Yesterday, Intel launched its Xeon 6 family of server processors based on P-cores manufactured on Intel 3 node. While the early reviews seem promising, Intel is preparing a more advanced generation of processors that will make or break its product and foundry leadership. Codenamed "Clearwater Forest," these CPUs are expected to be the first high-volume production chips based on the Intel 18A node. We have pictures of the five-tile Clearwater Forest processor thanks to Tom's Hardware. During the Enterprise Tech Tour event in Portland, Oregon, Tom's Hardware managed to take a picture of the complex Clearwater Forest design. With compute logic built on 18A, this CPU uses Intel's 3-T process technology, which serves as the foundation for the base die, marking its debut in this role. Compute dies are stacked on this base die, making the CPU building more complex but more flexible.

The Foveros Direct 3D and EMIB technologies enable large-scale integration on a package, achieving capabilities that previous monolithic single-chip designs could not deliver. Other technologies like RibbonFET and PowerVia will also be present for Clearwater Forest. If everything continues to advance according to plan, we expect to see this next-generation CPU sometime next year. However, it is crucial to note that if this CPU shows that the high-volume production of Intel 18A is viable, many Intel Foundry customers would be reassured that Intel can compete with TSMC and Samsung in producing high-performance silicon on advanced nodes at scale.

As AI continues to revolutionize industries, enterprises are increasingly in need of infrastructure that is both cost-effective and available for rapid development and deployment. To meet this demand head-on, Intel today launched Xeon 6 with Performance-cores (P-cores) and Gaudi 3 AI accelerators, bolstering the company's commitment to deliver powerful AI systems with optimal performance per watt and lower total cost of ownership (TCO).

"Demand for AI is leading to a massive transformation in the data center, and the industry is asking for choice in hardware, software and developer tools," said Justin Hotard, Intel executive vice president and general manager of the Data Center and Artificial Intelligence Group. "With our launch of Xeon 6 with P-cores and Gaudi 3 AI accelerators, Intel is enabling an open ecosystem that allows our customers to implement all of their workloads with greater performance, efficiency and security."

All eyes have been on Intel since we announced Q2 earnings. There has been no shortage of rumors and speculation about the company, including last week's Board of Directors meeting, so I'm writing today to provide some updates and outline what comes next. Let me start by saying we had a highly productive and supportive Board meeting. We have a strong Board comprised of independent directors whose job it is to challenge and push us to perform at our best. And we had deep discussions about our strategy, our portfolio and the immediate progress we are making against the plan we announced on August 1.

The Board and I agreed that we have a lot of work ahead to drive greater efficiency, improve our profitability and enhance our market competitiveness—and there are three key takeaways from last week's meeting that I want to focus on:

• We must build on our momentum in Foundry as we near the launch of Intel 18A and drive greater capital efficiency across this part of our business.
• We must continue acting with urgency to create a more competitive cost structure and deliver the $10B in savings target we announced last month.
• We must refocus on our strong x86 franchise as we drive our AI strategy while streamlining our product portfolio in service to Intel customers and partners.

We have several pieces of news to share that support these priorities.

Intel Corp. and Amazon Web Services. Inc., an Amazon.com company, today announced a co-investment in custom chip designs under a multi-year, multi-billion-dollar framework covering product and wafers from Intel. This is a significant expansion of the two companies' longstanding strategic collaboration to help customers power virtually any workload and accelerate the performance of artificial intelligence (AI) applications.

As part of the expanded collaboration, Intel will produce an AI fabric chip for AWS on Intel 18A, the company's most advanced process node. Intel will also produce a custom Xeon 6 chip on Intel 3, building on the existing partnership under which Intel produces Xeon Scalable processors for AWS.

Intel today announced that its lead products on Intel 18A, Panther Lake (AI PC client processor) and Clearwater Forest (server processor), are out of the fab and have powered-on and booted operating systems. These milestones were achieved less than two quarters after tape-out, with both products on track to start production in 2025. The company also announced that the first external customer is expected to tape out on Intel 18A in the first half of next year.

"We are pioneering multiple systems foundry technologies for the AI era and delivering a full stack of innovation that's essential to the next generation of products for Intel and our foundry customers. We are encouraged by our progress and are working closely with customers to bring Intel 18A to market in 2025." -Kevin O'Buckley, Intel senior vice president and general manager of Foundry Services

In a conversation with Intel's CEO Pat Gelsinger, industry analyst Patrick Moorhead revealed that Intel's Meteor Lake CPU platform suffers from some production issues. More specifically, Intel has been facing some yield and/or back-end production issues with its Meteor Lake platform, resulting in a negative impact on Intel's margins when producing the chip. The market is showing great demand for these chips, and Intel has been forced to run productions of "hot lots"-- batch production of silicon with the highest priority that gets moved to the front of the production line so they can get packaged as fast as possible. While this is a good sign that the demand is there, running hot lots increases production costs overall as some other wafers have to go back so Meteor Lake can pass.

The yield issues associated with Meteor Lake could be stemming from the only tile made by Intel in the MTL package: the compute tile made on the Intel 4 process. Intel 4 process is specific to Meteor Lake. No other Intel product uses it, not even the Xeon 6, which uses Intel 3, or any of the upcoming CPUs like Arrow Lake, which uses the Intel 20A node. So, Intel is doing multiple nodes for multiple generations of processors, further driving up costs as typical high-volume production with a single node for multiple processors yields lower costs. Additionally, the company is left with lots of "wafers to burn" with Intel 4 node, so even with Meteor Lake having yield issues, the production is ultimately fine, while the operating costs and margins take a hit.

Intel Corporation today reported second-quarter 2024 financial results. "Our Q2 financial performance was disappointing, even as we hit key product and process technology milestones. Second-half trends are more challenging than we previously expected, and we are leveraging our new operating model to take decisive actions that will improve operating and capital efficiencies while accelerating our IDM 2.0 transformation," said Pat Gelsinger, Intel CEO. "These actions, combined with the launch of Intel 18A next year to regain process technology leadership, will strengthen our position in the market, improve our profitability and create shareholder value."

"Second-quarter results were impacted by gross margin headwinds from the accelerated ramp of our AI PC product, higher than typical charges related to non-core businesses and the impact from unused capacity," said David Zinsner, Intel CFO. "By implementing our spending reductions, we are taking proactive steps to improve our profits and strengthen our balance sheet. We expect these actions to meaningfully improve liquidity and reduce our debt balance while enabling us to make the right investments to drive long-term value for shareholders."

A CPU-Z screenshot of an alleged Intel Core Ultra 9 285K "Arrow Lake-S" desktop processor engineering sample is doing rounds on social media, thanks to wxnod. CPU-Z identifies the chip with an Intel Core Ultra case badge with the deep shade of blue associated with the Core Ultra 9 brand extension, which hints at this being the top Core Ultra 9 285K processor model, we know it's the "K" or "KF" SKU looking at its processor base power reading of 125 W. The chip is built in the upcoming Intel Socket LGA1851. CPU-Z displays the process node as 7 nm, which corresponds with the Intel 4 foundry node.

Intel is using the same Intel 4 foundry node for "Arrow Lake-S" as the compute tile of its "Meteor Lake" processor. Intel 4 offers power efficiency and performance comparable to 4 nm nodes from TSMC, although it is physically a 7 nm node. Likewise, the Intel 3 node is physically 5 nm. If you recall, the main logic tile of "Lunar Lake" is being built on the TSMC N3P (3 nm) node. This means that Intel is really gunning for performance/Watt with "Lunar Lake," to get as close to the Apple M3 Pro as possible.

Today marks a new milestone in the growth of Intel Foundry's design ecosystem as key partners Ansys, Cadence, Siemens, and Synopsys have announced the availability of reference flows for Intel's embedded multi-die interconnect bridge (EMIB) advanced packaging technology. This comes on the heels of recent announcements where those same partners declared readiness for Intel 18A designs. "Today's news shows how Intel Foundry continues to combine the best of Intel with the best of our ecosystem to help our customers realize their AI systems ambitions," said Suk Lee, vice president for Ecosystem Development, Intel Foundry.

The success of Intel Foundry is rooted in collaboration with a vibrant design ecosystem. This ensures customers can access our leading process and packaging technologies. Now, in collaboration with our ecosystem partners, we are making it as easy and as fast as possible for companies to optimize, fabricate and assemble their system-on-chip designs through our foundries, while enabling their designers with validated EDA tools, design flows and IP portfolios for silicon-through-package design. This systems foundry approach allows our customers to innovate at every layer of the stack so they can meet the complex computing demands of the AI era, where chip architectures increasingly rely on multiple CPUs, GPUs and NPUs in a package to achieve performance requirements.

Intel Corporation (Nasdaq: INTC) and Apollo (NYSE: APO) today announced a definitive agreement under which Apollo-managed funds and affiliates will lead an investment of $11 billion to acquire from Intel a 49% equity interest in a joint venture entity related to Intel's Fab 34. The transaction represents Intel's second Semiconductor Co-Investment Program (SCIP) arrangement. SCIP is an element of Intel's Smart Capital strategy, a funding approach designed to create financial flexibility to accelerate the company's strategy, including investing in its global manufacturing operations, while maintaining a strong balance sheet.

Located in Leixlip, Ireland, Fab 34 is Intel's leading-edge high-volume manufacturing (HVM) facility designed for wafers using the Intel 4 and Intel 3 process technologies. To date, Intel has invested $18.4 billion in Fab 34. This transaction allows Intel to unlock and redeploy to other parts of its business a portion of this investment while continuing the build-out of Fab 34. As part of its transformation strategy, Intel has committed billions of dollars of investments to regaining process leadership and building out leading-edge wafer fabrication and advanced packaging capacity globally.

Intel Corporation today reported first-quarter 2024 financial results. "We are making steady progress against our priorities and delivered a solid quarter," said Pat Gelsinger, Intel CEO. "Strong innovation across our client, edge and data center portfolios drove double-digit revenue growth in Intel Products. With Intel 3 in high-volume production, leading-edge semiconductors are being manufactured in the U.S. for the first time in almost a decade and we are on track to regain process leadership next year as we grow Intel Foundry. We are confident in our plans to drive sequential growth throughout the year as we accelerate our AI solutions and maintain our relentless focus on execution, operational discipline and shareholder value creation in a dynamic market."

"Q1 revenue was in line with our expectations, and we delivered non-GAAP EPS above our guidance, driven by better-than-expected gross margins and strong expense discipline," said David Zinsner, Intel CFO. "Our new foundry operating model, which provides greater transparency and accountability, is already driving better decision-making across the business. Looking ahead, we expect to deliver year-over-year revenue and non-GAAP EPS growth in fiscal year 2024, including roughly 200 basis points of full-year gross margin improvement." In the first quarter, the company used $1.2 billion in cash from operations and paid dividends of $0.5 billion.

A CPU-Z screenshot has been shared by YuuKi_AnS—the image contains details about an alleged next-gen Intel Xeon Scalable processor engineering sample (ES). The hardware tipster noted in (yesterday's post) that an error had occurred in the application's identification of this chunk of prototype silicon. CPU-Z v2.09 has recognized the basics—an Intel Granite Rapids-SP processor that is specced with 80 cores, 2.5 GHz max frequency, a whopping 672 MB of L3 cache, and a max. TDP rating of 350 W. The counting of 320 threads seems to be CPU-Z's big mistake here—previous Granite Rapids-related leaks have not revealed Team Blue's Hyper-Threading technology producing such impressive numbers.

The alleged prototype status of this Xeon chip is very apparent in CPU-Z's tracking of single and multi-core performance—the benchmark results are really off the mark, when compared to finalized current-gen scores (produced by rival silicon). Team Blue's next-gen Xeon series is likely positioned to catch up with AMD EPYC's deployment of large core counts—"Granite Rapids" has been linked to the Intel 3 foundry node, reports from last month suggest that XCC-type processors could be configured with "counts going up to 56-core/112-threads." Micron is prepping next-gen "Tall Form Factor" memory modules, designed with future enterprise processor platforms in mind—including Intel's Xeon Scalable "Granite Rapids" family. Industry watchdogs posit that Team Blue will be launching this series in the coming months.

Intel Corp. today launched Intel Foundry as a more sustainable systems foundry business designed for the AI era and announced an expanded process roadmap designed to establish leadership into the latter part of this decade. The company also highlighted customer momentum and support from ecosystem partners - including Synopsys, Cadence, Siemens and Ansys - who outlined their readiness to accelerate Intel Foundry customers' chip designs with tools, design flows and IP portfolios validated for Intel's advanced packaging and Intel 18A process technologies.

The announcements were made at Intel's first foundry event, Intel Foundry Direct Connect, where the company gathered customers, ecosystem companies and leaders from across the industry. Among the participants and speakers were U.S. Secretary of Commerce Gina Raimondo, Arm CEO Rene Haas, Microsoft CEO Satya Nadella, OpenAI CEO Sam Altman and others.

Feast your eyes on the first pictures of an Intel "Granite Rapids" Xeon processor wafer, courtesy of Andreas Schilling with HardwareLuxx.de. This is Intel's first commercial silicon built on the new Intel 3 foundry node, which is expected to be the company's final silicon fabrication node to implement FinFET technology; before the company switches to Nanosheets with the next-generation Intel 20A. Intel 3 offers transistor densities and performance competitive to TSMC N3 series, and Samsung 3GA series nodes.

The wafer contains square 30-core tiles, two of which make up a "Granite Rapids-XCC" processor, with CPU core counts going up to 56-core/112-threads (two cores left unused per tile for harvesting). Each of the 30 cores on the tile is a "Redwood Cove" P-core. In comparison, the current "Emerald Rapids" Xeon processor uses "Raptor Cove" cores, and is built on the Intel 7 foundry node. Intel is planning to overcome the CPU core-count deficit to AMD EPYC, including the upcoming EPYC "Turin" Zen 5 processors with their rumored 128-core/256-thread counts, by implementing several on-silicon fixed-function accelerators that speed up popular kinds of server workloads. The "Redwood Cove" core is expected to be Intel's first IA core to implement AVX10 and APX.

According to a Bloomberg report, Intel is seeking to raise at least $2 billion in equity funding from investors for expanding its fabrication facility in Leixlip, Ireland, known as Fab 34. The chipmaker has hired an advisor to find potential investors interested in providing capital for the project. Fab 34 is currently Intel's only chip plant in Europe that uses cutting-edge extreme ultraviolet (EUV) lithography. It produces processors on the Intel 4 process node, including compute tiles for Meteor Lake client CPUs and expected future Xeon data center chips. While $2 billion alone cannot finance the construction of an entirely new fab today, it can support meaningful expansion or upgrades of existing capacity. Intel likely aims to grow Fab 34's output and/or transition it to more advanced 3 nm-class technologies like Intel 3, Intel 20A, or Intel 18A.

Expanding production aligns with Intel's needs for its own products and its Intel Foundry Services business, providing contract manufacturing. Intel previously secured a $15 billion investment from Brookfield Infrastructure for its Arizona fabs in exchange for a 49% stake, demonstrating the company's willingness to partner to raise capital for manufacturing projects. The Brookfield deal also set a precedent of using outside financing to supplement Intel's own spending budget. It provided $15 billion in effectively free cash flow Intel can redirect to other priorities like new fabs without increasing debt. Intel's latest fundraising efforts for the Ireland site follow a similar equity investment model that leverages outside capital to support its manufacturing expansion plans. Acquiring High-NA EUV machinery for manufacturing is costly, as these machines can reach up to $380 million alone.

The sneak peeks from the upcoming IEEE Solid State Circuit Conference continues, as the agenda items unveil interesting tech that will be either unveiled or demonstrated there. Intel, Synopsys, and Marvell, are leading providers of DRAM physical layer interface (PHY) IP. Various processor, GPU, and SoC manufacturers license PHY and memory controller IP from these companies, to integrate with their designs. All three companies are ready with over 200 Gbps around the 2.69 to 3 petajoule per bit range. This energy cost is as important as the data-rate on offer; as it showcases the viability of the PHY for a specific application (for example, a smartphone SoC has to conduct its memory sub-system at a vastly more constrained energy budget compared to an HPC processor).

Intel is the first in the pack to showcase a 224 Gbps sub-picojoule/bit PHY transmitter that supports PAM4 and PAM6 signaling, and is designed for 3 nm-class FinFET foundry nodes. If you recall, Intel 3 will be the company's final FinFET node before it transitions to nanosheets with the Intel 20A node. At the physical layer, all digital memory signal is analogue, and Intel's IP focuses on the DAC aspect of the PHY. Next up, is a somewhat similar transceiver IP by Synopsys. This too claims 224 Gbps speeds at 3 pJ/b, but at a 40 dB insertion loss; and is designed for 3 nm class FinFET nodes such as the TSMC N3 family and Intel 3. Samsung's 3 nm node uses the incompatible GAAFET technology for its 3 nm EUV node. Lastly, there's Marvell, with a 212 Gb/s DSP-based transceiver for optical direct-detect applications on the 5 nm FinFET nodes, which is relevant for high speed network switching fabrics.

Intel Corporation today reported third-quarter 2023 financial results. "We delivered a standout third quarter, underscored by across-the-board progress on our process and product roadmaps, agreements with new foundry customers, and momentum as we bring AI everywhere," said Pat Gelsinger, Intel CEO. "We continue to make meaningful progress on our IDM 2.0 transformation by relentlessly advancing our strategy, rebuilding our execution engine and delivering on our commitments to our customers."

David Zinsner, Intel CFO, said, "Our results exceeded expectations for the third consecutive quarter, with revenue above the high end of our guidance and EPS benefiting from strong operating leverage and expense discipline. As demonstrated by our recent portfolio actions, we are highly focused on being great allocators of our owners' capital and unlocking value for shareholders."

Intel at the 2023 InnovatiON event surprised audiences with a live demo of a reference notebook powered by a Core "Lunar Lake" processor. What's surprising about this is that "Lunar Lake" won't come out until 2025 (at least), and succeeds not just the upcoming "Meteor Lake" architecture, but also its succeeding "Arrow Lake," which debuts in 2024. Intel is expected to debut "Meteor Lake" some time later this year. What's also surprising is that Intel has proven that the Intel 18A foundry node works. The Compute tile of "Lunar Lake" is expected to be based on Intel 18A, which is four generations ahead of the current Intel 7, which will be succeeded by Intel 4, Intel 3, and Intel 20A along the way.

The demo focused on the generative AI capabilities of Intel's third generation NPU, the hardware backend of AI Boost. Using a local session of a tool similar to Stable Diffusion, the processor was made to generate the image of a giraffe wearing a hat; and a GPT program was made to pen the lyrics of a song in the genre of Taylor Swift from scratch. Both tasks were completed on stage using the chip's NPU, and in timeframes you'd normally expect from discrete AI accelerators or cloud-based services.

Intel at the 2023 InnovatiON event unveiled a 288-core extreme core-count variant of the Xeon "Sierra Forest" processor for high-density servers for scale-out, cloud-native environments. It succeeds the current 144-core model. "Sierra Forest" is a server processor based entirely on efficiency cores, or E-cores, based on the "Sierra Glen" core microarchitecture, a server-grade derivative of "Crestmont," Intel's second-generation E-core that's making a client debut with "Meteor Lake."

Xeon "Sierra Forest" is a chiplet-based processor, much like "Meteor Lake" and the upcoming "Emerald Rapids" server processor. It features a total of five tiles—two Compute tiles, two I/O tiles, and a base tile (interposer). Each of the two Compute tiles is built on the Intel 3 foundry node, a more advanced node than Intel 4, featuring higher-density libraries, and an undisclosed performance/Watt increase. Each tile has 36 "Sierra Glen" E-core clusters, 108 MB of shared L3 cache, 6-channel (12 sub-channel) DDR5 memory controllers, and Foveros tile-to-tile interfaces.

Intel Foundry Services (IFS) and Tower Semiconductor, a leading foundry for analog semiconductor solutions, today announced an agreement where Intel will provide foundry services and 300 mm manufacturing capacity to help Tower serve its customers globally. Under the agreement, Tower will utilize Intel's advanced manufacturing facility in New Mexico. Tower will invest up to $300 million to acquire and own equipment and other fixed assets to be installed in the New Mexico facility, providing a new capacity corridor of over 600,000 photo layers per month for Tower's future growth, enabling capacity to support forecasted customer demand for 300 mm advanced analog processing.

This agreement demonstrates the commitment from both Intel and Tower to expand their respective foundry footprints with unparalleled solutions and scaled capabilities. Intel will manufacture Tower's highly differentiated 65-nanometer power management BCD (bipolar-CMOS-DMOS) flows, among other flows at Intel's Fab 11X in Rio Rancho, New Mexico.

Competition between Samsung and TSMC in the 4 nm and 3 nm foundry process markets is about to heat up, with the Korean foundry claiming yields competitive to those of TSMC, according to a report in the Kukmin Ilbo, a Korean daily newspaper. 4 nm is the final silicon fabrication process to use the FinFET technology that powered nodes ranging between 16 nm to 4 nm. Samsung Foundry is claiming 4 nm wafer yields of 75%, against the 80% yields figure put out by TSMC. 4 nm powers several current-generation mobile SoCs, PC processors, and more importantly, the GPUs driving the AI gold-rush.

Things get very interesting with 3 nm, the node that debuts GAA-FET (gates all around FET) technology. Here, Samsung claims to offer higher yields than TSMC, with its 3 nm GAA node clocking 60% yields, against 55% put out by TSMC. Samsung was recently bitten by a scandal where its engineers allegedly falsified yields figures to customers to score orders, which had a cascading effect on the volumes and competitiveness of their customers. We're inclined to think that Samsung has taken lessons and is more careful with the yields figures being reported in the press. Meanwhile, Intel Foundry Services competes with the Intel 3 node, which is physically 7 nm FinFET, but with electrical characteristics comparable to those of 3 nm.

Intel Corporation today reported first-quarter 2023 financial results. "We delivered solid first-quarter results, representing steady progress with our transformation," said Pat Gelsinger, Intel CEO. "We hit key execution milestones in our data center roadmap and demonstrated the health of the process technology underpinning it. While we remain cautious on the macroeconomic outlook, we are focused on what we can control as we deliver on IDM 2.0: driving consistent execution across process and product roadmaps and advancing our foundry business to best position us to capitalize on the $1 trillion market opportunity ahead."

David Zinsner, Intel CFO, said, "We exceeded our first-quarter expectations on the top and bottom line, and continued to be disciplined on expense management as part of our commitment to drive efficiencies and cost savings. At the same time, we are prioritizing the investments needed to advance our strategy and establish an internal foundry model, one of the most consequential steps we are taking to deliver on IDM 2.0."

A new story is making the rounds, citing Wang Rui, chair Intel China, in the media in both China and Taiwan, claiming that Intel is working on test chips for as many as 43 potential customers for Intel Foundry Services (IFS). At least seven of those potential customers are said to be from the top 10 foundry clients globally. This sounds a bit too good to be true, considering that IFS has as yet to prove that they can deliver on their promises.

Furthermore, Wang Rui is meant to have gone on record, saying that IFS has taped out products on both its 20A and 18A nodes. Exactly what these products are, wasn't divulged, but as the 18A node isn't expected to go into mass production until the second half of 2024, this sounds a little bit too good to be true. What makes this even less believable is that the Intel 4 node is only set to go into mass production in the second half this year and before Intel moves to its Ångström nodes, the company still has to deliver on its Intel 3 node. The Intel China chair is also reportedly confident that Intel will be returning to a leading foundry position by 2025.

Intel's upcoming LGA-7529 socket designed for next-generation Xeon processors has been pictured, thanks to Yuuki_Ans and Hassan Mujtaba. According to the latest photos, we see the massive LGA-7529 socket with an astonishing 7,529 pins placed inside of a single socket. Made for Intel's upcoming "Birch Stream" platform, this socket is going to power Intel's next-generation "Sierra Forest" Xeon processors. With Sierra Forest representing a new way of thinking about Xeon processors, it also requires a special socket. Built on Intel 3 manufacturing process, these Xeon processors use only E-cores in their design to respond to AMD EPYC Bergamo with Zen4c.

The Intel Xeon roadmap will split in 2024, where Sierra Forest will populate dense and efficient cloud computing with E-cores, while its Granite Rapids sibling will power high-performance computing using P-cores. This interesting split will be followed by the new LGA-7529 socket pictured below, which is a step up from Intel's current LGA-4677 socket with 4677 pins used for Sapphire Rapids. With higher core densities and performance targets, the additional pins are likely to be mostly power/ground pins, while the smaller portion is picking up the additional I/O of the processor.20:20 UTC: Updated with motherboard picture of dual-socket LGA-7529 system, thanks to findings of @9550pro lurking in the Chinese forums.

Intel Foundry Services, the semiconductor foundry business of Intel, has onboarded an undisclosed fabless customer, the company disclosed in its Q4-2022 Financial Results presentation. This signals that the company wants to serve the semiconductor manufacturing industry beyond its own products, and scale up to demands, just like TSMC, UMC, Samsung Foundry, or other such semiconductor foundries do. The customer is looking to build chips on the Intel 3 foundry-node, which is rumored to offer performance/Watt and transistor-density figures comparable to TSMC 4N (4 nm EUV). Intel will extensively use Tower Semiconductor's silicon fabrication IP in the deal. Throughout its manufacturing lifecycle (from risk production to mass-production and completion), the deal is expected by Intel to generate over $4 billion in revenue for the company.Image Courtesy: VideoCardz