Friday, April 15th 2022

AMD Ryzen 7000 Series Processor Spotted Running on MSI MAG B650 Motherboard at 1.5 Volts

AMD is slowly gearing up to launch the latest 7000 series Ryzen processors codenamed "Raphael." Thanks to the famous hardware leaker @9550pro on Twitter, we have evidence of B650 motherboards for the next-generation hardware. According to the image posted by the leaker, it appears like AMD's Ryzen 7000 series Raphael processor is running on MSI's MAG B650 motherboard at a very high voltage of 1.5 Volts VCore. While we don't know the exact SKU running here, we see a note referring to it as an Engineering Sample, meaning that this is not a final product. It is expected to see the new AM5 platform make a debut alongside DDR5 and PCIe 5.0 technology, so we have to wonder what the B650 chipset can support.
Source: @9550pro (Twitter)
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58 Comments on AMD Ryzen 7000 Series Processor Spotted Running on MSI MAG B650 Motherboard at 1.5 Volts

#26
jesdals
I was wondering if we would se a x6xx chipset for socket AM4 but now we know that 6 series is AM5
Posted on Reply
#27
Shtb
TiggerI certainly wouldn't be, my ADL can do 5ghz at only 1.25.
And now look at number of Amps consumed, and you get the power consumption by multiplying two values.
The power consumption is important to you, isn't it?
Or are you just a fan of low voltage, just because node, used in your Intel processor, can do that?
Posted on Reply
#28
freeagent
eidairaman1I remember Athlon XPs running at 1.5
I remember running mine at 2.1v :toast:
Posted on Reply
#29
trsttte
MatsI guess the SMD's are moved outside of the lid in order to give them better cooling. Another reason could be to make more room under the lid for a third (fourth?) chiplet, or a larger IO with full graphics.
Does anyone know?
I think some designer was just having fun, they could have made the IHS square without the extra bits to the sides
Posted on Reply
#30
LabRat 891
trsttteI think some designer was just having fun, they could have made the IHS square without the extra bits to the sides
To me, looks like this was AMD's preventative measure to 'bendgate'.
I think the SMDs are largely filter caps. Makes sense to have them that spread out on the package when you've got such a pin-dense socket. We're also well into switching frequencies for busses and chips, that can illicit 'spooky' effects when not mitigated for. Not impossible the layout is in part for electrical 'noise'.
Posted on Reply
#31
SL2
It's definitely have that shape to avoid getting bent.

My guess is that the cutouts are an efficient way to get more area from the package available for components,
where the contact area against the package in yellow is probably thinner and not glued.
Red = glued areas.
Blue = space available for chips.


Compare with AM4, where the glued part takes up more space.

The AM5 design basically have more area available which is equal to all the cutouts together, more or less.

The goal was to minimize the glued area, which is unusable for both SMD's and chips.
Posted on Reply
#32
Unregistered
Delidding should be easier too
ShtbAnd now look at number of Amps consumed, and you get the power consumption by multiplying two values.
The power consumption is important to you, isn't it?
Or are you just a fan of low voltage, just because node, used in your Intel processor, can do that?
Whatever
Posted on Edit | Reply
#33
mechtech
TheLostSwedeAll you need is some compressed air... :fear:
A pressure washer would work way better ;)
Posted on Reply
#34
ir_cow
TiggerDelidding should be easier too
I laughed so hard at this!
Posted on Reply
#35
TheDeeGee
ixi1.5v, nice. More power = more heat!
Posted on Reply
#36
Mussels
Freshwater Moderator
Why is everyone assuming this is a stock voltage?

It could be an ES, an ES mobo, or someone doing overclocking/endurance testing?
Posted on Reply
#39
ir_cow
MusselsWhy is everyone assuming this is a stock voltage?

It could be an ES, an ES mobo, or someone doing overclocking/endurance testing?
Because stock voltage of Zen2 and Zen3 is 1.5v for the turbo. Same 7nm node so I assume the voltages stay the same.
Posted on Reply
#40
thesmokingman
ixi1.5v, nice. More power = more heat!
It's not a real voltage though. Just stating it at 1.5v tells more about the speaker than the chip, oh the irony.
Posted on Reply
#41
eidairaman1
The Exiled Airman
MatsIt's definitely have that shape to avoid getting bent.

My guess is that the cutouts are an efficient way to get more area from the package available for components,
where the contact area against the package in yellow is probably thinner and not glued.
Red = glued areas.
Blue = space available for chips.


Compare with AM4, where the glued part takes up more space.

The AM5 design basically have more area available which is equal to all the cutouts together, more or less.

The goal was to minimize the glued area, which is unusable for both SMD's and chips.
Also this is AMDs first MSDT LGA, so where else would SMDs go?
Posted on Reply
#42
Max(IT)
trsttteThat's already expected from previous leaks. Everything points at new power tiers including 170W for at least the top end (7950x?)

www.techpowerup.com/284516/amd-zen-4-desktop-processors-likely-limited-to-16-cores-170-w-tdp
www.techpowerup.com/285653/amd-socket-am5-to-retain-cooler-compatibility-with-am4
www.techpowerup.com/293253/amd-ryzen-7000-series-raphael-processors-to-come-with-up-to-170-watt-tdp-for-16-core-skus
the 170W "TDP" is quite scaring, considering AMD's definition of TDP. My 5900W with 105W TDP can draw something like 165W in real usage (rendering). That means Zen 4 will stay well above 200W.
Posted on Reply
#43
HD64G
Max(IT)the 170W "TDP" is quite scaring, considering AMD's definition of TDP. My 5900W with 105W TDP can draw something like 165W in real usage (rendering). That means Zen 4 will stay well above 200W.
As we saw with 5800X3D, 105W TDP =~110W power draw, so...
Posted on Reply
#44
SL2
eidairaman1Also this is AMDs first MSDT LGA, so where else would SMDs go?
Under the lid? Not sure what you're hinting at. (I know there's no room under the package on AM5.)
Max(IT)the 170W "TDP" is quite scaring, considering AMD's definition of TDP. My 5900W with 105W TDP can draw something like 165W in real usage (rendering). That means Zen 4 will stay well above 200W.
We don't know it they're trying to be more realistic with TDP with that 170 W, or if they're going to be just as off as before (like you suggest). I bet it's the latter, tho.
Posted on Reply
#45
eidairaman1
The Exiled Airman
MatsUnder the lid? Not sure what you're hinting at. (I know there's no room under the package on AM5.)


We don't know it they're trying to be more realistic with TDP with that 170 W, or if they're going to be just as off as before (like you suggest). I bet it's the latter, tho.
Its the layout of those SMDs that keeps the lid open like that.
Posted on Reply
#46
Tek-Check
MatsIt's definitely have that shape to avoid getting bent.

My guess is that the cutouts are an efficient way to get more area from the package available for components,
where the contact area against the package in yellow is probably thinner and not glued.
Red = glued areas.
Blue = space available for chips.


Compare with AM4, where the glued part takes up more space.

The AM5 design basically have more area available which is equal to all the cutouts together, more or less.

The goal was to minimize the glued area, which is unusable for both SMD's and chips.
Plus, cut outs provide more surface for heat dissipation. I am sure some cooler companies will soon design innovative contact plates that penetrate into those cut outs to increase heat absorption through more contact surface.
Posted on Reply
#47
Ruru
S.T.A.R.S.
eidairaman1I remember Athlon XPs running at 1.5
When we go back to that era, even 2V isn't that strange when overclocking S462 chips.
Posted on Reply
#48
chrcoluk
Ryzen has always gone over 1.5v for CPB, one of the reasons I disable CPB on my Ryzen rig.
Posted on Reply
#49
Ruru
S.T.A.R.S.
chrcolukRyzen has always gone over 1.5v for CPB, one of the reasons I disable CPB on my Ryzen rig.
My 3600 seems to hit 1.416V max, I have PBO +200 clocks and -0.05V offset.
Posted on Reply
#50
SL2
eidairaman1Its the layout of those SMDs that keeps the lid open like that.
Exactly, you asked where else would the put them, and I replied under the lid like before.
My point was that I don't think there's anything that stops AMD from putting the SMD's under the lid, it's just that this is a better solution.
Tek-CheckPlus, cut outs provide more surface for heat dissipation.
How is having a smaller contact area between the lid and the cooler a good thing? I'm pretty sure the CPU cooler provides more cooling than the air around the CPU.
Those cutouts will be like air pockets once the cooler is mounted, although probably a better cooling solution for the SMD's than having them under the lid.
Posted on Reply
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