Here are some of the first pictures of the ASUS ROG Crosshair X870E Extreme, the company's new flagship Socket AM5 motherboard. Until now, the company's AMD 800-series chipset motherboard lineup topped off with the ROG Crosshair X870E Hero for connectivity and the ROG Crosshair X870E Apex for overclocking chops, and the company is looking to push things up a notch, especially given that AMD's Ryzen 9000X3D series is established as the fastest processor series for gaming PC builds. This board is designed to compete with the likes of the MSI MEG X870E Godlike and the GIGABYTE X870E AORUS Xtreme. It is firmly into the E-ATX territory in terms of dimensions. The board draws power from a combination of 24-pin ATX, two 8-pin EPS, and an 8-pin PCIe power. It uses the company's most powerful CPU VRM solution for the AMD platform, above even the 22-phase solution of the Hero.

The ASUS ROG Crosshair X870E Extreme comes with a large number of 4-pin PWM fan and water pump headers. Storage connectivity includes one M.2-22110 Gen 5 on the board with a chunky heat pipe-based cooler; a second Gen 5 and two Gen 4 slots on the board, and a DIMM.2 module that provides additional slots. The expansion slots provided are a PCI-Express 5.0 x16 and a second PCI-Express 4.0 x4 (physical x16). There are a boat-load of USB ports, including a couple of 40 Gbps USB4, 20 Gbps USB 3.2 Gen 2x2, and several 10 Gbps and 5 Gbps USB 3.2 ports. Networking interfaces include Wi-Fi 7, a 10 GbE, and a 5 GbE. The board features the company's most premium onboard audio solution that probably combines a Realtek ALC4082 with an ESS ES9219 DAC for the front channels, an audiophile-grade OPAMP, and premium capacitors. The board offers many of the exclusive overclocker-friendly features found in the company's ROG Maximus Extreme motherboards. A star-attraction is its 4-inch true-color display over the VRM heatsinks, which can be programmed to show anything. There is no word on availability or pricing.

Earlier today, AMD confirmed finalized price points and a launch date for its two incoming additions to the Ryzen 9000X3D processor lineup. The current Zen 5 processor population (with 3D V-Cache onboard) has a count of one—Team Red's reigning gaming champion: the eight-core Ryzen 7 9800X3D model. AMD's Senior Vice President and General Manager of Computing and Graphics was the first staffer to make an official announcement regarding definitive talking points. Jack Huynh stated (via a social media post): the world's best processor for gaming and content creation is almost here. Available starting March 12th. Ryzen 9 9950X3D—$699. Ryzen 9 9900X3D—$599. A huge thank you to our incredible community of gamers, creators, and innovators for your continued support. Together, we're shaping the future of gaming and content creation! Let's level up together!"

The sixteen-core Ryzen 9 9950X3D and twelve-core 9900X3D SKUs were officially unveiled at CES 2025, in early January. Since then, many leaks have emerged online—certain soothsayers were bang on with their predictions. Almost a month ago, speculative $699 and $599 price points were leaked. On two separate occasions, a—now confirmed—March 12 launch day was projected. AMD is expected to lift media embargoes on March 11; reviews of finalized silicon will finally reveal whether the two new players can beat their incumbent sibling in gaming performance benchmarks. As reported this afternoon, China's JD.com retail platform has opened its order book to customers—a limited quantity of Ryzen 9 9950X3D and 9900X3D units were made available for a short period of time.

AMD's Ryzen 9 9950X3D and 9900X3D processors are reportedly due to launch mid-way through next week (March 12)—this "unofficial" release date was revealed by JD.com listings. Yesterday's report focused on the popular Chinese e-commerce platform's apparent leaking of Team Red's mid-March schedule. Last month, a local tipster—Golden Pig Upgrade—also alluded to a possible March 12 rollout of 16 and 12-core 3D V-Cache-equipped Zen 5 chips. In a surprise move, JD has started selling Ryzen 9 9950X3D and 9900X3D units. Earlier today, ITHome spotted updated product pages—JD disclosed that it was prepping an earlier than expected sale: "limited time and limited quantity available at 20:00 (local time) on March 7."

Officially, AMD has only teased a loose March launch window for its latest Ryzen Niners. VideoCardz has kept track of the company's recent announcements, and opines that the Ryzen 9000X3D release strategy is strange one. Embargoes for reviewer and influencers are tipped for lifting on March 11, so JD's premature sale of Ryzen 9 9950X3D and 9900X3D processors clashes with this schedule. JD's unusual 20:00 release time was highlighted by VideoCardz; they reckon that the 22:00 hour is a more appropriate kick-off time. It is possible that the limited quantity/short period sale was a mislabeled promotion for pre-orders—something could be lost in translation (see primary screenshot below), but similar events were reported in recent history.

AMD has confirmed pricing and launch for its newest Ryzen 9000X3D series processors, with the flagship 9950X3D priced at approximately 5599 RMB and the 9900X3D at 4599 RMB, according to preliminary Chinese store JD listings. Both processors will hit retail channels on March 12, with review embargoes reportedly lifting one day prior, as noted by VideoCardz. The Ryzen 9 9950X3D delivers 16 Zen 5 cores with boost frequencies reaching 5.7 GHz and operates within a 170 W TDP envelope. Its unique feature is 144 MB of combined cache memory (L2, L3, and stacked 3D V-Cache).

The 9900X3D scales back to 12 cores with 5.5 GHz peak frequencies and 140 MB total cache while reducing power consumption to 120 W TDP. These processors represent AMD's implementation of vertical cache stacking technology on its 12+ core Zen 5 setup, completing its Q1 2025 desktop portfolio expansion following earlier standard Ryzen 9000 series launches and the eight-core Ryzen 7 9800X3D. The 3D V-Cache technology could help with many workloads, with gaming performance expected to show the most significant gains and productivity expected to follow. We have to wait for official reviews to bring further conclusions, but we hope to hear official confirmation on availability soon.

COLORFUL has introduced a compelling new "X3D Gaming Mode" for its AM5-socketed motherboard models. The Chinese manufacturer previewed this newly supported feature via their official Weibo video channel—naturally, this mode was advertised as working in conjunction with compatible AMD Ryzen 7000X3D and 9000X3D processors. Curiously, COLORFUL did mention that non-3D V-Cache-equipped AM5 CPUs can work with their "X3D Gaming Mode." The aforementioned preview video demonstrates this new feature—accessed via the showcased B650 motherboard's BIOS interface—disabling Simultaneous Multi-Threading (SMT) on an involved processor. The population of dual-CCD Team Red 3D V-Cache models is set to grow this month, with the upcoming launch of Ryzen 9 9950X3D and 9900X3D chips.

COLORFUL's X3D Gaming Mode is touted to improve performance on dual-CCD CPUs, since it will disable the second unit. By transferring workloads to the (active) primary CCD, latency is reduced—thus boosting in-game performance. COLORFUL claimed that frame rates—in PUBG—increased by 17%, following the enabling of their snazzy X3D Gaming Mode. Wccftech opined on this scenario: "for processors like Ryzen 9 9900X3D and Ryzen 9 9950X3D, the X3D Gaming Mode is more ideal than on the single CCD non-X3D processors (e.g. Ryzen 7 9800X3D). Keep in mind that the performance of the Ryzen 9 9900X3D may be affected noticeably when one of its CCDs gets disabled. Since the processor brings only six cores on each CCD, it may not be ideal for a lot of users...Colorful's X3D Gaming Mode reminds us of Gigabyte's X3D Turbo Mode, but the latter works a bit differently and doesn't disable SMT or CCD but tweaks some CPU parameters." A "halved" Ryzen 9 9950X3D (16-core) is expected to behave in a similar manner to the current reigning champion (8-core) within gaming ecosystems.

AMD's Ryzen 9 9950X3D and Ryzen 9 9900X3D "Zen 5" processors are scheduled for launch around March time, with many a hardcore PC enthusiast salivating at the prospect of an increase in core counts over already released hardware—the ever popular Ryzen 7 9800X3D CPU makes do with eight cores (and sixteen threads). Under normal circumstances, higher core counts do not provide a massive advantage in gaming applications—over the years, Team Red's 8-core 3D V-Cache-equipped models have reigned supreme in this so-called "sweet spot." Many have wondered whether new-gen 12 and 16-core SKU siblings had any chance of stealing some gaming performance thunder—a recently published VideoGamer article provides a definitive answer for the "Granite Ridge" generation.

The publication managed to extract key quotes from Martijn Boonstra—a Team Red product and business development manager—providing a slightly tepid outlook for the incoming Ryzen 9 9950X3D and 9900X3D models. The company executive stated: "(our) new chips will provide similar overall gaming performance to the Ryzen 7 9800X3D. There will be some games that perform a bit better—if the game engine utilizes more cores and threads—and some games will perform a little worse (if the game engine favors a single CCD configuration), but on the whole, the experience is comparable." Boonstra did not reveal any details regarding forthcoming prices—the Ryzen 7 9800X3D has an MSRP of $479 (if you are lucky enough to find one)—but he hinted that finalized digits will be announced "closer to launch." He signed off with standard marketing spiel: "Ryzen 9000X3D Series desktop processors are perfect for gamers and content creators alike...whether you are already on the AM5 platform, on AM4 or another platform, these products are sure to impress."

At CES 2025, GIGABYTE unveiled an impressive lineup of motherboards designed for Intel and AMD platforms for gaming, content creation, and professional use, with support for the latest processors, PCIe 5.0, and Wi-Fi 7. GIGABYTE introduced several Z890 chipset motherboards for Intel's "Arrow Lake" Core Ultra 200S series. The flagship Z890 AORUS Master offers features like DDR5 memory overclocking, tool-free PCIe and M.2 installation, and Wi-Fi 7 connectivity. The compact Z890I AORUS Ultra targets Mini-ITX builds with its efficient 8+1+2 VRM solution and AI-enhanced BIOS profiles. Despite its small form factor, it delivers robust performance and thermal management. For those looking for aesthetics and reliability, the Z890 AORUS Elite WiFi 7 ICE impresses with a sleek white design, digital VRM capabilities, and simplified Wi-Fi EZ-Plug installation for improved connectivity. For more budget-friendly options, GIGABYTE showed B860M AORUS Elite WiFi6E ICE motherboard, too.

AMD today expanded its Ryzen 9000X3D line of Socket AM5 desktop processors that combine the "Zen 5" microarchitecture with 3D V-Cache technology, with the introduction of two high core-count models, the Ryzen 9 9950X3D and the Ryzen 9 9900X3D. The 9950X3D is a 16-core/32-thread chip, while the 9900X3D is 12-core/24-thread. These are dual-CCD processors, and much like the Ryzen 9 7000X3D, the 3D V-Cache is only present on one of the two CCDs, while the other is a regular CCD with just the 32 MB on-die L3 cache. There is one key difference, though. Since AMD has redesigned 3D V-Cache for "Zen 5" to be below the CCD and not above, the CCD with it has the same clock speed boosting characteristics as the CCD without 3D V-Cache; and AMD has worked to refine its software-based OS scheduler optimization such that productivity applications favor either of the CCDs, while games stick to the one with 3D V-Cache.

The Ryzen 9 9950X3D comes with a base frequency of 4.30 GHz, and boosts up to 5.70 GHz, with a 170 W TDP. This is much higher than the 5.20 GHz maximum boost frequency of the Ryzen 7 9800X3D, which makes the 9950X3D the company's fastest gaming desktop processor. The Ryzen 9 9900X3D is similarly interesting—you get a base frequency of 4.40 GHz, and 5.50 GHz maximum boost frequency, which is higher than that of the 9800X3D, although the CCD with the 3D V-Cache only has 6 cores. The 9950X3D should hence end up beating the 9800X3D in gaming workloads, while the 9900X3D should be either on par or slightly slower than the 9800X3D at gaming, although faster than any chip from the non-X3D Ryzen 9000 series.

The ASUS ROG Apex brand extension is reserved for motherboards with the best CPU and memory overclocking capabilities. Since Intel processors tended to overclock better than AMD, Apex remained confined to the Intel platform, until now. ASUS at CES showed off the ROG Crosshair X870E Apex, the first AMD platform motherboard to feature this brand extension. The board features a powerful CPU VRM solution meant for sub-zero overclocking of Ryzen 9000X3D processors that are fully capable of overclocking. It also comes with a 1 DIMM-per-channel memory topology, with just two DDR5 DIMM slots. 1DPC is the most optimal dual-channel topology for memory overclocking.

The topmost M.2 Gen 5 NVMe slot features an elaborate fan-heatsink solution. Right next to the two DDR5 DIMM slots, is a breakout DIMM.2 module that provides additional M.2 NVMe slots. There are a couple of more Gen 4 NVMe slots scattered across the board. The board features an I/O feature-set that's at least as good as the ROG Crosshair X870E Hero. The board draws power from two 8-pin EPS, a 24-pin ATX, and an additional 8-pin PCIe power input. The board is packed to the gills with features professional overclockers would look for, including onboard buttons, diagnostic readouts, a hydrophobic PCB surface treatment, dual-BIOS, and clearly labelled voltage domains.

GIGABYTE Technology, one of the top global manufacturers of motherboards, graphics cards, and hardware solutions, today unveils its groundbreaking B850 and B840 series motherboards, introducing a new era of performance optimization and EZ-friendly design for the latest AMD Ryzen processors with full-line PCIe Gen 5 x16 graphics cards support.⁠

D5 Bionic Corsa: Redefining Memory Overclocking
At the heart of GIGABYTE's new B850/ B840 motherboard series lies the innovative D5 Bionic Corsa technology, a game-changing approach to memory performance. This breakthrough technology has achieved remarkable up to 8600 MT/s DDR5 speeds, setting a new standard for memory overclocking. Through the intelligent AORUS AI SNATCH software, users can now effortlessly enhance their system's performance with unprecedented ease. The AI-powered EXPO AI BOOST feature eliminates the traditional time-consuming trial and error process, delivering optimized memory profiles that balance performance and stability with just a few clicks.

AMD's client computing division is expected to have an action-packed 2025 International CES. On the CPU front, the company is expected to expand its Ryzen 9000X3D family with high-core count models, such as the Ryzen 9 9950X3D and Ryzen 9 9900X3D. It is also expected to introduce certain power-efficient 65 W models of its non-X3D Ryzen 9000 series "Zen 5" chips, which serve as value options within this processor generation, to try and lure buyers off the 65 W Intel Core Ultra "Arrow Lake-S" models. On the gaming graphics side, the company is expected to debut its Radeon RX 9000 series, led by the RX 9070 XT and RX 9070, both of which are based on the "Navi 48" silicon, and powered by the RDNA 4 graphics architecture.

That's not all, AMD is also expected to announce the new FSR 4 technology for gamers. Leaks describe FSR 4 as being a performance enhancement that's a generation ahead of FSR 3.x. While FSR 3.x combines super-resolution based performance enhancement, and algorithmic frame-generation that nearly doubles framerates; FSR 4 is expected to be AMD's first performance enhancement to incorporate AI to not just enhance the visual detail in super-resolution, but also to improve accuracy of frame-generation. At this point, it is not known if FSR 4 will be available as a feature at launch of the Radeon RX 9070 series. VideoCardz reports that the early-January announcements could be followed by late-January availability of the hardware.

MSI has unveiled a new performance-enhancing feature for its AM5 socket motherboards to improve DDR5 memory latency. Some latency issues that emerged following AMD's AGESA 1.2.0.2a microcode update, which added support for AMD's Ryzen 9000X3D processors, are now fixed. MSI has baked in its BIOS tuning to develop a new "Latency Killer" feature, which can be found in the advanced menu section, specifically within the overclocking submenu in BIOS of MSI X870E/X870 gaming motherboards like MEG X870E GODLIKE and MPG X870E CARBON WIFI. Users have three options to choose from: Auto, Enabled, and Disabled. While the default behavior of the Auto setting remains unclear, it is believed to be initially disabled to ensure system stability.

Recent benchmark testing of Uniko's Hardware using AIDA64 has demonstrated promising results, showing an eight nanosecond improvement in memory latency when the new feature is activated. The test was conducted using a Ryzen 7 9800X3D processor paired with an MPG X870E Carbon WiFi motherboard and DDR5-8000 CL38 memory, running in High-Efficiency mode at its maximum preset. Some Reddit users with AMD Ryzen 7 9800X3D on MSI Tomahawk X870 reported seeing 10-12 ns improvement from enabling the "Latency Killer." MSI motherboards complement its Latency Killer feature with additional memory optimization tools in the BIOS, including EXPO / A-XMP profiles, Memory Try It presets, High-Efficiency Mode, and comprehensive manual overclocking options for enthusiasts seeking maximum performance.

ASRock, the global leading manufacturer of motherboards, graphics cards, mini PCs, and gaming monitors, announced today that its AM5 series motherboards are fully compatible with the AMD Ryzen 7 9800X3D processor, maximizing its impressive gaming performance. This allows PC enthusiasts worldwide to be among the first to experience the exceptional capabilities brought by the AMD Ryzen 7 9800X3D processor. The AMD Ryzen 7 9800X3D is the first model released in the 9000X3D processor series. ASRock AM5 motherboards will continue to receive updates to ensure seamless compatibility with upcoming Ryzen 9000 Series X3D processors, delivering outstanding performance for gaming enthusiasts.

Users can download and install the latest AGESA 1.2.0.2a BIOS from the ASRock website or use the BIOS Flashback and Instant Flash features for an easy upgrade. ASRock recommends updating to the latest BIOS version promptly to ensure optimal system compatibility and performance.

The upcoming AMD Ryzen 7 9800X3D processor is already in the hands of hardware modders, who have put the chip through de-lidding (removal of the integrated heatspreader or IHS), revealing what's underneath. In the 9800X3D de-lidded picture, the CCD appears plain, with no apparent L3D on top, unlike on the 7800X3D (second picture, below). We'd been hearing reports that with the 9000X3D series, AMD has redesigned the way the 3D V-cache die (L3D) and the CPU complex die (CCD) are stacked together, by inverting their arrangement, such that the CCD is on top, and the L3D below.

In past generations of X3D processors, such as the 7800X3D and the 5800X3D, the L3D is stacked on top of the CCD, with structural silicon handling the crucial task of transferring heat from the CPU cores to the IHS. This inversion in stacking should ensure better thermals for the CPU cores, the 9800X3D boosting behavior should be similar to that of non-X3D chips, such as the 9700X. AMD has given the 9800X3D a 120 W TDP and 5.20 GHz boost frequency. This inversion of the CCD and L3D stacking is probably what is behind the "X3D Reimagined" teaser blurb by AMD.

Much of the Ryzen 7 9800X3D teaser material from AMD had the recurring buzzwords "X3D Reimagined," causing us to speculate what it could be. 9550pro, a reliable source with hardware leaks, says that AMD has redesigned the way the CPU complex die (CCD) and 3D V-cache die (L3D) are stacked together. In past generations of X3D processors, such as the 5800X3D "Vermeer-X" and the 7800X3D "Raphael-X," the L3D is stacked on top of the CCD. It would stack above the central region of the CCD that has the on-die 32 MB L3 cache, while blocks of structural silicon would be placed on top of the edges of the CCD that have the CPU cores, with these structural silicon blocks performing the crucial task of transferring heat from the CPU cores to the IHS above. This is about to change.

If the leaks are right, AMD has inverted the CCD-L3D stack with the 9000X3D series such that the "Zen 5" CCD is now on top, the L3D is below it, under the central region of the CCD. The CPU cores now dissipate heat to the IHS as they do on regular 9000 series processors without the 3D V-cache technology. The way we imagine they achieved this is by enlarging the L3D to align with the size of the CCD, and serve as a kind of "base tile." The L3D would have to be peppered with TSVs that connect the CCD to the fiberglass substrate below. We know where AMD is going with this in the future. Right now, the L3D "base tile" contains the 64 MB 3D V-cache that gets appended to the 32 MB on-die L3 cache, but in the future (probably with "Zen 6"), AMD could design the CCDs with TSVs even for the per-core L2 caches.

MSI OCLab made some groundbreaking disclosures about the gaming performance of upcoming AMD Ryzen 9000X3D processors. It looks like AMD is set to dominate the Intel Core Ultra 2-series "Arrow Lake-S" desktop processors in gaming performance, if these numbers hold up. In the games that MSI tested, namely "Far Cry 6," "Shadow of the Tomb Raider," and "Black Myth: Wukong," the "8-core 9000X3D" processor, or the Ryzen 7 9800X3D, is found to be 11% faster on average than the Ryzen 7 7800X3D. The "16-core 9000X3D" processor, which is expected to be the Ryzen 9 9950X3D, is an impressive 13% faster than its predecessor, the Ryzen 9 7950X3D.

Normally we'd expect bigger gen-on-gen gains for the 8-core part than the 16-core part, but the 16-core 9000X3D pulling ahead by that much over its predecessor hints at the possibility of AMD either giving it significantly higher clock speeds, or the rumor about AMD deploying both 3D V-cache on both its CCDs could be true after all. The 9950X3D could end up roughly on-par with the 9800X3D if this turns out to be true, given that the gaming performance delta between the 7800X3D and 7950X3D is roughly that much—2-3 percentage points. Intel earlier this week officially announced the Core Ultra 2-series desktop processors. As part of the announcement, the company put out some first-party gaming performance numbers, which put the top Core Ultra 9 285K either on-par with the Core i9-14900K, or faster by 2-3%, which means it should land behind even the 7950X3D in gaming performance, and AMD is set to dominate Intel in gaming performance with the 9000X3D series.

A new rumor circulating via VideoCardz reveals alleged Cinebench R23 rendering scores for the upcoming AMD Ryzen 9 9800X3D CPU series. The lineup supposedly includes 8-core, 12-core, and 16-core models, all featuring Zen5 architecture and 3D V-Cache technology. The leak consists of Cinebench R23 benchmark scores, however, there are no screenshots, so it should be treated with caution as it comes from CodeCommando, a relatively new source with only one verified leak to his name—the Ryzen 9000 slides that emerged shortly before AMD's official announcement.

Comparing the results posted from CodeCommando with TechPowerUp review data of the previous generation, the picture presents itself in a promising way for the upcoming AMD CPUs. The Ryzen 9 9950X3D is around 10% faster in single-core and 17% faster in multi-core compared with Ryzen 9 7950X3D, while Ryzen 7 9800X3D seems to be 20% faster in single-core and 28% faster in multi-core than Ryzen 7 7800X3D. These initial benchmark results show notable performance gains for the 8-core SKU, with both X3D models demonstrating higher multi-core scores than their non-X3D counterparts. While the 9800X3D shows slightly lower single-core performance than the 8-core 9700X, it exceeds the 9700X in multi-core tests. This multi-core advantage likely comes from a higher TDP, though specific power specifications haven't been revealed yet.

Earlier this week, we got rumors that AMD is rushing in the Ryzen 7 9800X3D 8-core/16-thread "Zen 5" processor with 3D V-cache for a late-October debut. The 9800X3D succeeds the popular 7800X3D, and AMD probably hopes it will have a competitive gaming processor in time for Intel's Core Ultra 2-series "Arrow Lake-S" launch. In the previous article, it was reported that the higher core-count 9000X3D series processor models, the Ryzen 9 9950X3D and Ryzen 9 9900X3D, would arrive some time in Q1 2025, because it was reported that the chips have certain "new features" compared to their predecessors, the 7950X3D and 7900X3D. At the time, we even explored the possibility of AMD giving both 8-core CCDs on the processor 3D V-cache. Turns out, this is where things are headed.

A new report by Benchlife.info claims that the higher core-count 9950X3D and 9900X3D will implement 3D V-cache on both CCD chiplets, giving these processors an impressive 192 MB of L3 cache (96 MB per CCD), and 208 MB or 204 MB of "total cache" (L2+L3). The report also says that AMD is planning a Ryzen 5 9600X3D chip, its second attempt at taking on Intel's Core i5 lineup, following its very recent release of the Ryzen 5 7600X3D, which ended up 1-3% short of the Core i5-14600K in gaming workloads. There's no word on whether the 9600X3D will launch in October alongside the 9800X3D, or in Q1-2025 with the Ryzen 9 9000X3D series.

Facing poor sales of its Ryzen 9000 "Granite Ridge" desktop processors, and with the spectre of Intel's Core Ultra "Arrow Lake-S" looming, AMD is rumored to have given its desktop processor roadmap a shakedown. The company is working to rush in at least one of the three upcoming Ryzen 9000X3D series processor SKUs. The Ryzen 7 9800X3D is a successor to the popular Ryzen 7 7800X3D. It pairs the new "Zen 5" microarchitecture with 3D V-cache technology to boost gaming performance. AMD is allegedly rushing the 9800X3D for a late-October launch. If this chip meets its performance targets (of around 15-20% over the 9700X), then AMD hopes it could take the edge off Intel's Core Ultra 200-series.

Launch of a Ryzen 9000X3D series product-stack became inevitable when AMD confirmed that the "Zen 5" CCD has silicon-level preparation for 3D V-cache (such as TSVs over the region with the on-die L3 cache that interface with the stacked L3D silicon), however, it was expected that the non-X3D Ryzen 9000 series, such as the 9700X, would perform close to the 7800X3D in games, giving AMD room to launch the 9800X3D in Q1-2025. Prior to the 7800X3D and Intel's 13th Gen Core "Raptor Lake," the Ryzen 7 7700X nearly matched the gaming performance of the Ryzen 7 5800X3D, and so something similar was expected of the 9700X. Of course things didn't go to plan, the 9700X fell significantly short of the 7800X3D in gaming, resulting in mixed reviews and low sales.

AMD's upcoming Ryzen 9000X3D series of processors with 3D V-Cache have been reportedly scheduled to arrive in January 2025 and should make a debut at the CES event, a few months later than initially expected. While disappointing for eager enthusiasts, the delay could signify that AMD is taking extra precautions to ensure a smooth launch and deliver a product that meets the high-performance standards set by its previous 3D V-Cache offerings. Delaying the new product launch could also be a strategic move by AMD to avoid potential supply chain issues or to align the launch with other product announcements.

We previously reported that the series will maintain the same cache size configurations as the last generation with 3D V-Cache, and it will just be an upgrade to up the performance of the new Zen 5 design. The launch of the 9000X3D series follows a smaller six-month gap from the regular Ryzen 9000 series, where the previous Ryzen 7000X3D and 5000X3D followed seven and seventeen months after the launch of their regular SKUs, respectively.