Friday, December 11th 2020
Alleged Intel Sapphire Rapids Xeon Processor Image Leaks, Dual-Die Madness Showcased
Today, thanks to the ServeTheHome forum member "111alan", we have the first pictures of the alleged Intel Sapphire Rapids Xeon processor. Pictured is what appears to be a dual-die design similar to Cascade Lake-SP design with 56 cores and 112 threads that uses two dies. The Sapphire Rapids is a 10 nm SuperFin design that allegedly comes even in the dual-die configuration. To host this processor, the motherboard needs an LGA4677 socket with 4677 pins present. The new LGA socket, along with the new 10 nm Sapphire Rapids Xeon processors are set for delivery in 2021 when Intel is expected to launch its new processors and their respective platforms.
The processor pictured is clearly a dual-die design, meaning that Intel used some of its Multi-Chip Package (MCM) technology that uses EMIB to interconnect the silicon using an active interposer. As a reminder, the new 10 nm Sapphire Rapids platform is supposed to bring many new features like a DDR5 memory controller paired with Intel's Data Streaming Accelerator (DSA); a brand new PCIe 5.0 standard protocol with a 32 GT/s data transfer rate, and a CXL 1.1 support for next-generation accelerators. The exact configuration of this processor is unknown, however, it is an engineering sample with a clock frequency of a modest 2.0 GHz.
Source:
ServeTheHome Forums
The processor pictured is clearly a dual-die design, meaning that Intel used some of its Multi-Chip Package (MCM) technology that uses EMIB to interconnect the silicon using an active interposer. As a reminder, the new 10 nm Sapphire Rapids platform is supposed to bring many new features like a DDR5 memory controller paired with Intel's Data Streaming Accelerator (DSA); a brand new PCIe 5.0 standard protocol with a 32 GT/s data transfer rate, and a CXL 1.1 support for next-generation accelerators. The exact configuration of this processor is unknown, however, it is an engineering sample with a clock frequency of a modest 2.0 GHz.
83 Comments on Alleged Intel Sapphire Rapids Xeon Processor Image Leaks, Dual-Die Madness Showcased
www.techpowerup.com/235092/intel-says-amd-epyc-processors-glued-together-in-official-slide-deck
... which is a good thing right?!?!
/s
On the face of it whatever "interconnect" there's using is perhaps limiting them to just two dies/chiplets right now or maybe it's fundamentally different to IF in it's current form.
You might wanna add this ~
Also not ruling out four dies here, two under each half, it's Intel's 10nm remember and it's not great for big dies.
edit: toast press:p
This CPU looks a lot more "glued together" than anything from AMD. Here, even the socket is split into two.
Intel has spend so much time on nuturing Xeon platform, that's their core business, even if the performance wasn't the top, the overall feature that they are using and being utilized by their customer cannot be replaced by AMD
so far I haven't see any simillar technology as Optane on Data Center environment from AMD, while optane is kind of janky on Desktop, it being fully utilized on datacenter platform