SK hynix is showcasing its leading AI and data center memory products at the 2024 Open Compute Project (OCP) Global Summit held October 15-17 in San Jose, California. The annual summit brings together industry leaders to discuss advancements in open source hardware and data center technologies. This year, the event's theme is "From Ideas to Impact," which aims to foster the realization of theoretical concepts into real-world technologies.

In addition to presenting its advanced memory products at the summit, SK hynix is also strengthening key industry partnerships and sharing its AI memory expertise through insightful presentations. This year, the company is holding eight sessions—up from five in 2023—on topics including HBM and CMS.Displays & Demonstrations at the Booth: Transforming AI & Data Centers
Visitors to SK hynix's booth can see a range of the company's cutting-edge AI and data center solutions and view demonstrations with high-performance customer systems.Among the products being demonstrated is CMM-Ax, formerly known as CMS 2.0, which was shown under its new name for the first time. For the demonstration, SK hynix is highlighting the product's role in next-generation compute memory for AI infrastructure, particularly for multi-modal applications. Meanwhile, a heterogeneous memory management solution involving CMM (CXL Memory Module)-DDR5 and HMSDK is also being demonstrated as well as Niagara 2.0, which is illustrating its efficient utilization of pooled memory resources. Another demonstration is highlighting the computational storage drive's (CSD) AI storage capabilities for large-scale training systems.In addition, a live demonstration of the GDDR6-AiM-based accelerator card AiMX is being held using Meta's latest large language model (LLM), Llama3 70B, which has 70 billion parameters. The demonstration shows AiMX's capability to tackle industry challenges. For example, data centers' LLM services improve GPU efficiency by simultaneously processing requests from multiple users. However, as the length of the generated token increases, the computation of the attention layer increases, lowering GPU efficiency. Through the demonstration, AiMX shows it can overcome this issue by handling large amounts of data while offering greater efficiency and lower power consumption compared to the latest accelerators.The company also displayed a range of its industry-leading AI memory and data center products. HBM3E is shown along with the NVIDIA H200 Tensor Core GPU and NVIDIA GB200 Grace Blackwell Superchip. The booth also features SK hynix's DDR5 RDIMM and MCR DIMM server DRAM, as well as enterprise SSDs (eSSDs), with Supermicro servers. The DDR5 products on display include the world's first DDR5 DRAM built using the 1c node, the sixth generation of the 10 nm process technology. Designed to meet the growing computational and energy demands of AI-driven data centers, the 16 Gb 1c DDR5 offers improved performance and energy efficiency from the previous generation. Additionally, SK hynix unveiled the 1bnm 96 GB DDR5 which can reach speeds of up to 7,200 megabits per second (Mbps), making it ideal for supporting massive data flows in data centers.In the SSD section, the Gen5 eSSDs PS1010 and PS1030 and the Gen4 PE9010 are among those on display. Offering ultra-fast read/write speeds, these SSD solutions are vital for accelerating AI training and inference in large-scale environments. Through all these innovations, SK hynix is continuing to lead the way in AI memory and storage solutions, fueling the future of AI and transforming data center operations.