extends beyond their renowned PSUs. This comprehensive expansion includes air coolers, water coolers, case fans, and chassis, aiming to provide PC enthusiasts with a broader range of components that deliver both performance and aesthetic appeal. The new products are designed to meet the diverse needs of gamers, content creators, and tech enthusiasts who seek reliable, high-quality solutions for their custom builds.

Leading the lineup is the Leadex III ATX 3.1, available in 650 W, 750 W, 850 W, 1000 W, and 1300 W configurations. This PSU exemplifies Super Flower's commitment to excellence, offering unmatched performance, efficiency, and safety for even the most demanding systems. Its advanced features cater to gamers and power users alike, ensuring stability and reliability under intense loads.

According to a recent Reuters report, the US government, under Biden's administration, will allow a few criteria-matching semiconductor fabs to circumvent environmental protection laws. On Wednesday, President Joe Biden signed legislation that effectively enables these fabs to not follow the strict regulations designed for maximum preservation of the environment. The Semiconductor Industry Association has noted that without this new legislation, companies that are extending facilities on US soil would be significantly slowed down due to the National Environmental Policy Act (NEPA) of 1969. The CHIPS Act's primary force driver isn't just domestic production but near-future completion so that future geopolitical shifts don't impact US companies. The speed of getting permits to manufacture advanced chips is essential for every CHIPS Act recipient company, like Intel, Samsung, TSMC, and Micron.

Huawei has reportedly started shipping its Ascend 910C accelerator—the company's domestic alternative to NVIDIA's H100 accelerator for AI training and inference. As the report from China South Morning Post notes, Huawei is shipping samples of its accelerator to large NVIDIA customers. This includes companies like Alibaba, Baidu, and Tencent, which have ordered massive amounts of NVIDIA accelerators. However, Huawei is on track to deliver 70,000 chips, potentially worth $2 billion. With NVIDIA working on a B20 accelerator SKU that complies with US government export regulations, the Huawei Ascend 910C accelerator could potentially outperform NVIDIA's B20 processor, per some analyst expectations.

If the Ascend 910C receives positive results from Chinese tech giants, it could be the start of Huawei's expansion into data center accelerators, once hindered by the company's ability to manufacture advanced chips. Now, with foundries like SMIC printing 7 nm designs and possibly 5 nm coming soon, Huawei will leverage this technology to satisfy the domestic demand for more AI processing power. Competing on a global scale, though, remains a challenge. Companies like NVIDIA, AMD, and Intel have access to advanced nodes, which gives their AI accelerators more efficiency and performance.

TSMC and Samsung are reportedly in talks with the United Arab Emirates (UAE) to establish chip factories in the Gulf nation. As reported by the Wall Street Journal, this "desert dream" aligns with the UAE's ambitious plans to diversify its economy beyond oil and become a key player in the AI sector by building chips for AI domestically. The UAE and neighboring Saudi Arabia plan to leverage their oil wealth to invest in cutting-edge manufacturing, with AI emerging as a primary focus due to its high computational demands. Successful implementation of chip factories could significantly boost the region's AI capabilities and impact the global semiconductor supply chain. However, the project faces substantial challenges. Previous attempts to establish semiconductor manufacturing in the Gulf, such as the GlobalFoundries initiative over a decade ago, have yet to progress beyond initial planning.

The current proposal faces even greater obstacles, with estimated costs exceeding $100 billion for a state-of-the-art facility and necessary infrastructure. Geopolitical concerns add another layer of complexity. Recent US export restrictions of certain chips to the Gulf region may complicate the transfer of advanced manufacturing processes to the UAE. Despite these hurdles, the potential benefits are significant. For the UAE, success would represent a major step towards economic diversification and technological leadership. TSMC and Samsung could gain a strategic presence in a region eager for technological advancement. TSMC noted that the company focuses on current expansion projects in the US, Japan, and Germany, while Samsung declined to comment.

The $8.5 billion in CHIPS Act assistance intended for Intel from the US government is expected to be delayed due to the company's ongoing financial struggles. According to a Bloomberg report, the Department of Commerce rejected the initial allocation request, requiring Intel to meet specific objectives and complete a comprehensive due diligence process before the funds are released.

Intel has committed to remaining engaged in discussions despite the additional requirements, though it encountered regulatory and timing challenges. The terms of the funding include $8.5 billion in direct assistance to Intel, along with $11 billion in low-cost credit, and a 25 percent tax credit worth up to $100 billion for Intel's investments in Arizona, New Mexico, Ohio, and Oregon.

TSMC has reportedly managed to produce yields at its Arizona facility that are on par with yields back home in Taiwan, making its expansion efforts successful. According to Bloomberg, TSMC did a trial production, a multi-month effort, to produce N4 node wafers with low defect rates. With wafers now in TSMC's labs for testing, it is reported that Arizona facility yields have achieved parity with their Taiwanese facilities back home. This indicates that TSMC's efforts to expand in the US are so far considered a success, as advanced chipmaking is a very complex process that is only done by a few makers and in very few locations. With TSMC expanding in the US now and proving that its technology can work on US soil, the company has a green light to start volume production in the first half of 2025.

However, this is only the beginning of TSMC's Arizona expansion. The Taiwanese giant plans to have a second fab operational by 2028 and produce 2 nm and 3 nm chips in the state. Additionally, there will be a third facility for 2 nm and more advanced nodes in Phoenix, bringing the total value of TSMC's US expansion efforts to $65 billion, with $6.6 billion from the CHIPS Act grants and $5 billion in loans from the US government. If upcoming fabs follow the lead of the first facility, US-based production needs will possibly be satisfied.

The Netherlands government announced additional export controls on advanced chipmaking equipment on Friday. This decision, which specifically targets ASML's DUV immersion lithography tools, has drawn sharp criticism from Beijing. The new regulations, aligning with similar restrictions imposed by the US last year, will require additional licensing for the export of ASML's 1970i and 1980i models. China's Commerce Ministry swiftly responded to the announcement, expressing dissatisfaction with what it perceives as unwarranted restrictions on trade. In a statement released Sunday, the ministry accused the United States of leveraging its global influence to pressure allies into tightening export controls, describing it as an attempt to maintain "global hegemony" in the semiconductor industry.

The Chinese government urged the Netherlands to reconsider its position, calling for a balance between security concerns and the preservation of mutually beneficial economic ties. Beijing emphasized the importance of safeguarding the "common interests" of businesses in both countries and warned against potential damage to Sino-Dutch cooperation in the semiconductor sector. Dutch Trade Minister Reinette Klever defended the decision, stating it was made "for our safety." However, this move could have significant implications for ASML, which has already faced restrictions on exporting its most advanced systems to China. ASML receives as much as 49% of its revenue from China, meaning that additional export regulations could significantly reduce revenues if licenses aren't approved.

According to a recent report from Nikkei, China has claimed the number one spot as the single highest spender on chipmaking tools. As the data from SEMI highlights, China spent a whopping $25 billion on key semiconductor tools in the first half of 2024, more than the US, Taiwan, and South Korea combined. And the train of acceleration for the Chinese semiconductor industry doesn't seem to be slowing down, as the country is expected to spend more than $50 billion for the entire year 2024. However, this equipment is not precisely leading-edge, as Chinese companies are under Western sanctions and are unable to source advanced EUV lithography tools for making sub-7 nm chips.

Most of the spending is allocated to mature node chipmaking facilities. These so-called "second tier" companies are driving the massive expenditures, and they are plentiful. Nikkei reports that there are at least ten firms that operate with mature nodes like 10/12/16 nm nodes. Being the biggest spender, China is also one of the primary revenue sources for many companies. For the US chipmaking tool companies like Applied Materials, Lam Research, and KLA, Chinese purchases accounted for 32%, 39%, and 44% of their latest quarterly revenue, respectively. Tokyo Electron recorded orders to China accounting for 49.9% of its revenues in June, while the Netherlands giant ASML also attributed 49%. Perhaps even more interesting is the expected outlook for 2025, which shows no signs of slowing down. The Chinese semiconductor industry must establish complete self-sufficiency, and massive capital expenditures are expected to continue.

According to a recent report from Bloomberg, Intel is in talks with investment banks about a possible spin-out of its foundry business, as well as scraping some existing expansion plans to cut losses. As the report highlights, sources close to Intel noted that the company is exploring various ways to deal with the recent Q2 2024 earnings report. While Intel's revenues are in decline, they are still high. However, the profitability of running its business has declined so much that the company is now operating on a net loss, with an astonishing $1.61 billion in the red. CEO Pat Gelsinger is now exploring various ways to control these losses and make the 56-year-old giant profitable again. Goldman Sachs and Morgan Stanley are reportedly advising Intel about its future moves regarding the foundry business and overall operations.

The Intel Foundry unit represents the biggest consumer of the company's funds, as the expansion plans across the US and Europe are costing Intel billions of US Dollars. Even though the company receives various state subsidies to build semiconductor manufacturing facilities, it still has to put much of its capital to work. Given that the company is running tight on funds, some of these expansion plans that are not business-critical may get scraped. Additionally, running the foundry business is also turning out to be rather costly, with Q2 2024 recording a negative 65.5% operating margin. Separating Intel Product and Intel Foundry may be an option, or even selling the foundry business as a whole is on the table. Whatever happens next is yet to be cleared up. During the Deutsche Bank Technology Conference on Thursday, Pat Gelsinger also noted that "It's been a difficult few weeks" for Intel, with many employees getting laid off to try to establish new cost-saving measures.

Latest reports indicate that sanctioned Chinese PC hardware manufacturer DeepCool's products have appeared on major US online marketplaces under the brand "Shaking Tank," as revealed by YouTuber Greg Salazar on social media platform X. This comes two months after the US State Department sanctioned DeepCool for alleged business with Russian firms involved in the Ukraine conflict, barring US sales and imports of their products. Despite this, retailers like Amazon and Newegg list apparent DeepCool products under the Shaking Tank brand. These listings show product renders with the DeepCool logo blurred or removed. Fan hubs previously displaying the DeepCool emblem now show blank spaces, and product packaging has obscured identifying marks. Examples include the DeepCool AK620 and LS720 models, now advertised as ShakingTank AK620 and LS720.

The nature of this rebranding still needs to be clarified. While DeepCool adopting a new name to bypass sanctions would likely face severe legal consequences, more plausible explanations include a reseller rebranding remaining inventory or retailers clearing sanctioned stock. This situation questions trade sanctions' effectiveness and enforcement in the global marketplace, leaving consumers uncertain about DeepCool's future in the US market and potential impacts on international trade regulations.

The market for artificial intelligence (AI) platforms software grew at a rapid pace in 2023 and is projected to maintain its remarkable momentum, driven by the increasing adoption of AI across many industries. A new International Data Corporation (IDC) forecast shows that worldwide revenue for AI platforms software will grow to $153.0 billion in 2028 with a compound annual growth rate (CAGR) of 40.6% over the 2023-2028 forecast period.

"The AI platforms market shows no signs of slowing down. Rapid innovations in generative AI is changing how companies think about their products, how they develop and deploy AI applications, and how they leverage technology themselves for reinventing their business models and competitive positioning," said Ritu Jyoti, group vice president and general manager of IDC's Artificial Intelligence, Automation, Data and Analytics research. "IDC expects this upward trajectory will continue to accelerate with the emergence of unified platforms for predictive and generative AI that supports interoperating APIs, ecosystem extensibility, and responsible AI adoption at scale."

The PC market gathered momentum in Q2 2024, with worldwide shipments of desktops and notebooks up 3.4% year-on-year, reaching 62.8 million units. Shipments of notebooks (including mobile workstations) hit 50 million units, growing 4%. Desktops (including desktop workstations), which constitute 20% of the total PC market, experienced a slight 1% growth, totaling 12.8 million units. The stage is now set for accelerated growth as the refresh cycle driven by the Windows 11 transition and AI PC adoption ramps up over the next four quarters.

"The PC industry is going from strength to strength with a third consecutive quarter of growth," said Ishan Dutt, Principal Analyst at Canalys. "The market turnaround is coinciding with exciting announcements from vendors and chipset manufacturers as their AI PC roadmaps transition from promise to reality. The quarter culminated with the launch of the first Copilot+ PCs powered by Snapdragon processors and more clarity around Apple's AI strategy with the announcement of the Apple Intelligence suite of features for Mac, iPad and iPhone. Beyond these innovations, the market will start to benefit even more from its biggest tailwind - a ramp-up in PC demand driven by the Windows 11 refresh cycle. The vast majority of channel partners surveyed by Canalys in June indicated that Windows 10 end-of-life is likely to impact customer refresh plans most in either the second half of 2024 or the first half of 2025, suggesting that shipment growth will only gather steam in upcoming quarters."

PC (excluding tablets) shipments to the United States grew 5% year-on-year to 14.8 million units in Q1 2024. The consumer and SMB segments were the key growth drivers, both witnessing shipment increases above 9% year-on-year in the first quarter. With a strong start to the year, the market is now poised for a healthy recovery trajectory amid the ongoing Windows refresh cycle. Total PC shipments to the US are expected to hit 69 million units in 2024 before growing another 8% to 75 million units in 2025.

For the third consecutive quarter, the consumer segment showed the best performance in the US market. "Continued discounting after the holiday season boosted consumer demand for PCs into the start of 2024," said Greg Davis, Analyst at Canalys. "However, the first quarter also saw an uptick in commercial sector performance. Shipment growth in small and medium businesses indicates that the anticipated refresh brought by the Windows 10 end-of-life is underway. With enterprise customers set to follow suit, the near-term outlook for the market remains highly positive."

Legendary overclocker Vince Lucido, aka KINGPIN, has reportedly partnered with PNY to develop next-generation GPUs for extreme overclocking. KINGPIN, known for his unparalleled expertise in pushing hardware to its limits, revealed the partnership during a recent interview with Gamers Nexus at Computex 2024. The move comes as welcome news to enthusiasts who have been eagerly awaiting KINGPIN's next venture since EVGA's departure left a noticeable gap in the high-end GPU segment. Previously, he was the leading engineer of EVGA's high-end KINGPIN designs aimed at pushing the GPU to its limits. However, since EVGA decided to leave the GPU business, KINGPIN was looking for a new company to work on the next-generation GPU designs.

This time, the company of choice for KINGPIN is now PNY. While he has been in contact with many companies like GALAX and ASUS, he claims that it would be very crowded to work there as there are "too many cooks in the kitchen" with these companies already having in-house overclockers. He has also been talking with MSI, but the company wasn't interested in making GPUs for extreme overclocking. However, PNY has been very interested in shaking up the high-end GPU market. KINGPIN claims that there is a massive hole in the high-end GPU market, and he hopes to fill it with a collaboration with PNY. Next-generation GPU designs assisted by KINGPIN will reportedly arrive for the upcoming NVIDIA GeForce RTX 50 series of GPUs when we hope to see the legacy EVGA left to continue at PNY.

Mimir IP, a South Korean patent management company, bought around 1,500 chip-related patents from SK hynix in May. They have now filed a lawsuit against the U.S. memory company Micron, accusing it of using these patents without permission, TrendForce reported. If Mimir wins, they could get up to USD 480 million in damages. The lawsuit, filed on June 3, also targets Tesla, Dell, HP, and Lenovo for using Micron's products. The patents in question are related to circuits, voltage measurement devices, and non-volatile memory devices.

The case is being heard in the US District Court for the Eastern District of Texas and the US International Trade Commission. This is the first time a South Korean company that acquired patents from domestic chipmakers has filed a lawsuit against a US semiconductor company. Officials from the involved companies have not commented. Micron, Samsung, and SK hynix have been changing how they deal with their patents recently, so this is not really a surprise move. In March 2023, Micron transferred over 400 chip-related patents to Lodestar Licensing Group. In June 2023, Samsung transferred 96 US chip patents, including the right to file patent infringement complaints, to IKT, an affiliate of Samsung Display.

The United States Federal Trade Commission (FTC) has taken legal action against software giant Adobe and two of its top executives for allegedly deceiving consumers about the actual costs of its popular subscription services and deliberately obstructing cancellations. In a federal court complaint filed by the Department of Justice at the FTC's request, the commission accuses Adobe of obscuring hefty early termination fees and making it excessively difficult for customers to cancel their subscriptions. The complaint alleges that when signing up for subscriptions on Adobe's website, the company steers consumers toward the "annual paid monthly" option, pre-selecting it as the default while burying details about the 50% early termination fee for canceling within the first year. Customers have lodged numerous complaints, saying they were unaware the plan committed them for a full year.

According to the FTC, even when customers did attempt to cancel, Adobe forced them to navigate a bureaucratic maze of web pages, unhelpful customer service reps, dropped calls, and transfers. Some customers who thought they had successfully canceled continued to be charged. Samuel Levine, Director of the FTC's Bureau of Consumer Protection, noted, "Adobe trapped customers into year-long subscriptions through hidden early termination fees and numerous cancellation hurdles." The complaint charges that these deceptive "dark patterns" violate the Restore Online Shoppers' Confidence Act. It names Adobe's President of Digital Media, David Wadhwani, and Vice President Maninder Sawhney as co-defendants for their oversight roles in these shady business practices.

XFX has prepared its newest "Magnetic Air" series of Radeon RX 7000 series GPUs with hot-swappable fans for the US market, where they were only exclusive to the Chinese region. The company has informed us that the series will be called "Magnetic Air," instead of the previously believed "MagAir." Comprising the XFX Qicksilver Radeon RX 7800 XT Magnetic Air and the XFX Mercury Radeon RX 7900 XTX Magnetic Air, these GPUs are now available for purchase in the US, with an official launch date set for June 18. What sets the Magnetic Air series apart is its unique cooling design, featuring Honeywell PTM 7950 phase-changing thermal pads that offer superior thermal conductivity. The cooling system boasts 216 ultra-thin matrix fins strategically arranged in a high and low structure to optimize airflow, while the heatsink is attached to a vapor chamber for efficient heat dissipation. Additionally, the backplate is crafted from durable aluminium die-cast, ensuring long-lasting performance.

The XFX Qicksilver Radeon RX 7800 XT Magnetic Air is available in both white and black variants, priced at $529.99, while the XFX Mercury Radeon RX 7900 XTX Magnetic Air carries a price tag of $979.99. The most innovative feature of the Magnetic Air series is its swappable fan design, allowing users to customize their cooling setup to suit their specific needs. This level of flexibility is sure to appeal to enthusiasts and overclockers seeking optimal performance from their rigs. Currently, only the black variants of the 7900XTX and 7800XT are in stock, but all Magnetic Air models are expected to be available on the official launch date of June 18 for PC enthusiasts in the United States.

[Editor's note: Our in-depth review of the RX 7900 XTX Magnetic Air is now live]