As we've known for a few months now, Intel is looking at setting up shop, or should that be fab, somewhere in Europe. The company already has fabs in Ireland, but now it looks like its second destination will be Magdeburg in Germany, at least if a story by MDR in Germany is to be trusted. The news outlet claims that the official announcement will take place sometime next week. It's not clear what kind of fab it'll be at this point in time, but hopefully we'll get more details once Intel makes an official announcement.

Magdeburg was apparently not the only location scouted by Intel in Germany, as Dresden was also in the running, the home of the Fraunhofer Institute for Organic Electronics, Electron Beam and Plasma Technology among several other Fraunhofer Societies based in the city. Dresden also has twice the population of Magdeburg, which makes Intel's choice somewhat peculiar, as Magdeburg doesn't appear to have any particularly stand-out features that would make it the ideal choice of a semiconductor fab or even a packaging facility. It's possible that Intel chose the location based on the local supply chain, but that's just speculation at this point.

Much of the globalized world's logistics is still in disarray from the COVID-19 pandemic, and now, Russia has thrown its weight on the matter through its invasion of Ukraine. As the initial offensive played out in the early hours of February 24th, semiconductor industry analysts turned to the situation with a prying eye - how exactly could this deadlock, and the following political and economical sanctions towards Russia, impact the semiconductor industry? The consensus seems to be a favorable one: not that much.

"The semiconductor industry has a diverse set of suppliers of key materials and gases, so we do not believe there are immediate supply disruption risks related to Russia and Ukraine," said John Neuffer, chief executive and president of the Semiconductor Industry Association. That sentiment was echoed by Intel; a company representative told Bloomberg that the company does not anticipate "(...) any impact on our supply chain. Our strategy of having a diverse, global supply chain minimizes our risk of potential local interruptions."

It seems that someone at Intel forgot to press "post" on the company's promised day-0 driver update for one of this year's most anticipated games - Elden Ring. The company previously announced a partnership with Elden Ring developer FromSoftware in the development of an updated driver that wold give Intel-based Elden Ring players streamlined performance and a (hopefully) bug-free experience when it comes to graphics rendering. But Elden Ring's launch day of February 24th has come and gone - and Intel is mum on where exactly its updated driver lies. For now, the latest available Intel graphics driver stands at version 101.1121 - released in November last year.

It may be the case that the driver development hit an unexpected snag, or perhaps Intel has simply opted to delay the driver's launch until there are actually some discrete-level graphics cards available for purchase - the company's initial Arc Alchemist lineup is expected to be announced and launched later this month. That would make sense - especially considering how a driver update this close to release might include some interesting data on the upcoming graphics cards that could be pursued by data miners. Even so, it doesn't seem like a good PR move for Intel to have loudly promised an updated driver and then fail to release it - especially as Intel's uphill battle in the discrete GPU market is just beginning. Perhaps the driver developers are having too much fun with the critically and consumer-acclaimed latest installment from FromSoftware?

Since OpenVINO launched in 2018, Intel has enabled hundreds of thousands of developers to dramatically accelerate AI inferencing performance, starting at the edge and extending to the enterprise and the client. Today, ahead of MWC Barcelona 2022, the company launched a new version of the Intel Distribution of OpenVINO Toolkit. New features are built upon three-and-a-half years of developer feedback and include a greater selection of deep learning models, more device portability choices and higher inferencing performance with fewer code changes.

"The latest release of OpenVINO 2022.1 builds on more than three years of learnings from hundreds of thousands of developers to simplify and automate optimizations. The latest upgrade adds hardware auto-discovery and automatic optimization, so software developers can achieve optimal performance on every platform. This software plus Intel silicon enables a significant AI ROI advantage and is deployed easily into the Intel-based solutions in your network," said Adam Burns, vice president, OpenVINO Developer Tools in the Network and Edge Group.

Intel is designing a "Halo" SKU of a future generation of mobile processors with a goal to match Apple's in-house silicon of the time. Slated for tape-out some time in 2023, with mass-production expected in 2024, the 15th Generation Core "Arrow Lake-P Halo" processor is being designed specifically to compete with Apple's "premium 14-inch laptop" (presumably the MacBook Pro) that the company could have around 2024, based on an in-house Apple silicon. This is to essentially tell its notebook partners that they will have an SoC capable of making their devices in the class truly competitive. Apple relies on a highly scaled out Arm-based SoC based on in-house IP blocks, with a software that's closely optimized for it. Intel's effort appears to chase down its performance and efficiency.

The Core "Arrow Lake" microarchitecture succeeds the 14th Gen "Meteor Lake." It is a multi-chip module (MCM) of three distinct dies built on different fabrication nodes, in line with the company's IDM 2.0 strategy. These nodes are Intel 4 (comparable to TSMC N7 or N6), Intel 20A (comparable to TSMC N5), and an "external" 3 nm-class node that's just the TSMC N3. The compute tile, or the die which houses the CPU cores, combines a hybrid CPU setup of 6 P-cores, and 8 E-cores. The performance cores are likely successors of the "Redwood Cove" P-cores powering the "Meteor Lake" compute tiles. Intel appears to be using one kind of E-cores across two generations (eg: Gracemont across Alder Lake and Raptor Lake). If this is any indication, Arrow Lake could continue to use "Crestmont" E-cores. Things get interesting with the Graphics tile.

OFF Global today announces a licensing agreement with Nokia for the design and sale of laptops. The new French technology company holds an international exclusive licence to create Nokia-branded laptops.

OFF Global also unveils the Nokia PureBook Pro, the first laptop in the Nokia PureBook range, designed and developed under the Nokia brand. With a Full HD screen, a 12th generation Intel i3 processor and a sleek design, the Nokia PureBook Pro is a computer suited to both personal and professional users looking for an easy-to-use device, with no compromise on performance or price.

As a true hybrid device, the Nokia PureBook Pro is a versatile laptop that seamlessly blends work, life and entertainment needs, with a simple and fluid user experience, available from 699 €.

Acer today updated its popular Swift line of notebooks with new models of the Swift 5 and Swift 3. To push the limits of what's possible with a thin and light device, these new laptops come with 12th Gen Intel Core processors, gorgeous touchscreen displays, and all-day battery life: everything a mobile professional needs.

"Designed for executives and mobile professionals, the latest Acer Swift 5 offers a perfect balance of performance and portability," said James Lin, General Manager, Notebooks, IT Products Business, Acer. "The Intel Evo-verified laptop not only provides a great experience, it is housed in a stylish thin-and-light CNC-machined unibody chassis featuring a gorgeous touchscreen display." "Intel and Acer have a long history of co-engineering to deliver amazing laptops," said Josh Newman, VP and GM of Client Computing Group Mobile Innovation. "Now, more than ever, our engineers are focused on the experiences that matter most with the Intel Evo platform, powered by 12th Gen Intel Core processors."

Today, Intel expands the 12th Gen Intel Core mobile processor lineup with the official launch of 12th Gen Intel Core P-series and U-series processors. Engineered for blazing performance and superior productivity, these 20 new mobile processors will power the next generation of thin-and-light laptops. The first devices will be available in March 2022, with more than 250 coming this year from Acer, Asus, Dell, Fujitsu, HP, Lenovo, LG, MSI, NEC, Samsung and others.

"Following our launch of the fastest mobile processor for gaming, we're now expanding our 12th Gen Intel Core processor family to deliver a massive leap forward in performance for thin-and-light laptops. From the ultra-thin form factors to enthusiast-grade performance in a sleek design, we're providing consumers and businesses with leadership performance and cutting-edge technologies."

Since the launch of AMD's Ryzen processors, the CPU market share has been reshaped in AMD's favor. Intel's offerings were matched by team red, and AMD quickly broke into the consumer market. However, according to the latest round of reports, it seems like that is no longer the case. As per the Japanese DIY market analysis from BCNR, sales of Intel processors started rising in mid-2021, and the company is managing to grab some market share from AMD. After nearly two years of dominance in the Japanese market, AMD is now behind Intel in sales, and team blue is getting back to its older setting.

Another source that is generally a pretty good indicator of the market share of Intel and AMD processor is PassMark. As users submit their benchmark runs, the PassMark software developer has updated the CPU market share statistics chart, mainly showing the desktop segment. It also concludes the same thing as BCRN: Intel is again gaining share in the CPU market. As it always goes hand-in-hand, AMD is losing the CPU marker share naturally. This is due to many reasons, and it seems like Intel's marketing and supply tactics are paying off. Intel now sits at 60% share, while AMD is set at 40%.

SiSoftware put out the mother lode of information on Intel's upcoming Arc "Alchemist" gaming graphics card series, along with OpenCL compute performance of the entry-level Arc A380. The Arc series model numbering is "A" (Alchemist) followed by a number series. The A300 series makes up the entry-mainstream; the A500 series makes up the mid-performance segment; and the A700 series leads the pack with high-end SKUs. The "Alchemist" GPUs are built on the 7 nm silicon fabrication node at TSMC, the N7.

The A300 series is based on the smaller "Alchemist" series dies, with 128 EUs (execution units), which work out to 1,024 programmable shaders. The A500 series and A700 series appear to be carved out from the larger silicon. The A500 series has roughly 384 EU or 3,072 shaders. The top-dog A700 series has all 512 EU or 4,096 shaders enabled. Intel is tapping into industry-standard GDDR6 for dedicated graphics memory. The A300-series SKUs typically have 6 GB of 14 Gbps-rated memory across a 96-bit wide memory bus, for 192 GB/s of bandwidth. The A500 series parts have 12 GB of 16 Gbps-rated memory across a 192-bit bus, for 384 GB/s of bandwidth. The top A700 series maxes out the 256-bit memory bus with 16 GB of memory at 16 Gbps data-rate, for 512 GB/s bandwidth.

During the International Solid-State Circuits Conference (ISSCC) 2022, Intel gave us a more significant look at its upcoming Ponte Vecchio HPC accelerator and how it operates. So far, Intel convinced us that the company created Ponte Vecchio out of 47 tiles glued together in one package. However, the ISSCC presentation shows that the accelerator is structured rather interestingly. There are 63 tiles in total, where 16 are reserved for compute, eight are used for RAMBO cache, two are Foveros base tiles, two represent Xe-Link tiles, eight are HBM2E tiles, and EMIB connection takes up 11 tiles. This totals for about 47 tiles. However, an additional 16 thermal tiles used in Ponte Vecchio regulate the massive TDP output of this accelerator.

What is interesting is that Intel gave away details of the RAMBO cache. This novel SRAM technology uses four banks of 3.75 MB groups total of 15 MB per tile. They are connected to the fabric at 1.3 TB/s connection per chip. In contrast, compute tiles are connected at 2.6 TB/s speeds to the chip fabric. With eight RAMBO cache tiles, we get an additional 120 MB SRAM present. The base tile is a 646 mm² die manufactured in Intel 7 semiconductor process and contains 17 layers. It includes a memory controller, the Fully Integrated Voltage Regulators (FIVR), power management, 16-lane PCIe 5.0 connection, and CXL interface. The entire area of Ponte Vecchio is rather impressive, as 47 active tiles take up 2,330 mm², whereas when we include thermal dies, the total area jumps to 3,100 mm². And, of course, the entire package is much larger at 4,844 mm², connected to the system with 4,468 pins.

China is reacting to new outbreaks of the Omicron variant of the Coronavirus with partial lockdowns. This could further delay the availability of laptops with 12th Gen Intel Core processors and NVIDIA's Ti graphics cards, which debuted at the beginning of the year. The first factories have already been closed in Suzhou in the east of the country. Supply chain and logistics bottlenecks, a shortage of certain chip types and price increases are already on the horizon.

Back in December, we reported that Tower Semiconductor was one of several semiconductor manufacturers that was considering building a fab in India, largely due to government subsidies. Since then, Intel has stepped in and bought Tower Semiconductor and has taken over the negotiations with the Indian government. What has also come to light is that Tower Semiconductor has been in discussions with the Indian government for over a decade, but apparently the two parties have been unable to come up with a suitable agreement. Tower Semiconductor was apparently ready to cancel any plans on building in India as late as September 2021, but the more recent government initiative renewed their interest.

As to exactly what kind of fab Intel would build, is unclear at this point in time, but it might still be a MEMS fab or it could simply be a testing and packaging plant. Regardless of what kind of facility it'll be, it's interesting that Intel decided to keep the ongoing plans from Tower Semiconductor going. Tower Semiconductor mostly manufactured for fabless companies and were producing some two million wafers a year. It's likely that Intel will carry on producing for the same companies at the same terms for now, although as Tower Semiconductor gets integrated closer with the Intel foundry, things could change.

Intel plans to ship no less than 4 million discrete GPUs in 2022, the company stated in its Investor Meeting 2022 presentation. The Accelerated Computing Systems and Graphics Group (AXG), headed by Raja Koduri, announced this bold target. The company announced a Q1-2022 debut of its ambitious new Arc "Alchemist" discrete GPU for notebooks (before April). This is to be followed by a desktop debut in Q2-2022 (before July), before a professional-visualization (workstation-class) debut in Q3 (before October). All put together, the company plans to ship over 4 million discrete GPUs over the year.

Intel announced over 50 design wins for OEMs and "AICs." This is big, as it denotes that Arc "Alchemist" graphics cards won't just be sold in the OEM/SI channel, but also the DIY retail channel. Among the familiar brands in the DIY space from the Intel slide are ASUS, MSI, and GIGABYTE. The company is working with over 100 software-ecosystem partners or ISVs, to optimize their current and upcoming applications and games, for the Xe HPG graphics architecture. This includes support for the XeSS performance enhancement (analogous to AMD FSR and NVIDIA DLSS), and DeepLink, a graphics processing resource virtualization tech. Intel plans to launch a new generation of Arc almost every year for the next 3 years, starting with "Alchemist" in 2022, "Battlemage" somewhere around 2023-2024, and "Celestial" after 2024.

Intel is allegedly advancing the launch of its 13th Gen Core "Raptor Lake-S" desktop processors to some time in Q3-2022, according to a report by Moore's Law is Dead. It was earlier believed to be a Q4 launch, much like "Alder Lake" was, in 2021. The report predicts the debut of "Raptor Lake" in the desktop segment in Q3-2022 (between July and September), with certain mobile SKUs expected toward the end of the year, in Q4. The Core "Raptor Lake-S" processor is built in the existing Socket LGA1700 package, and is being designed for compatibility with existing Intel 600-series chipset motherboards with a firmware update.

The "Raptor Lake-S" silicon is built on the existing Intel 7 (10 nm Enhanced SuperFin) node, and physically features eight "Raptor Cove" P-cores, along with sixteen "Gracemont" E-cores that are spread across four clusters. The chip has additional cache memory, too. Moore's Law is Dead predicts that the "Raptor Cove" P-core could introduce an IPC uplift in the region of 8 to 15 percent over the "Golden Cove" core, while the chip's overall multi-threaded performance could be anywhere between 30 to 40 percent over "Alder Lake-S," on account of not just increased IPC of the P-cores, but also eight additional E-cores.

Intel has recently unveiled its plans for their 3rd generation Celestial Arc graphics cards to compete with NVIDIA and AMD in the "Ultra Enthusiast" GPU market. The Arc Celestial GPU series is now scheduled to launch in 2024 with the architecture currently under active development. These cards will target future flagship cards from NVIDIA however in 2023/2024 we should see the launch of 2nd generation Arc Battlemage products that may narrow the gap. The timeline Intel shared indicates a launch date of 2024+ for Celestial GPUs so the launch date may slip into 2025. This was previously the year which Intel was rumored to launch 4th generation Arc Druid graphics cards so it remains to be seen if this official timeline will hold.

Intel Xeon Scalable "Sapphire Rapids" is an upcoming enterprise processor with a CPU core count of up to 60. This core-count is achieved using four dies inter-connected using EMIB. Locuza, who leads social media with logic die annotation, posted one for "Sapphire Rapids," based on a high-resolution die-shot revealed by Intel in its ISSCC 2022 presentation.

Each of the four dies in "Sapphire Rapids" is a fully-fledged multi-core processor in its own right, complete with CPU cores, integrated northbridge, memory and PCIe interfaces, and other platform I/O. What brings four of these together is the use of five EMIB bridges per die. This allows CPU cores of a die to transparantly access the I/O and memory controlled any of the other dies transparently. Logically, "Sapphire Rapids" isn't unlike AMD "Naples," which uses IFOP (Infinity Fabric over package) to inter-connect four 8-core "Zeppelin" dies, but the effort here appears to be to minimize the latency arising from an on-package interconnect, toward a high-bandwidth, low-latency one that uses silicon bridges with high-density microscopic wiring between them (akin to an interposer).

Intel Corporation today announced that Christoph Schell has been appointed executive vice president and chief commercial officer to lead the Sales, Marketing and Communications Group (SMG), starting March 14. Schell will succeed Michelle Johnston Holthaus, who will take on a new role as general manager of Intel's Client Computing Group (CCG).

"Christoph has an exceptional track record of driving innovative and disruptive go-to-market strategies around the globe. He brings expertise in understanding business segments, verticals and the solutions and services customers want," said Pat Gelsinger, Intel CEO. "We are harnessing our core strengths as an advantage to grow in our traditional markets and accelerate our entry into new ones. I'm confident Christoph is the right leader to take on this critical role and guide the talented SMG organization to achieve our growing ambitions."

Schell joins Intel from HP Inc., where he was most recently chief commercial officer. With his go-to-market team, he led customer and partner success, category management and customer support globally. During his 25 years with the company, Schell held various senior management roles across the globe, including president of 3D Printing & Digital Manufacturing. Prior to rejoining HP in 2014, Schell served as executive vice president of Growth Markets for Philips, where he led the lighting business across Asia Pacific, Japan, Africa, Russia, India, Central Asia and the Middle East. He started his career in his family's distribution and industrial solutions company and worked in brand management at Procter & Gamble.

The NUC Extreme might not share much in terms of design with either the original NUC or its earlier Extreme siblings these days, as it's grown into a rather hefty SFF system. Now the 12th gen NUC Extreme has leaked and it comes with a few unexpected surprises, in both a good and a bad sense. Initially it looks like there will be two main barebones SKU's, the NUC12EDBi9 and the NUC12EDBi7, with a 65 W Core i9-12900 and a Core i7-12700 CPU respectively. In other words, it appears we're not looking at any dedicated CPU SKU's this time around.

The first thing that sticks out in the spec is the fact that Intel has gone for a pair of DDR4 SO-DIMM slots, rather than DDR5. In all fairness, this could be due to a lack of DDR5 SO-DIMMs in the market, but feels odd in a product with Extreme in the product name. Memory speeds of up to 3200 MHz are supported and up to 64 GB can be fitted. On the storage side, there's support for no less than three PCIe 4.0 M.2 NVMe drives using the 2280 form factor. Two of the slots can also accept 2242 drives and SATA drives. A full PCIe 5.0 x16 slot is also present for an optional graphics card, but more on that a little bit later.

Intel's upcoming "Meteor Lake" and "Arrow Lake" client mobile processors introduce an interesting twist to the chiplet concept. Earlier represented in vague-looking IP blocks, new artistic impressions of the chip put out by Intel shed light on a 3-die approach not unlike the Ryzen "Vermeer" MCM that has up to two CPU core dies (CCDs) talking to a cIOD (client IO die), which handles all the SoC connectivity; Intel's design has one major difference, and that's integrated graphics. Apparently, Intel's MCM uses a GPU die sitting next to the CPU core die, and the I/O (SoC) die. Intel likes to call its chiplets "tiles," and so we'll go with that.

The Graphics tile, CPU tile, and the SoC or I/O tile, are built on three different silicon fabrication process nodes based on the degree of need for the newer process node. The nodes used are Intel 4 (optically 7 nm EUV, but with characteristics of a 5 nm-class node); Intel 20A (characteristics of 2 nm), and external TSMC N3 (3 nm) node. At this point we don't know which tile gets what. From the looks of it, the CPU tile has a hybrid CPU core architecture made up of "Redwood Cove" P-cores, and "Crestmont" E-core clusters.

When Intel announced the company's first hybrid design, codenamed Alder Lake, we expected to see more of such design philosophies in future products. During Intel's 2022 investor meeting day, the company provided insights into future developments, and a successor to Alder Lake is no different. Codenamed "Raptor Lake," it features a novel Raptor Cove P-core design that is supposed to bring significant IPC uplift from the previous generation of processors. Using Intel 7 processor node, Raptor Lake brings a similar ecosystem of features to Alder Lake, however, with improved performance across the board.

Perhaps one of the most exciting things to note about Raptor Lake is the advancement in core count, specifically the increase in E-cores. Instead of eight P-cores and eight E-cores like Alder Lake, the Raptor Lake design will retain eight P-cores and double the E-core count to 16. It was a weird decision on Intel's end; however, it surely isn't anything terrible. The total number of cores now jumps to 24, and the total number of threads reaches 32. Additionally, Raptor Lake will bring some additional overclocking improvement features and retain socket compatibility with Alder Lake motherboards. That means that, at worst, you would need to perform a BIOS update to get your previous system ready for new hardware. We assume that Intel has been working with software vendors and its engineering team to optimize core utilization for this next-generation processor, even though they have more E-cores present. Below, we can see Intel's demonstration of Raptor Lake running Blender and Adobe Premiere and the CPU core utilization.

At Intel's 2022 investor meeting, the company has presented a technology roadmap update to give its clients an insight into what is to come. Today, team blue announced one of the first discrete data-centric graphics cards in the lineup, codenamed Arctic Sound-M GPU. Based on the DG2 Xe-HPG variation of Intel Xe GPUs, Arctic Sound-M is the company's first design to enter the data center space. The DG2 GPU features 512 Execution Units (EUs), which get passive cooling from the single-slot design of Arctic Sound's heatsink, envisioned for data center enclosures with external airflow.

One of the most significant selling points that Intel advertises is support for hardware-based AV1 encoding standard. This feature allows the card to achieve a 30% greater bandwidth, and it is the main differentiator between consumer-oriented Arc Alchemist GPUs and itself. The card is powered by PCIe power and an 8-pin EPS power connector. Arctic Sound-M is already sampling to select customers and it will become available in the middle of 2022.Below is Intel's teaser video.

The "tick tock" product development cycle, which enabled Intel to develop a new silicon fabrication node every alternating year, a new microarchitecture every alternating year, and interleaving the two in such a way that each new microarchitecture is built on two successive nodes, and each node is used for building two succeeding microarchitectures, is back. The company has, for the first time in over 6 years, mentioned the tick-tock development cadence in its Investor Day presentation.

When laying out its upcoming foundry nodes following the current Intel 7 (10 nm enhanced SuperFin), the company mentioned its successors, starting with Intel 4 (7 nm EUV-based), which offers electrical properties and transistor densities in the league of 5 nm-class nodes by TSMC. Intel 4 debuts with "Meteor Lake" mobile architecture slated for the first half of 2023, with mass-production of wafers commencing in 2H-2022. The Intel 3 node is targeted for a year later in late-2023, with the server processor that succeeds "Sapphire Rapids" being developed for this node. Following this, Intel, along with several other foundry companies, enter the tricky sub-2 nm class.

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Intel on Thursday (17/02/2022), hosted its 2022 Investor Meeting and outlined key elements of the company's strategy and path to long-term growth during an era of unprecedented demand for semiconductors. The event included a series of announcements at both a corporate and individual business unit level, including more details of the company's Smart Capital strategy, product roadmaps across its new reporting segments and key execution milestones.

"The continued proliferation of technology is driving sustained, long-term demand for semiconductors, creating a $1 trillion market opportunity by 2030," said Pat Gelsinger, Intel chief executive officer. "With that opportunity in mind, today we outlined our strategy and roadmap for accelerating to 10%-12% year-over-year revenue growth by 2026 by doubling down on innovation, driving even deeper collaboration with our customers and partners, and leveraging our core strengths to successfully grow traditional markets and disrupt new ones. Our goals are ambitious, but I'm confident we have the right strategy and right team to achieve them and to deliver long-term value for our shareholders."