With the rapid development of advanced technologies, such as 5G, the Internet of Things (IoT), Artificial Intelligence (AI), and 8K, people are placing more stringent requirements on the convenience, intelligence, and functional integration of their electronics. This has given rise to new development opportunities in the storage industry. As we progress further into the digital revolution, intelligent electronics will require small-capacity storage products which feature an increased level of reliability and stability. High-temperature tolerance in storage products will be vital for customers in the intelligent and small-sized consumer electronics market.

Longsys recently launched the FORESEE DDR4, which utilizes 96-ball thin fine ball grid array (TFBGA) encapsulation. The product's manufacturing process, transmission speed, power consumption, and high-temperature reliability all perform at an industry-leading level.

Samsung Electronics, the world leader in advanced memory technology, today announced that it has begun mass producing the industry's smallest, 14-nanometer (nm), DRAM based on extreme ultraviolet (EUV) technology. Following the company's shipment of the industry-first EUV DRAM in March of last year, Samsung has increased the number of EUV layers to five to deliver today's finest, most advanced DRAM process for its DDR5 solutions.

"We have led the DRAM market for nearly three decades by pioneering key patterning technology innovations," said Jooyoung Lee, Senior Vice President and Head of DRAM Product & Technology at Samsung Electronics. "Today, Samsung is setting another technology milestone with multi-layer EUV that has enabled extreme miniaturization at 14 nm—a feat not possible with the conventional argon fluoride (ArF) process. Building on this advancement, we will continue to provide the most differentiated memory solutions by fully addressing the need for greater performance and capacity in the data-driven world of 5G, AI and the metaverse."

Good news everyone, for once it looks like prices are going to be going down for something computer related, as DRAM prices are expected to drop this quarter. At least this is what Nanya Technology Corporation's president, Dr. Pei-Ing Lee told investors during the company's third quarter results announcement, last week.

Apparently the word that was used was correction, although this is meant to be taken as a drop in prices for DRAM, due to less market demand. This is tied to the shortage of various components, not just in the consumer space, but also the server, and mobile devices space, as well as the EV market. That said, Nanya is expecting continued demand for mobile and server DRAM, as well as enterprise PC's and various other consumer products, as well as SSDs. The shortfall is likely to be from EVs, digital TV and specifically Chromebooks are mentioned.

AAEON, an industry leader in AI Edge Computing solutions, announces the PICO-TGU4 compact PICO-ITX board powered by the 11th Generation Intel Core U processors. By leveraging AAEON's expertise and the cutting-edge technologies offered with this latest generation of processors, the PICO-TGU4 delivers performance and flexibility to power the next generation of industrial AI and machine vision applications.

The 11th Generation Intel Core processors (formerly Tiger Lake) are the third generation of Intel's 10 nm microarchitecture, delivering up to 15~20% better performance than the previous generation processors. The PICO-TGU4 offers users the choice of Intel Core U i3/i5/i7 or Intel Celeron processors to power their projects. These processors support a range of technologies to ensure data integrity, accuracy and security, including on-board TPM 2.0 and in-band memory ECC (with select SKUs). Combined with up to 32 GB of on-board LPDDR4x memory, the PICO-TGU4 helps unlock the performance needed to deploy a wide range of embedded and edge computing applications.

MSI, a world leader in high-performance and innovative computing solutions, announced the Cubi N JSL Business & Productivity PC. Featuring small chassis, powerful processor, exclusive software, and various IO ports, the Cubi N is designed with efficiency and productivity in mind.

The Cubi N mini PC kit with 0.5L in size is ready to defy your imagination. The tiny design allows you to have a well-organized and efficient working space without limiting your capability of being productive and effective. Equipping Intel Jasper Lake Processor built on 10 nm "Tremont" delivers up to 30% IPC performance boost that improves your computing experience while working. It provides better performance for users while scalability, durability, VESA Mount support, and upgradable design that is time-saving and space-saving allow users to use it in any kind of situation. The low noise and power-saving features provide users a better quality of life and can even avoid bothering others in the same space including office, home, or dormitory.

The 12th Gen Core "Alder Lake" microarchitecture will see Intel unify its desktop- and mobile processor IP, back to the way things were up to the 9th Gen. With its post-14 nm silicon fabrication nodes in their infancy, Intel had diverged the client processor IP across its 10th and 11th Gen Core. With 10th Gen, the company introduced "Ice Lake" for ultra-portable platforms (28 W and below), while retaining 14 nm "Comet Lake" for mainstream notebooks (28 W to 45 W); while keeping desktop exclusively with 14 nm "Comet Lake." For 11th Gen, the story is mostly similar. Cutting-edge 10 nm "Tiger Lake" now covers all mobile categories, while desktop receives an IPC upgrade, thanks to the 14 nm "Rocket Lake." The 12th Gen will see a common microarchitecture, "Alder Lake," span across all client segments, from 7 W ultra mobile, to 125 W enthusiast desktop.

This, however, doesn't mean that Intel has a one-size fits all silicon that it can carve SKUs out of. The company has developed as many as three physical dies based on "Alder Lake," which vary in CPU core counts, the size of the iGPU, and other on-die components. "Alder Lake" is a hybrid processor with a combination of larger "Golden Cove" P-cores, and smaller "Gracemont" E-cores. The P-cores are spatially large, and along with their L3 cache slices, take up a large share of the compute portion of the silicon. The E-cores come in clusters of 4 cores each.

Intel, in a move comparable to its competitors' Performance Rating system from the 1990s, has invented a new naming scheme for its in-house foundry nodes to claim technological parity with contemporaries such as TSMC and Samsung, that are well into the sub-10 nm class. Back in the i586 era, when Intel's competitors such as AMD and Cyrix, couldn't keep up with its clock-speeds yet found their chips to be somewhat competitive, they invented the PR (processor rating) system, with a logical number attempting to denote parity with an Intel processor's clock-speed. For example, a PR400 processor rating meant that the chip rivaled a Pentium II 400 MHz (which it mostly didn't). The last that the PR system made sense was with the final generation of single-core performance chips, Pentium 4 and Athlon XP, beyond which, the introduction of multi-core obfuscated the PR system. A Phenom X4 9600 processor didn't mean performance on par with a rival Intel chip running at an impossible 9.60 GHz.

Intel's new foundry naming system sees its 10 nm Enhanced SuperFin node re-badge as "Intel 7." The company currently builds 11th Gen Core "Tiger Lake" processors on the 10 nm SuperFin node, and is expected to build its upcoming 12th Gen Core "Alder Lake" chips on its refinement, the 10 nm Enhanced SuperFin, which will now be referred to as "Intel 7." The company is careful to avoid using the nanometer unit next to the number, instead signaling the consumer that the node somehow offers transistor density and power characteristics comparable to a 7 nm node. Intel 7 offers a 10-15 percent performance/Watt gain over 10 nm SuperFin, and is already in volume production, with a debut within 2021 with "Alder Lake."

Intel Corporation today revealed one of the most detailed process and packaging technology roadmaps the company has ever provided, showcasing a series of foundational innovations that will power products through 2025 and beyond. In addition to announcing RibbonFET, its first new transistor architecture in more than a decade, and PowerVia, an industry-first new backside power delivery method, the company highlighted its planned swift adoption of next-generation extreme ultraviolet lithography (EUV), referred to as High Numerical Aperture (High NA) EUV. Intel is positioned to receive the first High NA EUV production tool in the industry.

"Building on Intel's unquestioned leadership in advanced packaging, we are accelerating our innovation roadmap to ensure we are on a clear path to process performance leadership by 2025," Intel CEO Pat Gelsinger said during the global "Intel Accelerated" webcast. "We are leveraging our unparalleled pipeline of innovation to deliver technology advances from the transistor up to the system level. Until the periodic table is exhausted, we will be relentless in our pursuit of Moore's Law and our path to innovate with the magic of silicon."

Intel has recently confirmed during a recent earnings call that it is now manufacturing more 10 nm wafers than 14 nm wafers as part of its IDM 2.0 plan. This news comes four years after Intel first started shipping 10 nm products to customers however the production capacity did not exist to launch any mainstream desktop processors. Intel launched a few low-power mobile Ice Lake processors in 2019 but their 2021 flagship 11th Generation Rocket lake processors remained on 14 nm. This looks set to change as Intel highlights reduced production costs and prepares to launch 10 nm 12th Generation Alder Lake processors in Q4 2021. Intel will offer more details on their future manufacturing plans during their upcoming Intel Accelerated event.

Intel CEOUnder IDM 2.0, our factory network continues to deliver and we are now manufacturing more 10-nanometer wafers than 14-nanometer. As 10-nanometer volumes ramp, economics are improving with 10-nanometer wafer cost 45% lower year-over-year with more to come.

Intel will debut its 12th Gen Core "Alder Lake-S" desktop processors either toward the end of 2021, or early 2022, introducing the LGA1700 socket, 600-series chipset, and more importantly, hybrid CPU core architecture to the desktop space. The 10 nm "Alder Lake-S" silicon features up to eight "Golden Cove" performance cores (P-cores), and up to eight "Gracemont" efficiency cores (E-cores), in a heterogenous CPU core setup rivaling Arm big.LITTLE. Specifications of the top Core i9, fairly-top Core i7, and mid-tier Core i5 parts were leaked to the web on Chinese social media.

The 12th Gen Core lineup will be led, predictably, by the Core i9-12900K, which succeeds the i9-11900K with a maxed out 8+8 (P+E) configuration, unlocked multipliers, the most cache, and the highest clock speeds. The P-cores ("Golden Cove" cores) are clocked up to 5.30 GHz (1-2 cores boost), and up to 5.00 GHz all-core / 8 cores; while the E-cores ("Gracemont" cores), are clocked up to 3.90 GHz (1-4 cores boost), with 3.70 GHz all-core / 8 cores boost. The total L3 cache on the silicon is 30 MB. The i9-12900K has a TDP of 125 W (PL1), with 228 W PL2. Intel will introduce several new overclocking features, including multiple memory gear ratios.

The Intel Core i9-12900K is the companies upcoming flagship 12th Generation Alder Lake-S processor featuring a hybrid design with 8 high-performance cores and 8 high-efficiency cores. The qualification sample for the processor reportedly features a base clock of 3.9 GHz and a boost clock of 5.3 GHz which is less than initial rumors which claimed boost speeds could reach 5.5 GHz. The processor achieved a multi-core score of 11300 points in Cinebench R20 which is 800 points higher than AMD's flagship Ryzen 9 5950X. Intel's 12th Generation Alder Lake-S processors will be manufactured on the 10 nm Enhanced SuperFin node and will include support for PCIe 5.0 and DDR5. Intel is expected to announce the processors in Q3 2021 for a Q4 2021 release which will position them against AMD's upcoming V-Cache technology expected to arrive in early 2022.

SK hynix announced that it has started this month mass production of the 8 Gigabit (Gb) LPDDR4 mobile DRAM based on the 1anm, which is the fourth generation of the 10 nm process technology. As the semiconductor industry classifies the 10 nm DRAM products, naming them after the alphabets, the 1a technology is the fourth generation, following the first three generations of the 1x, 1y, and 1z. SK hynix plans to provide the latest mobile DRAM products to smartphone manufacturers from the second half of 2021. This is the first time that SK hynix adopted the EUV equipment for mass production after proving the stability of the cutting edge lithography technology through partial adoption for its 1ynm DRAM production.

As technology migration continues to ultra-micro levels, an increasing number of semiconductor companies are adopting the EUV equipment for the photo process where circuit patterns are drawn on the wafer surfaces. Industry experts believe that a semiconductor company's leadership in technology will depend on how it can fully take advantage of the EUV equipment. SK hynix plans to use the EUV technology for production of all its 1anm DRAM products going forward as it has proved the stability of the process.

Intel is slowly preparing to launch its 4th generation of Xeon Scalable processors, with it being the first arrival of the 10 nm designs to the server market. Codenamed Sapphire Rapids, these processors are expected to bring much-needed IPC and platform improvements so Intel can keep up with AMD's EPYC processors. Today, we are getting some first performance results as well as some information about a specific 20 core, 40 threaded Intel Xeon Sapphire Rapids SKU. In a leaked Geekbench 4 submission, the latest Xeon processor was tested and we get to see even more details about the processor.

Featuring 20 cores and 40 threads, the CPU has a base clock speed of 1.5 GHz. It features as much as 40 MB of L2 cache and 75 MB of L3 cache spread across the die. The system was tested on an Intel reference platform called VulcanCity, with this configuration carrying 32 GB of DDR5 memory. The reported results of the benchmarks that this processor went through are not very impressive. These numbers are easily beaten by AMD Ryzen 9 5950X, however, this is only an engineering sample with low clock speed and it could be possible that Geekbench is not optimized to run on this processor. You can check out some of the performance numbers below, and see the submitted results here.

We haven't seen any new prosumer HEDT processors since AMD launched their Ryzen Threadripper 3000 lineup in early 2020. Intel has had a very weak HEDT offering over the past few years with their 14 nm Cascade Lake processors and X299 chipset where the flagship Core i9-10980XE offered just 18 cores. Intel appears to be preparing to launch an updated HEDT offering in Q2 2022 with 10 nm Sapphire Rapids processors and a new W790 chipset. The new W790 chipset may launch alongside Raptor Lake which is expected to support the Z790 chipset. We still have a while until these products launch with Intel not yet having released their Alder Lake predecessors while AMD is expected to announce Threadripper 5000 in the coming months.

Intel's struggles with semiconductor manufacturing have been known for a very long time. Starting from its 10 nm design IP to the latest 7 nm delays, we have seen the company struggle to deliver its semiconductor nodes on time. On the other hand, Intel's competing companies are using 3rd party foundries to manufacture their designs and not worry about the yields of semiconductor nodes. Most of the time, that 3rd party company is Taiwan Semiconductor Manufacturing Company (TSMC). Today, thanks to some reporting from Nikkei Asia, we are learning that Intel is tapping TSMC's capacities to manufacture some of the company's future processors.

Citing sources familiar with the matter, Nikkei notes that: "Intel, America's biggest chipmaker, is working with TSMC on at least two 3-nm projects to design central processing units for notebooks and data center servers in an attempt to regain market share it has lost to Advanced Micro Devices and Nvidia over the past few years. Mass production of these chips is expected to begin by the end of 2022 at the earliest." This means that we could expect to see some of the TSMC manufactured Intel processors by the year 2023/2024.

Intel's upcoming Ponte Vecchio graphics card is set to be the company's most powerful processor ever designed, and the chip is indeed looking like an engineering marvel. From Intel's previous teasers, we have learned that Ponte Vecchio is built using 47 "magical tiles" or 47 dies which are responsible either for computing elements, Rambo Cache, Xe links, or something else. Today, we are getting a new piece of information coming from Igor's LAB, regarding the Ponte Vecchio and some of its design choices. For starters, the GPU will be a heterogeneous design that consists out of many different nodes. Some parts of the GPU will be manufactured on Intel's 10 nm SuperFin and 7 nm technologies, while others will use TSMC's 7 nm and 5 nm nodes. The smaller and more efficient nodes will probably be used for computing elements. Everything will be held together by Intel's EMIB and Foveros 3D packaging.

Next up, we have information that this massive Intel processor will be accountable for around 600 Watts of heat output, which is a lot to cool. That is why in the leaked renders, we see that Intel envisioned these processors to be liquid-cooled, which would make the cooling much easier and much more efficient compared to air cooling of such a high heat output. Another interesting thing is that the Ponte Vecchio is designed to fit inside OAM (OCP Accelerator Module) form factor, an alternative to the regular PCIe-based accelerators in data centers. OAM is used primarily by hyper scalers like Facebook, Amazon, Google, etc., so we imagine that Intel already knows its customers before the product even hits the market.

Thanks to the information coming from Yuuki_Ans, a person which has been leaking information about Intel's upcoming 4th generation Xeon Scalable processors codenamed Sapphire Rapids, we have the first die shots of the Sapphire Rapids processor and its delidded internals to look at. After performing the delidding process and sanding down the metal layers of the dies, the leaker has been able to take a few pictures of the dies present on the processor. As the Sapphire Rapids processor uses multi-chip modules (MCM) approach to building CPUs, the design is supposed to provide better yields for Intel and give the 10 nm dies better usability if defects happen.

In the die shots, we see that there are four dies side by side, with each die featuring 15 cores. That would amount to 60 cores present in the system, however, not all of the 60 cores are enabled. The top SKU is supposed to feature 56 cores, meaning that there would be at least four cores disabled across the configuration. This gives Intel flexibility to deliver plenty of processors, whatever the yields look like. The leaked CPU is an early engineering sample design with a low frequency of 1.3 GHz, which should improve in the final design. Notably, as Sapphire Rapids has SKUs that use in-package HBM2E memory, we don't know if the die configuration will look different from the one pictured down below.

Intel is likely preparing to launch its 10 nm "Tiger Lake" processor on the desktop platform. momomo_us discovered the existence of at least four new processor SKUs in Intel's ARK pages. At least one of these is marked as a desktop chip. What isn't clear, is whether these are Socket LGA1200 chips, like "Rocket Lake-S," or whether these are FC-BGA chips that have been adapted for specific desktop use-cases, such as NUCs. At the heart of these chips is the new 10 nm "Tiger Lake" 8-core/16-thread silicon, which packs 8 "Willow Cove" CPU cores, 24 MB of shared L3 cache, and a Gen12 Xe LP iGPU that has 32 EUs.

The common theme with the processor model numbering with these SKUs is the brand extension "B," next to model numbers we commonly associate with "Rocket Lake-S" SKUs. Another commonality is TDP. All four SKUs are marked as 65-Watt chips, including the part that has an unlocked multiplier. The lineup is led by the Core i9-11900KB, an 8-core/16-thread chip with Thermal Velocity Boost frequency of up to 5.30 GHz, and base frequency of 3.30 GHz. The Core i7-11700B lacks an unlocked multiplier, but interestingly features TVB, and retains the core-count and cache amount of the i9-11900KB. It is clocked at speeds of up to 5.30 GHz. The Core i5-11500B is a 6-core/12-thread part, with 12 MB of L3 cache, and the same 5.30 GHz boost, set via TVB. The Core i3-11100B is a 4-core/8-thread part with 8 MB L3 cache, and is likely based on the 4-core "Tiger Lake" die, with its iGPU cut down. The clocks remain the same. It remains to be seen how Intel markets these parts.

XMG introduces an additional configuration variant to the high-end NEO range of gaming laptops with Intel's new Tiger Lake H45 processors. The eight-core CPUs from the 11th Core generation not only offer higher performance compared to their predecessors, but also boast the advantages of a completely updated platform. These includes support for PCI Express 4.0 and Thunderbolt 4 - features that the AMD version of the XMG NEO cannot offer. In addition, the models utilising the new Intel processor also benefit from a slight performance increase on the graphics card side. The GPU in the XMG NEO 15 and NEO 17 (M21) now operates with a TGP of up to 165 instead of 150 watts.

GIGABYTE Technology, an industry leader in high-performance servers and workstations, today announced a newly designed ultra-compact, low power PC for the BRIX lineup, which adopts the latest 10 nm Intel Pentium Silver & Celeron Processor. Coupling that with support for 2933 MHz memory results in a 60% overall performance boost compared to the previous generation. Adopting a compact size, the new BRIX delivers powerful computing that fits perfectly in any IoT employment, whether for office use, education use, home use, digital signage, medical care, or KIOSK. It is also worth mentioning that the new BRIX provides powerful storage flexibility with dual storage (M.2 2280 + 2.5' SSD/HDD) and output flexibility with dual 4K/60P outputs for diverse applications, proving that only GIGABYTE BRIX can break the boundaries and offer unlimited possibilities.

BRIX uses the newest Intel Pentium Silver & Celeron Processor that offer amazing video conferencing abilities, faster wireless connectivity, improved overall application and graphics performance, and long battery life. BRIX with an Intel new 10 nm generation processor delivers unmatched balance of performance, experience and value for education and entry level computing. The platform includes ultra-fast Wi-Fi, 4K media support, next-gen Intel UHD Graphics, and improvements in security at a price point for users who want rich experiences at a great value.

IBASE Technology Inc. (TPEx: 8050), IBASE, a leading provider of industrial motherboards and embedded systems, launches its latest 3.5" SBC IB953 powered by 11th Gen Intel Core processors (codenamed Tiger Lake). Measuring 146 x 102 mm in a compact footprint, the single board computer offers impressive I/O and computing performance, making it an ideal platform for a broad range of demanding applications in factory automation, machine vision, healthcare, as well as retail environments.

The IB953 features a 5G compatible M.2 3052 socket and the latest 11th Gen. Intel Core and Celeron processors built on 10 nm SuperFin process, delivering up to 25% faster performance and greater AI acceleration. With the Intel Core i7-1185G7 (IBASE model IB953AF-I7) comes the new Iris Xe (Xe-LP) graphics architecture supporting 96 EUs (Execution Units) which equals 768 cores and runs at 1.35 GHz, an increase of 250 MHz over the previous 11-gen graphics to provide up to twice the performance and improved power efficiency. The graphics engine's hardware acceleration can drive up to four simultaneous 4K HDR displays (via 2x DisplayPort + eDP and LVDS).

Intel's fabled 8-core "Tiger Lake-H" silicon built on the 10 nm SuperFin process, is close to reality. The company's upcoming 11th Gen Core "Tiger Lake-H" processors for performance- and gaming notebooks, leverages this die. An HD Tecnologia report leaks alleged company slides from Intel that detail the processor line up and feature-set. To begin with, the 11th Gen Core-H series processors come in core-counts ranging from 4-core/8-thread, to 6-core/12-thread, and 8-core/16-thread. Look at the embargo date on the leaked slides, one could expect a formal launch as close as May 11, 2021.

The 10 nm SuperFin "Tiger Lake-H" silicon features 8 "Willow Cove" CPU cores, and an updated iGPU based on the company's latest Gen12 Xe LP graphics architecture. Each of the eight CPU cores has 1.25 MB of L2 cache, and they share a massive 24 MB of L3 cache. The Gen12 Xe LP iGPU only has 32 execution units (EUs), according to the slides, 1/3rd those of the 96 EUs on the "Tiger Lake-U." The uncore component is also updated, now featuring dual-channel DDR4-3200 native support, and a 28-lane PCI-Express 4.0 root-complex. 16 of these lanes are wired out as PEG (PCI-Express Graphics), four as a CPU-attached NVMe slot, and eight toward the 8-lane DMI 3.0 chipset bus.

Intel's upcoming Alder Lake generation of processors is going to be the first iteration of heterogeneous x86 architecture. That means that Intel will for the first time combine smaller, low-power cores, with some big high-performance cores to provide the boost to all the workloads. If a task doesn't need much power, as some background task, for example, the smaller cores are used. And if you need to render something or you want to fire up a game, big cores are used to provide the power needed for the tasks. Intel has decided to provide such an architecture on the advanced 10 nm SuperFin, which represents a major upgrade over the existing 14 nm process.

Today, we got some information from Igor's Lab, showing the leaked specification of the Intel Core-1800 processor engineering sample. While this may not represent the final name, we see that the leaked information shows that the processor is B0 stepping. That means that the CPU will see more changes when the final sample arrives. The CPU has 16 cores with 24 threads. Eight of those cores are big ones with hyperthreading, while the remaining 8 are smaller Atom cores. They are running at the base clock of 1800 MHz, while the boost speeds are 4.6 GHz with two cores, 4.4 GHz with four cores, and 4.2 GHz with 6 cores. When all cores are used, the boost speed is locked at 4.0 GHz. The CPU has a PL1 TDP of 125 Watts, while the PL2 configuration boosts the TDP to 228 Watts. The CPU was reportedly running at 1.3147 Volts during the test. You can check out the complete datasheet below.

Here are some of the first pictures of the ASUS ROG Zephyrus M16, a high-end 16-inch gaming notebook in development, characterized with its tall 16:10 aspect-ratio display. This display will come in two resolution options—2560 x 1600 at 144 Hz and 1920 x 1200 at 165 Hz. Both displays support 100% DCI-P3 coverage, and are mounted via a 180-degree hinge. Things get very interesting with that's alleged to be under the hood. The 2021 ROG Zephyrus M16 is powered by 11th Gen Core "Tiger Lake H45" processors, with the top SKU powered by the 10 nm Core i9-11900H, an 8-core/16-thread beast. Graphics options go all the way up to the GeForce RTX 3070 Mobile. A PCI-Express 4.0 x4 NVMe SSD is also included. Given its early listings on Amazon, one can expect launch of these notebooks to be right around the corner.

Intel has just launched its Ice Lake-SP lineup of Xeon Scalable processors, featuring the new Sunny Cove CPU core design. Built on the 10 nm node, these processors represent Intel's first 10 nm shipping product designed for enterprise. However, there is another 10 nm product going to be released for enterprise users. Intel is already preparing the Sapphire Rapids generation of Xeon processors and today we get to see more details about it. Thanks to the anonymous tip that VideoCardz received, we have a bit more details like core count, memory configurations, and connectivity options. And Sapphire Rapids is shaping up to be a very competitive platform. Do note that the slide is a bit older, however, it contains useful information.

The lineup will top at 56 cores with 112 threads, where this processor will carry a TDP of 350 Watts, notably higher than its predecessors. Perhaps one of the most interesting notes from the slide is the department of memory. The new platform will make a debut of DDR5 standard and bring higher capacities with higher speeds. Along with the new protocol, the chiplet design of Sapphire Rapids will bring HBM2E memory to CPUs, with up to 64 GBs of it per socket/processor. The PCIe 5.0 standard will also be present with 80 lanes, accompanying four Intel UPI 2.0 links. Intel is also supposed to extend the x86_64 configuration here with AMX/TMUL extensions for better INT8 and BFloat16 processing.