Friday, March 29th 2024

Intel Xeon "Granite Rapids-SP" 80-core Engineering Sample Leaked

A CPU-Z screenshot has been shared by YuuKi_AnS—the image contains details about an alleged next-gen Intel Xeon Scalable processor engineering sample (ES). The hardware tipster noted in (yesterday's post) that an error had occurred in the application's identification of this chunk of prototype silicon. CPU-Z v2.09 has recognized the basics—an Intel Granite Rapids-SP processor that is specced with 80 cores, 2.5 GHz max frequency, a whopping 672 MB of L3 cache, and a max. TDP rating of 350 W. The counting of 320 threads seems to be CPU-Z's big mistake here—previous Granite Rapids-related leaks have not revealed Team Blue's Hyper-Threading technology producing such impressive numbers.

The alleged prototype status of this Xeon chip is very apparent in CPU-Z's tracking of single and multi-core performance—the benchmark results are really off the mark, when compared to finalized current-gen scores (produced by rival silicon). Team Blue's next-gen Xeon series is likely positioned to catch up with AMD EPYC's deployment of large core counts—"Granite Rapids" has been linked to the Intel 3 foundry node, reports from last month suggest that XCC-type processors could be configured with "counts going up to 56-core/112-threads." Micron is prepping next-gen "Tall Form Factor" memory modules, designed with future enterprise processor platforms in mind—including Intel's Xeon Scalable "Granite Rapids" family. Industry watchdogs posit that Team Blue will be launching this series in the coming months.
Sources: yuuki_ans Tweet, Tom's Hardware
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9 Comments on Intel Xeon "Granite Rapids-SP" 80-core Engineering Sample Leaked

#1
natr0n
500 MHz hello amd k6 2
Posted on Reply
#2
freeagent
natr0n500 MHz hello amd k6 2
600-2500..
Posted on Reply
#3
Dr. Dro
I doubt it supports 4-way SMT, but it's as expected of what should be a credit card sized chunk of silicon. Not too bad. Amazing instruction set support.
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#4
Wirko
Dr. DroI doubt it supports 4-way SMT, but it's as expected of what should be a credit card sized chunk of silicon. Not too bad. Amazing instruction set support.
More like CompactFlash card sized chunk. Those grey blocks are HBM, which will only be present in crème-de-la-crème variants, and yellow ones are I/O dies.
Posted on Reply
#5
Dr. Dro
WirkoMore like CompactFlash card sized chunk. Those grey blocks are HBM, which will only be present in crème-de-la-crème variants, and yellow ones are I/O dies.
Still chonky piece of silicon there... beautiful.
Posted on Reply
#6
Wirko
For reference, the largest possible silicon die (26 x 33 mm) is very close in size to a SD card (24 x 32 mm), and two dies side by side (52 x 33 mm) are close to a CF card (43 x 36 mm).
Posted on Reply
#7
matar
So each core has 4 threads wow that's interesting.
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#8
Daven
Still one generation behind AMD. This should go up against Zen 4 Epyc 96 core but by the time it come out, it will be up against Zen 5 Epyc 128 core.

This is the best looking die shot IMHO.
Posted on Reply
#9
DavidC1
matarSo each core has 4 threads wow that's interesting.
It doesn't. CPU-Z is mis-reporting it.

It says 160x L1, L2, and L3 cache, meaning it's a 2-socket system with each having 80 cores, hence 320 threads, because it's 160 cores.
DavenStill one generation behind AMD. This should go up against Zen 4 Epyc 96 core but by the time it come out, it will be up against Zen 5 Epyc 128 core.

This is the best looking die shot IMHO.
The -AP version has 3 compute tiles, thus 120 cores and that'll bring it in the ballpark as compared to predecessors which was a complete flop.
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