The late 2024 news cycle suggested that Samsung's semiconductor business was going through tough times. Alleged yield problems—affecting the 3 nm Gate-All-Around (GAA) process—were highlighted last November. Fast-forward to January 2025; the South Korean megacorp has launched its cutting-edge Galaxy S25 smartphone series. The entire lineup of newly unveiled flagship smartphones contains Qualcomm's Snapdragon 8 Elite mobile chipsets; the Southern Californian chip designer is reportedly pulling in a tidy sum from this partnership. Fresh reports from South Korean news outlets indicate that Samsung System LSI employees have received an "encouraging" email from their boss, regarding current production predicaments.

Businesskorea and Sedaily reports include quotes extracted from the (apparently) leaked internal memo. LSI division president, Park Yong-in, reportedly stated: "we are currently in a situation where we have to develop two flagship products at the same time." Both articles allege that Samsung's semiconductor teams are expected to "cultivate roots and withstand storms." Industry watchdogs believe that the aforementioned "flagship products" are the Exynos 2500 mobile chipset, and Samsung Electronic's next-gen Galaxy S26 smartphone family. Earlier this month, we heard whispers about the much-delayed in-house chip design being readied (with a 2 nm process) for a possible late 2025 launch, inside unannounced Galaxy Z Flip 7 and Fold 7 devices. Park disclosed anticipated incoming obstacles in 2025: "last year's business division profit was higher than expected, but this was a temporary phenomenon...Looking at the entire business division, there will be monthly surpluses and deficits." Last month, inside sources proposed the notion that foundry investments were slashed in half.