Thursday, August 30th 2018
Intel-Micron QLC NAND Yields Less Than 50%, a Prelude to Global SSD Price Hikes?
IMFlash Technologies (IMFT), the Intel-Micron joint venture that manufactures NAND flash and 3D Xpoint memory for use in Intel and Micron end-user products, and Micron Technology-branded NAND flash supply to other SSD manufacturers, is facing a big hurdle with its QLC NAND flash manufacturing ramp-up, which if not checked, could influence SSD prices globally. The company is apparently seeing dangerously low yields of less than 50 percent for its 3D QLC NAND flash memory. This effectively makes its QLC NAND pricier (in terms of $/GB) than current-generation 3D TLC NAND.
The first victim of low yields of 3D QLC NAND flash is Intel's SSD 660p series, a mainstream NVMe SSD that brought 1 TB of storage under the $200-mark. Sources within IMFT tell Tweaktown that the company is seeing 48% yields in its 64-layer QLC NAND flash wafers (i.e. 52% of the wafer is unfit for further production). In contrast, 64-layer 3D TLC yields are above 90% (margin/incomplete dies are excluded from these figures). What's worse, the source predicts that the conditions may never get better with this generation.
Source:
Tweaktown
The first victim of low yields of 3D QLC NAND flash is Intel's SSD 660p series, a mainstream NVMe SSD that brought 1 TB of storage under the $200-mark. Sources within IMFT tell Tweaktown that the company is seeing 48% yields in its 64-layer QLC NAND flash wafers (i.e. 52% of the wafer is unfit for further production). In contrast, 64-layer 3D TLC yields are above 90% (margin/incomplete dies are excluded from these figures). What's worse, the source predicts that the conditions may never get better with this generation.
49 Comments on Intel-Micron QLC NAND Yields Less Than 50%, a Prelude to Global SSD Price Hikes?
the greed.....
and now, the deed........
all is well in the world of capitalism 101 :D
nOt
@Tsukiyomi91 Your Vega comparison is good, except that AMD did not jack up the prices as a result, with some even claiming they sold them at a loss.
should of been stated as ''a Prelude to Global SSD Price Fixing? ''
now all they need is someone to start a factory production fire and the fix is in...
Anyhow, since we're seeing new techs, we'll have to give them time to mature before we can actually see how much value we're getting out of them over what we currently have.
TLC is already 1000 to 2000 rewrites before dying, what is QLC made for ?
Sauce : www.anandtech.com/show/6459/samsung-ssd-840-testing-the-endurance-of-tlc-nand
(old, but still)
All are stating between 500 and 1000 p/e cycles, even by Toshiba themselves ; not higher. Pretty sure endurance is higher now, at same shrink node, but, they are going onto 10 and 7nm (even though it's not real 7nm, but that's not the point).
TLC even with 3D-NAND gets less and less reliable every time they shrink. And that also why Intel is strugelling right now.
I'm quite afraid of an 256GB SSD with QLC...1TB you can see it coming, but 256GB or less ...
Yield is different from reliability. They probe wafers, test them, and say ok, this wafer passed, this wafer failed (at a high level).
Reliability is can the chip work long long term. Your chip can yield, but it might not be reliable.
The article says that they're having yield problems.
The more layers are added, the more voltages have to be dealt with. This increases the variance/drift. It's why the Samsung 840, an early planar TLC drive, had to have its data regularly rewritten to the drive to prevent read speeds from falling.
In addition to the issue of how many layers there are (single = SLC, double = MLC, triple = TLC, quad = QLC) there are others:
1) process node size (larger is more reliable, e.g. 40nm vs. 15nm)
2) 3D vs. planar. 3D is more reliable. 3D fabrication is mainly what has made TLC so much more relevant in the market than it was initially.
3) various controller design factors, like DRAM-using vs. dramless (DRAM-using is better for reliability, except with Sandforce* which is a more complex case), error correction sophistication, and the presence of a capacitor to protect against power failure
4) how much NAND is set aside
5) the grade of the NAND
6) "SLC" caching. As far as I know, no drive has actual SLC NAND in its so-called SLC cache. Instead, a portion of MLC or TLC NAND is "functioning like SLC". This improves speed but I don't know how much it affects reliability. If it were true SLC then reliability would increase, certainly.
7) firmware/controller bugs
8) cooling (e.g. metal casing, thermal pads, heat sinks). This can affect performance consistency, which is a form of reliability (performance reliability).
*In terms of Sandforce, it was a dramless design that had improved theoretical reliability via on-the-fly data compression. This reduced the amount of data written quite a lot versus other controllers at the time; Sandforce had an excellent write amplication factor, with compressible data. Unfortunately, the design made TRIM mostly ineffective, causing the drives to slow, especially in steady state, and not recover. The design also wasn't very reliable (most severely with the Vertex 2 with 64-bit NAND in the 240 GB size) and was further worsened because Sandforce favored locking the drive to "prevent people from looking at their special firmware design". There were a lot of firmware updates for both the 2nd and 3rd generation controllers. It seems that the third generation eventually became pretty stable with 64-bit NAND but the performance, especially with a drive in need of TRIM recovery, wasn't competitive with later companies' designs. My speculation, as to the main reason why Sandforce is no longer a significant market player, is the poor compatibility with TRIM.
PS: C'mon intel your not exactly a forthcoming and honest company either>>>>