Wednesday, June 12th 2024
SK Hynix Targets Q1 2025 for GDDR7 Memory Mass Production
The race is on for memory manufacturers to bring the next generation GDDR7 graphics memory into mass production. While rivals Samsung and Micron are aiming to have GDDR7 chips available in Q4 of 2024, South Korean semiconductor giant SK Hynix revealed at Computex 2024 that it won't kick off mass production until the first quarter of 2025. GDDR7 is the upcoming JEDEC standard for high-performance graphics memory, succeeding the current GDDR6 and GDDR6X specifications. The new tech promises significantly increased bandwidth and capacities to feed the appetites of next-wave GPUs and AI accelerators. At its Computex booth, SK Hynix showed off engineering samples of its forthcoming GDDR7 chips, with plans for both 16 Gb and 24 Gb densities.
The company is targeting blazing-fast 40 Gbps data transfer rates with its GDDR7 offerings, outpacing the 32 Gbps rates its competitors are starting with on 16 Gb parts. If realized, higher speeds could give SK Hynix an edge, at least initially. While trailing a quarter or two behind Micron and Samsung isn't ideal, SK Hynix claims having working samples now validates its design and allows partners to begin testing and qualification. Mass production timing for standardized memories also doesn't necessarily indicate a company is "late" - it simply means another vendor secured an earlier production window with a specific customer. The GDDR7 transition is critical for SK Hynix and others, given the insatiable demand for high-bandwidth memory to power AI, graphics, and other data-intensive workloads. Hitting its stated Q1 2025 mass production target could ensure SK Hynix doesn't fall too far behind in the high-stakes GDDR7 race, with faster and higher-density chips to potentially follow shortly after volume ramp.
Source:
AnandTech
The company is targeting blazing-fast 40 Gbps data transfer rates with its GDDR7 offerings, outpacing the 32 Gbps rates its competitors are starting with on 16 Gb parts. If realized, higher speeds could give SK Hynix an edge, at least initially. While trailing a quarter or two behind Micron and Samsung isn't ideal, SK Hynix claims having working samples now validates its design and allows partners to begin testing and qualification. Mass production timing for standardized memories also doesn't necessarily indicate a company is "late" - it simply means another vendor secured an earlier production window with a specific customer. The GDDR7 transition is critical for SK Hynix and others, given the insatiable demand for high-bandwidth memory to power AI, graphics, and other data-intensive workloads. Hitting its stated Q1 2025 mass production target could ensure SK Hynix doesn't fall too far behind in the high-stakes GDDR7 race, with faster and higher-density chips to potentially follow shortly after volume ramp.
12 Comments on SK Hynix Targets Q1 2025 for GDDR7 Memory Mass Production
Why are some people still dreaming about HBM in consumer products?
It seems that the availability of GDDR7 will put a brake on the train of new GPU launches.
More likely is that one stack of HBM3e consumes much less power than eighth GDDR7 chips while taking up significantly less space.
To say nothing of power to move data across the PCB and a wide enough bus for those GDDR7 chips that is not cheap.
People take examples of a few cards released nearly a decade ago on not so great architecture as examples why HBM is no good. Not realizing that it took ~2,5 years, card that costs more than double with 52% higher board TDP to equal (not surpass) the last consumer HBM2 cards bandwidth.
And you ask why people keep dreaming of HBM on consumer cards? Because we could have ~2027 bandwidth today with twice the capacity and half the TDP.
At least on enthusiast cards that already cost a lot of money.
Other than that: It may also mean avoiding a more expensive VRAM interface of 448 bit (the 28GB rumor) or 512 bit (16 2GB chips * 32bit per chip), and instead 384 bit (12 3GB chips * 32bit per chip) could be used, although the ~+50% bandwidth would be satisfied, I don't think the +50% increase in VRAM (36GB) in consumer cards in the upcoming gen is going to be a thing.
That said, 3GB densities would indeed allow for consumer ~"AI Extra High VRAM" (TM) card products (no clamshell).