Leading global motherboard manufacturer, ASRock, proudly announces its new WRX90 WS EVO & TRX50 WS motherboard for new AMD Ryzen Threadripper 7000 and AMD Ryzen Threadripper PRO 7000 WX-Series processors. The new motherboards support 4/8 channel memory up to 1 TB/2 TB DDR5 ECC RDIMM, PCI-Express 5.0 expansion slots, server grade storage expansion such as Slim-SAS & MCIO and 10 Gbps Ethernet, giving ultimate performance for almost every application such as content creating, video rendering, high-end workstation and even AI machine learning.
Ultimate Performance & Rock-Solid Stability
To ensure stability for AMD Ryzen Threadripper 7000 and AMD Ryzen Threadripper PRO 7000 WX-Series processors in all conditions and systems loads, the WRX90 WS EVO & TRX50 WS has been given a flagship-class server grade ultra-low loss PCB and 18+3+3 phase SPS Dr.MOS VRM design to ensure ultimate performance and superb reliability, even when subjected to the most demanding sustained workloads.
To deliver ultimate performance and longevity, both motherboard is equipped with super large aluminium heat-pipe designed heatsink with server grade cooling fans, providing ultimate heat dissipation especially under overclocking.
Extreme Storage & PCIE 5.0 Performance
The new processor provides monstrous amount of PCIe 5.0 lanes and PCIe 4.0 lanes, with 144 usable PCIe 5.0/4.0 lanes for the WRX90 and 88 PCIe usable 5.0/4.0 for the TRX50, both motherboard is equipped with ample amount of PCIe slots for expansion, PCIe 5.0 x4 'Blazing' M.2 NVMe SSD Sockets, SlimSAS (SFF-8654) and MCIO connector offering the latest high speed and stable storage expansion possibilities, providing numerous storage options making them the perfect choice for your next high end desktop or even workstation build.
Ultimate Network Connectivity
Fast large file transferring is crucial for content creators, therefore TRX50 WS is equipped with Marvell 10 GbE & Realtek 2.5 GbE LAN to ensure superfast file-transfer speed to local server, NAS or Cloud storage. Wireless network is also available on both motherboard, Wi-Fi 6E with 2x2 antenna improves connection reliability and provides gigabit-class wireless networking, giving the convenience of high-speed, wire-free connectivity.
For WRX90 WS EVO, it's been armed with server grade Intel X710 dual 10GbE solution to ensure ultimate stability and networking performance. And besides the vast connectivity of WRX90 WS EVO motherboard, it also supports remote management via AST2600 BMC Server Management Processor, giving system administrators out-of-band managing and monitoring through IPMI interface.
44 Comments on ASRock Launches New AMD WRX90 & TRX50 Motherboards to Maximize Productivity for Creators and Machine Learning
Another regression from Zen3 to Zen4 high-end platforms is that chipset link speed has been halved! Oh dear... ♂️ This.
My work issued me a Dell laptop with TB4, so naturally I bought a Dell WD22TB4 dock for it. I have 3 monitors and the dock has 3 display outputs, so all good right? Nope, because as long as display is being output from the laptop, the Intel iGPU is in play... and its driver causes dwm.exe to leak memory like nobody's business (a longstanding known issue with Intel's fantastic graphics driver quality). The laptop does have a built-in RTX A2000... but its outputs route through the Intel iGPU, so the bad Intel driver remains in play, and the memory remains leaking.
So I decided to try something drastic. I purchased a TB4-to-PCIe adapter (TH3P4 Lite) off AliExpress, slapped in an RTX A2000 I snagged off Ebay and plugged in my 3 monitors, then plugged the TH3P4 into the dock. After a bit of messing around in the laptop's BIOS (disabling Intel TXT) and Windows (disabling the built-in RTX A2000), BAM I have full output of all my monitors being driven by the offboard RTX A2000 - which means the Intel iGPU has no hand in outputting anything, so no more memory leaks. And all of this with a single TB4 cable from laptop to dock.
Now, did I buy an eGPU dock and an external GPU just to solve a problem I can get around by killing dwm.exe from Task Manager a couple times a day? Yes, I did. But that's not the point, the point is that all of this (mostly) Just Works, and that would've been completely impossible to even think of half a decade ago. This is the kind of connectivity that professionals like myself don't just expect, but demand from our systems, because why the hell shouldn't we? And that kind of connectivity is what Thunderbolt provides, and what USB4 should provide, and that's why the lack of TB4/USB4 on so-called "high-end" motherboards, in both the standard consumer and now HEDT space, is so freaking bizarre.
Get with the program, AMD and Asrock.
It's unacceptable that memory leaks, of course, and that laptop does not have mux chip to output images from GPU and iGPU separately. How is it possible that all video outputs route through iGPU!? So stupid... Excellent job! That was a lot of work that you should have never carried out has Intel and laptop vendors provided a proper video output solution. Exactly. There is no excuse whatsoever for HEDT/WS boards, even upper mid-range and high-end desktop, not to provide TB4/USB4 connectivity in 2023. It's not a premium feature.
Essentially, the chipset was downgraded from X570 to B650, at the same time increasing the capability of CPU's connectivity more than the loss in the chipset. It's a good compensation. The CPU gained 20 usable PCIe lanes while the chipset lost 8. As a a whole, the new platform is substantially faster and more connected. It's up to motherboard vendors to expose this potential with imagination and engineering craftsmanship. AMD gave them a great platform to work with. Now, as someone said above, you have to be an idiot to place 4 and 5 fans on the motherboard, as well as ignorant to skip TB4/USB4 interface and DP IN ports. Asrock had brilliant Creator boards on Zen 3 platforms. I am confused as to why they made such a sharp turn now, instead of evolving and perfecting the past successful platform.
So, I would not pay too much attention to crippled chipset, as there is enough of peripherals on it for everything this platform needs from USB, SATA, (W)LAN and a few other bits. All other faster interfaces could be easily installed on CPU's PCIe lanes.
Part of the problem is actually the now really old and pretty bad ATX motherboard standard. If we moved the CPU to the middle of the PCB, things might get a bit better, at least in terms of lane routing. That does indeed appear to be the case. It's apparently called the Pro 695 though.
The trend looks quite opposite. At the end of the day, Threadrippers are simply adapted EPYC CPUs. EPYC processors sell like hot cakes. The same could easily happen with new Threadripper in relevant markets, such as media studios, scientific teams, auto industry design, game developers, enthusiasts, etc. There is an apetite for high-end compute around the world in specific sectors. If the entry platform is perceived as too expensive, people will not buy it and prices will have to go down, like Zen 4 desktop last year. It's really simple. I would not be surprised if the US government tries to restrict the access to some SKUs to Chinese exploding institutional compute sector. @TheLostSuede explained this point well. Not correct. A620 chipset is more advanced and richer in configuration than both other older chipsets. It's on motherboard vendors to decide which features to expose. AMD does not dictate exposure of all features. There is no reason for pathos such as "tragically stripped...". Nonsense. AMD initially said that there would be boards for $125, and indeed, we have seen boards that even hit $99 and can comfortably run 7800X3D. See testing by tech tubers.
There is definitely not enough space on the motherboard. Even if it's E-ATX size, it's a scramble for space.
- CPU socket is large.
- Since the TDP is so high, the cooling mechanism is large.
- Only 7 PCIe sockets can be installed at most.
- Even a normal graphics card requires 3 sockets
- M.2SSD also takes up space. Especially if there is more than one.
From the above, even if the CPU has a large number of lanes, it is extremely difficult to reflect them on the motherboard. One of the countermeasures is MCIO and SlimSAS. It is possible to "offload" the SSD to the outside of the motherboard.By the way, both ASRock, Gigabyte, and probably ASUS have a large number of unused lanes on their TRX50 motherboards. ASRock has 12 lanes unused and Gigabyte has 18 lanes unused. They are in a situation where they cannot use it even if they want to, I think so.
- all Gen 5 lanes are used
- from Gen 4, I cannot account only one x8 link on CPU
(there are PCIe slots x8 + x4, x2 or x4 for 10GbE LAN, x4 for SlimSAS)
- chipset is almost entirely full - x4 M.2, x4 SATA, WiFi and LAN, all USBs
Asrock has made a decent use of almost all data lanes.
Quite some time ago now GamersNexus asked their readers/viewers to help them select a manufacturer for a GamersNexus designed case. I tried contacting them repeatedly from two different e-mail addresses (I created one for just this purpose), and I e-mailed several of their staff and never got a response, they obviously were not actually interested.! That sparked my designing of cases, and as you would expect, the immediate problem was the numerous shortcomings of the ATX standard and various associated standards. Apple of course does not have this issue at all, and can create whatever they like.
Ultimately for this to actually get off the ground there would need to be involved, at least one of either AMD or Intel, at least one motherboard manufacturer, at least one case manufacturer, at least one of nVidia or AMD, at least one OEM to bulk buy and put this out to the mass market, AND for all of these parts manufacturers to mass manufacture and sell their products to individuals, custom builders etc as apart from the OEM, the primary market in the beginning will be gamers, power users, and professionals, of which power users and professionals is exactly where this discussion started, and the primary points here have been around USB4/TB4, which is not relevant here, the lackluster I/O, the problems with front I/O, AsRock using multiple 40mm fans to cool the VRM's/MOSFETS, and of course the board layout, and the problems with the archaic ATX standard.
If a moderator wants me to, I can create a whole new thread for this topic, or just leave this here. Depending on the feedback I may just do that myself anyway, although I wont be able to do it until Monday.
This problem as you rightly say cannot realistically be done right now in the Workstation market without increasing the motherboard size, and STILL has shortcomings such as massive GPU's covering slots and making them unusable. These problems will continue as the CPU sockets continue to grow in size and add yet more memory channels. Forget thinking outside of the box, time to tear that box up and create a new one (almost) from scratch, it is rapidly becoming not fit for purpose, especially in the Workstation sphere, the Server sphere is very different and has seen the ATX standard being scrapped entirely in many products in recent years, the only real constraint there is the 19" rackmount standard. That is true, but none of that addresses the people who have a Threadripper, a couple of add-in cards plus a couple of GPU's, and still need a heap of internal and external I/O.
The overlap between "gaming" systems and "pro" systems ends at the constraints of the physical size of modern high performance GPU's and the ATX standard. FYI: My original designs/ideas started with Gaming and relatively small changes, it is very clear to me that the ATX (or mATX, DTX, ITX etc) all have significant restraints with just the GPU and ATX standard. I did however move onto Workstations and their constraints and that is where I essentially ripped up the ATX standard and looked for solutions to everything that has come up in this thread (except for why there is a serious lack of USB4/TB4, I cant help there).
We need more cases that are friendly to hotswap frames.