Thursday, February 22nd 2024
SK Hynix VP Reveals HBM Production Volumes for 2024 are Sold Out
SK Hynix Vice President Kitae Kim presides over the company's HBM Sales & Marketing (S&M) department—an official leadership blog profile reveals that the executive played a key role in making the South Korean supplier's high bandwidth memory (HBM) product line "a superstar of the semiconductor memory industry in 2023." Growing demand for powerful AI processors has placed SK Hynix in a more comfortable position, following recessive spells—including a major sales downturn in 2022. NVIDIA is the market leader in AI processing chips, and many of its flagship enterprise designs are fitted with cutting-edge SK Hynix memory modules. Kim noted that his firm has many notable international clients: "HBM is a revolutionary product which has challenged the notion that semiconductor memory is only one part of an overall system...in particular, SK Hynix's HBM has outstanding competitiveness. Our advanced technology is highly sought after by global tech companies."
The VP outlined how artificial intelligence industries are fuelling innovations: "With the diversification and advancement of generative AI services, demand for HBM, an AI memory solution, has also exploded. HBM, with its high-performance and high-capacity characteristics, is a monumental product that shakes the conventional wisdom that memory semiconductors are only a part of the overall system. In particular, SK Hynix HBM's competitiveness is outstanding." Business is booming, so much so that nothing can be added to this year's HBM order books: "Proactively securing customer purchase volumes and negotiating more favorable conditions for our high-quality products are the basics of semiconductor sales operations. With excellent products in hand, it's a matter of speed. Our planned production volume of HBM this year has already sold out. Although 2024 has just begun, we've already started preparing for 2025 to stay ahead of the market."
Sources:
SK Hynix News #1, Wccftech, SK Hynix News #2
The VP outlined how artificial intelligence industries are fuelling innovations: "With the diversification and advancement of generative AI services, demand for HBM, an AI memory solution, has also exploded. HBM, with its high-performance and high-capacity characteristics, is a monumental product that shakes the conventional wisdom that memory semiconductors are only a part of the overall system. In particular, SK Hynix HBM's competitiveness is outstanding." Business is booming, so much so that nothing can be added to this year's HBM order books: "Proactively securing customer purchase volumes and negotiating more favorable conditions for our high-quality products are the basics of semiconductor sales operations. With excellent products in hand, it's a matter of speed. Our planned production volume of HBM this year has already sold out. Although 2024 has just begun, we've already started preparing for 2025 to stay ahead of the market."
17 Comments on SK Hynix VP Reveals HBM Production Volumes for 2024 are Sold Out
Now price 4TB platinum P41 / P44 Pro nvme drives at $300CAD or less and watch them sell out too.
HBM has to be bonded to a die interposer. Meaning, there is no salvaging of this highly-performant memory.
Most-all of the "AI accelerators" are not in a PCIe Add-in card form factor, and most are no longer even GPU/Pin-compatible with anything else in PCIe.
Meaning, as soon as these AI Accelerators are superseded by faster (and more profitable) designs, they become un-re-usable eWaste.
Unlike Radeon Instinct's older models and the PCIe-slottable nVidia Tesla cards, almost all of this HBM, will soon become nothing more than glass waste.
:oops: save some HBM for us, gaiz
"The new company’s origins stem from an October 2020 agreement by SK hynixto acquire Intel's NAND and SSD business"
www.techpowerup.com/review/solidigm-p44-pro-2-tb-1-tb/
"The Solidigm P44 Pro is based on the Hynix ACNS075 controller, paired with Hynix 176-layer 3D TLC NAND flash. This means that the P44 Pro has the same hardware configuration as the Hynix Platinum P41 SSD—the fastest SSD we ever tested."
"Platinum P41 doesnt come in 4TB capacity"
I am aware - that's why I said 4TB - they should make some
Pretty sad even newer drives like the SN580 WD doesn't have a 4TB version....................
If there were an FPGA that could be used as an HBM controller, the assembly could be used as a plug-in fast cache.
I'd imagine there are smaller datacenter companies and high-performance SOHO users around the world that would find use for Low-Latency high-bandwidth caching devices.
A Plug-in 'Flash' Card with Optane DIMMs and HBM stacks, connected with an FPGA seems like it would have wide non-gaming Professional/Experimental use.
Maybe it could finally saturate a PCIe 5.0 x16 link.
I'm still using Vega64 XTX... works as good as the day I bought it.
would be neat to have a 8C/16T with a RX 7600 as the GPU on top of HBM
Also, as you said that "HBM has to be bonded to a die interposer" - yes, but that's still soldering, using an alloy that melts at a temperature low enough to not destroy the transistors immediately. The grey substance here. Problem is, there are tens of thousands of contact points. Connecting them requires *far* greater precision than soldering of packaged chips with solder bumps. The dies in the TSV stack are also connected to each other with solder, which should not melt during the surgery.
Its why it didnt stay in GPUs after AMD testing it out unfortunately. What I would love to see is a next gen AMD GPU going for the chiplet method as currently but over the MCD they stick an HBM module over it. That way it lowers/removes the Active interposer cost.