Launch of AMD's upcoming Ryzen Threadripper 5000 series high-end desktop (HEDT) and Threadripper WX workstation processors, is rumored to have been delayed to 2022, according to Greymon55, a reliable source with AMD leaks. Codenamed "Chagall," these processors are compatible with existing sTRX4 and sWRX8 motherboards, based on the AMD TRX40 and AMD WRX80 chipsets, respectively. What's new, is the "Zen 3" microarchitecture.

It remains to be seen if the delay is the result of a last-minute decision by AMD to go with the newer "Zen 3" CCD that comes with 3D Vertical Cache technology, over the conventional "Zen 3" CCD; or some other reason. A 2022 launch would mean that Threadripper 5000 series will be launching around the time when Intel has desktop platforms with DDR5 memory and PCI-Express Gen 5. Threadripper 5000 chips with quad-channel DDR4 memory (four 64-bit wide channels) will be seen offering only comparable memory bandwidth to "Alder Lake" systems with overclocked DDR5 memory (four 40-bit wide channels). AMD is likely to prioritize its next "big" socket for the enterprise segment with EPYC "Genoa," as the company could find itself embattled with Xeon "Sapphire Rapids" processors that come with next-gen I/O.

AMD's "Zen 3" CCD, or compute complex die, the physical building-block of both its client- and enterprise processors, possibly has a core count limitation owing to the way the various on-die bandwidth-heavy components are interconnected, says an AnandTech report. This cites what is possibly the first insights AMD provided on the CCD's switching fabric, which confirms the presence of a Ring Bus topology. More specifically, the "Zen 3" CCD uses a bi-directional Ring Bus to connect the eight CPU cores with the 32 MB of shared L3 cache, and other key components of the CCD, such as the IFOP interface that lets the CCD talk to the I/O die (IOD).

Imagine a literal bus driving around a city block, picking up and dropping off people between four buildings. The "bus" here resembles a strobe, the buildings resemble components (cores, uncore, etc.,) while the the bus-stops are ring-stops. Each component has its ring-stops. To disable components (eg: in product-stack segmentation), SKU designers simply disable ring-stops, making the component inaccessible. A bi-directional Ring Bus would see two "vehicles" driving in opposite directions around the city block. The Ring Bus topology comes with limitations of scale, mainly resulting from the latency added from too many ring-stops. This is precisely why coaxial ring-topology faded out in networking.

BIOSTAR, a leading brand of motherboards, graphics cards, and storage devices, today announced product support for the latest AMD Ryzen 5000G series Cezanne processors. AMD's next-generation Ryzen 5000G series desktop processors codenamed "Cezanne" are ready to invade the global market. The new 5000G series processors are based on Zen 3 architecture, AMD's Ryzen 5000 series of desktop APUs based on the Zen 3 CPU and Vega GPU microarchitectures succeeding the Ryzen 4000 "Renoir" series.

Extreme performance enabled for personal computing with up to 8 cores fueled by the world's most advanced 7 nm processor core technology, the AMD Ryzen 5000 G-series desktop processors with Radeon graphics deliver ultra-fast responsiveness and multi-threaded performance for any use case.

AMD is looking to launch a substantial lineup of HEDT and workstation processors before the end of 2021, based on its latest "Zen 3" microarchitecture. These processors are categorized in two distinct lines—the Ryzen Threadripper 5000X targeting HEDTs, and the Ryzen Threadripper Pro 5000WX targeting workstations. Both are based on different sockets, sTRX4 and sWRX8, respectively, with the latter featuring 8-channel DDR4 memory, compared to the former's 4-channel. Two Ryzen Threadripper Pro 5000WX series chips surfaced on the Milky Way@Home distributed computing database, the 5945WX and 5995WX.

The application identifies the 5945WX as a 12-core/24-thread processor, while the 5995WX is the top-dog 64-core/128-thread part. AMD maintains lower core-count Threadrippers to target the section of the market that seeks I/O capabilities over core-counts (memory bandwidth, a large number of PCIe lanes supporting NVMe RAID or multiple AIC compute accelerators, etc,). The lower core counts also come with higher CPU clock-speeds, benefiting less-parallelized applications. At this point it's not known if the Threadripper 5000 family features the conventional "Zen 3" CCD chiplet, or the new "Zen 3+" chiplets with 64 MB 3D Vertical Cache (3DV cache), but the company is planning to monetize the new chiplet across its EPYC enterprise line as the additional cache benefits certain applications with large streaming data-sets. It's conceivable that the Threadripper Pro series could benefit from 3DV cache, too.

Here's the first picture of a production EVGA X570 DARK motherboard, the company's flagship Socket AM4 motherboard targeting overclocking features on the latest "Zen 3" processors. The board prioritizes CPU and memory overclocking headroom above all else. The orientation of the Socket AM4 is rotated 240°, such that the memory slots are located on top of the socket. There's only 1 DIMM per memory channel, which is the most optimal topology for memory overclocking. The angled power inputs, along with onboard buttons, switches, POST code display, and voltage measurement points, are conveniently located in the top-right corner of the PCB, with the power inputs being angled to reduce cable clutter.

The CPU socket is wired to two PCI-Express 4.0 x16 slots (x8/x8 with both populated), and an M.2 NVMe slot with PCI-Express 4.0 x4 wiring. The X570 chipset (not specified whether it's an X570S), is cooled passively, by a large heatsink that extends into heatsink over the board's two M.2 slots. Connectivity likely includes two wired networking interfaces, a Wi-Fi 6E wireless interface, and EVGA's highest-grade onboard audio solution. The board's BIOS is optimized for record-breaking CPU and memory overclocking, using sub-zero cooling solutions. The company didn't reveal availability or pricing.

The upcoming Ryzen Threadripper 5000 lineup of processors has been leaked in documents received by Wccftech from the recent Gigabyte data breach. The next generation of Zen 3 based Threadripper processors will include at least 8 SKUs with varying core counts up to 64 cores. The documents also confirm that AMD will launch both Workstation and High-End Desktop models for the WRX80 and TRX40 sockets respectively with the same TDP and core counts as their Zen 2 predecessors. The five PRO (Workstation) chips will be offered in 64, 32, 24, 16, and 12 core models while the three HEDT versions will be offered with 64, 32, and 24 cores. The Workstation processors will offer an 8-channel IMC and 128 PCIe 4.0 lanes compared to 64 on the HEDT chips. AMD is expected to launch these Ryzen Threadripper 5000 processors in November 2021.

We have recently seen the first high-resolution die shots of AMD's Ryzen 5 5600G Cezanne APU thanks to the work of Fritzchens Fritz. The photos show the internal layout of the processor with its Zen 3 CPU, Vega GPU, and corresponding components. To get these shots, the chip had to be delidded by removing the IHS which has been made harder with the move to a soldered design. The Ryzen 5 5600G is a 6 core, 12 thread part with 7 Vega GPU cores which can all be seen in the annotated diagram of the die created by Locuza. The diagram also shows the suspected locations of various PCIe 3.0, and memory controllers along with cache placements for the CPU and GPU. The processor is manufactured on TSMC's 7 nm process and features a total of 10.7 Billion transistors packed into the 180 mm² die.

German online retailer Mindfactory may not be as big as Amazon, but it puts out its sales figures of PC hardware components, that often get picked up by the tech-press as a sample size. While using its data as a yardstick for AMD outselling Intel in the DIY market is debatable, sales of individual AMD or Intel products provide valuable insights to what consumers are after these days. Apparently, the recently launched Ryzen 7 5700G and Ryzen 5 5600G APUs are already outselling the Ryzen 7 5800X and Ryzen 5 5600X, respectively, for the week of 2nd August running.

AMD designed the Ryzen 7 5700G to succeed the popular Ryzen 7 3700X, and the 5600G to succeed the best-selling Ryzen 5 3600, which explains the absence of "Ryzen 7 5700X" or "Ryzen 5 5600," at least in the DIY market. It's little surprise then, that just as the 3700X outsold the 3800X, Mindfactory bagged orders for 820 units of 5700G, as opposed to 610 units of the 5800X; and 900 units of the 5600G, compared to 680 units of the 5600X. It's interesting to note that the 5700G even outsold the 5600X. The 5700G and 5600G are based on the 7 nm "Cezanne" silicon, which packs up to 8 "Zen 3" cores, and an iGPU with up to 512 stream processors. Unlike "Vermeer," Cezanne is a monolithic die.

Senior Technology Fellow Yuzo Fukuzaki shed light on the elusive new CPU technology AMD unveiled at its Computex 2021 keynote, 3D Vertical Cache (3DV Cache). The company had then detailed it as an additional 64 MB last-level cache stacked on top of a CCD (CPU core complex die), which significantly improves performance, including a claimed 15% average gain in gaming performance, which accounts for a generational performance gain over "Zen 3." The prototype AMD unveiled in its keynote was based on a Socket AM4 processor with "Zen 3" CCDs that have the 3DV Cache components in place. With two such CCDs, a 16-core processor would end up with 192 MB of L3 cache.

Yuzo Fukuzaki's theory sheds light on the most plausible position of 3DV Cache in the processor's cache hierarchy. Apparently, it expands the CCD's L3 cache, and doesn't serve as an "L4" victim cache to the L3. This way, the cache setup remains transparent to the OS, which sees it as a contiguous 96 MB block of L3 cache (per CCD). The 3DV Cache die is an SRAM chip fabricated on the same 7 nm process as the "Zen 3" CCD. It measures 6 mm x 6 mm (36 mm²), and is located above the region of the CCD that typically has the 32 MB L3 SRAM. Fukuzaki estimates that roughly 23,000 TSVs (through-silicon vias), each about 17 µm in size, connect the 3DV Cache die to the main CCD.

AMD CEO Dr Lisa Su, in the company's Q2-2021 financial results call, confirmed that the company is on-track to launch the Zen 4 CPU microarchitecture and RDNA3 graphics architecture, in 2022. Zen 4 would herald the first major desktop platform change since the original Zen architecture, with the introduction of a new CPU socket, and support for DDR5 memory. The RDNA3 graphics architecture, meanwhile, is expected to nearly triple SIMD resources over the previous generation, and introduce even more fixed-function hardware for raytracing.

In the meantime, AMD is preparing a counter to Intel's 12th Gen Core "Alder Lake-S" processor, in the form of Zen 3 with 3D Vertical Cache, which is also being referred to as the Zen 3+ architecture. These processors feature additional last-level cache, and the company claims a 15% gaming performance uplift, which should help it close the gaming performance gap with Intel, and win on sheer core-count of its big cores. It remains to be seen if Zen 3+ remains on Socket AM4 or if it debuts AM5, as AMD will be under pressure to match "Alder Lake" in platform I/O, which includes DDR5. Dr Su also confirmed that AMD has started shipping the Instinct MI200 "Aldebaran" compute accelerator based on the CDNA2 architecture. AMD's first MCM GPU with two logic dies, "Aldebaran" takes the fight to NVIDIA's top A100 series compute accelerators, and has already scored wins with ongoing HPC/supercomputing projects.

Regardless the hype surrounding the impending DDR5 memory and boards, Neo Forza (the gaming arm and brand of Goldkey Technology Corporation, TAIWAN) firmly believes DDR4 systems to still be the de-facto choice for the gaming community for some time to come, due primarily to both budget considerations and the large pool of DDR4 community forums. Would not be surprised for DDR4 versions of Alder Lake boards and Zen 4 boards to appear in the near horizon.

Entrenched in this belief, Neo Forza proudly announces release of readily available DDR4-5000 and DDR4-4600 memory. Neo Forza's frequency segmentation; 3000-3600 MHz | 3600-4400 MHz | 4400-5000 MHz is acknowledgement of bulk of PC gamers and enthusiasts to having systems one to two generations behind very latest CPU and mainboard offerings. Neo Forza's frequency segmentation practically matches DDR4 motherboard chipset tiers and CPU configurations, thereby eking out every last drop of performance from the system, maximizing budgets across all tiers of enthusiasts.

With qualification samples of the upcoming Intel Core i9-12900K "Alder Lake-S" processors and companion Socket LGA1700 motherboards hitting the black-market, expect a deluge of benchmarks on social media. One such that stands out makes a fascinating claim that the i9-12900K beats AMD's current flagship Ryzen 9 5950X processor at Cinebench R20, which has been AMD's favorite multi-threaded benchmark. At stock speeds, with liquid cooling, the i9-12900K allegedly scores 810 points in the single-threaded test, and 11600 points in multi-threaded.

To put these numbers into perspective, a retail Ryzen 9 5950X scores 641 points in the single-threaded test, and 10234 points in multi-threaded, in our own testing. The i9-12900K is technically a 16-core processor, just like the 5950X, but half its cores are low-power "Gracemont." The "Alder Lake-S" chip appears to be making up ground on the single-threaded performance of the "Golden Cove" P-core, that's a whopping 25% higher than the "Zen 3" core on the 5950X. This is aided not just by higher IPC, but also the max boost frequency of 5.30 GHz for 1~2 cores, and 5.00 GHz "all-core" boost (for the P-cores).

AMD is preparing to launch the Ryzen Threadripper 5000 "Chagall" HEDT processors in August 2021, according to a MoePC report, confirming a rumor from April 2021. These chips will arrive in core-counts of up to 64, spanning two CPU socket types—sTRX4 (Ryzen Threadripper) and sWRX8 (Ryzen Threadripper PRO), and compatible with existing motherboards that run Ryzen 3000 Threadrippers, requiring a UEFI firmware update. Nearly every retail sTRX4 motherboard we've come across features USB BIOS Flashback, letting you update the firmware of an off-the-shelf motherboard without needing to install a compatible processor.

What's new with the Ryzen Threadripper 5000 is the new "Zen 3" CCDs, which place all 8 CPU cores of the die into a single CCX, sharing a unified 32 MB L3 cache. The I/O is identical to the previous generation, with the sTRX4 chips featuring quad-channel DDR4 interface, and sWRX8 ones featuring 8-channel, both with ECC; and up to 88 PCI-Express Gen 4 lanes. AMD also slightly increased the xGMI2 bandwidth to 18 GT/s, from 16 GT/s on the Ryzen Threadripper 3000 series.Many Thanks to DeathtoGnomes for the tip.

Today, HP Inc. announced its lightest consumer laptop yet, the HP Pavilion Aero 13 Laptop PC. Starting at less than 1 kilogram, the Pavilion Aero 13 delivers a flawless sustainable design with the power to entertain, connect, and be productive. HP also welcomed the HP M24fwa FHD Monitor and HP M27fwa FHD Monitor to the M-Series line of monitors featuring built-in audio; the newest additions are part of the world's first Eyesafe certified monitor series made with recycled ocean bound plastics.

As more people return to a new normal, they need a PC that can move with them while at home and on the go. The PC is used away from home 45% of the time to perform a wide range of tasks, with 25% of time spent streaming videos while 11% of the time is spent being productive, whether it be learning or work-related. With the new Pavilion Aero 13, people can work hard and play hard no matter where they are, on a single, lightweight device.

AMD's next generation Ryzen Embedded V3000 system-on-chips aren't simply "Cezanne" dies sitting on BGA packages, but rather based on a brand new silicon, according to Patrick Schur, a reliable source with leaks. The die will be built on the more advanced 6 nm silicon fabrication node, whilst still being based on the current "Zen 3" microarchitecture. There are several things that set it apart from the APU silicon of the current-generation, making it more relevant for the applications the Ryzen Embedded processor family is originally built for.

Built in the FP7r2 BGA package, the V3000 silicon features an 8-core/16-thread CPU based on the "Zen 3" microarchitecture. There are also an integrated GPU based on the RDNA2 graphics architecture, with up to 12 CUs, a dual-channel DDR5 memory interface, a 20-lane PCI-Express 4.0 root complex, with up to 8 lanes put out for PEG; two USB4 ports, and two 10 GbE PHYs. AMD could design at least three SKUs based on this silicon, spanning TDP bands of 15-30 W and 35-54 W.

AMD Socket AM5 motherboards are set to arrive in Q2-2022, according to PJ, the editor of Uniko's Hardware. This would mean that the Zen 3 + 3D Vertical Cache chiplet AMD CEO Dr Lisa Su showed off in her Computex keynote, could very well be built in the Socket AM4 package, compatible with existing motherboards. The prototype Dr Su showed off appeared Socket AM4, too. AMD claims that the 3D Vertical Cache feature, when paired with a "Zen 3" chiplet, improves gaming performance by a significant 15 percent, helping AMD catch up with Intel's "Rocket Lake-S" processor at gaming. Elsewhere across the landscape, PJ predicts that the Z690 chipset, which goes with "Alder Lake-S" processors in the LGA1700 package, will arrive by Q4 2021, with cost-effective chipsets such as the B660 and H610 in Q1-2022.

AMD via its official YouTube has shared a video that goes into slightly more detail on their usage of V-Cache on the upcoming Zen 3+ CPUs. Firstly demoed to the public on AMD's Computex 2021 event, the 3D V-Cache leverages TSMC's SoIC stacking technology, which enables silicon developments along the Z axis, instead of the more usual footprint increase along the X axis. The added 3D V-Cache, which was shown in Computex as being deployed in a prototype Ryzen 9 5900X 12-core CPU, adds 64 MB of L3 cache to each CCX (the up-to-eight-cores core complex on AMD's latest Zen design), basically tripling the amount of L3 cache available for the CPU. This, in turn, was shown to increase FPS in games quite substantially (somewhere around 15%), as games in particular are sensitive to this type of CPU resources.

The added information explains that there is no usage of microbumps - instead, there is a perfect alignment between the bottom layer (with the CCX) and the top layer (the L3 cache) which enables the bonding process to occur naturally via the TSVs (Through Silicon Vias) already present in the silicon, in a zero-gap manner, between both halves of the CPU-cache sandwich. To enable this, AMD flipped the CCX upside down (the core complex now faces the bottom of the chip, instead of the top), shaved 95% of the silicon on top of the upside-down core complexes, and then attaches the 3D V-Cache chips on top of this formation. This also has the added bonus of decreasing the distance between the L3 cache and the CCX (the distance between both in the Z axis is around 1,000 times smaller than if the L3 cache was deployed in the classical X axis), which decreases power consumption, temperatures, and latency, allowing for further increases to system performance. Look after the break for the full video.

GIGABYTE Technology, a leading manufacturer of motherboards, graphics cards, and hardware solutions, today announced the all-new 2021 BRIX mini-PC series, which adopts the latest AMD Ryzen 5000U mobile processors that have leading 7 nm technology, 8 cores/16 threads CPU architecture, low 15 W TDP, and reduced power consumption compared to the previous generation. Benefiting from AMD's premium "Zen 3" core architecture and "Vega" GPU cores, these processors boost the performance significantly in CPU and GPU related workloads. Enhanced by GIGABYTE's exclusive design, the all-new 2021 BRIX mini-PC design integrates 4 display outputs, 2.5G Ethernet, and 802.11ax WiFi 6E configuration, creating the most powerful multitasking mini-PC with astounding performance and responsiveness for either gaming or content creation.

The latest AMD Ryzen 5000U mobile processors highlight 7 nm technology, and when compared to the previous generation, these new processors feature a 16% increase in single-threaded performance, 14% increase in multi-threaded performance, and do so with higher clock frequencies and lower SoC power consumption. The powerful performance of AMD Ryzen 5000U mobile processors sets a milestone for the mobile platform. When it comes to benchmark testing, it is inspiring to see that 3DMark CPU Performance scores come in at 1.23x that of competitor's 11th Gen processors and 1.8x on Cinebench R20 benchmark too. No more needing to compromise between productivity, performance, and gaming/video performance.

AMD today announced the launch of its first Ryzen 5000 series desktop processors with integrated graphics, under the Ryzen 5000G and Ryzen Pro 5000G lines. These processors are based on the 7 nm "Cezanne" silicon, featuring up to 8 CPU cores based on the "Zen 3" microarchitecture, an iGPU based on the "Vega" graphics architecture with up to 8 compute units, but updated display- and media-acceleration engines; 512 KB of L2 cache per core, and 16 MB of L3 cache that's shared between all eight cores. Built in the Socket AM4 package, the processors are compatible with AMD 500-series chipset motherboards. The chips feature PCI-Express Gen 3 downstream I/O.

The consumer Ryzen 5000G series include the Ryzen 7 5700G, and the Ryzen 5 5600G. The 5700G features an 8-core/16-thread CPU, clock speeds of 3.80 GHz, with up to 4.60 GHz boost, and all 8 iGPU compute units being unlocked with up to 2.00 GHz engine clocks. The 5600G, on the other hand, has a 6-core/12-thread CPU clocked at 3.90 GHz, with up to 4.40 GHz boost, and 7 iGPU compute units with up to 1.90 GHz engine clocks. Both chips have their TDP rated at 65 W. AMD claims that the 5700G beats the Core i7-11700 in a variety of content creation and iGPU gaming tasks, as shown in the graphs below; and the iGPU is capable of 1080p e-sports gaming. The 5700G is priced at USD $359, and the 5600G goes for $259. Both chips are available from August 5, 2021.

Acer today introduced the Swift X, the newest member of its popular Swift line of notebooks. Designed to take ultra-portable PC design to the next level, this ultrathin-and-light laptop boasts an AMD Ryzen 5000 Series Mobile Processor with "Zen 3" architecture and the latest NVIDIA GeForce RTX 3050 Ti Laptop GPUs.

"Acer's new notebook models are designed to offer consumers the widest possible choice of high-performance, ultraportable computing devices," said James Lin, General Manager, Notebooks, IT Products Business, Acer Inc. "Professionals need a clean-looking notebook that is compact enough to take with them throughout the day, but it also has to be powerful enough to run multiple resource-intensive programs at once. With every device we make, we're always pursuing that balance."

Hot of the release of the new generation of AERO creator and AORUS professional gaming laptops equipped with the GeForce RTX 30 series laptop GPUs, world leading PC brand, GIGABYTE is proud to unveil the all new mid-range gaming laptop series: GIGABYTE GAMING laptops. Introducing two models, the A5 and A7 laptops made for multitasking. Beyond gaming the A7 laptop is GIGABYTE's first mid-end gaming laptops to be equipped with AMD Ryzen 5000H series mobile processors and NVIDIA GeForce RTX 30 series laptop GPUs.

As COVID-19 continues to ravage countries around the world, cities are once again under lockdown and people are once again subject quarantine restrictions. Working remotely, learning remotely, and stay-at-home economics means accessible innovative computing is needed to meet the changes. GIGABYTE GAMING series target Gen Z and Millennial users, by offering up machines built for "multitasking" and meeting multiple needs at once, whether its learning, commerce, gaming or content creation. Capable of great performance, the GIGABYTE GAMING is ideal for everyday life, work, and entertainment. It features all-purpose product specifications - Up to 144 Hz refresh rate and 72% NTSC wide color gamut, 1+3 external DisplayPort, and three slots that support up to 6 TB storage space. The GIGABYTE GAMING series is ready to offer high performance to the mid-range market.

AMD is in a constant process of processor development, and there are always new technologies on the horizon. Back in March of 2020, the company has revealed that it is working on new X3D packaging technology, that integrated both 2.5D and 3D approaches to packing semiconductor dies together as tightly as possible. Today, we are finally getting some more information about the X3D technology, as we have the first codename of the processor that is featuring this advanced packaging technology. According to David Schor, we have learned that AMD is working on a CPU that uses X3D tech with stacked dies, and it is called Milan-X.

The Milan-X CPU is AMD's upcoming product designed for data center usage. The rumors suggest that the CPU is designed for heavy bandwidth and presumably a lot of computing power. According to ExecutableFix, the CPU uses a Genesis-IO die to power the connectivity, which is an IO die from EPYC Zen 3 processors. While this solution is in the works, we don't know the exact launch date of the processor. However, we could hear more about it in AMD's virtual keynote at Computex 2021. For now, take this rumor with a grain of salt.

Intel will detail its 12th Gen Core "Alder Lake" client and "Sapphire Rapids" server CPU microarchitectures at the Hot Chips 33 conclave, this August. In fact, Intel's presentation leads the CPU sessions on the opening day of August 23. "Alder Lake" will be the session opener, followed by AMD's presentation of the already-launched "Zen 3," and IBM's 5 GHz Z processor powering its next-gen mainframes. A talk on Xeon "Sapphire Rapids" follows this. Hot Chips is predominantly an engineering conclave, where highly technical sessions are presented by engineers from major semiconductor firms; and so the sessions on "Alder Lake" and "Sapphire Rapids" are expected to be very juicy.

"Alder Lake" is Intel's attempt at changing the PC ecosystem by introducing hybrid CPU cores, a concept introduced to the x86 machine architecture with "Lakefield." The processor will also support next-generation I/O, such as DDR5 memory. The "Sapphire Rapids" server CPU microarchitecture will see an increase in CPU core counts, next-gen I/O such as PCI-Express 5.0, CXL 1.1, DDR5 memory, and more.

Intel today announced the 11th generation Core "Tiger Lake-H" mobile processors for notebooks of conventional thickness, gaming notebooks, and mobile workstations. This is the first scale-up of the "Tiger Lake" microarchitecture, with the introduction of a brand new die that has up to 8 "Willow Cove" CPU cores. These processors typically come with TDP of 35-45 W, but the flagship part ships with TDP as high as 65 W. Unlike "Rocket Lake," this chip is built on Intel's latest 10 nm SuperFin silicon fabrication process. With it, Intel is announcing ten processor SKUs—five each for the consumer and commercial notebook market segments. These span across the Core i9, Core i7, and Core i5 brand extensions.

The 10 nm "Tiger Lake-H" silicon measures roughly 190 mm², and has several changes compared to the 4-core "Tiger Lake-U" silicon the company debuted the 11th Gen with. The biggest change is the CPU core count of 8. This lets it not only achieve parity with AMD in mobile CPU core counts, but also purportedly beat it on the back of a higher IPC. Each of these 8 "Willow Cove" cores has 1.25 MB of dedicated L2 cache, and share 24 MB of L3 cache. You get the same "Willow Cove" ISA as the "Tiger Lake-U," including AVX-512 and DLBoost. Next up, the chip features an integrated graphics based on the Gen12 Xe LP graphics architecture, only that the execution units have reduced to just 32 on this silicon, compared to 96 on the 4-core Tiger Lake-U. The new chip enjoys a bigger power budget to run the iGPU at higher clock speeds. There is also a 20-lane PCI-Express Gen 4.0 interface, and a dual-channel DDR4 memory controller.

Several benchmark numbers of the upcoming AMD Ryzen 7 5700G and Ryzen 5 5600G desktop processors were fished out by Thai PC enthusiast TUM_APISAK. The 5700G and 5600G are based on the 7 nm "Cezanne" silicon that combines up to 8 "Zen 3" CPU cores across a single CCX, sharing a single 16 MB L3 cache; along with an iGPU based on the "Vega" graphics architecture. Both chips were put through the CPU-Z Bench, where they posted spectacular results.

Both chips post higher single-thread score than the Core i9-10900K "Comet Lake," riding on the back of the high IPC of the "Zen 3" cores, and low latencies from the monolithic "Cezanne" silicon. In the multi-threaded test, the 8-core/16-thread 5700G scored above the Core i9-9900KS (5.00 GHz all-core). An HP OMEN 25L pre-built was put through Geekbench 5, where it was found performing within 90% of the Core i5-11600K. Userbenchmark remarks that the 5600X performs within the league of contemporaries, but falls behind on memory latency. Find the validation pages in the source links below.