In a video message posted on her Twitter timeline, AMD CEO Dr Lisa Su confirmed that the company's next-generation "Zen 3" microarchitecture is coming out "later this year." Speaking in context of 7/7 (a year since AMD debuted high-performance CPU- and GPU- architectures on the same day, leveraging 7 nm), and the Ryzen 3000XT series processor announcement, Dr Su stated "As you know with Ryzen, we're always on a journey, a journey to push the highest performance that we can for our users and our fans. So Zen 3 is exactly that. Zen 3 is looking great in the labs, we're on track to launch later this year, and I can't wait to tell you more about it." Watch the video in the source link below.

The earliest reports on AMD's next-generation "Cezanne" APU silicon pointed at the possibility of the chip combining "Zen 3" CPU cores with a next-generation iGPU solution based on RDNA2 ("Navi 2#"). AMD plans to launch "Cezanne" in 2021, which makes it the immediate successor to "Renoir." A report by Igor's Lab has fresh details on "Cezanne." Apparently the chip sticks with the "Vega" graphics architecture on its iGPU. This doesn't necessarily mean that it's the same exact iGPU as the 8 CU version on "Renoir."

On the other hand, the "Van Gogh" silicon slated for 2021 is expected to receive RDNA2 graphics. It's important to note here that "Van Gogh" and "Cezanne" sit in the same product stack, and "Van Gogh" does not succeed "Cezanne." Rather, it's the codename for an entry-level APU, succeeding "Dali" (Athlon 3000G), which also means the RDNA2-based iGPU will be a lot slimmer than the "Vega" based one on "Cezanne." It's only by 2022 that AMD will have a performance-segment APU with RDNA2-based iGPU, with "Rembrandt." Find our older article getting into AMD's roadmaps here.

AMD in an official briefing call with us confirmed that the company's "Zen 3" client processors are on-track for launch within 2020. This refutes rumors that "Zen 3" based Ryzen processors had been delayed to 2021 in favor of giving the upcoming Ryzen 3000XT reign over the rest of the year. The call was chaired by AMD's client-segment product managers who were speaking purely in context of their product segment, which is how we deduce that they were referring to "Vermeer" and not [just] "Milan." They were responding to speculation that "Zen 3" has been delayed to 2021, forcing AMD to refresh its existing IP.

In the call, AMD told us that the information about "Zen 3" launching in 2020 is not under embargo, and so here we are. An AMD spokesperson told us that "the rumor on Zen 3 delay is inaccurate." AMD recently also refuted rumors of "Zen 3" being based on 5 nm, by putting out microarchitecture roadmap slides on the occasion of a recent investor relations event, which reaffirmed "Zen 3" as a 7 nm-class microarchitecture.

AMD has a lot riding on RDNA2, its first graphics architecture that meets the DirectX 12 Ultimate logo requirements, introducing real-time ray-tracing to the lineup. RDNA2 is confirmed to be part of the SoC that powers next-gen consoles PlayStation 5 and Xbox Series X. The company is simultaneously readying its own Radeon RX discrete graphics cards based on the Navi 2# silicon, based on RDNA2, with a leading part unofficially called the "Big Navi" given its alleged lofty specs increase over the "Navi 10." Turns out, that this GPU, and not next-gen consoles, will debut RDNA2.

AMD is planning a big gamer-specific event in late-Q3/early-Q4, likely September, where it plans to announce its 4th generation Ryzen desktop processors based on the "Zen 3" microarchitecture, and Radeon RX graphics cards based on RDNA2, including the "Big Navi." Speaking at the Bank of America Securities Global Technology Conference, AMD CFO Devinder Kumar confirmed that "Big Navi" will be a halo product and not merely a lofty performance increase over the RX 5700 XT to make AMD competitive against GeForce "Ampere." He states "there's a lot of excitement for Navi 2, or what our fans have dubbed as the Big Navi," adding "Big Navi is a halo product." He goes on to state that "enthusiasts love to buy the best, and we are certainly working on giving them the best." AMD's product stack so far is application-specific, rather than competition-specific. The RX 5700 XT was designed for 1440p gaming, and ended up competitive to the RTX 2070. "Big Navi" could hence have a lofty design goal: 4K gaming with ray-tracing.

Earlier this week, we brought you a report about codenames of AMD processors that won't launch before 2022. It referenced "Raphael" being distant 5 nm "Zen 4" based successor to today's "Matisse." At the time, the codename for the 2021 release of AMD's mainstream desktop processor wasn't known. We're now getting a pointer as to what it is - "Warhol."

Named after American artist and filmmaker Andy Warhol, this processor combines CPU chiplets based on the "Zen 3" with a cIOD that retains PCI-Express gen 4.0, just like "Vermeer," but still qualifies as a new generation (and not a refresh). What's more, "Warhol" apparently sticks to a 7 nm-class silicon fabrication process. This means that "Warhol" could see AMD innovate on other fronts, such as leveraging an even more advanced version of TSMC's 7 nm node (such as N7+), to increase core counts over the chiplet that makes it to "Vermeer, "Genesis Peak," and "Milan."

MSI confirmed that AMD's "Zen 3" processor support will be added to the company's AMD 400-series chipset motherboards, including the non-MAX SKUs that only have 16 MB EEPROM chips. Marketing Director Eric van Beurden in an MSI Insider video presentation confirmed that with the non-MAX motherboards, "Zen 3" support will be added as AMD planned to go about doing so (i.e. add "Zen 3" support by cutting out support for older processors and slimming down the UEFI setup program down to the GSE Click BIOS program, which may not correspond with your motherboard's original feature-set). On the other hand, the MAX SKUs, with their 32 MB EEPROMs will receive "Zen 3" support painlessly, meaning that the board may retain support for some, if not all, older processor generations, and retain their original feature-rich UEFI setup programs.

Apparently, AMD will be taking a slightly confusing step with its new AGESA codes - at least for the B550 platform. A report via Hardwareluxx has AMD rebooting AGESA (the most basic firmware for your motherboard and chipset support that's a requirement for correct CPU and feature support) versions back to version 1.0.0.0, but with a catch. The new AGESA version that's supposed to allow for support for AMD's Zen 3 CPUs will be coded as ComboAM4 v2 1.0.0.0 - instead of the next version in the current AGESA nomenclature, 1.0.0.6. It is still unclear if this change only refers to AMD's B550 or if it will also move on to X570's next AGESA releases.

It's expected that new motherboards based on AMD's B550 chipset will start landing in June. For now, there's confirmation on at least two motherboards running with this V2 of AGESA: MSI's MAG B550 Tomahawk (ComboAM4 v2 1.0.0.0), and the Gigabyte B550 Aorus Master (ComboAM4v2 1.0.0.1). So if you're looking to use AMD's B550 motherboard (or even X570) with AMD's upcoming Zen 3 CPUs, make sure to read your motherboard manufacturers' release notes for each AGESA version, so that you install the correct one and avoid yourself a potential load of pain with a non-functioning AGESA for your shiny new Zen 3 CPU.

Several future AMD processor codenames across various computing segments surfaced courtesy of an Expreview leak that's largely aligned with information from Komachi Ensaka. It does not account for "Matisse Refresh" that's allegedly coming out in June-July as three gaming-focused Ryzen socket AM4 desktop processors; but roadmap from 2H-2020 going up to 2022 sees many codenames surface. To begin with, the second half of 2020 promises to be as action packed as last year's 7/7 mega launch. Over in the graphics business, the company is expected to debut its DirectX 12 Ultimate-compliant RDNA2 client graphics, and its first CDNA architecture-based compute accelerators. Much of the processor launch cycle is based around the new "Zen 3" microarchitecture.

The server platform debuting in the second half of 2020 is codenamed "Genesis SP3." This will be the final processor architecture for the SP3-class enterprise sockets, as it has DDR4 and PCI-Express gen 4.0 I/O. The EPYC server processor is codenamed "Milan," and combines "Zen 3" chiplets along with an sIOD. EPYC Embedded (FP6 package) processors are codenamed "Grey Hawk."

Rumors of AMD refreshing its 3rd generation Ryzen desktop processor family are growing louder. On Friday (22/05), reports of the "Matisse Refresh" processor family surfaced, with talk of "Ryzen 7 3850X" and "Ryzen 7 3750X" processors headed for a June 2020 announcement followed by July availability. Turns out AMD has a different naming scheme in mind, targeted at wooing gamers. The company is reportedly bringing its "XT" brand extension over from its Radeon graphics card family over to the Ryzen line.

There are three SKUs AMD is developing, the Ryzen 9 3900XT, the Ryzen 7 3800XT, and the Ryzen 5 3600 XT. All three are likely to retain core counts of the SKUs they are displacing from current price points - with the 3900XT likely being a 12-core/24-thread part; the 3800XT an 8-core/16-thread part, and the 3600XT a 6-core/12-thread part. AMD is likely to give the three a major clock speed increase to shore up gaming performance. It won't surprise us if AMD tinkers with boost algorithms, either. GIGABYTE has already referenced "Matisse Refresh" in its motherboard product roadmaps, which adds plenty of credibilty to this rumor. With "Zen 3" based 4th gen Ryzen processors unlikely to relieve the embattled 3900X, 3800X, and 3600X in the wake of Intel's 10th gen Core "Comet Lake" launch until Q4-2020, it makes sense for AMD to plan a product stack refresh to bolster its competitiveness. AMD is reportedly planning a June 16 product announcement, followed by July 7 availability.

The bulk of AMD's 4th generation Ryzen desktop processors will comprise of "Vermeer," a high core-count socket AM4 processor and successor to the current-generation "Matisse." These chips combine up to two "Zen 3" CCDs with a cIOD (client I/O controller die). While the maximum core count of each chiplet isn't known, they will implement the "Zen 3" microarchitecture, which reportedly does away with CCX to get all cores on the CCD to share a single large L3 cache, this is expected to bring about improved inter-core latencies. AMD's generational IPC uplifting efforts could also include improving bandwidth between the various on-die components (something we saw signs of in the "Zen 2" based "Renoir"). The company is also expected to leverage a newer 7 nm-class silicon fabrication node at TSMC (either N7P or N7+), to increase clock speeds - or so we thought.

An Igor's Lab report points to the possibility of AMD gunning for efficiency, by letting the IPC gains handle the bulk of Vermeer's competitiveness against Intel's offerings, not clock-speeds. The report decodes OPNs (ordering part numbers) of two upcoming Vermeer parts, one 8-core and the other 16-core. While the 8-core part has some generational clock speed increases (by around 200 MHz on the base clock), the 16-core part has lower max boost clock speeds than the 3950X. Then again, the OPNs reference A0 revision, which could mean that these are engineering samples that will help AMD's ecosystem partners to build their products around these processors (think motherboard- or memory vendors), and that the retail product could come with higher clock speeds after all. We'll find out in September, when AMD is expected to debut its 4th generation Ryzen desktop processor family, around the same time NVIDIA launches GeForce "Ampere."

In their briefing leading up to today's Ryzen 3 3100 and 3300X review embargo, AMD disclosed that its upcoming "Zen 3" 4th generation Ryzen desktop processors will only support AMD 500-series (or later) chipsets. The next-gen processors will not work with older 400-series or 300-series chipsets. This comes as a blow to those who bought premium X470 motherboards hoping for latest CPU compatibility running into 2020. At this time only B550 is available, but we expect more news on enthusiast chipsets as the Zen 3 launch date comes closer. AMD B550 is a fascinating new mid-range chipset by AMD. Launching today as a successor to the popular B450 chipset, B550 is a low-power silicon with roughly the same 5-7 W TDP as the older 400-series chipset. Although AMD won't confirm it, it's likely that the chipset is sourced from ASMedia. It brings a lot to the table that could draw buyers away from B450, but it also takes some away.

The AMD B550 currently only supports 3rd generation Ryzen "Matisse" processors. Ryzen 3000 "Picasso" APU are not supported. What's more, older Ryzen 2000 "Pinnacle Ridge," "Raven Ridge," and first gen Ryzen 1000 "Summit Ridge" aren't supported, either. The Athlon 200 and 3000 "Zen" based chips miss out, too. AMD argues that it ran into ROM size limitations when trying to cram AGESA microcode for all the older processors. We find that hard to believe because B450 motherboards with the latest ComboAM4 AGESA support 2nd gen and 3rd gen processors, including APUs and Athlon SKUs based on the two. On the bright side, AMD assured us (within its marketing slides for the B550), that the chipset will support upcoming processors based on the "Zen 3" microarchitecture. The company also came up with a new motherboard packaging label that clarifies that the processors won't work with the 3400G and 3200G.

AMD in its post Q1-2020 earnings release disclosures stated that the company is "on track" to launching its next-generation "Zen 3" CPU microarchitecture and RDNA2 graphics architecture in late-2020. The company did not reveal in what shape or form the two will debut. AMD is readying "Zen 3" based EPYC "Milan" enterprise processors, "Vermeer" Ryzen desktop processors, and "Cezanne" Ryzen mobile APUs based on "Zen 3," although there's no word on which product line the microarchitecture will debut with. "Zen 3" compute dies (CCDs) are expected to do away with the quad-core compute complex (CCX) arrangement of cores, and are expected to be built on a refined 7 nm-class silicon fabrication process, either TSMC N7P or N7+.

The only confirmed RDNA2 based products we have as of now are the semi-custom SoCs that drive the Sony PlayStation 5 and Microsoft Xbox Series X next-generation consoles, which are expected to debut by late-2020. The AMD tweet, however, specifies "GPUs" (possibly referring to discrete GPUs). Also, with AMD forking its graphics IP to RDNA (for graphics processors) and CDNA (for headless compute accelerators), we're fairly sure AMD is referring to a Radeon RX or Radeon Pro launch in the tweet. Microsoft's announcement of the DirectX 12 Ultimate logo is expected to expedite launch of Radeon RX discrete GPUs based on RDNA2, as the current RDNA architecture doesn't meet the logo requirements.

AMD's 7 nm "Renoir" silicon breathed life into the notebook processor market, by bringing 8-core/16-thread CPU performance into segments Intel reserved for 4-core/8-thread; and beat Intel in the iGPU performance front. 7 nm brought performance-Watt uplifts that spell serious competition for Intel across all notebook form factors, be it 15 W or 45 W. According to _rogame, who has a knack of getting far-out hardware rumors right, AMD has its successor on the drawing-board, and it's codenamed "Cézanne," after the French post-impressionist painter Paul Cézanne.

"Cézanne" could prove vital for AMD's foothold in the premium mobile computing segments as Intel is preparing to launch its 10 nm+ "Tiger Lake" processor soon, with advanced "Willow Cove" CPU cores, and Xe based integrated graphics. AMD plans to tap into its very latest IP. Although its core-count is not known, "Cézanne" will feature CPU cores based on the latest "Zen 3" microarchitecture. The iGPU will receive its biggest performance uplift in 3 generations, with an iGPU based on the cutting-edge RDNA2 graphics architecture that meets DirectX 12 Ultimate logo requirements.

AMD's upcoming Ryzen 4000 series "Vermeer" lineup of CPUs based on the new Zen 3 core is slated to launch sometime in late 2020, and we have information about the chipset support of 4th generation of Ryzen CPUs. The laptop manufacturer XMG, known for its crazy Apex 15 laptop with 16 core AMD Ryzen 3950X CPU inside, has posted a Reddit thread about its new laptop. In the thread, XMG has listed specifications of the laptop, and in one point it mentions support for Ryzen 4000 series of CPUs. XMG has written that the B450 motherboards will be supporting the next generation CPUs simply by microcode updates AMD will push to OEMs. XMG uses the B450 chipset in its laptops, so they are presumably going to offer some configurations with Ryzen 4000 CPUs in the future. This information is good news for everybody who has a motherboard with a B450 chipset as they can get a bit more mileage out of it.

AMD's 4th generation Ryzen desktop processors are expected to launch around September 2020, sources in the motherboard industry tell DigiTimes. Codenamed "Vermeer," successor to "Matisse," these processors will be socket AM4 multi-chip modules of up to two CPU complex dies based on the "Zen 3" microarchitecture, combined with an I/O controller die. The "Zen 3" chiplets are expected to be fabricated on a newer 7 nm-class process by TSMC, either N7P or N7+. The biggest design change with "Zen 3" is the doing away of CCX arrangement of CPU cores, with each chiplet holding a common block of cores sharing a last-level cache. This, along with clock speed headroom gains from the new node are expected to yield generational price-performance increases.

The "Zen 2" based 8-core "Renoir" die is also expected to make its socket AM4 debut within 2020, succeeding the "Picasso" based quad-core Ryzen 3000-series APUs. This is a particularly important product for AMD, as it is expected to compete with Intel's 10th generation Core i5 6-core/12-thread processors in terms of pricing, while offering more cores (8-core/16-thread) and a faster iGPU. The 4th gen Ryzen socket AM4 processor lineup will launch alongside AMD's 600-series motherboard chipset, with forwards- and backwards-compatibility (i.e., "Vermeer" and "Renoir" working with older chipsets, and older AM4 processors working on 600-series chipset motherboards). AMD was originally expected to unveil these processors at the 2020 Computex trade-show in June, but Computex itself is rescheduled to late-September.

AMD's Zen 3 architecture will power the next generation Ryzen 4000 desktop chips and the 3rd Gen EPYC lineup which are both expected to launch later this year. Adored TV has received some leaked information detailing the technical specifications of the Zen 3 architecture. The majority of the leaked information confirmed existing rumors such as the 8 core CCX, higher clocks and lower power draw.

However the leak suggests IPC improvements will be less than the expected 20% hinted at by AMD and may end up being closer to 10 - 15%. The leak also claims that L3 cache will remain at 32 MB however it will no longer be split due to the single CCX. While this may be disappointing for some, remember to take the claims with a grain of salt as with any rumor.

AMD at its Financial Analyst Day 2020 presentation made a major clarification about its silicon fabrication process. It was previously believed that the company's upcoming "Zen 3" CPU microarchitecture and RDNA2 graphics architectures were based on TSMC's N7+ (7 nm EUV) silicon fabrication process because AMD would mark the two as "7 nm+" in its marketing slides. Throughout its Financial Analyst Day presentation, however, AMD avoided using that marker, and resorted to an amorphous "7 nm" marker, prompting one of the financial analysts to seek a clarification. At the time, AMD responded that they were aligning their marketing with that of TSMC, and hence chose to use "7 nm" in its new slides.

It turns out that the next step to TSMC N7, the company's current-generation 7 nm DUV silicon fabrication node, isn't N7+ (7 nm EUV), but rather it has a nodelet along the way, which the foundry refers to as N7P. This is a generational refinement of N7, but does not use EUV lithography, which means it may not offer the 15-20 percent gains in transistor densities offered by N7+ over N7. AMD clarified that "7 nm+" in its past presentations did not intend to signify N7+, and that the "+" merely denoted an improvement over N7. At the same time, it won't specify whether "Zen 3" and RDNA2 are based on N7P or N7+, so the company doesn't rule out N7+, either. We'll probably learn more as we near the late-2020 launch of "Zen 3" as EPYC "Milan."

AMD Financial Analyst Day presents an opportunity for AMD to talk straight with the finance industry about the company's current financial health, and a taste of what's to come. Guidance and product teasers made during this time are usually very accurate due to the nature of the audience. In this live blog, we will post information from the Financial Analyst Day 2020 as it unfolds.20:59 UTC: The event has started as of 1 PM PST. CEO Dr Lisa Su takes stage.

Intel's policy on CPU pricing has been a strong, definite one for years: no price reductions. Faced with less than admirable competition from a struggling AMD back in its Phenom and especially Bulldozer days, Intel enforced a heavy hand on the market and on CPU pricing. However, a much revitalized AMD and difficulties in the transition to the 10 nm process have left Intel with no other recourse than to cut pricing on its CPUs in order to remain competitive. No uptake of new I/O technologies such as PCIe 4.0 has also taken its toll on Intel's position in the server and HEDT market, which has led to recent price-cuts and tightening of Intel's Xeon line of CPUs - as well as price-cuts in the order of 50% in their Cascade Lake-X processors compared to the previous generation.

DigiTimes, citing industry PC makers, says that Intel is gearing up to keep fighting in the only front it actually can, besides puny core count increases on their heavily-iterated Skylake architecture - pricing. This move comes in a bid to keep its market dominance, which Intel themselves have said - after Zen 2, that is - isn't a priority for the consumer market. You can rest assured that Intel is very, very likely already practicing hefty price reductions for tray-quantity purchases for partners. However, it seems that the company might bring some price cuts on to its upcoming Comet Lake CPUs. The company has always been loathe to reduce pricing on existing inventory, rather choosing to reduce the price on new launches (see the Cascade Lake-X example above), which, arguably, saves Intel's face on claims of only being able to compete on pricing - which lurks dangerously close to Intel being painted as the budget, price-cut alternative to AMD.

AMD in the second half of 2020 could outpace Apple as the biggest foundry customer of TSMC for its 7 nm silicon fabrication nodes (DUV and EUV combined). There are two key factors contributing to this: AMD significantly increasing its orders for the year; and Apple transitioning to TSMC's 5 nm node for its A14 SoC, freeing up some 7 nm allocation, which AMD grabbed. AMD is currently tapping into 7 nm DUV for its "Zen 2" chiplet, "Navi 10," and "Navi 14" GPU dies. The company could continue to order 7 nm DUV until these products reach EOL; while also introducing the new "Renoir" APU die on the process. The foundry's new 7 nm+ (EUV) node will be utilized for "Zen 3" chiplets and "Navi 2#" GPU dies in 2020.

Currently, the top-5 customers for TSMC 7 nm are Apple, HiSilicon, Qualcomm, AMD, and MediaTek. Barring AMD, the others in the top-5 build mobile SoCs or 4G/5G modem chips on the node. AMD is expected to top the list as it scales up orders with TSMC. In the first half of 2020, TSMC's monthly output for 7 nm is expected to grow to 110,000 wafers per month (wpm). Apple's migration to 5 nm in 2H-2020, coupled with capacity-addition could take TSMC's 7 nm output to 140,000 wpm. AMD has reportedly booked the entire capacity-addition for 30,000 wpm, taking its allocation up to 21% in 2H-2020. Qualcomm is switching to Samsung for its next-generation SoCs and modems designed for 7 nm EUV. NVIDIA, too, is expected to built its next-gen 7 nm EUV GPUs on Samsung instead of TSMC. These moves by big players could free up significant foundry allocation at TSMC for AMD's volumes to grow in 2020.

A prominent Taiwanese newspaper reported that AMD will formally unveil its next-generation "Zen 3" CPU microarchitecture at the 2020 International CES. Company CEO Dr Lisa Su will head an address revealing three key client-segment products under the new 4th generation Ryzen processor family, and the company's 3rd generation EPYC enterprise processor family based on the "Milan" MCM that succeeds "Rome." AMD is keen on developing an HEDT version of "Milan" for the 4th generation Ryzen Threadripper family, codenamed "Genesis Peak."

The bulk of the client-segment will be addressed by two distinct developments, "Vermeer" and "Renoir." The "Vermeer" processor is a client-desktop MCM that succeeds "Matisse," and will implement "Zen 3" chiplets. "Renoir," on the other hand, is expected to be a monolithic APU that combines "Zen 2" CPU cores with an iGPU based on the "Vega" graphics architecture, with updated display- and multimedia-engines from "Navi." The common thread between "Milan," "Genesis Peak," and "Vermeer" is the "Zen 3" chiplet, which AMD will build on the new 7 nm EUV silicon fabrication process at TSMC. AMD stated that "Zen 3" will have IPC increases in line with a new microarchitecture.

AMD's upcoming Ryzen 4000 series processors will be based on the company's Zen 3 design, which will feature a deeply revised architecture aiming to offer increased performance (surprising no-one). AMD themselves have already said that Zen 3 will offer performance increases in line with the release of new architectures - and we all remember the around 15% increase achieved with the release of Zen 2 Ryzen 3000 series, which surprised even AMD on its performance capabilities. Several sources around the web are quoting an around 17% increase in performance, taking into account increased operating frequencies of Zen 3 (100 to 200 MHz at least for the enterprise solutions, which could pave the way for even higher increases in consumer-geared products) and increased IPC of its core design. The utilization of EUV in the 7 nm process shouldn't have much to do with the increased frequencies of the CPUs, and will mostly be used to reduce the number of masks that are required for production of AMD's Zen 3 CPUs (which in turn will lead to increased yields).

Sources are claiming an increase of up to 50% in Zen 3's Floating Point Units (FPU) compared to Zen 2, while integer operations should make do with a 10-12% increase. Cores should remain stable across the board - and with that increase in performance, I'd say an upper limit of 16 physical and 32 logic cores in a consumer-geared CPU is more than enough. Increased IPCs and frequencies will definitely make AMD an even better proposition for all markets - gaming in particular, where Intel still has a (slightly virtual) hold in consumer's minds.

Hardware-accelerated ray tracing and variable-rate shading will be the design focal points for AMD's next-generation RDNA2 graphics architecture. Microsoft's reveal of its Xbox Series X console attributed both features to AMD's "next generation RDNA" architecture (which logically happens to be RDNA2). The Xbox Series X uses a semi-custom SoC that features CPU cores based on the "Zen 2" microarchitecture and a GPU based on RDNA2. It's highly likely that the SoC could be fabricated on TSMC's 7 nm EUV node, as the RDNA2 graphics architecture is optimized for that. This would mean an optical shrink of "Zen 2" to 7 nm EUV. Besides the SoC that powers Xbox Series X, AMD is expected to leverage 7 nm EUV for its RDNA2 discrete GPUs and CPU chiplets based on its "Zen 3" microarchitecture in 2020.

Variable-rate shading (VRS) is an API-level feature that lets GPUs conserve resources by shading certain areas of a scene at a lower rate than the other, without perceptible difference to the viewer. Microsoft developed two tiers of VRS for its DirectX 12 API, tier-1 is currently supported by NVIDIA "Turing" and Intel Gen11 architectures, while tier-2 is supported by "Turing." The current RDNA architecture doesn't support either tiers. Hardware-accelerated ray-tracing is the cornerstone of NVIDIA's "Turing" RTX 20-series graphics cards, and AMD is catching up to it. Microsoft already standardized it on the software-side with the DXR (DirectX Raytracing) API. A combination of VRS and dynamic render-resolution will be crucial for next-gen consoles to achieve playability at 4K, and to even boast of being 8K-capable.

AMD's "Zen 4" CPU microarchitecture is on track for a 2021 launch as its principal foundry partner, TSMC, is optimistic about early yields of its 5 nm silicon fabrication node. TSMC supports the 5 nm product roadmaps of not just AMD, but also Apple and HiSilicon. "Zen 4" is particularly important for AMD, as it will release its next enterprise platform, codenamed "Genoa," along with the new SP5 socket. The new socket will present AMD with the opportunity to significantly change the processor's I/O, such as support for a new memory standard, a new PCIe generation, more memory channels, more PCIe lanes, etc. As early as 2019, the foundry is seeing yields of over 50 percent for the 5 nm node (possibly risk production designed to test the node), which is very encouraging for its customers.

AMD's roadmap for 2020 sees the introduction of "Zen 3" on the 7 nm EUV process (dubbed 7 nm+). AMD recently commented that the performance uplift of "Zen 3" versus "Zen 2" will be "right in line with what you would expect from an entirely new architecture." The 7 nm EUV node provides a significant 20 percent increase in transistor-density compared to the current 7 nm DUV node "Zen 2" chiplets and the company's "Navi" family of GPUs are built on. "Zen 3" could see the company do away with the CCX (quad-core CPU complex), and make chiplets monolithic blocks of CPU cores without sub-divisions. For the client-segment, 5 is a recurring number in 2021. It will see the introduction of the 5th generation Ryzen processors (5000-series), built on the 5 nm process, supporting DDR5 memory, PCI-Express gen 5, and the new AM5 client-segment CPU socket.

At its recent SC19 talk, AMD touched upon its upcoming "Zen 3" CPU microarchitecture. Designed for the 7 nm EUV silicon fabrication process that significantly increases transistor densities, "Zen 3" could post performance gains "right in line with what you would expect from an entirely new architecture," states AMD, referring to the roughly 15 percent IPC gains that were expected of "Zen 2" prior to its launch. "Zen 2" IPC ended up slightly over 15 percent higher than that of the original "Zen" microarchitecture. AMD's SC19 comments need not be a guidance on the IPC itself, but rather performance gains of end-products versus their predecessors.

The 7 nm EUV process, with its 20 percent transistor-density increase could give AMD designers significant headroom to increase clock speeds to meet the company's generational performance improvement targets. Another direction in which "Zen 3" could go is utilizing the additional transistor density to bolster its core components to support demanding instruction-sets such as AVX-512. The company's microarchitecture is also missing something analogous to Intel's DLBoost, an instruction-set that leverages fixed-function hardware to accelerate AI-DNN building and training. Even VIA announced an x86 microarchitecture with AI hardware and AVX-512 support. In either case, the design of "Zen 3" is complete. We'll have to wait until 2020 to find out how fast "Zen 3" is, and the route taken to get there.