According to a report produced by semiconductor industry analysts at Kiwoom Securities—a South Korean financial services firm—Semiconductor Manufacturing International Corporation (SMIC) is expected to complete the development of a 5 nm process at some point in 2025. Jukanlosreve summarized this projection in a recent social media post. SMIC is often considered to be China's flagship foundry business; the partially state-owned organization seems to heavily involved in the production of (rumored) next-gen Huawei Ascend 910 AI accelerators. SMIC foundry employees have reportedly struggled to break beyond a 7 nm manufacturing barrier, due to lack of readily accessible cutting-edge EUV equipment. As covered on TechPowerUp last month, leading lights within China's semiconductor industry are (allegedly) developing lithography solutions for cutting-edge 5 nm and 3 nm wafer production.

Huawei is reportedly evaluating an in-house developed laser-induced discharge plasma (LDP)-based machine, but finalized equipment will not be ready until 2026—at least for mass production purposes. Jukanlosreve's short interpretation of Kiwoom's report reads as follows: (SMIC) achieved mass production of the 7 nm (N+2) process without EUV and completed the development of the 5 nm process to support the mass production of the Huawei Ascend 910C. The cost of SMIC's 5 nm process is 40-50% higher than TSMC's, and its yield is roughly one-third." The nation's foundries are reliant on older ASML equipment, thus are unable to produce products that can compete with the advanced (volume and quality) output of "global" TSMC and Samsung chip manufacturing facilities. The fresh unveiling of SiCarrier's Color Mountain series has signalled a promising new era for China's foundry industry.

According to a recent Center for Strategic and International Studies report, Huawei got its hand on approximately two million Ascend 910B logic dies through shell companies that misled TSMC. This acquisition violates US export controls designed to restrict China's access to advanced semiconductor technology. The report details how Huawei leveraged intermediaries to procure chiplets for its AI accelerators before TSMC discovered the deception and halted shipments. These components are critical for Huawei's AI hardware roadmap, which progressed from the original Ascend 910 (manufactured by TSMC on N7+ until 2020) to the domestically produced Ascend 910B and 910C chips fabricated at SMIC using first and second-generation 7 nm-class technologies, respectively. Huawei reportedly wanted TSMC-made dies because of manufacturing challenges in domestic chip production. The Ascend 910B and 910C reportedly suffer from poor yields, with approximately 25% of units failing during the advanced packaging process that combines compute dies with HBM memory.

Despite these challenges, the performance gap with market-leading solutions still remains but has narrowed considerably, with the Ascend 910C reportedly delivering 60% of NVIDIA H100's performance. Huawei has executed a strategic stockpiling initiative, particularly for high-bandwidth memory components. The company likely acquired substantial HBM inventory between August and December 2024, when restrictions on advanced memory sales to China were announced but not yet implemented. The semiconductor supply chain breach shows that enforcing technology export controls is challenging, and third parties can still purchase silicon for restricted companies. While Huawei continues building AI infrastructure for both internal projects and external customers, manufacturing constraints may limit its ability to scale deployments against competitors with access to more advanced manufacturing processes. Perhaps a future domestic EUV-based silicon manufacturing flow will allow Huawei to gain access to more advanced domestic production, completely circumventing US-imposed restrictions.

TrendForce's latest research reveals that the global foundry industry exhibited a polarized trend in 4Q24. Advanced process nodes benefited from strong demand in AI servers, flagship smartphone application processors (APs), and new PC platforms, driving high-value wafer shipments. This growth helped offset the slowdown in mature process demand, allowing the top 10 foundries to achieve nearly 10% QoQ revenue growth, reaching US$38.48 billion, and marking another industry record.

TrendForce notes that new U.S. trade tariffs under the Trump administration have started affecting the foundry industry. A surge in recent orders for TVs, PCs, and notebooks bound for the U.S. in 4Q24 is expected to extend into 1Q25. Additionally, China's consumer subsidy program—introduced in late 2024—has spurred early inventory restocking among upstream customers. Combined with persistent demand for TSMC's AI-related chips and advanced packaging, these factors suggest that despite Q1 being a seasonally weak quarter, foundry revenue will only decline slightly.

China's domestic extreme ultraviolet (EUV) lithography development is far from a distant dream. The newest system, now undergoing testing at Huawei's Dongguan facility, leverages laser-induced discharge plasma (LDP) technology, representing a potentially disruptive approach to EUV light generation. The system is scheduled for trial production in Q3 2025, with mass manufacturing targeted for 2026, potentially positioning China to break ASML's technical monopoly in advanced lithography. The LDP approach employed in the Chinese system generates 13.5 nm EUV radiation by vaporizing tin between electrodes and converting it to plasma via high-voltage discharge, where electron-ion collisions produce the required wavelength. This methodology offers several technical advantages over ASML's laser-produced plasma (LPP) technique, including simplified architecture, reduced footprint, improved energy efficiency, and potentially lower production costs.

The LPP method relies on high-energy lasers and complex FPGA-based real-time control electronics to achieve the same result. While ASML has refined its LPP-based systems over decades, the inherent efficiency advantages of the LDP approach could accelerate China's catch-up timeline in this critical semiconductor manufacturing technology. When the US imposed sanctions on EUV shipments to Chinese companies, the Chinese semiconductor development was basically limited as standard deep ultraviolet (DUV) wave lithography systems utilize 248 nm (KrF) and 193 nm (ArF) wavelengths for semiconductor patterning, with 193 nm immersion technology representing the most advanced pre-EUV production technique. These longer wavelengths contrast with EUV's 13.5 nm radiation, requiring multiple patterning techniques to achieve advanced nodes.

When the US imposed sanctions on Chinese semiconductor makers, China began the push for sovereign chipmaking tools. According to a study conducted by the Emerging Technology Observatory (ETO), Chinese institutions have dramatically outpaced their US counterparts in next-generation chipmaking research. Between 2018 and 2023, nearly 475,000 scholarly articles on chip design and fabrication were published worldwide. Chinese research groups contributed 34% of the output—compared to just 15% from the United States and 18% from Europe. The study further emphasizes the quality of China's contributions. Focusing on the top 10% of the most-cited articles, Chinese researchers were responsible for 50% of this high-impact work, while American and European research accounted for only 22% and 17%, respectively.

This trend shows China's lead isn't about numbers only, and suggests that its work is resonating strongly within the global academic community. Key research areas include neuromorphic, optoelectric computing, and, of course, lithography tools. China is operating mainly outside the scope of US export restrictions that have, since 2022, shrunk access to advanced chipmaking equipment—precisely, tools necessary for fabricating chips below the 14 nm process node. Although US sanctions were intended to limit China's access to cutting-edge manufacturing technology, the massive body of Chinese research suggests that these measures might eventually prove less effective, with Chinese institutions continuing to push forward with influential, high-citation studies. However, Chinese theoretical work is yet to be proven in the field, as only a single company currently manufactures 7 nm and 5 nm nodes—SMIC. Chinese semiconductor makers still need more advanced lithography solutions to reach high-volume manufacturing on more advanced nodes like 3 nm and 2 nm to create more powerful domestic chips for AI and HPC.

Chinese manufacturers have seized significant market share in legacy chip production, driving prices down and creating intense competitive pressure that Western competitors cannot match. The so-called "China shock" in the semiconductor sector appears as mature node production shifts East at accelerating rates. Legacy process nodes, which are usually 16/20/22/24 nm and larger, form the backbone of consumer electronics and automotive applications while providing established manufacturers with stable revenue streams for R&D investment. However, this economic framework now faces structural disruption as Chinese fabs leverage domestic demand and government support to expand capacity. By Q4 2025, Chinese facilities will control 28% of global mature chip production, with projections indicating further expansion to 39% by 2027.

This rapid capacity growth directly results from Beijing's strategic pivot following US export controls on advanced semiconductor equipment, which redirected investment toward mature nodes where technological barriers remain lower. This is happening in parallel with companies like SMIC, although isolated, which are developing lithography solutions for cutting-edge 5 nm and 3 nm wafer production. For older nodes, The market impact appears most pronounced in specialized materials like silicon carbide (SiC). Industry benchmark 6-inch SiC wafers from Wolfspeed were previously $1,500, compared to current $500 pricing from Guangzhou Summit Crystal Semiconductor—representing a 67% price compression that Western manufacturers cannot profitably match. Multiple semiconductor firms report significant financial strain from this pricing pressure. Wolfspeed has implemented 20% workforce reductions following a 96% market capitalization decline, while Onsemi recently announced 9% staff cuts. With more Chinese expansion into the mature node category, Western companies can't keep up with the lowered costs of what is now becoming a commodity.

China's dominance in semiconductor equipment procurement is expected to face its first setback since 2021, with spending projected to decrease from $41 billion to $38 billion in 2025, according to semiconductor research firm TechInsights. This 6% decline marks a significant shift for the world's largest buyer of wafer fabrication equipment, whose purchases represented 40% of global sales in 2024. The downturn reflects mounting pressures from both market dynamics and geopolitical constraints. US export controls targeting advanced semiconductor capabilities have intensified while domestic chipmakers grapple with overcapacity in mature node segments. SMIC, China's leading foundry, has already signaled concerns about oversupply risks in this sector, where Chinese manufacturers have rapidly expanded their market share against Taiwanese competitors.

Despite these headwinds, Chinese equipment manufacturers have notably advanced domestic capability development. Naura Technology Group has emerged as the seventh-largest global equipment manufacturer, while AMEC continues to expand its international presence. However, critical gaps persist in China's semiconductor equipment ecosystem, particularly in lithography systems, where dependence on foreign suppliers like ASML remains high. TechInsights data reveals that Chinese companies supplied only 17% of testing tools and 10% of domestic assembly equipment in 2023. The spending reduction comes after a period of aggressive stockpiling prompted by US sanctions to limit Beijing's access to advanced chipmaking capabilities, especially those applicable to artificial intelligence and military applications. However, Chinese manufacturers have demonstrated resilience, with SMIC and Huawei successfully producing advanced chips through alternative, albeit more costly, manufacturing methods.

Huawei Technologies reported a robust 22% year-over-year revenue increase for 2024, reaching 860 billion yuan ($118.27 billion), demonstrating remarkable resilience amid continued US-imposed trade restrictions. The Chinese tech giant's resurgence was primarily driven by its revitalized smartphone division, which captured 16% of China's domestic market share, overtaking Apple in regional sales. This achievement was notably accomplished by deploying domestically produced chipsets, marking a significant milestone for the company. In collaboration with Chinese SMIC, Huawei delivers in-house silicon solutions to integrate with HarmonyOS for complete vertical integration. The company's strategic diversification into automotive technology has emerged as a crucial growth vector, with its smart car solutions unit delivering autonomous driving software and specialized chips to Chinese EV manufacturers.

In parallel, Huawei's Ascend AI 910B/C platform recently announced compatibility with DeepSeek's R1 large language model and announced availability on Chinese AI cloud providers like SiliconFlow. Through a strategic partnership with AI infrastructure startup SiliconFlow, Huawei is enhancing its Ascend cloud service capabilities, further strengthening its competitive position in the global AI hardware market despite ongoing international trade challenges. Even if the company can't compete on performance versus the latest solutions from NVIDIA and AMD due to the lack of advanced manufacturing required for AI accelerators, it can compete on costs and deliver solutions that are typically much more competitive with the price/performance ratio. Huawei's Ascend AI solutions deliver modest performance. Still, the pricing makes AI model inference very cheap, with API costs of around one Yaun per million input tokens and four Yuan per one million output tokens on DeepSeek R1.

Hua Hong Semiconductor (HHS) is China's second-largest chip manufacturer; trailing just behind its main rival: Semiconductor Manufacturing International Corporation (SMIC)—a recent recruitment drive has signalled the company's desire to advance further. Nikkei Asia believes that the recruitment of a former Intel executive—Bai Peng—will boost the development of logic chips, and in turn generate greater revenue. A late 2024 reshuffling of leadership positions produced a notable vacancy: company president—Bai Peng assumed this role, effective January 1. His career at Intel spanned three decades—by 2015 he became Team Blue's corporate vice president, although his tenure ended at some point in 2022 (according to a LinkedIn profile).

Industry watchdogs reckon that Hua Hong Semiconductor's freshly established chief will be tasked with advancing semiconductor production technologies. Peng's experience—being a former co-director of Logic Technology Development at the Intel Technology and Manufacturing Group—is cited as a crucial factor in diversifying the firm's product portfolio. HHS foundries produce a lot of 100+ nm-based designs—mostly in the fields of power semiconductors, analog chips, and embedded memory—but two locations are capable of churning out relatively complex silicon via a 40 nm process node. A new plant—based in Wuxi—is supposedly ready to push into sub-forty digits. The latest industry reports suggest that Peng and his colleagues will be focused on improving HSS's manufacturing processes—targeted advancements could open up new product lines: high-end enterprise and AI processors.

The Biden administration is set to announce new, targeted restrictions on China's semiconductor industry, focusing primarily on emerging chip manufacturing equipment companies rather than broad industry-wide limitations. According to Bloomberg, these new restrictions are supposed to take effect on Monday. The new rules will specifically target two manufacturing facilities owned by Semiconductor Manufacturing International Corp. (SMIC) and will add select companies to the US Entity List, restricting their access to American technology. However, most of Huawei's suppliers can continue their operations, suggesting a more mild strategy. The restrictions will focus on over 100 emerging Chinese semiconductor equipment manufacturers, many of which receive government funding. These companies are developing tools intended to replace those currently supplied by industry leaders such as ASML, Applied Materials, and Tokyo Electron.

The moderated approach comes after significant lobbying efforts from American semiconductor companies, who argued that stricter restrictions could disadvantage them against international competitors. Major firms like Applied Materials, KLA, and Lam Research voiced concerns about losing market share to companies in Japan and the Netherlands, where similar but less stringent export controls are in place. Notably, Japanese companies like SUMCO are already seeing the revenue impacts of Chinese independence. Lastly, the restrictions will have a limited effect on China's memory chip sector. The new measures will not directly affect ChangXin Memory Technologies (CXMT), a significant Chinese DRAM manufacturer capable of producing high-bandwidth memory for AI applications.

Semiconductor Manufacturing International Corporation (SMIC), one of the leading semiconductor foundries in the world, today announced its consolidated results of operations for the three months ended September 30, 2024.

Third Quarter 2024 Highlights

• Revenue was $2,171.2 million in 3Q24, compared to $1,901.3 million in 2Q24, and $1,620.6 million in 3Q23.
• Gross profit was $444.2 million in 3Q24, compared to $265.1 million in 2Q24, and $321.6 million in 3Q23.
• Gross margin was 20.5% in 3Q24, compared to 13.9% in 2Q24 and 19.8% in 3Q23.

GlobalFoundries faces a $500,000 fine from the US Commerce Department for breaching export controls by shipping $17.1 million worth of chips to SJ Semiconductor (SJS), a blacklisted Chinese firm affiliated with Semiconductor Manufacturing International Corporation (SMIC). The company made 74 unauthorized shipments between February 2021 and October 2022, delivering nearly 5,700 wafers. The chipmaker attributed the violation to a data entry error in its Oracle trade management system, where SJS was incorrectly recorded under a direct customer's shipping details. While SJS had previously handled GlobalFoundries' chips as a third-party assembly provider, both SJS and SMIC were placed on the Entity List in 2020 due to suspected military ties.

GlobalFoundries received a significantly reduced fine due to its voluntary disclosure and cooperation avoiding a potential fine of up to $34.2 million. "GlobalFoundries' voluntary self-disclosure (VSD) and extensive cooperation throughout the investigation resulted in a significant reduction in the monetary penalty, which is the main incentive of our VSD policies," said John Sonderman, director of the Office of Export Enforcement (OEE) within the Commerce Department. The incident comes as the company anticipates $1.5 billion in CHIPS Act funding for manufacturing expansion. For comparison, the department previously fined Seagate $300 million in April 2023 for shipping $1.1 billion worth of drives to Huawei.

Huawei has reportedly started shipping its Ascend 910C accelerator—the company's domestic alternative to NVIDIA's H100 accelerator for AI training and inference. As the report from China South Morning Post notes, Huawei is shipping samples of its accelerator to large NVIDIA customers. This includes companies like Alibaba, Baidu, and Tencent, which have ordered massive amounts of NVIDIA accelerators. However, Huawei is on track to deliver 70,000 chips, potentially worth $2 billion. With NVIDIA working on a B20 accelerator SKU that complies with US government export regulations, the Huawei Ascend 910C accelerator could potentially outperform NVIDIA's B20 processor, per some analyst expectations.

If the Ascend 910C receives positive results from Chinese tech giants, it could be the start of Huawei's expansion into data center accelerators, once hindered by the company's ability to manufacture advanced chips. Now, with foundries like SMIC printing 7 nm designs and possibly 5 nm coming soon, Huawei will leverage this technology to satisfy the domestic demand for more AI processing power. Competing on a global scale, though, remains a challenge. Companies like NVIDIA, AMD, and Intel have access to advanced nodes, which gives their AI accelerators more efficiency and performance.

When NVIDIA started preparing the H20 GPU for China, the company anticipated great demand from sanction-obeying GPUs. However, we now know precisely what the company makes from its Chinese venture: an astonishing $12 billion in take-home revenue. Due to the massive demand for NVIDIA GPUs, Chinese AI research labs are acquiring as many as they can get their hands on. According to a report from Financial Times, citing SemiAnalysis as its source, NVIDIA will sell over one million H20 GPUs in China. This number far outweighs the number of home-grown Huawei Ascend 910B accelerators that the Chinese companies plan to source, with numbers being "only" 550,000 Ascend 910B chips. While we don't know if Chinese semiconductor makers like SMIC are capable of producing more chips or if the demand isn't as high, we know why NVIDIA H20 chips are the primary target.

The Huawei Ascend 910B features Total Processing Performance (TPP), a metric developed by US Govt. to track GPU performance measuring TeraFLOPS times bit-length of over 5,000, while the NVIDIA H20 comes to 2,368 TPP, which is half of the Huawei accelerator. That is the performance on paper, where SemiAnalysis notes that the real-world performance is actually ahead for the H20 GPU due to better memory configuration of the GPU, including higher HBM3 memory bandwidth. All of this proves to be a better alternative than Ascend 910B accelerator, accounting for an estimate of over one million GPUs shipped this year in China. With an average price of $12,000 per NVIDIA H20 GPU, China's $12 billion revenue will undoubtedly help raise NVIDIA's 2024 profits even further.

According to sources familiar with the matter and reported by Bloomberg, the Biden administration is considering imposing further export controls to limit China's ability to acquire advanced semiconductor technologies crucial for developing AI systems. Gate-all-around (GAA) transistor technology and high-bandwidth memory (HBM) chips are at the center of the proposed restrictions. These cutting-edge components play a pivotal role in creating powerful AI accelerators. GAA transistors, a key feature in next-generation chips, promise substantial improvements in power efficiency and processing speeds. Meanwhile, HBM chips enable high-speed data transfer between a processor and memory. While existing sanctions prevent American firms from supplying Chinese companies with equipment for manufacturing leading-edge chips, concerns persist that China could still attain advanced capabilities through other means.

For instance, China's leading chipmaker, SMIC, could potentially integrate GAA transistors into its existing 7 nm process node, markedly enhancing performance. Access to HBM would further augment China's ability to develop AI accelerators on par with cutting-edge offerings from US firms. The reflections within the Biden administration show a strategic effort to preserve America's technological edge by denying China access to key semiconductor innovations. However, implementing such stringent export controls is a delicate balancing act, as it risks heightening tensions and prompting Chinese retaliation. No final decision has been made, and officials continue weighing the proposed restrictions' pros and cons. Nonetheless, the discussions highlight the pivotal role that semiconductor technology plays in the great power rivalry between the US and China, especially in the AI era.

Beijing has doubled down on its push for semiconductor self-sufficiency with the establishment of a new $47.5 billion investment fund to accelerate growth in the domestic chip sector. The fund, officially registered on May 24th under the name "China Integrated Circuit Industry Investment Fund Phase III", represents the largest of three state-backed vehicles aimed at cultivating China's semiconductor capabilities. The announcement comes as tensions over advanced chip technology continue to escalate between the U.S. and China. Over the past couple years, Washington has steadily ratcheted up export controls on semiconductors to Beijing over national security concerns about potential military applications. These measures have lent new urgency to China's quest for self-sufficiency in chip design and manufacturing.

With a war chest of 344 billion yuan ($47.5 billion), the "Big Fund" dwarfs the combined capital of the first two semiconductor investment vehicles launched in 2014 and 2019. Officials have outlined a multipronged strategy targeting key bottlenecks, focusing on equipment for chip fabrication plants. The fund has bankrolled major projects such as flash memory maker Yangtze Memory Technologies and leading foundries like SMIC and Huahong. China's homegrown chip industry still needs to catch up to global leaders like Intel, Samsung, and TSMC. However, the immense scale of state-directed capital illustrates Beijing's unwavering commitment to developing a self-reliant supply chain for semiconductors—a technology viewed as indispensable for economic and military competitiveness. News of the "Big Fund" sent Chinese chip stocks surging over 3% on hopes of fresh financing tailwinds.

According to Bloomberg's latest investigation, Huawei and Semiconductor Manufacturing International Corporation (SMIC) have submitted patents on the self-aligned quadruple patterning (SAQP) pattern etching technique to enable SMIC to achieve 5 nm semiconductor production. The two Chinese giants have been working with the Deep Ultra Violet (DUV) machinery to develop a pattern etching technique allowing SMIC to produce a node compliant with the US exporting rules while maintaining the density improvements from the previously announced 7 nm node. In the 7 nm process, SMIC most likely used self-aligned dual patterning (SADP) with DUV tools, but for the increased density of the 5 nm node, a doubling to SAQP is required. In semiconductor manufacturing, lithography tools take multiple turns to etch the design of the silicon wafer.

Especially with smaller nodes getting ever-increasing density requirements, it is becoming challenging to etch sub-10 nm designs using DUV tools. That is where Extreme Ultra Violet (EUV) tools from ASML come into play. With EUV, the wavelengths of the lithography printers are 14 times smaller than DUV, at only 13.5 nm, compared to 193 nm of ArF immersion DUV systems. This means that without EUV, SMIC has to look into alternatives like SAQP to increase the density of its nodes and, as a result, include more complications and possibly lower yields. As an example, Intel tried to use SAQP in its first 10 nm nodes to reduce reliance on EUV, which resulted in a series of delays and complications, eventually pushing Intel into EUV. While Huawei and SMIC may develop a more efficient solution for SAQP, the use of EUV is imminent as the regular DUV can not keep up with the increasing density of semiconductor nodes. Given that ASML can't ship its EUV machinery to China, Huawei is supposedly developing its own EUV machines, but will likely take a few more years to show.

The latest TrendForce report reveals a notable 7.9% jump in 4Q23 revenue for the world's top ten semiconductor foundries, reaching $30.49 billion. This growth is primarily driven by sustained demand for smartphone components, such as mid and low-end smartphone APs and peripheral PMICs. The launch season for Apple's latest devices also significantly contributed, fueling shipments for the A17 chipset and associated peripheral ICs, including OLED DDIs, CIS, and PMICs. TSMC's premium 3 nm process notably enhanced its revenue contribution, pushing its global market share past the 60% threshold this quarter.

TrendForce remarks that 2023 was a challenging year for foundries, marked by high inventory levels across the supply chain, a weak global economy, and a slow recovery in the Chinese market. These factors led to a downward cycle in the industry, with the top ten foundries experiencing a 13.6% annual drop as revenue reached just $111.54 billion. Nevertheless, 2024 promises a brighter outlook, with AI-driven demand expected to boost annual revenue by 12% to $125.24 billion. TSMC, benefiting from steady advanced process orders, is poised to far exceed the industry average in growth.

SMIC, China's largest semiconductor manufacturer, is reportedly assembling a dedicated team to develop 3 nm semiconductor node technology, following reports of the company setting up 5 nm chip production for Huawei later this year. This move is part of SMIC's efforts to achieve independence from foreign companies and reduce its reliance on US technology. According to a report from Joongang, SMIC's initial goal is to commence operations of its 5 nm production line, which will mass-produce Huawei chipsets for various products, including AI silicon. However, SMIC is already looking beyond the 5 nm node. The company has assembled an internal research and development team to begin work on the next-generation 3 nm node.

The Chinese manufacturer is expected to accomplish this using existing DUV machinery, as ASML, the sole supplier of advanced EUV technology, is prohibited from providing equipment to Chinese companies due to US restrictions. It is reported that one of the biggest challenges facing SMIC is the potential for low yields and high production costs. The company is seeking substantial subsidies from the Chinese government to overcome these obstacles. Receiving government subsidies will be crucial for SMIC, especially considering that its 5 nm chips are expected to be up to 50 percent more expensive than TSMC's due to the use of older DUV equipment. The first 3 nm wafers from SMIC are not expected to roll out for several years, as the company will prioritize the commercialization of Huawei's 5 nm chips. This ambitious undertaking by SMIC represents a significant challenge for the company as it strives to reduce its dependence on foreign semiconductor technology and establish itself as an essential player in the global manufacturing industry.

Huawei's new server CPU based on the HiSilicon Taishan V120 core has shown impressive single-threaded performance that matches AMD's Zen 3 architecture in a leaked Geekbench 6 benchmark. The Taishan V120 is likely being manufactured on SMIC's 7 nm process node. The Geekbench 6 result posted on social media does not identify the exact Huawei server CPU model, but speculation points to it being the upcoming Kunpeng 930 chip. In the benchmark, the Taishan V120 CPU operating at 2.9 GHz scored 1527 in the single-core test. This positions it nearly equal to AMD's EPYC 7413 server CPU based on the Zen 3 architecture, which boosts up to 3.6 GHz and which scored 1538 points. It also matches the single-threaded performance of Intel's Coffee Lake-based Xeon E-2136 from 2018, even though that Intel chip can reach 4.5 GHz boost speeds, scoring 1553 points.

The Taishan V120 core first appeared in Huawei's Kirin 9000 smartphone SoC in 2020. Using the core in server CPUs would allow Huawei to achieve competitive single-threaded performance to rival AMD's last-generation EPYC Milan and Intel's older Skylake server chips. Multi-threaded benchmarks will be required to gauge the Kunpeng 930's overall performance fully when it launches. Huawei continues innovating its ARM-based server CPU designs even while facing restrictions on manufacturing and selling chips internationally due to its inclusion on the US Entity List in 2019. The impressive single-threaded results versus leading x86 competitors demonstrate Huawei's resilience and self-reliance in developing homegrown data center technology through its HiSilicon division. More details on the Kunpeng 930 server chip will likely surface later this year, along with server configurations from Chinese OEMs.

China's homegrown Loongson 3A6000 CPU shows promise but still needs to catch up AMD and Intel's latest offerings in real-world performance. According to benchmarks by Chinese tech reviewer Geekerwan, the 3A6000 has instructions per clock (IPC) on par with AMD's Zen 4 architecture and Intel's Raptor Lake. Using the SPEC CPU 2017 processor benchmark, Geekerwan has clocked all the CPUs at 2.5 GHs to compare the raw benchmark results to Zen 4 and Intel's Raptor Lake (Raptor Cove) processors. As a result, the Loongson 3A6000 seemingly matches the latest designs by AMD and Intel in integer results, with integer IPC measured at 4.8, while Zen 4 and Raptor Cove have 5.0 and 4.9, respectively. The floating point performance is still lagging behind a lot, though. This demonstrates that Loongson's CPU design can catching up to global leaders, but still needs further development, especially for floating point arithmetic.

However, the 3A6000 is held back by low clock speeds and limited core counts. With a maximum boost speed of just 2.5 GHz across four CPU cores, the 3A6000 cannot compete with flagship chips like AMD's 16-core Ryzen 9 7950X running at 5.7 GHz. While the 3A6000's IPC is impressive, its raw computing power is a fraction of that of leading x86 CPUs. Loongson must improve manufacturing process technology to increase clock speeds, core counts, and cache size. The 3A6000's strengths highlight Loongson's ambitions: an in-house LoongArch ISA design fabricated on 12 nm achieves competitive IPC to state-of-the-art x86 chips built on more advanced TSMC 5 nm and Intel 7 nm nodes. This shows the potential behind Loongson's engineering. Reports suggest that next-generation Loongson 3A7000 CPUs will use SMIC 7 nm, allowing higher clocks and more cores to better harness the architecture's potential. So, we expect the next generation to set a bar for China's homegrown CPU performance.

Semiconductor Manufacturing International Corporation (SMIC) posted better than expected fourth quarter 2023 financial tallies, but issued a warning with a downward revisement of near future gross margin expectations. According to DigiTimes Asia and TrendForce, China's leading pure-play semiconductor foundry has experienced an overall decline in net profit due to various cited factors including: "the industry downturn, weak market demand, high industry inventory, and fierce competition among peers, all contributing to reduced capacity utilization and decreased wafer shipment for the group." The DigiTimes report focuses mainly on a significant SMIC shares plunge—stock prices are reported to have dropped by ~20% in early 2024, indicating a loss of confidence in the foundry's prospects.

TrendForce laid out the financial nitty gritty: "SMIC International saw a revenue increase of over 3.5% to more than USD 1.678 billion, marking the only quarter of revenue growth last year. Net profit plummeted by 54.7% to nearly USD 175 million. The gross margin of 16.4% was almost halved compared to the same period in 2022 and experienced a significant decline from the previous three quarters, reaching its lowest point of the year. In the full year of 2023, SMIC International experienced a revenue decline of over 13% to USD 6.3 billion, with a net profit decrease of 50.4% to USD 900 million. The gross margin was approximately halved to 19.3%." Many industry watchdogs believed that SMIC was in a comfortable position, thanks to an uptick in demand for natively developed AI GPUs—their flagship Shanghai plants are reportedly churning out 7 nm wafers for Huawei's Ascend 910B model. Insiders also claim that high profile smartphone clients are pushing for 5 nm production lines—a significant challenge for the foundry's existing collection of (less than cutting-edge) equipment.

Semiconductor Manufacturing International Corp (SMIC) is preparing new semiconductor production lines at its Shanghai facilities according to a fresh Reuters report—China's largest contract chip maker is linked to next generation Huawei SoC designs, possibly 5 nm-based Kirin models. SMIC's newest Shanghai wafer fabrication site was an expensive endeavor—involving a $8.8 billion investment—but their flagship lines face a very challenging scenario with new phases of mass production. Huawei, a key customer, is expected to "upgrade" to a 5 nm process for new chip designs—their current flagship, Kirin 9000S, is based on a SMIC 7 nm node. Reuter's industry sources believe that the foundry's current stable of "U.S. and Dutch-made equipment" will be deployed to "produce 5-nanometer chips."

Revised trade rulings have prevented ASML shipping advanced DUV machinery to mainland China manufacturing sites—SMIC workers have reportedly already repurposed the existing inventory of lithography equipment for next-gen pursuits. Burn Lin (ex-TSMC), a renowned "chip guru," believes that it is possible to mass produce 5 nm product on slightly antiquated gear (previously used for 7 nm)—but the main caveats being increased expense and low yields. According to a DigiTimes Asia report, mass production of a 5 nm SoC on SMIC's existing DUV lithography would require four-fold patterning in a best case scenario.

News reports from Asia point to an ongoing price battle between major chip foundries in the region—sluggish market conditions in 2023 have caused the big industry names to adjust charges, in concerted efforts to retain customers. This situation has escalated in early 2024—news media outlets claim that mainland China-situated factories have plenty of new production capacity, and are therefore eager to get their order books filled. The reports point to: "Semiconductor Manufacturing International Corporation (SMIC), Hua Hong Semiconductor and Jinghe Semiconductor lowering the price of tape-out services to chip design companies in Taiwan." Industry insiders believe that several Taiwanese IC designers have jumped onto better deals, as offered by Chinese facilities—it is alleged that Samsung, GlobalFoundries, UMC and Powerchip have all experienced a worrying increase in customer cancellations (at the tail end of 2023). The loss of long-term clients has forced manufacturers—in South Korea and Taiwan—into a price war.

TrendForce's analysis of market trends stated: "Due to the mature manufacturing processes in China, unaffected by US export restrictions, the lowered wafer fabrication costs have become attractive to Taiwanese IC design companies seeking to enhance their cost competitiveness. Reports also indicate that this competitive pressure has forced Taiwan's foundries, UMC and PSMC, to follow suit by reducing their prices. UMC has lowered its 12-inch wafer foundry services by an average of 10-15%, while its 8-inch wafer services have seen an average price reduction of 20%. These price adjustments took effect in the fourth quarter of 2023." Samsung is reportedly slashing prices by ~10-15%, and is expressing a "willingness to negotiate" with key clients in early 2024. Reports state this is a major change in attitude for the South Korean chip giant—allegedly, leadership was unwilling to budge on 2023 tape-out costs. TrendForce reckons that TSMC's response was a bit quicker: "(having) already initiated pricing concessions last year, mainly related to mask costs rather than wafer fabrication. It was reported that these concessions primarily applied to the 7 nm process and were dependent on order volumes."

According to the latest teardown from TechInsights, China's biggest technology maker, Huawei, has been shipping laptops with technology supposedly sanctioned by the United States. As the teardown shows, TechInisights has discovered that Huawei's Kirin 9006C processor is manufactured on TSMC's 5 nm semiconductor technology. Originally, the United States have imposed sanctions on Huawei back in 2020, when the government cut off Huawei's access from TSMC's advanced facilities and forbade the use of the latest nodes by Huawei's HiSilicon chip design arm. Today's findings show signs of contradiction, as the Qingyun L540 notebook that launched in December 2023 employs a Kirin 9006C chipset manufactured on a TSMC 5 nm node.

TechInsight's findings indicate that Kirin 9006C assembly and packaging occurred around the third quarter of 2020, whereas the 2020 Huawei sanctions started in the second quarter. Of course, the implication of the sanctions likely prohibited any new orders and didn't prevent Huawei from possibly stockpiling millions of chip orders in its warehouse before they took place. The Chinese giant probably made orders beforehand and is using the technology only now, with the Qingyun L540 laptop being one of the first Kirin 9006C appearances. Some online retailers also point out that the laptop complies with the latest security practices required for the government, which means that they have been in the works since the chip began the early stages of design, way before 2020. We don't know the stockpile quantity, but SMIC's domestic efforts seem insufficient to supply the Chinese market alone. The news that Huawei is still using TSMC chips made SMIC's share go for a 2% free fall on the Hong Kong stock exchange.