Friday, April 15th 2022
AMD Ryzen 7000 Series Processor Spotted Running on MSI MAG B650 Motherboard at 1.5 Volts
AMD is slowly gearing up to launch the latest 7000 series Ryzen processors codenamed "Raphael." Thanks to the famous hardware leaker @9550pro on Twitter, we have evidence of B650 motherboards for the next-generation hardware. According to the image posted by the leaker, it appears like AMD's Ryzen 7000 series Raphael processor is running on MSI's MAG B650 motherboard at a very high voltage of 1.5 Volts VCore. While we don't know the exact SKU running here, we see a note referring to it as an Engineering Sample, meaning that this is not a final product. It is expected to see the new AM5 platform make a debut alongside DDR5 and PCIe 5.0 technology, so we have to wonder what the B650 chipset can support.
Source:
@9550pro (Twitter)
58 Comments on AMD Ryzen 7000 Series Processor Spotted Running on MSI MAG B650 Motherboard at 1.5 Volts
The power consumption is important to you, isn't it?
Or are you just a fan of low voltage, just because node, used in your Intel processor, can do that?
I think the SMDs are largely filter caps. Makes sense to have them that spread out on the package when you've got such a pin-dense socket. We're also well into switching frequencies for busses and chips, that can illicit 'spooky' effects when not mitigated for. Not impossible the layout is in part for electrical 'noise'.
My guess is that the cutouts are an efficient way to get more area from the package available for components,
where the contact area against the package in yellow is probably thinner and not glued.
Red = glued areas.
Blue = space available for chips.
Compare with AM4, where the glued part takes up more space.
The AM5 design basically have more area available which is equal to all the cutouts together, more or less.
The goal was to minimize the glued area, which is unusable for both SMD's and chips.
It could be an ES, an ES mobo, or someone doing overclocking/endurance testing?
My point was that I don't think there's anything that stops AMD from putting the SMD's under the lid, it's just that this is a better solution. How is having a smaller contact area between the lid and the cooler a good thing? I'm pretty sure the CPU cooler provides more cooling than the air around the CPU.
Those cutouts will be like air pockets once the cooler is mounted, although probably a better cooling solution for the SMD's than having them under the lid.