Thursday, July 27th 2023
Leaker Claims No Liquid Metal Cooling for PlayStation 5 Refresh
PlayStation 5-related rumors have been flowing over the past week—Zuby_Tech was reportedly the main source responsible for leaking out Project Q footage, but the tipster has turned to his attention to an alleged new version of the host system. Yesterday's tweet makes reference to a refreshed PlayStation 5 model—the "CFI-1300 series"—with a revised 5 nm APU. The late-2020 launch model (CFI-1200) sported a 7 nm chipset, while 2022's die shrink granted the CFI-1202 series with a 6 nm SoC.
The tipster thinks that Sony will be dropping the PS5's liquid metal cooling system for its next iteration, thanks to a central 5 nm part offering greater efficiency and reduced thermal output. Previous reports have predicted that this refreshed "modular model" is marked for a late 2023 release window. Sony has been running a summer price reduction campaign—could this marketing incentive be clearing the way—i.e selling off older stock—in anticipation of the refreshed model's arrival? "CFI-1300" should not be confused with the heavily rumored PlayStation 5 Pro variant—Insider Gaming's Tom Henderson has reiterated multiple times that this major hardware upgrade is still a long way off from launching.
Sources:
Zuby_Tech Tweet, Wccftech
The tipster thinks that Sony will be dropping the PS5's liquid metal cooling system for its next iteration, thanks to a central 5 nm part offering greater efficiency and reduced thermal output. Previous reports have predicted that this refreshed "modular model" is marked for a late 2023 release window. Sony has been running a summer price reduction campaign—could this marketing incentive be clearing the way—i.e selling off older stock—in anticipation of the refreshed model's arrival? "CFI-1300" should not be confused with the heavily rumored PlayStation 5 Pro variant—Insider Gaming's Tom Henderson has reiterated multiple times that this major hardware upgrade is still a long way off from launching.
17 Comments on Leaker Claims No Liquid Metal Cooling for PlayStation 5 Refresh
I know people tried regular paste on the current PS5 and it overheats within minutes of gaming.
If the thermal density is just as high, trying to replace the broken soldered-pad with TIM will not go well.
We don't know how thermal dense is the new chip, how much power it will require (being N5 certainly less than current version), if they'll change to a new architecture (zen3 or zen4 for example) or what changes they might do to the cooler and overall design of the console. It's very premature to jump to any conclusions
I could see some 'work' needed to deal with any 'tricks, etc.' RDNA 2.0/Zen2-specific, but that's about it. Basically, Sony'll just need an updated I/O and Graphics Driver.
I'd laugh if Sony is just integrating a Phoenix-derivative APU. Considering how far-and-wide I've seen devices using APUs from that lineup, I'd bet the yields are fantastic. Note: Sony has been adamant that the APU in the PS5 is 'very custom' but I've not ever seen a detailed overview and x-ray comparisons.
Or maybe they just port everything to the lower node, they did with ps4 moving from 28nm to 16nm, the change from the current N6 (already upgraded from the launch N7 version) to N5 or N4 would already give them access to better efficiency and higher clocks.
www.anandtech.com/show/13570/the-amd-radeon-rx-590-review
Same ol shit some one venting idea's \ thought's and people over reacting.
I guess we will know sooner or later, not as if i care about any consoles anyways so.
But isn't PS5 backwards compatible with PS4?
Also:
Darkplates are a thing, this is how my PS5 looks. Dbrand also offer translucent variants now: