Wednesday, May 13th 2020
TSMC Says it Still Won't Build a Fab in the US
TSMC, as one of the largest silicon manufacturers in the world, has been subject to pressure from the Trump administration to build a Fab and manufacture silicon on US soil. The reasoning behind this is that the US government could order chips that are supposed to be used in military applications. For security reasons, they need to be manufactured on US grounds and "checked" by the US government. However, it seems like a Taiwanese company has no concrete plans to realize the building of the US Fab.
Thanks to the report of DigiTimes, TSMC has confirmed that they have resisted requests from the US government, and will not build a Fab on US soil for the government. They haven't dismissed the possibility of building one or silicon manufacturing facilities in the US completely. TSMC chairman Mark Liu has told DigiTimes previously that if the company wants to build a US Fab, it will do so because of consumer demand, not the government demand. And that is understandable. It is much easier to work with regular customers compared to the US government which would force a company to go through rigorous security levels to deliver chips.
Source:
DigiTimes
Thanks to the report of DigiTimes, TSMC has confirmed that they have resisted requests from the US government, and will not build a Fab on US soil for the government. They haven't dismissed the possibility of building one or silicon manufacturing facilities in the US completely. TSMC chairman Mark Liu has told DigiTimes previously that if the company wants to build a US Fab, it will do so because of consumer demand, not the government demand. And that is understandable. It is much easier to work with regular customers compared to the US government which would force a company to go through rigorous security levels to deliver chips.
45 Comments on TSMC Says it Still Won't Build a Fab in the US
There are Wiki articles which confirm, and they don't even include Intel's 10nm+.
en.wikipedia.org/wiki/10_nm_process
en.wikipedia.org/wiki/7_nm_process
Put two and two together and there is no way we can conclude that Intel's 10nm is now somehow better than 7nm TSMC, in fact, it is likely NOT to be. There are also real world products on 10nm and 7nm that are remarkably similar and we see power and clocking advantages for the 7nm versions. Architecture of course plays a role, but fact is, net perf/watt is strong on 7nm, and does not manage to scale well at 10nm. Otherwise Intel would never have respinned their 14nm for the umpteenth time. There is no tangible high performance CPU on 10nm available. The best they have is low power optimized.
Stay on topic and play nice.
Report problems... don't reply and become one.
Thank you,
Have a glorious day.
Intel states 100.8 MTr/sq.mm for 60/40 NAND+SFF logic.
newsroom.intel.com/newsroom/wp-content/uploads/sites/11/2017/09/10-nm-icf-fact-sheet.pdf
This whole proposition smells of horse piss, cause in the long run US govt. can use that fab, or a threat of switching to Intel as a leverage whenever they need something from TSMC.
DoD contracts may be good and plenty, but the real agenda is too obvious.
Intel can produce a smaller die, and ever since they moved to 22nm there are consistent problems with heat captured inside that tiny die. They are fighting that problem to this day, forced to move to different solutions under the IHS to make it work. On 10nm, their high density does not translate to higher performance than the competition.
Density only really matters from a cost/yield perspective.
Sorry, 99 years.
anyways, all country's have a agenda and better support those who support you. And tbh i bet their is many reason's why they will not build another ? fab in the US. Their site seems to show they do have one in WA already how ever @R-T-B said one was in New York ?, which i remember being talked about some years ago.
From the OP: