Wednesday, March 2nd 2022
Intel, AMD, Arm, and Others, Collaborate on UCIe (Universal Chiplet Interconnect Express)
Intel, along with Advanced Semiconductor Engineering Inc. (ASE), AMD, Arm, Google Cloud, Meta, Microsoft Corp., Qualcomm Inc., Samsung and Taiwan Semiconductor Manufacturing Co., have announced the establishment of an industry consortium to promote an open die-to-die interconnect standard called Universal Chiplet Interconnect Express (UCIe). Building on its work on the open Advanced Interface Bus (AIB), Intel developed the UCIe standard and donated it to the group of founding members as an open specification that defines the interconnect between chiplets within a package, enabling an open chiplet ecosystem and ubiquitous interconnect at the package level.
"Integrating multiple chiplets in a package to deliver product innovation across market segments is the future of the semiconductor industry and a pillar of Intel's IDM 2.0 strategy," said Sandra Rivera, executive vice president and general manager of the Datacenter and Artificial Intelligence Group at Intel. "Critical to this future is an open chiplet ecosystem with key industry partners working together under the UCIe Consortium toward a common goal of transforming the way the industry delivers new products and continues to deliver on the promise of Moore's Law."The founding companies, representing a wide range of industry expertise across cloud service providers, foundries, system OEMs, silicon IP providers and chip designers, are finalizing incorporation as an open standards body. Upon incorporation of the new UCIe industry organization this year, member companies will begin work on the next generation of UCIe technology, including defining the chiplet form factor, management, enhanced security and other essential protocols.
The chiplet ecosystem created by UCIe is a critical step in the creation of unified standards for interoperable chiplets, which will ultimately allow for the next generation of technological innovations.
For more information, visit this page.
"Integrating multiple chiplets in a package to deliver product innovation across market segments is the future of the semiconductor industry and a pillar of Intel's IDM 2.0 strategy," said Sandra Rivera, executive vice president and general manager of the Datacenter and Artificial Intelligence Group at Intel. "Critical to this future is an open chiplet ecosystem with key industry partners working together under the UCIe Consortium toward a common goal of transforming the way the industry delivers new products and continues to deliver on the promise of Moore's Law."The founding companies, representing a wide range of industry expertise across cloud service providers, foundries, system OEMs, silicon IP providers and chip designers, are finalizing incorporation as an open standards body. Upon incorporation of the new UCIe industry organization this year, member companies will begin work on the next generation of UCIe technology, including defining the chiplet form factor, management, enhanced security and other essential protocols.
The chiplet ecosystem created by UCIe is a critical step in the creation of unified standards for interoperable chiplets, which will ultimately allow for the next generation of technological innovations.
For more information, visit this page.
19 Comments on Intel, AMD, Arm, and Others, Collaborate on UCIe (Universal Chiplet Interconnect Express)
This proprietary socket nonsense has always sucked.
Unfortunately, I think it would stifle innovation in some ways, but it might also lead to less electronic waste and slower upgrade cycles.
releasingpromoting 'new standards' and saying 'this is the best, use it or else be left sitting on the curb'.It was simple and easy. The previous way of doing things was FAR more flexible and greatly more environmentally friendly.
But seriously, it doesn't sound like science fiction any longer. The CPU/system on chip development by Intel and AMD has basically converged, the level of integration is very similar in both, even the number of pins is suspiciously similar, at least on consumer platforms. One serious issue of course remains: how would an Intel CPU on a non-Intel board (and non-Intel chipset) know if it's allowed to run overclocked? They need a technology to build foot-tall stacks of chiplets full of user data, metadata, Metadata, and other user data.
I would also love if Intel and AMD shared a socket, but ... well, that sounds utopian. Not only would it be a "consortium" of two members (unless motherboard makers get to join, which doesn't really make sense - they would literally always be motivated to not want to make a new model as that's quite expensive), and two members with a ~4-to-1 power balance, at least in market share; you would make BIOS development massively more complicated (including managing diverging featuresets across not only CPU lines but vendors); you would need a socket/platform design that attempts to be unrealistically future-proof (at least accounting for one generation ahead in any relevant I/O standards for your desires to be possible), and a bunch of other issues.
As for this consortium, my first thought was "this sounds great". Second thought: "Coming from Intel though ... wonder if they've purposely designed this to be inferior to EMIB and its derivatives?" I certainly wouldn't put it past them in how they tend to conduct business, though they might not have done anything like that simply because engineering something to be slightly worse than something else is incredibly difficult - and it couldn't be too much worse, as it wouldn't see adoption.
Still, broader adoption of chiplet architectures is a great thing, as are open standards. Curious why Nvidia is nowhere to be seen though - but then given that both TSMC and Samsung are in, I guess they'd have access anyhow.
Bear in mind TSMC and AMD also already had EMIB-like tech in their pipeline. For all we know, TSMC might have been ahead of Intel on future development in this area and everyone decided to settle down and level the playing field. It does lower the risk and the investment cost for all parties as far as chiplet interconnects go and that is a big deal. With an open standard AMD and Intel can focus their attention elsewhere and not have to worry that chiplet interconnects will ruin their next generation's competitive standing.
As I look deeper into it though, I find it very interesting how the materials from this consortium repeatedly refer to building SoCs with IP/chiplets from different suppliers. That is an interesting focus. Is that just for the foundry customers, or do the big guys have plans of their own? Interesting times ahead. Chiplets are for the open standard plebs. Only THEIR chiplets are tiles :laugh:
The last time they made a chiplet in earnest for the consumer market was early Core2Quad where they 'glued' two Core2Duo chips onto the same substrate and had the motherboard chipset deal with most of the mess that caused. Those were fun days too; Easy 50% overclocks and good old FSB shenanigans...
Loved those days :)
I so saw this happening, I said only the other day I thought Intel would/could dish out Emib on license, totally wrong on the license but who the f£#@ saw that team up coming without licences?!
I think anything that could mean less E waste ,more cooperation and innovation and easier lives could only be win win for all.