Thursday, September 24th 2020
TSMC Begins Construction of 2 nm Manufacturing Facility
TSMC, the leading semiconductor foundry in the world, has reportedly begun construction of its 2 nm manufacturing facility. According to a DigiTimes report, translated by @chiakokhua on Twitter, besides the construction of 2 nm R&D center, TSMC has also started the construction of the manufacturing facility for that node, so it will be ready in time. Please do note that the node name doesn't represent the size of the transistor, so it will not actually be 2 nm wide. The new facilities will be located near TSMC's headquarters in Hsinchu Science Park, Taiwan. The report also confirms the first details about the node, specifically that it will use Gate-All-Around (GAA) technology. And there is also another interesting piece of information regarding even smaller node, the planning for 1 nm node has begun according to the source.
Besides advanced nodes, TSMC also laid out clear plans to accelerate the push of advanced packaging technology. That includes SoIC, InFO, CoWoS, and WoW. All of these technologies are classified as "3D Fabric" by the company, even though some are 2.5D. These technologies will be mass-produced at "ZhuNan" and "NanKe" facilities starting in the second half of 2021, and are expected to significantly contribute to the company's profits. It is also reported that the competing foundry, Samsung, has a 3D packaging technology of its own called X-cube, however, it is attracting customers a lot slower than TSMC due to the high costs of the new technology.
Sources:
@chiakokhua (Twitter), DigiTimes.tw
Besides advanced nodes, TSMC also laid out clear plans to accelerate the push of advanced packaging technology. That includes SoIC, InFO, CoWoS, and WoW. All of these technologies are classified as "3D Fabric" by the company, even though some are 2.5D. These technologies will be mass-produced at "ZhuNan" and "NanKe" facilities starting in the second half of 2021, and are expected to significantly contribute to the company's profits. It is also reported that the competing foundry, Samsung, has a 3D packaging technology of its own called X-cube, however, it is attracting customers a lot slower than TSMC due to the high costs of the new technology.
17 Comments on TSMC Begins Construction of 2 nm Manufacturing Facility
Its quantum physics territory where stuff works slightly different. Note this is not related to Quantum Computing as that is using different principles and does use standard gates as in conventional cpu.
Effectively it means that its impossible to create cheaper/faster product since, your gates need double checking - if their behavior is desired or quantum interferenced.
But don't expect signficantly higher clocks or performance per Hz / gates because Dennard scaling, on the other hand, is almost dead.
2nm => 22-5 = 17nm transistors
Right?
Oh and Samsung's 5nm is only 127 MTr/mm2
Silicon this is a raw material as is for example the butter.
To cut down butter in small portions you need something smaller than an axe.
Carl Zeiss the optics manufacturer he has advance in the regard of making fine optics them able to focus laser beam (this does the cutting) and to focus the rays in to a smaller diameter.
It’s time that the optics industry this advances then we gets a new generation of Chips.
Such a knife it can cut silicon and also engrave silicon as required for the creation of electronic components, they are named as transistors.
Imagine transistors as a number of horses them pulling a wagon. ( many horses = faster speed = less strain to its horse)
Additionally the silicon canvas this is named as wafer.
In conclusion, the size of the electronic parts which are available to us, this is defined by the progress made in the industry of optics design.
You seem itching to upgrade you VGA by something that this is not here yet.
It is wiser of you to contact AMD by email for getting a hint of their upcoming road-map.
NVIDIA released all ready their fastest VGA RTX 3080/3090 which this is not further tweak-able by the users.
Any one reasonable thinking he will never tweak a racing car which this is factory optimized to win all known opponents at September 2020.
AMD this is well aware that at high speed racing cars, the slightest mistake will be drive the car out of the road.
They are the ones which will be forced to add power limit circuit too and follow of what product design tweaks NVIDIA did.
a) I care of the context when this is signed by non-anonymous people, such context has the name of white paper.
b) Power Usage this is of highest importance factor to me, entire Europe trying to educate their consumers to stop spending at power hungry devices.
I did my own research and made the discovery that GTS 1660 Super this is the latest ambassador of performance this bonded with wise use of power in watts.
I also started a topic that no one care to respond, I am thinking that terms as Low power Usage combined with the term Silent PC they are not popular in our days.
www.techpowerup.com/forums/threads/i-am-looking-feedback-for-asus-dual-gtx-1660-super-evo-oc-cooler-performance.268943/