Manufacturing silicon is no easy task. You need to have all the right supplies available all the time. One of the most used ingredients in silicon manufacturing is water. Almost every process needs it and it needs to be constantly available to the manufacturer. According to the report coming from Reuters, Taiwan Semiconductor Manufacturing Company (TSMC) and United Microelectronics Corporation (UMC) are experiencing water shortages. The Taiwan island is in trouble, as the typhoon season has been rather mild and water supplies are at the historic lows. Water restrictions are in place all across the island and the reservoirs in the center and southern regions are at only 20% capacity.

The lack of water is a big problem for TSMC and UMC, as both companies rely on the constant income of it. With water restrictions in place, TSMC has to keep its facilities running and needs to solve the problem. That is why Taiwan's biggest silicon manufacturer is now making small orders of waters, delivered by a truckload. TSMC expects to compensate for the lack of water coming from its regular sources with truckloads of it. While we do not know the numbers of it, we can expect the water use to be very high if we take into account the number of wafers TSMC produces at its facilities.

Industry specialists with various analysis groups have stated that they expect the world's current chip supply shortages to not only fail to be mitigated in the first half of 2021, but that they might actually last well into 2022. It's not just a matter of existing chip supply being diverted by scalpers, miners, or other secondary-market funnels; it's a matter of fundamental lack of resources and production capacity to meet demand throughout various quadrants of the semiconductor industry. With the increased demand due to COVID-19 and the overall increasingly complex design of modern chips - and increased abundance of individual chips within the same products - foundries aren't being able to scale their capacity to meet growing demand.

As we know, the timeframe between start and finish of a given semiconductor chip can sometimes take months. And foundries have had to extend their lead times (the time between a client placing an order and that order being fulfilled) already. This happens as a way to better plan out their capacity allocation, and due to the increased complexity of installing, testing, and putting to production increasingly complex chip designs and fabrication technologies. And analysts with J.P. Morgan and Susquehanna that are in touch with the pulse of the semiconductor industry say that current demand levels are 10% to 30% higher than those that can be satisfied by the fabrication and supply subsystems for fulfilling that demand.

OLED panes are expertise areas of display makers such as LG and Samsung, however, when it comes to Apple, they have to rely on external manufacturers to make a display. For years Apple has been contracting LG and Samsung to make the display for iPhones and Macs, but it looks like Apple is now collaborating with another firm to develop micro OLED technology. According to sources over at Nikkei Asia, Apple is collaborating with Taiwan Semiconductor Manufacturing Company (TSMC) to develop "ultra-advanced display technology at a secretive facility in Taiwan". Despite TSMC not being the traditional choice for panel manufacturing, there is a list of reasons why Apple chose its years-long partner to work with.

TSMC is known for manufacturing silicon chips, however, Apple envisions that the Taiwan maker will manufacture ultra-advanced micro OLED technology using wafers. Building the displays using wafers will result in much lower power consumption and far lower size. Why is this approach necessary you might wonder? Well, Apple is developing a new generation of AR glasses and there needs to be a solid display technology for them to exist. It is reported that the new micro OLED displays are under development and are about one inch in diameter. The source also adds that this is just one out of two projects being worked on inside of Apple's secretive labs located in the Taiwanese city of Taoyuan. What is the other project remains a mystery, however, with more time we could get information on that as well.

It's been doing the rounds in the rumor mill that AMD is looking to expand its semiconductor manufacturing partners beyond TSMC (for the 7 nm process and eventually 5 nm) and Global Foundries (12 nm process used in its I/O dies). The intention undoubtedly comes from the strain that's being placed on TSMC's production lines, as most foundry-less businesses outsource their wafer production to the Taiwanese companies' factories and manufacturing processes, which are currently the industry's best. However, as we've seen, TSMC is having a hard time scaling its production facilities to the unprecedented demand it's seeing from its consumers. The company also has recently announced it may prioritize new manufacturing capabilities for the automotive industry, which is also facing shortages in chips - and that certainly doesn't instill confidence in capacity increases for its non-automotive clients.

That's what originated form the rumor mill. Speculating, this could mean that AMD would be looking to outsource products with generally lower ASP to Samsung's foundries, instead of trying to cram even more silicon manufacturing onto TSMC's 7 nm process (where it already fabricates its Zen 3, RDNA 2, EPYC, and custom silicon solutions for latest-gen consoles). AMD might thus be planning on leveraging Samsung's 8 nm or even smaller fabrication processes as alternatives for, for example, lower-than-high-end graphics solutions and other product lines (such as APUs and FPGA production, should its acquisition of Xilinx come through).

We recently reported on Intel's goal to launch their 7 nm node in 2023 which would put them on track to directly compete with TSMC's 3 nm node. It would seem like Intel has partially accepted defeat according to a recent DigiTimes report which alleges that Intel has signed a deal with TSMC to mass-produce 3 nm processors starting H2 2022. The report goes on to detail an arrangement where TSMC manufacturers the bulk of Intel processors with in-house production expected to continue albeit at lower quantities. This arrangement would also see Intel and TSMC cooperate on 2 nm products. If this deal turns out to be real Intel would become TSMC's second-largest customer after Apple.

TSMC is one of the world's biggest semiconductor manufacturers, and the company is currently the leading provider of the newest technologies like 5 nm and 3 nm, along with advanced packaging. So far, TSMC's biggest customers have included Apple, NVIDIA, AMD, etc., where the company has mainly produced chips for mobile phones and PCs/Servers. However, Taiwan's Economics Ministry has announced that they have spoken to TSMC and have reached an agreement that the company will be putting away some additional capacity for the automotive industry, specifically for the production of automotive chips. The reason for this push is the increasing shortage of semiconductors for automakers, experienced due to the Trump administration sanctions against key Chinese chip factories.

TSMC has stated that "Other than continuously maximizing utilization of our existing capacity, Dr. Wei also confirmed in our investors' conference that we are working with customers closely and moving some of their mature nodes to more advanced nodes, where we have a better capacity to support them". The company also states that their capacities are fully utilized for now, however, TSMC has ensured ministry that "if production can be increased by optimizing production capacity, it will cooperate with the government to regard automotive chips as a primary application." That means that TSMC will not decrease any existing capacity, but rather just evaluate any increased capacity for automotive chip production.

Intel has today reported its Q4 2020 earnings disclosing full-year revenue with the current CEO Bob Swan, upcoming new CEO Pat Gelsinger, and Omar Ishrak, Chairman of Intel's board. During the call, company officials have talked about Intel's earnings and most importantly, addressing the current problems about the company's manufacturing part - semiconductor foundries. Incoming Intel CEO, Pat Gelsinger, has talked about the state of the 7 nm node, giving shareholders reassurance and a will to remain in such a position. He has made an argument that he has personally reviewed the progress of the "health and recovery of the 7 nm program."

The 7 nm node has been originally delayed by a full year amid the expectations, and as with the 10 nm node, we have believed that it is going to experience similar issues. However, the incoming CEO has reassured everyone that it is very much improving. The new 7 nm node is on track for 2023 delivery, when Intel is expected to compete with the 3 nm node of TSMC. Firstly, Intel will make a debut of the 7 nm node with client processors scheduled for 1H 2023 arrival, with data center models following that. The company leads have confirmed that Intel will stay true to its internal manufacturing, but have stressed that there will still be a need for some outsourcing to happen.

Research and development spending by semiconductor companies worldwide is forecast to grow 4% in 2021 to $71.4 billion after rising 5% in 2020 to a record high of $68.4 billion, according to IC Insights' new 2021 edition of The McClean Report—A Complete Analysis and Forecast of the Integrated Circuit Industry. Total R&D spending by semiconductor companies is expected to rise by a compound annual growth rate (CAGR) of 5.8% between 2021 and 2025 to $89.3 billion.

When the world was hit by the Covid-19 virus health crisis in 2020, wary semiconductor suppliers kept a lid on R&D spending increases, even though total semiconductor industry revenue grew by a surprising 8% in the year despite the economic fallout from the deadly pandemic. Semiconductor R&D expenditures as a percentage of worldwide industry sales slipped to 14.2% in 2020 compared to 14.6% in 2019, when research and development spending declined 1% and total semiconductor revenue fell 12%. Figure 1 plots semiconductor R&D spending levels and the spending-to-sales ratios over the past two decades and IC Insights' forecast through 2025.

MediaTek today unveiled its new Dimensity 1200 and Dimensity 1100 5G smartphone chipsets with unrivaled AI, camera and multimedia features for powerful 5G experiences. The addition of the 6 nm Dimensity 1200 and 1100 chipsets to MediaTek's 5G portfolio gives device makers a growing suite of options to design highly capable 5G smartphones with top of the line camera features, graphics, connectivity enhancements and more.

"MediaTek continues to expand its 5G portfolio with highly integrated solutions for a range of devices from the high-end to the mid-tier," said JC Hsu, Corporate Vice President and General Manager of MediaTek's Wireless Communications Business Unit. "Our new Dimensity 1200 stands out with its impressive 200MP camera support and advanced AI capabilities, in addition to its innovative connectivity, display, audio and gaming enhancements."

Chinese company Shanghai Tianshu Zhixin Semiconductor Co., Ltd., commonly known (at least in Asia) as Tianshu Zhixin, has announced the availability of their special-purpose GPGPU, affectionately referred to as Big Island (BI). The BI chip is the first fully domestic-designed solution for the market it caters to, and features close to the latest in semiconductor manufacturing, being built on a 7 nm process featuring 2.5D CoWoS (chip-on-wafer-on-substrate) packaging. The chip is built towards AI and HPC applications foremost, with applications in other industries such as education, medicine, and security. The manufacturing and packaging processes seem eerily similar to those available from Taiwanese TSMC.

Tianshu Zhixin started work on the BI chip as early as 2018, and has announced that the chip features support for most AI and HPC data processing formats, including FP32, FP16, BF16, INT32, INT16, and INT8 (this list is not exhaustive). The company says the chip offers twice the performance of existing mainstream products on the market, and emphasizes its price/performance ratio. The huge chip (it packs as many as 24 billion transistors) is being teased by the company as offering as much as 147 TFLOPs in FP126 workloads, compared to 77.97 TFLOPs in the NVIDIA A100 (54 billion transistors) and 184.6 TFLOPS from the AMD Radeon Instinct MI100 (estimated at 50 billion transistors).

AMD is always in development mode and just when they launch a new product, the company is always gearing up for the next-generation of devices. Just a few months ago, back in November, AMD has launched its Zen 3 core, and today we get to hear about the next steps that the company is taking to stay competitive and grow its product portfolio. In the AnandTech interview with Dr. Lisa Su, and The Street interview with Rick Bergman, the EVP of AMD's Computing and Graphics Business Group, we have gathered information about AMD's plans for Zen 4 core development and RDNA 3 performance target.

Starting with Zen 4, AMD plans to migrate to the AM5 platform, bringing the new DDR5 and USB 4.0 protocols. The current aim of Zen 4 is to be extremely competitive among competing products and to bring many IPC improvements. Just like Zen 3 used many small advances in cache structures, branch prediction, and pipelines, Zen 4 is aiming to achieve a similar thing with its debut. The state of x86 architecture offers little room for improvement, however, when the advancement is done in many places it adds up quite well, as we could see with 19% IPC improvement of Zen 3 over the previous generation Zen 2 core. As the new core will use TSMC's advanced 5 nm process, there is a possibility to have even more cores found inside CCX/CCD complexes. We are expecting to see Zen 4 sometime close to the end of 2021.

According to a market analysis from TrendForce, Intel's manufacturing efforts with TSMC will go way beyond a potential TSMC technology licensing for that company's manufacturing technology to be employed in Intel's own fabs. The market research firm says that Intel will instead procure wafers directly from TSMC, starting on 2H2021, in the order of 20-25% of total production for some of its non-CPU products. But the manufacturing deal is said to go beyond that, with TSMC picking up orders for Intel's Core i3 CPUs in the company's 5 nm manufacturing node - one that Intel will take years to scale down to on its own manufacturing capabilities.

According to TrendForce, that effort will scale upwards with TSMC manufacturing certain allotments of Intel's midrange and high-end CPUs using the semiconductor manufacturer's 3 nm technology in 2022. TrendForce believes that increased outsourcing of Intel's product lines will allow the company to not only continue its existence as a major IDM, but also maintain and prioritize in-house production lines for chips with high margins, while more effectively spending CAPEX on advanced R&D due to savings on fabrication technology scaling - fewer in-house chips means lower needs for investment in capacity increases, which would allow the company to sink the savings into further R&D. The move would also allow Intel to close the gap with rival AMD's manufacturing advantages in a more critical, timely manner.

Intel's first discrete gaming graphics card based on the Xe-HPG graphics architecture, will be built on a TSMC 7 nanometer silicon fabrication node, according to a Reuters report citing sources "familiar with the matter." The first such discrete GPU is being referred to internally by Intel as the DG2. Recent reports suggest that Intel will give the DG2 formidable specs, such as 4,096 unified shaders across 512 execution units, and 8 GB of GDDR6 video memory. Back in 2020, the company launched the DG1 under the Intel Iris Xe MAX marketing name, targeting only the mobile discrete GPU market. The DG1 has entry-level specs, with which Intel is eyeing the same pie as NVIDIA's fast-moving GeForce MX series mobile GPUs. Interestingly, the other major client of TSMC-N7 following Apple's transition to N5, is Intel's rival AMD.

TSMC (TWSE: 2330, NYSE: TSM) today announced its net revenues for December 2020: On a consolidated basis, revenues for December 2020 were approximately NT$117.37 billion, a decrease of 6.0 percent from November 2020 and an increase of 13.6 percent from December 2019. Revenues for January through December 2020 totaled NT$1,339.26 billion, an increase of 25.2 percent compared to the same period in 2019.

AMD may be finding itself riding a new wave of success caused by its accomplishments with the Zen architecture, which in turn bolstered its available R&D for its graphics division and thus turned the entire AMD business on its head. However, success comes at a cost, particularly when you don't own your own fabs and have to vie for capacity with TSMC against its cadre of other clients. I imagine that currently, AMD's HQ has a direct system of levers and pulleys that manage its chip allocation with TSMC: pull this lever and increase number of 7 nm SOC for the next-generation consoles; another controls Ryzen 5000 series; and so on and so on. As we know, production capacity on TSMC's 7 nm is through the roof, and AMD is finding it hard to ship enough of its Zen 3 CPUs and RDNA2 graphics cards. The reported delay for the AMD RX 6700 series may well be a result of AMD overextending its product portfolio on the 7 nm process with foundry partner TSMC.

A report coming from Cowcotland now points towards a 1Q2021 release for AMD's high-performance RX 6700 series, which was initially poised to see the light of day in the current month of January. The RX 6700 series will ship with AMD's Navi 22 chip, which is estimated to be half of the full Navi 21 chip (which puts it at a top configuration of 2560 Stream Processors over 40 CUs). These cards are expected to ship with 12 GB of GDDR6 memory over a 192-bit memory bus. However, it seems that AMD may have delayed the launch for these graphics cards. One can imagine that this move from AMD happens so as to not further dilute the TSMC wafers coming out of the factory, limited as they are, between yet another chip. One which will undoubtedly have lower margins than the company's Zen 3 CPUs, EPYC CPUs, RX 6800 and RX 6900, and that doesn't have the same level of impact on its business relations as console-bound SoCs. Besides, it likely serves AMD best to put out enough of its currently-launched products' to sate demand (RX 6000 series, Ryzen 5000, cof cof) than to launch yet another product with likely too limited availability in relation to the existing demand.

Intel is familiar with chip manufacturing problems since the company started the development of a 10 nm silicon semiconductor node. The latest node is coming years late with many IPs getting held back thanks to the inability of the company to produce it. All of Intel's chip production was historically happening at Intel's facilities, however, given the fact that the demand for 14 nm products is exceeding production capability, the company was forced to turn to external foundries like TSMC to compensate for its lack of capacity. TSMC has a contract with Intel to produce silicon for things like chipsets, which is offloading a lot of capacity for the company. Today, thanks to the exclusive information obtained by Reuters, we have information that a certain New York hedge fund, Third Point LLC, is advising the company about the future of its manufacturing.

The hedge fund is reportedly accounting for about one billion USD worth of assets in Intel, thus making it a huge and one influencing shareholder. The Third Point Chief Executive Daniel Loeb wrote a letter to Intel Chairman Omar Ishrak to take immediate action to boost the company's state as a major provider of processors for PCs and data centers. The company has noted that Intel needs to outsource more of its chip production to satisfy the market needs, so it can stay competitive with the industry. The poor performance of Intel has reflected on the company shares, which have declined about 21% this year. This has awoken the shareholders and now we see that they are demanding more aggressiveness from the company and a plan to outsource more of the chip production to partner foundries like TSMC and Samsung. It remains to be seen how Intel responds and what changes are to take place.

In the upstream semiconductor industry, the major foundries such as TSMC and UMC are reporting fully loaded capacities, while in the downstream, the available production capacity for OSAT is also lacking, according to TrendForce's latest investigations. Given this situation, suppliers of NAND Flash controller ICs such as Phison and Silicon Motion are now unable to meet upside demand from their clients. Not only have many controller IC suppliers temporarily stopped offering quotes for new orders, but they are also even considering raising prices soon because the negotiations between NAND Flash suppliers and module houses over 1Q21 contracts are now at the critical juncture. The potential increases in prices of controller ICs from outsourced suppliers (IC design houses) are currently estimated to be the range of 15-20%.

With regards to the demand side, demand has risen significantly for eMMC solutions with medium- and low-density specifications (i.e., 64 GB and lower), for which NAND Flash suppliers have mostly stopped updating the NAND Flash process technology, while maintaining support with the legacy 2D NAND or the 64L 3D NAND process. This is on account of strong sales for Chromebook devices and TVs. As older processes gradually account for a lowering portion of bit output proportions from NAND Flash suppliers, these companies are exhibiting a lowered willingness to directly supply such eMMC products to clients. As a result, clients now need to turn to memory module houses, which are able to source NAND Flash components and controllers, to procure eMMC products in substantial quantities.

NVIDIA has launched its GeForce RTX 3000 series of graphics cards based on the Ampere architecture three months ago. However, we are already getting information about the next-generation that the company plans to introduce. In the past, the rumors made us believe that the architecture coming after Ampere is allegedly being called Hopper. Hopper architecture is supposed to bring multi-chip packaging technology and be introduced after Ampere. However, thanks to @kopite7kimi on Twitter, a reliable source of information, we have data that NVIDIA is reportedly working on a monolithic GPU architecture that the company internally refers to as "ADxxx" for its codenames.

The new monolithically-designed Lovelace architecture is going make a debut on the 5 nm semiconductor manufacturing process, a whole year earlier than Hopper. It is unknown which foundry will manufacture the GPUs, however, both of NVIDIA's partners, TSMC and Samsung, are capable of manufacturing it. The Hopper is expected to arrive sometime in 2023-2024 and utilize the MCM technology, while the Lovelace architecture will appear in 2021-2022. We are not sure if the Hopper architecture will be exclusive to data centers or extend to the gaming segment as well. The Ada Lovelace architecture is supposedly going to be a gaming GPU family. Ada Lovelace, a British mathematician, has appeared on NVIDIA's 2018 GTC t-shirt known as "Company of Heroes", so NVIDIA may have already been using the ADxxx codenames internally for a long time now.

The percentage distribution of 2021 NAND Flash bit demand by application currently shows that client SSD accounts for 31%, enterprise SSD 20%, eMMC/UFS 41%, and NAND wafer 8%, according to TrendForce's latest investigations. TrendForce expects NAND Flash ASP to undergo QoQ declines throughout 2021, since the number of NAND suppliers far exceeds DRAM suppliers, and the bit supply remains high. As Samsung, YMTC, SK Hynix, and Intel actively expand their NAND Flash bit output in 1Q21, the oversupply situation in the industry will become more severe, with a forecasted 6% QoQ increase in NAND Flash bit output and a 10-15% QoQ decline in NAND Flash ASP in 1Q21.

The possibility barely exists to account for all the silicon manufacturing processes currently in development; TSMC themselves are rolling out 5 nm, 4 nm, 3 nm, and 2 nm processes at various points in time in the future. Now, the company has announced that it will be rolling out a revision of the 3 nm manufacturing process, named 3 nm Plus, come 2023. According to DigiTimes, the Taiwanese manufacturer's first client for this process will be Apple.

There is no information on what exactly 3 nm Plus leverages and offers over the "vanilla" 3 nm process. It could be anything from higher transistor density, lower power consumption, or higher operating frequency - or maybe a mixture of the three. The original 3 nm manufacturing process is set to offer a 15% performance gain over the current top-of-the-line 5 nm node, with 30% decreased power use and up to 70% density increase. Interestingly, TSMC is keeping their FinFet manufacturing technology, on grounds of better implementation costs and higher power efficiency compared to the more exotic GAA (Gate-All-Around) technology that its rival Samsung, for one, aims to implement in 3 nm.

Taiwan Semiconductor Manufacturing Company (TSMC), one of the largest semiconductor manufacturers in the world, is reportedly ending its volume discounts. The company is the maker of the currently smallest manufacturing nodes, like 7 nm and 5 nm. For its biggest customers, TSMC used to offer a discount - when you purchase 10s or 100s of thousands of 300 mm (12-inch) wafers per month, the company will give you a deal of a 3% price decrease per wafer, meaning that the customer is taking a higher margin off a product it sells. Many of the customers, like Apple, NVIDIA, and AMD, were a part of this deal.

Today, thanks to a report from the Taiwanese Central News Agency, TSMC is terminating this type of discount. Now, every customer will pay full price for the wafer, without any exceptions. For now, it is unclear what drove that decision at TSMC's headquarters, but the only thing that we could think is that the demand is too high to keep up with the discounts and the margins are possibly lower. What this means for consumers is a possible price increase in products that are manufactured at TSMC's facilities. The consumer market is already at a drought of new PC components like CPUs and GPUs due to high demand and scalping. This could contribute a bit to the issue, however, we do not expect it to be of any major significance.

AMD's launch of their top of the line RX 6900 XT graphics card seems that it will have even less availability than the company's high-end RX 6800 and RX 6800 XT graphics card. This isn't surprising; the RX 6900 XT is a 590 mm² beast of a GPU with all of its execution units enabled - that's a lot of die space to harvest without a single silicon fault, no matter how good TSMC's 7 nm manufacturing process really is. Stock will be scarce, and likely will be scarce throughout the lifetime of the product, especially with the clogged, unmet, existing demand for high performance GPUs from a world population that has turned to gaming as a solace in times of quarantine.

Digitec, the largest Swiss retailer (serving a population of 8.5 million people), is only receiving 35 RX 6900 XT graphics cards for launch. We don't know, of course, what exactly is the Swiss demand for high-performance graphics cards, but it being one of the world's wealthiest countries (when it comes to its population's average income) it's expected to be higher than other countries with comparable population but lower income. As a result, the retailer isn't even putting the cards up for sale as they normally would; instead, there's a sweepstakes of sorts where 35 random users that opt-in for the event will receive a code that allows them to purchase the graphics card for its retail price of $999. An interesting solution, albeit of course, it just signals the dimension of the cards' availability issues.

In a bid to maximize utilization of its own semiconductor foundry for manufacturing larger, more profitable processors, Intel could be look at contracting TSMC to manufacture certain processors based on its low-power CPU microarchitectures, according to a new Intel job posting discovered by Komachi Ensaka. The job description for a position in Intel's Bengaluru facility, speaks of a "QAT Design Integration Engineer" who would play a role in the "development and integration of CPM into Atom and Xeon-based SoC on Intel and TSMC process."

QAT is a hardware feature that accelerates cryptography and data-compression workloads. Since the Xeon part in this sentence is referenced next to SoC, Intel could be referring to Xeon processors based on low-power cores, such as "Snow Ridge," which uses "Tremont" CPU cores. The decision to go with TSMC could also be driven by the 5G infrastructure hardware gold rush awaiting the likes of Intel across dozens of new markets, particularly those averse to buying hardware from Huawei.

They say that it is hard to keep up with Moore's Law, however, for the folks over at Taiwan Semiconductor Manufacturing Company (TSMC), that doesn't seem to represent any kind of a problem. Today, to confirm that TSMC is one of the last warriors for the life of Moore's Law, we have information that the company has completed building its manufacturing facility for the next-generation 3 nm semiconductor node. Located in Southern Taiwan Science Park near Tainan, TSMC is expecting to start high-volume manufacturing of the 3 nm node in that Fab in the second half of 2022. As always, one of the first customers expected is Apple.

Estimated to cost an amazing 19.5 billion US Dollars, the Fab is expected to have an output of 55,000 300 mm (12-inch) wafers per month. Given that the regular facilities of TSMC exceed the capacity of over 100K wafers per month, this new facility is expected to increase the capacity over time and possibly reach the 100K level. The new 3 nm node is going to use the FinFET technology and will deliver a 15% performance gain over the previous 5 nm node, with 30% decreased power use and up to 70% density increase. Of course, all of those factors will depend on a specific design.

Silicon manufacturing is starting to get harder and harder every day, with new challenges appearing daily. It requires massive investment and massive knowledge to keep a silicon manufacturing company afloat. No company can survive that alone, so some collaborations are emerging. Today, thanks to the sources of Nikkei Asia, we have information that Taiwanese Semiconductor Manufacturing Company (TSMC) is collaborating with Google to push the production of 3D chip manufacturing process, that is said to overcome some of the silicon manufacturing difficulties. The sources also say that AMD is involved in the process as well, making Google and AMD the first customers of the advanced 3D chip design. The two companies are preparing designs for the new way of creating silicon and will help TSMC test and certify the process.

TSMC will deploy the 3D silicon manufacturing technology at its chip packaging plant in Miaoli, which is supposed to do mass production in 2022. With Google and AMD being the first customers of new 3D technology, it is exciting to see what new products will look like and how they will perform. The 3D approach is said to bring huge computing power increase, however, it is a waiting game now to see how it will look like.